JPH0759911A - Manufacture of matrix sensor - Google Patents

Abstract

PURPOSE:To simplify manufacture steps by constituting a matrix sensor where a plurality of transmitting and receiving wires are arranged in a matrix form for a detection range, of a board supporting the wires and board having a plurality of terminals. CONSTITUTION:A metal detecting device for a pachinko game machine is provided with a matrix sensor which functions as metal sensor while having a surface type detection range. This sensor 20 is arranged to cross a plurality of transmitting and receiving wire 22, 26 and wiring boards. Such a sensor 20 is manufactured by attaching the wiring boards 19b, 29b to specified positions, one of plural transmitting and receiving wires is wired between the corresponding terminal of board 29b, thereafter an insulation layer is arranged on the top face of the boards 19b, 29b to which wiring is made, and on the insulation layer conductive paste is printed so that at least a part of the boards may be covered.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal body detecting apparatus for detecting the position of a metal body, and more particularly, a plurality of transmission lines and a plurality of reception lines are arranged in a detection area in a matrix. The present invention relates to a metal body detection device that detects the presence or absence of a metal body and the position where the metal body exists by using a configured matrix sensor.

[0002]

2. Description of the Related Art It is sometimes necessary to detect a position where a metal body exists in a predetermined area, particularly a planar area. For example, the movement locus of a metal body moving in a plane area may be detected. Further, when a metal body is distributed in a certain area, the distribution pattern may be detected. As an example of the former, specifically, detecting the movement trajectory of the game execution medium in the game machine can be mentioned.

There is a game machine in which a metal body, for example, a metal ball is moved within a specific space set in the game machine, and the presence or absence of a prize is determined according to the movement destination. As a typical example, for example, "pachinko ball"
There is a pachinko game machine that plays by dropping and moving a metallic ball called a metal ball in a space surrounded by parallel planes with many obstacles.

In general, a pachinko game machine is composed of a board surface (base board) forming a space for moving a pachinko ball, a glass plate covering the board surface at a constant interval, and a pachinko ball composed of the board surface and the glass plate. And a projection mechanism for projecting into the partitioned space. Pachinko game machine,
The board surface is installed so that it is substantially parallel to the vertical direction. On the board, a plurality of winning holes, which are awarded when the pachinko balls enter the board and are ejected from the board, and the pachinko balls that have not entered the winning holes are finally collected and ejected from the board. A discharge hole is provided.

In addition, a large number of pins (nails) have a length corresponding to the diameter of the pachinko ball so that the pachinko ball falling along the plate surface frequently collides with the board surface and causes fluctuations in the movement direction. It is provided substantially vertically while protruding from the board surface. These pins guide the colliding pachinko ball toward the winning hole in some cases, and in some cases, to move it away from the winning hole, while giving fluctuations in the direction of its movement. As described above, the distribution is determined and arranged on the board.

By the way, in a pachinko parlor in which a large number of such pachinko game machines are arranged, it is necessary to manage the winning situation in each pachinko game machine. That is,
This is because it is necessary to find a machine with an uneven trajectory of a pachinko ball or a machine with an abnormal trajectory, and perform replacement or repair. For example, if a machine that is easy to win a prize is left unattended, the pachinko parlor will suffer a great deal of business damage, so it is necessary to find such a machine. Also,
On the other hand, if there are many machines that are difficult to win, the parlor will be disliked by the customer, so it is necessary to discover such machines. Also, it is necessary to detect an illegal act such as guiding a pachinko ball with a magnet or the like during the execution of the game.

Conventionally, as a metal body detecting device for such a purpose, there are those disclosed in Japanese Patent Application Laid-Open No. 2-279186, Japanese Patent Application No. 2-244898 and Japanese Patent Application Laid-Open No. 4-122375.

These publications disclose pachinko ball detection devices. This detection device is disclosed in JP-A-2-279.
In Japanese Patent No. 186, a receiving coil in which a transmitting coil row group in which a plurality of transmitting coil rows having continuous open ring transmitting units are arranged in one direction is arranged, and an open ring receiving unit that is inductively coupled to the transmitting unit is continuous. It has a metal sensor called a detection matrix which is composed of a receiving coil group in which columns are arranged side by side in a direction intersecting the transmitting coil row group.
Then, this metal sensor is connected to a management device and driven thereby to detect whether or not a metal body is present in each portion where the transmission unit and the reception unit are superposed. Also,
Japanese Patent Application No. 2-244898 and Japanese Patent Laid-Open No. 12237/1992.
In the publication No. 5, the applicant of the present invention, instead of the coil array,
It has been proposed to construct the sensor using transmit and receive lines. That is, a plurality of parallel folded-back transmission lines are attached to one surface of the substrate, and a plurality of parallel folded-back reception lines are crossed with each other so as to be electromagnetically coupled to the transmission lines, and are opposite to the substrate. A sensing matrix is shown that is configured to be mounted on a surface. This detection matrix connects the transmission line and the reception line corresponding to the transmission circuit and the reception circuit of the management device, sequentially applies a signal current to each transmission line, and induces an induction current induced by the signal current for each reception line. By detecting the presence or absence of a metal body from the induced current received by the receiving circuit, knowing the combination of the transmission line carrying the signal current and the receiving line receiving the induced current, the metal The position of the body can be detected.

These metal sensors are attached to a glass plate covering the board surface of the pachinko game machine so that the player can see the board surface, and a connector mounting plate is provided at the lower end of the glass plate. A transmission connector and a reception connector are fixed to the connector mounting plate at positions corresponding to the ends of the transmission line and the reception line described above, and the ends of the transmission line and the reception line are fixed through these connectors. The ends are connected to the transmission circuit and the reception circuit of the management device, respectively.

Further, the front glass covering the board surface is along the board surface of the pachinko game machine and has a double structure of a surface glass body and an inner glass body. Further, the inner glass body is composed of a glass plate to which a metal sensor is attached and surface glass adhered to both surfaces of the glass plate, respectively.
It is composed of layers. This configuration is shown in FIG.

As shown in FIG. 4, the front glass covering the board surface 11 is along the board surface 11 of the pachinko game machine 10 and has a double structure of a surface glass body 16 and an inner glass body 17. . In addition, the inner glass body 17 includes the glass substrate 17a and the surface glass 1 adhered to both surfaces thereof.
7b and 17c. The metal sensor is shown in FIG.
As shown in, among the two glass bodies that cover the board surface 11,
The surface is formed inside, that is, inside the inner glass body on the side of the board.

The inner glass body has a transmission line attached to one surface of the glass substrate 17a by a transparent adhesive layer,
The surface glass c is attached by a transparent adhesive layer so as to cover it. In addition, the inner glass body is formed by arranging the reception line on the other surface of the glass substrate by adhering it with a transparent adhesive layer, and by adhering the surface glass b with the transparent adhesive layer so as to cover it. In addition, the glass substrate 17
Before the surface glasses 17b and 17c are bonded to a, an insulating layer and a shield layer are provided on the outside of the glass substrate 17a to block electromagnetic induction from the outside.

The inner glass body 17 has, for example, a vertical length a.
Is a glass substrate having a square shape with a size of 367 mm ± 10 mm and a lateral length b of 367 mm ± 10 mm, and 3.0
It has a thickness of ~ 3.5 mm.

[0014]

In such a metal sensor, since the inner glass body is composed of the glass substrate 17a and the surface glasses 17b and 17c, the thickness of the inner glass body is reduced in consideration of space. In order to
There is a problem that the strength of the surface glasses 17b and 17c becomes weak because the glass of the surface glasses 17b and 17c must be thinned. If the strength becomes weak, the metal sensor may be damaged by the collision of the pachinko balls of the pachinko game machine. Further, in the case of providing the insulating layer and the shield layer, the inner glass body has a problem in that the number of manufacturing steps is increased due to the complicated structure.

An object of the present invention is to provide a thin metal body detection device having a simpler structure in order to solve the above problems.

[0016]

A plurality of transmission lines arranged in parallel, a plurality of reception lines arranged in parallel, a substrate supporting the plurality of transmission lines and the plurality of reception lines, and the plurality of transmissions. A wire and a routing board having a plurality of terminals for placing the plurality of receiving wires on the board, and
Manufacturing of a matrix sensor arranged on a substrate such that a plurality of parallel transmission lines and a plurality of parallel reception lines cross each other and their intersections are arranged in a matrix. A method comprising: adhering the routing board to a predetermined position on the board; wiring one of the plurality of transmission lines and the plurality of reception lines between corresponding terminals of the routing board. A second step in which the other is crossed to wire between corresponding terminals of the routing board; a third step in which an insulating layer is provided on the upper surface of the wired routing board wired in the second step;
A fourth step of printing a conductor paste on the insulating layer so as to cover at least a part of the routing substrate. In this case, the method may further include a fifth step of adhering a transparent protective plate having a conductive film on the insulating layer provided in the fourth step.

Further, a plurality of transmission lines arranged in parallel, a plurality of reception lines arranged in parallel, a substrate supporting the plurality of transmission lines and the plurality of reception lines, the plurality of transmission lines and the plurality of substrates. A wiring board having a plurality of terminals for arranging the reception line of the board, and a plurality of transmission lines arranged in parallel, and a plurality of reception lines arranged in parallel, cross each other, A method of manufacturing a matrix sensor arranged on a substrate so that the intersections thereof are arranged in a matrix, the first step of adhering the routing substrate to a predetermined position of the holding substrate, A second step in which one of the plurality of transmission lines and the plurality of reception lines is wired between corresponding terminals of the routing board, and the other is crossed to be wired between corresponding terminals of the routing board; Second stage And a third step of providing an insulating layer on the upper surface of the wired routing board in the wiring, and a position where at least a part of the routing board is covered when the routing board is attached to a transparent protective plate provided with a conductive film. The method may include a fourth step of printing a conductor paste on the substrate, and a fifth step of adhering the insulating layer and the protective plate printed with the conductor paste in the fourth step.

Further, a matrix sensor having a detection area having a planar spread, and driving this matrix sensor,
The matrix sensor has a plurality of transmission lines arranged in parallel and a plurality of reception lines arranged in parallel. The plurality of transmission lines and the plurality of reception lines arranged in parallel intersect with each other, and their intersection points are
In a metal body detection device arranged on a substrate so as to be arranged in a matrix, the matrix sensor includes a substrate supporting the matrix sensor, the plurality of transmission lines and the plurality of reception lines on the substrate. A wiring board having a plurality of terminals for arranging, each of the plurality of transmission lines and each of the plurality of reception lines, a wiring layer wired to the wiring board, and for insulating the wiring layer. An insulating layer and a conductor layer that covers at least a part of the routing substrate are provided.

[0019]

A board for supporting the plurality of transmission lines and the plurality of reception lines, and a wiring board having a plurality of terminals for disposing the plurality of transmission lines and the plurality of reception lines on the board are prepared. Keep it. The routing board can be formed by screen-printing a predetermined pattern.

In the first step, the routing substrate is adhered to a predetermined position on the substrate. The transmitting side and the receiving side may be configured by different routing boards.
In the second step, one of the plurality of transmission lines and the plurality of reception lines is wired between corresponding terminals of the routing board, and the other is crossed and wired between corresponding terminals of the routing board. . In the third step, an insulating layer is provided on the upper surface of the wiring board thus wired in the second step. Each of the plurality of transmission lines and each of the plurality of reception lines may be arranged on the same surface of the routing board or may be arranged on different surfaces. In the fourth step, a conductor paste is printed on the insulating layer so as to cover at least a part of the routing board. Thereby, a substrate supporting the matrix sensor, a routing substrate having a plurality of terminals for disposing the plurality of transmission lines and the plurality of reception lines on the substrate, each of the plurality of transmission lines and the plurality of transmission lines. It is possible to manufacture a matrix sensor in which each of the reception lines includes a wiring layer wired on the wiring board, an insulating layer for insulating the wiring layer, and a conductor layer covering at least a part of the wiring board. .

Further, the conductor paste may be printed at a position where at least a part of the wiring board is covered when the wiring board is attached to a transparent protective plate having a conductive film. This conductor paste provides a blinding effect that keeps the routing lines invisible to the player, and also acts as a shield. By manufacturing in this way, the whole manufacturing process can be simplified.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

Prior to the description of the embodiment, a pachinko game machine to which the embodiment of the present invention is applied will be described with reference to FIG.

The pachinko game machine shown in FIG. 3 has a board surface 11 which constitutes a space for moving a pachinko ball, a surface glass body 16 which covers the pachinko ball at a constant interval, a pachinko ball, and the board surface 11 and the glass body. And a projection mechanism for projecting into a space partitioned by 16. The pachinko game machine is installed such that the board surface 11 thereof is substantially parallel to the vertical direction.

A guide rail 12 is provided on the board surface 11. The board surface 11 has a game area 12a defined by an inner area surrounded by the guide rails 12. The guide rail 12 guides the pachinko ball hit by the projection mechanism along the guide rail 12 and sends the pachinko ball to the vertically upper position (upstream portion) of the game area 12a.

In the game area 12a, a plurality of winning holes 14a are provided, in which a pachinko ball enters there and is discharged from the board 11, and a special hole is provided in the center of the board between upstream and downstream. The winning prize device device 14b for realizing the winning state and the pachinko balls that have not entered the winning holes 14a are finally collected and ejected from the board surface 1
Two discharge holes 15 are provided. Prize winning device 14
b is a device that gives out a large number of pachinko balls as a prize when the state of the pachinko balls changes each time they enter a specific winning hole 14a and a certain condition is satisfied. For example, by arranging a rotating drum like a slot machine, rotating the drum for each winning, and when a predetermined pattern is aligned, it becomes a special winning state and is configured to give out a large number of pachinko balls. There is.

Further, a large number of pins (nails) 13 are provided in the game area 12a of the board 11 so that the pachinko balls B falling along the board 11 frequently collide with each other to cause fluctuations in the movement direction. Has been. As shown in FIG. 4, these pins 13 are substantially vertically driven into the board surface 11 in a state of protruding from the board surface 11 by a length substantially equivalent to the diameter of the pachinko ball B. These pins 13 are distributed and arranged on the board 11 for the purpose as described above.

On the front surface of the pachinko game machine 10,
A launching handle 33 for launching a pachinko ball
And a tray 34 for receiving the pachinko balls paid out as a prize. The handle 33 constitutes a part of the projection mechanism.

Next, an embodiment of the metal body detecting device of the present invention will be described with reference to the drawings.

As shown in FIG. 6, the metal body detecting apparatus of this embodiment has a matrix sensor 20 that has a detection area having a planar spread and functions as a metal sensor, and a matrix sensor 20 that drives the matrix sensor 20 to generate a metal. Signal processing system (signal processing device) that detects the presence of the body and the position of the body
170 and. The matrix sensor 20 is shown in FIG.
As shown in FIG. 3, it has a plurality of transmission lines 22, a plurality of reception lines 26, and a substrate that supports these. Transmission line 22
Is composed of a pair of conducting wires 62 forming a forward path 62a and a return path 62b which are parallel to each other. The reception line 26 is also composed of a pair of conductors 62. In this embodiment, the conductor 62
Is composed of, for example, a wire made of a copper wire insulatingly coated with polyurethane. The pair of conducting wires 62 are configured such that the forward path and the returning path are connected at one end side, and the other end side serves as a signal input / output end.

The transmission line 22 and the reception line 26 are arranged so as to intersect with each other. Specifically, for example, the transmission lines 22 are arranged at regular intervals along the row direction, and the reception lines 26 are arranged at regular intervals along the column direction. The transmission line 22 and the reception line 26 are arranged in this way,
The intersections of the transmission lines 22 and the reception lines 26, which are the detection areas, are arranged in a matrix. Note that the arrangement in the row direction and the column direction is arbitrary, and either row may be arranged.

The signal processing system 170 includes a transmitting / receiving board 171 functioning as a transmitting / receiving means for driving the matrix sensor 20, and the transmitting / receiving board 171.
The control board 172 functions as a signal processing unit that controls the control signal, receives a detection signal, determines the presence or absence of the metal body based on the detection signal, and detects the position where the metal body is detected.

The transmission / reception board 171 includes each transmission line 22.
A transmission circuit 40 which sequentially scans a designated line among them to transmit a transmission signal, and a designated line of each reception line 26 which is sequentially scanned to sequentially receive the reception signal of each reception line Circuit 50. Control board 172
Specifies the transmission line and the reception line to be scanned on the transmission / reception board 171, determines the presence or absence of metal from the signal received by the reception circuit 50, and scans the transmission line in the transmission circuit 40. The position where the metal is detected is detected based on the information indicating the position and the information indicating the reception line scanning position in the receiving circuit 50.

Further, the control board 172 can obtain the movement trajectory of the pachinko ball by temporally accumulating information indicating the existing position of the pachinko ball. Then, it is possible to know the characteristics of the pachinko game machine from the movement locus, and it is possible to detect an abnormal locus and determine whether a fraudulent act has been performed.

Next, the structure of the matrix sensor and the manufacturing method thereof will be described with reference to FIGS.

As shown in FIG. 5, each transmission line 22 intersects.
Each square-shaped surrounding portion (detection position) surrounded by and each reception line 26 is a detection unit 20a, 2 for detecting a metal body.
0a ... In the present embodiment, the detection units 20a, 20a ... Are set to a size capable of detecting a pachinko ball.

The inner glass body 17 is the base glass 103.
And the ITO glass 102, and the FPC (Flexib
le printed circuits). The base glass 103 has, for example, a vertical length a of 367 mm ± 10 m.
A glass substrate having a square shape with m and a horizontal length b of 367 mm ± 10 mm and a thickness of 3.0 to 3.5 mm. In addition, the IT that is placed outside the game console
The O glass 102 has a shorter vertical length than the base glass 103, and the lower end of the base glass 103 is exposed.

As shown in FIG. 5, this base glass 10
On one surface of No. 3, an L-shaped transmitting-side routing board 19b is provided at the right end, and a transmitting-side return board 19a is provided at the left end. Further, on the same surface, a receiving side routing board 29b is provided at the lower end and a folding board 29a is provided at the upper end. These substrates are composed of FPC. External views of the respective substrates are shown in FIGS. 10 and 11.

As shown in FIGS. 5 and 17, the transmission line 22 includes a folded portion 61 formed on the folded substrate 19a,
Wires 62a connected to these folded-back portions 61 by soldering
And 62b. The input / output end of the transmission line 22 is connected to the transmission terminal portion 23 via the lead wiring. One end side of the transmission line 22, that is, the wire 62a side is routed to the output terminal 23a of the transmission terminal unit 23 by the routing section 64 formed on the transmission side routing board 19b. The other end of the transmission line 22, that is, the wire 62b.
The side is connected to the common terminal 23b by the common common line of the transmission side routing board 19b. Further, instead of wiring the common line on the wiring board, a shield layer may be provided and the shield layer may be used as the common line. Transmission terminal section 23
Includes the common terminal 23b of the transmitting-side routing board 19b.

As shown in FIG. 5, the receiving line 26 includes the folded portions 61 formed on the folded substrate 29a, and the wires 62a and 62 connected to the folded portions 61 by soldering.
b, the lower end of which is the base glass 10
It is connected to the receiving terminal section 27 by each routing section 64 and the like formed on the routing board 29b bonded to the lower end of 3. The reception terminal portion 27 also has an input terminal connected to the reception circuit 50 and a common terminal connected to the common side (COM) of the reception circuit 50. Therefore, the reception line 2
Both sides of 6 need to be connected to these terminals respectively, but all of these connections may be made by the routing section 64, or like the transmission line 22, the routing board 29b on the common side. You may make it carry out collectively via the shield layer of.

FIG. 18 is a partial enlarged view of the transmitting-side routing board 19b and the receiving-side routing board 29b. Figure 1
8 shows a routing pattern of the transmission terminal section and the reception terminal section connected to the transmission / reception board 171 of the transmission-side routing board 19b and the reception-side routing board 29b, and the transmission / reception board 171. The pattern of the terminal of is shown. When the number of terminals between the wiring board and the transmission / reception board 171 is large, the wiring board and the transmission / reception board 171 are formed in a plurality of layers, and the wiring lines and terminals are dispersed in each layer to May be configured to have a smaller width.

The respective wires 62a and 62b have a matt black surface so as to prevent the reflection of light in order to make them inconspicuous to the player. In addition, by printing the copper paste on the area of the base glass plate where the FPC is attached before attaching the FPC,
The routing line can be made invisible to the player, and can also serve as a shield.

The pattern of the matrix sensor 20 suitable for the ordinary pachinko game machine 10 has three transmission lines 22.
There are two rows, the reception lines 26 are 32 columns, and the number of the detection units 20a is a total of 1024 patterns.
The case where the reception line 26 has two rows and 32 columns is illustrated.

The thickness of the wires forming the transmission line 22 and the reception line 26 is preferably set to a value of 25 μm to 30 μm. In the case of the present embodiment, as shown in FIG. 5, the overall widths c and d of the transmission terminal portion 23 and the reception terminal portion 27 are 126 mm, respectively. The widths e and f of the vertically extending portions of the substrate 19b are each formed to be 10 mm or less.
The width of each of the transmission terminal portion 23 and the reception terminal portion 27 is 1.5 mm.

In the matrix sensor 20, a transmission / reception board 171 is attached to the lower end of the base glass 103. By the substrate case of the transmission / reception board 171, the lower end of the base glass 103 and the transmission / reception board 171 are sandwiched from both sides, and the transmission / reception board 171 is fitted so as to be fixed to the inner glass body 17. The substrate case of the transmitting / receiving board 171 is made of plastic or stainless steel,
It is provided to protect the transmission / reception line attached to the transmission / reception board 171.

The transmission / reception board 171 is provided with a transmission circuit 40 and a reception circuit 50 at positions corresponding to the transmission terminal portion 23 and the reception terminal portion 27, respectively, and these are connected by solder.

In this embodiment, the matrix sensor 2
The inner glass body 17 shown in FIG. 4 with 0 is constructed as shown in FIG. In FIG. 1, the matrix sensor 20 is formed in a planar shape on the inner glass body 17 on the board surface side.

The manufacturing process of the matrix sensor will be described below.

(1) As shown in FIG. 10, an inner glass and four FPCs are prepared. The FPC includes a transmission line routing, a transmission line folding, a reception line routing, and a reception line folding, and each has an area (bonding pad portion) for bonding a lead wire. A double-sided tape may be attached to the back surface of the FPC so that it can be adhered to the base glass. Or FP
C may be adhered to the base glass with an adhesive.

(2) Next, as shown in FIG.
A predetermined pattern is screen-printed on the bonding pad portion C by cream solder. This pattern is predetermined as shown in FIG.

(3) As shown in FIG. 12, a wire made of copper wire insulatingly coated with polyurethane is connected to each FP.
Solder to the bonding pad of C. The 64 lines each of the reception line and the transmission line are arranged so as to intersect with each other, as described above.

(4) Next, ITO (indium tin oxide) glass with a metal band to be the outer glass is bonded onto the base glass. The ITO glass serves as a shield for blocking external electromagnetic induction from outside the pachinko machine, and one surface of the glass (outer surface of the game machine) is an ITO surface. Any transparent conductive film other than ITO may be used. As a method of bonding, as shown in FIG. 13, there are (a) UV bonding and (b) hot melt bonding.

(A) In the case of UV adhesion, the UV adhesive is flown on the base glass on which the wire of (3) is wired.

Put the ITO glass on.

A roller is put on the ITO glass to push out the excess adhesive.

UV irradiation is applied to cure.

The ITO glass is adhered as described above.

In the case of (b) hot melt adhesion, an adhesive sheet is placed on the base glass on which the wire of (3) is wired.

Put the ITO glass on.

Bonding with a laminator device. That is,
The ITO glass is adhered by heating and pressurizing in vacuum.

These adhesives or adhesive sheets serve as insulating layers.

(5) Next, as shown in FIG.
The metal plate 140 as shown in FIG. Metal plate 14
0 is used to connect the matrix sensor to the transmission / reception board 171 shown in FIG. 6, and the metal plate 140 is attached to the portion excluding the transmission terminal portion 23 and the reception terminal portion 27. The metal plate 140 and the base glass to which the ITO glass is adhered are adhered with a double-sided tape. 14
Shows (a) a front view in the case where a metal plate is attached to the matrix sensor, (c) an A-A sectional view, and (b) BB.
FIG. (C) As shown in the cross-sectional view taken along the line AA of FIG.
One or two or more cover mounting brackets 142 are connected by spot welding to the portions where there is no. Further, the cover mounting bracket 142 has a transmission / reception board 171.
The grommet 141 for attaching is attached. The material of the grommet 141 is nylon, and the tapping screw can be fitted therein.

(6) Next, as shown in FIG. 15, the transmission terminal portion 23 and the reception terminal portion 27 of the bonded glass FPC are soldered to the transmission / reception board 171.
As a method of soldering, as shown in FIGS. 7A and 7B, the insulating layers of the transmission terminal portion 23 and the reception terminal portion 27 of the FPC are removed and soldering is performed. Figure 7
In (a), the insulating layer at the tip of the copper pattern is removed,
In (b), soldering is performed by removing a part of the inside from the tip. The shape of the terminal portion for explaining the soldering shown in FIG. 7 is further shown in FIG. As shown in FIG. 20, in (a), the insulating layer at the tip of the copper pattern is removed to expose the copper pattern at the tip. In (b),
The insulating layer on the inner side of the tip is removed, soldering is performed as shown in FIG.
Is connected to the terminal portion of the FPC board. As shown in FIG. 21B, the method of soldering the terminal portion of the transmission / reception board 171 and the terminal portion of the FPC board is as follows. The transmission / reception board 171 and the FPC board are superposed and soldered by the solder 210. 21 (c).
As shown in FIG. 21, after the transmission / reception board 171 and the FPC board are superposed and soldered by the solder 210, the FPC board is bent 180 degrees to obtain the state shown in FIG. is there. The latter method has the advantage that the work is easy.

(7) Next, as shown in FIG. 16, a transmission / reception cable is attached to the transmission / reception board 171, the transmission / reception board 171 is turned over, and a metal plate is set on the transmission / reception board 171. In addition, the transmission / reception board 171
The substrate case may be attached. In this case, as shown in FIG. 19, the board case 19 is attached to the transmitting / receiving board 171.
By fitting 1 into the above-mentioned grommet with tapping screws, the board case 191, the transmission / reception board 171, and the cover mounting bracket 142 welded to the metal plate 140 are fixed.

When the matrix sensor is manufactured by the above steps, the structure shown in FIGS. 1 and 2 is obtained. As shown in FIGS. 1 and 2, the transmission wire 106 and the reception wire 107 are wired on the same surface on one side of the base glass, and the ITO glass is adhered on the wiring, thereby simplifying the process. The thickness of the matrix sensor can also be reduced.

As described above, in the FPC,
The insulating layer and the shield layer may be formed on the wiring pattern. This shield layer has a blinding effect that keeps the routing lines invisible to the player.

Alternatively, instead of forming the shield layer, a copper paste may be printed on the area of the base glass plate of the above (1) where the FPC is to be attached, as shown in FIG. 9, before the FPC is attached. Good. This copper paste acts as a blinding shield that keeps the routing lines invisible to the player, and as a shield. Further, before the base glass is bonded to the surface of the ITO glass in the above (4) opposite to the ITO surface, the copper paste may be similarly printed corresponding to the area where the FPC overlaps. With this configuration, the entire manufacturing process can be simplified.

According to the matrix sensor of the present embodiment, unlike the conventional case, the management device is not connected via the connector, so that there is no risk of contact failure of the connector and direct soldering is performed. Can be securely connected to the transmitter / receiver board. Therefore, a more reliable metal body detection device can be realized.

Further, since the transmission line and the reception line are wired on the same surface of the FPC, the work process can be simplified and the matrix sensor is provided as compared with the conventional configuration in which the transmission line and the reception line are arranged on different surfaces. The thickness of the inner glass plate can be reduced.

Further, by forming a shield layer by printing a copper paste on the glass surface of the inner glass plate, it is not necessary to provide a shield layer on the FPC.
The structure of can be simplified. When the shield layer is provided on the FPC, the insulating layer and the shield layer have to be configured, but since the copper paste is simply printed on the glass surface,
As a result, the thickness of the inner glass plate provided with the matrix sensor can be reduced.

[0071]

According to the present invention, a thin metal body detection device having a simpler structure can be realized.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a matrix sensor and a matrix sensor.

FIG. 2 is a sectional view of a matrix sensor.

FIG. 3 is a perspective view showing an example of a pachinko game machine to which the metal body detection device of the present invention is applied.

FIG. 4 is a side sectional view of a board surface of a pachinko game machine.

FIG. 5 is a front view showing a matrix sensor.

FIG. 6 is a block diagram of a metal body detection device.

FIG. 7 is an explanatory diagram of soldering of the FPC tip portion.

FIG. 8 is a cross-sectional view of a matrix sensor.

FIG. 9 is a cross-sectional view of a matrix sensor.

FIG. 10 is an explanatory view showing the manufacturing process (1) of the matrix sensor.

FIG. 11 is an explanatory view showing a manufacturing process (2) of the matrix sensor.

FIG. 12 is an explanatory view showing a manufacturing process (3) of the matrix sensor.

FIG. 13 is an explanatory diagram showing a manufacturing process (4) of the matrix sensor.

FIG. 14 is an explanatory view showing the manufacturing process (5) of the matrix sensor.

FIG. 15 is an explanatory view showing the manufacturing process (6) of the matrix sensor.

FIG. 16 is an explanatory view showing the manufacturing process (7) of the matrix sensor.

FIG. 17 is a front view showing a transmission line and its routing portion.

FIG. 18 is a pattern diagram of the terminal portion of the routing board and the terminal portion of the transmission / reception board.

FIG. 19 is an explanatory view of a method of mounting the metal plate and the transmission / reception board.

FIG. 20 is an explanatory diagram of a shape of an FPC terminal portion and a soldering method.

FIG. 21 is an explanatory diagram of a soldering method.

[Explanation of symbols]

101 ... Received FPC FPC, 102 ... ITO lath,
103 ... Base glass, 104 ... Transmission routing board, 1
06 ... Transmission wire, 107 ... Reception wire, 20 ... Matrix sensor, 10 ... Pachinko game machine, 11 ... Board surface, 1
2 ... Guide rail, 12a ... Game area, 13 ... Nail, 14a
… Safe hole, 14b… Prize winning device device, 15… Out hole,
22 ... Transmission line, 26 ... Reception line, 33 ... Launching handle, 34 ... Sauce, B ... Pachinko ball, 16 ... Outer glass body, 17 ... Inner glass body, 17a ... Glass substrate, 17b
... Surface glass, 17c ... Surface glass, 19a, 29a ...
Folded board, 19b, 29b ... Circulation board, 20 ... Matrix sensor, 20a ... Detection unit, 23 ... Transmission terminal, 27 ...
Receiving terminal, 61 ... folding part, 62 ... wire, 64 ... wiring part.

Claims (4)

[Claims] 1. A plurality of transmission lines arranged in parallel, a plurality of reception lines arranged in parallel, a substrate supporting the plurality of transmission lines and the plurality of reception lines, the plurality of transmission lines and the plurality of substrates. And a plurality of transmission lines arranged in parallel and a plurality of reception lines arranged in parallel with each other so as to cross each other. A method of manufacturing a matrix sensor arranged on a substrate so that the intersections thereof are arranged in a matrix, the first step of adhering the routing substrate to a predetermined position of the substrate, A second step in which one of the plurality of transmission lines and the plurality of reception lines is wired between corresponding terminals of the routing board, and the other is crossed to be wired between corresponding terminals of the routing board; Second step A third step of providing an insulating layer on an upper surface of the wired routing board in the wiring; and a fourth step of printing a conductive paste on the insulating layer so as to cover at least a part of the routing board. A method for manufacturing a characteristic matrix sensor. 2. The matrix according to claim 1, further comprising a fifth step of adhering a transparent protective plate having a conductive film on the insulating layer provided in the fourth step. Sensor manufacturing method. 3. A plurality of transmission lines arranged in parallel, a plurality of reception lines arranged in parallel, a substrate supporting the plurality of transmission lines and the plurality of reception lines, the plurality of transmission lines and the plurality of substrates. A wiring board having a plurality of terminals for arranging the reception line of the board, and a plurality of transmission lines arranged in parallel, and a plurality of reception lines arranged in parallel, cross each other, A method for manufacturing a matrix sensor arranged on a substrate so that the intersections thereof are arranged in a matrix, the first step of adhering the routing substrate to a predetermined position of the holding substrate, A second step in which one of the plurality of transmission lines and the plurality of reception lines is wired between corresponding terminals of the routing board, and the other is crossed to be wired between corresponding terminals of the routing board; Second step A third step of providing an insulating layer on the upper surface of the wired routing board in the wiring, and a position where at least a part of the routing board is covered when the routing board is attached to a transparent protective plate provided with a conductive film. A method of manufacturing a matrix sensor, comprising: a fourth step of printing a conductor paste; and a fifth step of adhering the insulating layer and a protective plate printed with the conductor paste in the fourth step. . 4. A matrix sensor having a detection area having a planar spread, and a signal processing system for driving the matrix sensor to detect the presence and the position of a metal body, the matrix sensor comprising: A plurality of transmission lines arranged in parallel and a plurality of reception lines arranged in parallel, and a plurality of transmission lines arranged in parallel and a plurality of reception lines arranged in parallel are crossed with each other. In the metal body detection device arranged on a substrate so that the intersections thereof are arranged in a matrix, the matrix sensor includes a substrate supporting the matrix sensor, the plurality of transmission lines, and the plurality of transmission lines. A wiring board having a plurality of terminals for arranging a reception line on the board, and a wiring layer in which each of the plurality of transmission lines and each of the plurality of reception lines are wired to the wiring board.
A metal body detection device comprising: an insulating layer for insulating the wiring layer; and a conductor layer that covers at least a part of the routing board.