JPH0758755B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a microcomputer-incorporated hybrid integrated circuit device in which a resin-sealed microcomputer is mounted on an integrated circuit substrate.

(B) Conventional Technology A microcomputer in which stored information already written in a mask ROM is built in is favorably used in various electronic devices. Most of the microcomputers are currently mounted on a printed wiring board together with a control or driving integrated circuit. For various electronic devices that are required to be small and lightweight, a semiconductor integrated circuit (IC) chip is directly mounted on a printed wiring board by a technique called chip-on-board, and after the required wiring is performed, this The IC chip including the wiring portion is covered with a synthetic resin, and the size and weight are extremely reduced.

The mounting structure of such a conventional microcomputer will be described with reference to FIG. 17. FIG. 17 is a perspective view showing a partial cross section of the conventional microcomputer, in which a conductive wiring pattern (41) is formed on the main surface. A microcomputer (44) incorporated in a sardip type package is mounted in a through hole (43) of an insulating substrate (42) made of glass, epoxy resin or the like. The microcomputer (44) has a header (45) and a cap (46), and the header (45) is bonded to a ceramic base material (47) with an external lead (48) or a low melting point glass material. The header (45) has an element mounting portion (50) formed by sintering a so-called gold paste in which a large amount of gold powder is mixed in glass, on the low melting glass material or the ceramic base material (4).
7) The device mounting part (50) is attached to the above, and a microcomputer chip (51) is mounted on the device mounting part (50), and the electrode of the chip (51) and the external lead (48) are connected by a thin metal wire (52). It is connected. The cap (46) seals the microcomputer chip (51) arranged in the header (45) with a low melting point glass. The microcomputer (44) thus sealed with the microcomputer chip (51) is fixed by soldering by inserting the external lead (48) into the through hole (43) of the insulating base material (42). The through hole (43) is routed by the conductive wiring pattern (41) as required, and the male connector terminal portion (55) provided at the end of the insulating substrate is transferred to a female connector (not shown). Connected with.

By the way, such a conventional mounting structure of a microcomputer element has an extremely large package outer shape as compared with the microcomputer chip (51), and has a three-dimensional, that is, a height several times as high as the chip height as well as a plane occupation ratio. It is extremely disadvantageous to Furthermore, it is necessary to fix the lead-out lead through the through-hole (43) with solder or the like. A further major drawback to be noted is that the microcomputer device is once assembled in a package prior to mounting on the insulating substrate.

Here, the cerdip package type microcomputer element has been described, but the above-mentioned problems also occur in the resin-sealed package.

The mounting structure shown in FIG. 18 has already been used to solve such a problem.

The microcomputer mounting structure shown in FIG. 18 will be described below.

A chip mounting area (60c) for mounting a microcomputer chip (61) on an insulating substrate (60) such as a glass / epoxy resin plate having a conductive wiring pattern (60b) formed on the main surface (60a). And has the wiring pattern (60b)
Is routed from the vicinity of this area on the main surface (60a) and connected to a male connector terminal portion (not shown). In the area (60c), a microcomputer chip (6
1) is mounted, and the surface electrode of the chip (61) and the wiring pattern (60b) are connected by a thin metal wire (62). Of course, one of the thin metal wires (62) is the tip (61).
This chip (61) is wired to the wiring pattern (60b) on which the chip (61) is mounted in order to connect to the substrate.

It is already known as a well-known technique to mount a microcomputer chip directly on a substrate as described above.

As shown in FIG. 16, by mounting various types of microcomputers, for example, three types of microcomputers on the printed circuit board integrated circuit on which the microcomputers shown in FIGS. 17 and 18 are mounted, as shown in FIG.
In order to realize the printed circuit board integrated circuit having the rising waveforms of the motors different from each other in (C), as a matter of course, each (A). (B), (C) Using the microcomputer with built-in rising waveform data, three printed boards corresponding to each of the three types of microcomputers must be used, and each must be separately developed and integrated on the printed board. did not become.

Here, FIG. 16 shows the pattern of the control method of the rotation speed at the time of rising when controlling the rotation of the motor,
(A) gives a large number of rotations in the initial stage, and then obtains a stable rotated rotation, (B) shows one that rotates slowly in the initial stage, then increases the number of rotations greatly and then stabilizes, (C)
Is to gradually increase the rotation speed and stabilize it.

(C) Problems to be Solved by the Invention Needless to say, in the microcomputer mounting structure shown in FIG. 18, the microcomputer chip is die-bonded onto the printed circuit board, which results in miniaturization. However, the miniaturization referred to here is only miniaturization of the microcomputer itself. That is, although it is not clear from FIG. 18, the peripheral circuit elements fixed to the periphery of the microcomputer are composed of electronic components such as discretes, so that the integrated circuit for the printed circuit board on which the microcomputer is mounted is integrated. When looking at the entire system as a circuit, there is a problem that the size of the printed circuit board is not as small as it is and the size of the entire system becomes large as usual. Furthermore, as described above with the microcomputer mounting structure shown in FIG. 18, when mounting (mounting) three types of microcomputers, it is almost impossible to use a single printed circuit board as a common purpose. Three printed circuit boards corresponding to three types of microcomputers are required, and each development must be carried out separately, resulting in a large loss of development time and a number of problems such as high cost.

Furthermore, in the mounting structure shown in FIG. 18, since it is almost impossible to remove the microcomputer chip that controls the inverter motor as described above, the standard of the motor controlled by the microcomputer is higher than the preset standard. There is a problem that vibration due to uneven rotation of the motor occurs when there is a slight deviation.

That is, not only the motor used for the inverter, but a certain standard is set in advance when manufacturing the motor,
Actually, when a motor is manufactured, an error slightly occurs with respect to the set standard and the motor is manufactured. Due to this subtle error, the normal output signal output from the inverter eventually becomes a defective signal, and there is a problem that the rotation of the motor cannot be kept constant. Therefore, in the structure shown in FIG. 18, since the microcomputer cannot be removed as described above, an error occurs in the motor itself. In addition, since the entire unit is replaced when replacing, there is a problem in that the loss is large in terms of cost and work.

Further, in the mounting structure shown in FIG. 17, since it is possible to attach and detach from the printed circuit board in terms of detaching the above-mentioned microcomputer, it is relatively easy to exchange the above-mentioned different type of microcomputers. You can do it. However, in the mounting structure shown in FIG. 18 as well as in FIG. 17, the peripheral circuit of the microcomputer,
In other words, since circuit elements such as LSI and IC are composed of electronic components such as discretes, the printed circuit board becomes larger, that is, the entire system becomes larger, and the light, thin, short, and small integrated microcomputer-equipped circuit required by the user is provided. There is a big problem that cannot be done.

Further, in the mounting structure shown in FIG. 17 and FIG. 18, the peripheral circuit of the microcomputer to be fixed and mounted is fixed on the circuit board or the electronic component corresponding to the electronic equipment to be used on one large printed circuit board. The printed circuit board equipped with the microcomputer can only be used for one electronic device. That is, in the case where the motor control of the inverter air conditioner is used, since the peripheral circuit related to the inverter air conditioner is formed on the printed circuit board, it can be used only for the air conditioner for the inverter, and the electronic device in other fields such as sewing machines and laundry can be used. There is a problem that it cannot be used for machines and blowers.

Further, in the microcomputer mounting structure shown in FIGS. 17 and 18, as described above, the entire system becomes large and the conductive pattern for connecting the microcomputer and its peripheral circuit elements to each other is exposed. There is a problem that it deteriorates.

Furthermore, in the microcomputer mounting structure shown in FIGS. 17 and 18, the microcomputer and its surrounding IC, L
Since the circuit elements such as SI are exposed, there is a problem that unevenness occurs on the upper surface of the substrate, which makes it difficult to handle and reduces workability.

(D) Means for Solving the Problems The present invention has been made in view of the above-described problems, and it is possible to mount a resin-sealed microcomputer on a substrate and connect the microcomputer to the surroundings. It is characterized in that it has a structure in which a circuit element is mounted, and all the circuit elements around the circuit element are hermetically sealed by the case material, and only the microcomputer is exposed by a hole provided in the case material.

Therefore, it is possible to provide a hybrid integrated circuit device with a built-in microcomputer, which enables miniaturization of the hybrid integrated circuit equipped with the microcomputer and free insertion and removal of the microcomputer.

(E) Action As described above, according to the present invention, since the microcomputer is connected to the conductive path on the substrate exposed through the hole at the predetermined position of the case material, the mounting position of the microcomputer can be arbitrarily set. Therefore, the microcomputer and the most related circuit element can be efficiently connected in consideration of the electrical connection with the built-in peripheral circuit, and the signal line, that is, the wiring line of the conductive path can be eliminated. it can. Further, peripheral circuit elements most closely related to each other can be arranged in adjacent positions of the microcomputer, and data lines for exchanging data between the microcomputer and well-known circuit elements can be realized with the shortest distance or the minimum distance. Loss of mounting density due to turning is suppressed to a minimum, and high-density mounting can be performed.

Further, according to the present invention, all elements other than a microcomputer are housed in a chip-like shape and housed in a sealed space formed by a case material and a substrate, so that it is possible to provide a hybrid integrated circuit device which is compact and easy to handle. You can

Further, in the present invention, the microcomputer is exposed by the hole of the case material, the microcomputer can be easily attached and detached, and various microcomputers can be selected and mounted by one integrated circuit.

(F) Embodiment Hereinafter, the hybrid integrated circuit device of the present invention will be described in detail based on the embodiment shown in FIGS. 1 to 16.

1 and 2 show a hybrid integrated circuit device (1) according to an embodiment of the present invention. This hybrid integrated circuit device (1) is used as an independent electronic component and is used as an integrated circuit having independent functions in the field of a wide range of inverter motors such as an inverter air conditioner.

As shown in FIGS. 1 and 2, the hybrid integrated circuit device (1) includes an integrated circuit board (2), a conductive path (3) having a desired shape formed on the integrated circuit board (2), Conductive path (3)
A microcomputer (4) (hereinafter referred to as a microcomputer) connected to the peripheral circuit element (6) supplied with a control output signal from the microcomputer (4) and connected to the conductive path (3) on the substrate (2). And a case member (8) integrated with the substrate (2) and having a hole (7) at a predetermined position.

A hard substrate made of ceramics, glass epoxy, metal, or the like is used as the integrated circuit substrate (2), and in this embodiment, a metal substrate excellent in heat dissipation and mechanical strength is used.

As the metal substrate, for example, an aluminum substrate having a thickness of 0.5 to 1.0 mm is used. As shown in FIG. 3, an aluminum oxide film (9) is formed on the surface of the substrate (2) by known anodic oxidation.
(Alumite layer) is formed, 10-70μ on one main surface side
Insulating resin layer such as thick epoxy or polyimide (10)
Is attached. Furthermore, a copper foil (11) having a thickness of 10 to 70 μm is adhered to the insulating resin layer (10) at the same time as the insulating resin layer (10) by means such as a roller or a hot press. That is, the copper foil (11) and the insulating resin layer (10) which are previously integrated are used.

On the surface of the copper foil (11) provided on one main surface of the substrate (2), a conductive path of a desired shape is exposed by screen printing and masked with a resist, and a noble metal (gold, silver, platinum) plating layer is formed. The surface of the copper foil (11) is plated. Then, the resist is removed and the copper foil (11) is etched using the noble metal plating layer as a mask to form a desired conductive path (3). Here, the fineness of the conductive path (3) by screen printing is 0.5 mm.
Therefore, when a very fine wiring pattern is required, a well-known photo-etching technique can be used to form a very fine conductive path (3) of about 2 μ rule.

Although the conductive path (3) formed on the substrate (2) is not clear from FIGS. 1 and 2, a thick conductive path (3 ') of a power system for a large signal and a thin conductive path for a small signal. A path (not shown) is formed.

At a predetermined position on the conductive path (3), a microcomputer (4) and its peripheral circuit element (6) to which data contained in the microcomputer (4) is supplied are mounted and connected to the conductive path (3). . Although the conductive path (3) is not shown, it is almost the substrate (2).
The lead fixing pad is formed on the tip of the conductive path (3) extending over the entire peripheral area of the substrate (2). An external lead (12a) for large current and an external lead (12b) used for a signal system are fixed to the lead fixing pad.

In this embodiment, the sizes of the external leads (12a) and (12b) are different, but the shape is arbitrary as long as they can be connected to an external circuit.

As is well known, the microcomputer (4) is an element that combines a program memory (RAM), a POM, and a peripheral device with an input / output interface centering on a program processor (CPU).

The structure of a general microcomputer (4) is a DIP (dual in line) type, as shown in FIGS. 4 and 5.
Broadly speaking, there are a resin mold type package type and a ceramic type package type. As long as it is a DIP type microcomputer (4), either resin mold type or ceramic type package may be used. Since such a DIP type microcomputer is already known, detailed description thereof will be omitted. The type of the microcomputer (4) is basically arbitrary, for example, a ceramic type or resin mold type LC.
It can also be used in C-type, PLCC-type or QIP-type packages. Each type of EPROM device of LCC and PLCC has a structure in which electrodes for connection are provided on four sides of the bottom surface. Further, in the QIP type package, as shown in FIGS. 6 and 7, the lead terminals (4a) are led out from the four sides and bent downward at a substantially right angle.

In the present invention, the package of the microcomputer (4) is DIP type, LC
Although it is possible to use a microcomputer having any of C-type, PLCC-type and QIP-type packages, in this embodiment, the microcomputer (4) using the QIP-type package was used to request a small system. An example shall be described.

The microcomputer (4) used in the present embodiment has a mask ROM in which predetermined program data (ROM) is masked in advance.
Type microcomputer will be used for explanation.

On the other hand, the case member (8) is made of a thermoplastic resin as an insulating member, and is formed in a box shape so that a space is formed when it is fixed to the substrate (2). The peripheral edge of the box-shaped case material (8) is arranged substantially at the peripheral edge of the substrate (2) and firmly fixed to the substrate (2) by an adhesive sealant (J sheet: product name). Be integrated. As a result, a predetermined sealed space (14) is formed between the substrate (2) and the case material (8). Furthermore, the case material (8) of this embodiment
A hole (7) is provided in the. The hole (7) has substantially the same shape as the external shape of the packaged microcomputer (4), and is formed slightly larger than the microcomputer (4) to facilitate the insertion and removal of the microcomputer (4). .

On the substrate (2) exposed through the hole (7) of the case material (8), one end of a plurality of conductive paths (3) fixedly connected to the electrodes of the socket (15) is formed, and the conductive path (3) is formed. The socket (15) for inserting the microcomputer (4) is fixed to the tip of the. The other end of the conductive path (3) to which the socket (15) is fixed is efficiently routed to the vicinity of the circuit element (6) most closely related to the microcomputer (4), and a plurality of circuits such as chip-shaped ICs, LSIs, etc. It is electrically connected to the element (6) by a bonding wire.

Here, the positional relationship between the microcomputer (4) and the most closely related circuit element (6) arranged adjacent to the microcomputer (4) will be described. FIG. 8 is an enlarged view of an essential part when the microcomputer (4) and the circuit element (6) related to the microcomputer (4) are arranged on the substrate (2). The microcomputer (4) and the chip-shaped LSI, As shown in FIG. 8, it is connected to a plurality of circuit elements (6) such as ICs through a large number of conductive paths (3). Therefore, in order to shorten the routing of the conductive paths (3), a microcomputer is used. The circuit element (6) that is most related to (4) and the microcomputer (4) are arranged so as to be located adjacent to each other or as close to each other as possible. Therefore, the routing of the microcomputer (4), the circuit element (6) related to the microcomputer (4) and the conductive path (3) can be formed in the shortest distance, and the mounting area on the substrate can be effectively used. As shown in FIG. 8, the microcomputer (4) and a plurality of chip-shaped circuit elements (6) arranged in the vicinity of or adjacent to the microcomputer (4) are connected to the conductive path (3) extending in the vicinity of the circuit element (6). The tip end is wire-bonded to be electrically connected to the microcomputer (4).

By the way, the microcomputer (4) is inserted into the socket (15) and mounted on the substrate (2), and only the upper surface of the microcomputer (4) is exposed to the outside.
At this time, it is preferable that the upper surface of the microcomputer (4) and the upper surface of the case member (8) are substantially aligned with each other. As a result, only the microcomputer (4) is exposed and the other plurality of circuit elements (6) around it are arranged in the sealed space (14).

As described above, the peripheral circuit element (6) connected to the microcomputer (4) is set to be placed in the sealed space (14) formed by the substrate (2) and the case material (8). That is, all elements such as chip-shaped electronic parts and resistance elements such as printing resistors and plating resistors are provided in the sealing space (14).

By the way, the case material (8) in which the microcomputer (4) is arranged.
The sealing material (16) for sealing is adhered on the hole (7) of
The microcomputer (4) is completely sealed.

When the microcomputer (4) is replaced in this embodiment,
With the hybrid integrated circuit itself attached (fixedly connected) to the mounting substrate, the microcomputer (4) is detached from the hybrid integrated circuit,
It can be easily replaced by inserting a microcomputer (4) containing another ROM.

A specific example of a hybrid integrated circuit device for an inverter for driving a motor according to the present invention will be shown below.

An inverter for driving a motor generally makes an arbitrary AC power supply from a DC power supply and arbitrarily controls the rotation speed of a three-phase motor, for example. That is, a DC power supply obtained by rectifying a commercial AC power supply using a rectifier circuit is used as a power supply. The input DC power source is called an inverter main circuit, and chopping is performed under a predetermined control signal using a switch element having a three-phase bridge structure to output a pseudo AC to a load. By changing the control signal, the output AC voltage and frequency can be made variable, and the rotation speed and torque of the motor can be adjusted variably.

The motor drive inverter will be briefly described with reference to the block diagram shown in FIG.

FIG. 9 is a block diagram when the motor driving inverter is mounted on the integrated circuit board (2).

The motor drive inverter chops the rectifier circuit (21) that inputs AC power and converts it to DC, and the DC power output from the rectifier circuit (21) at specified intervals to supply pseudo AC to the load (motor). Inverter main circuit (22)
And a microcomputer (4) (hereinafter referred to as a microcomputer) which supplies an output signal for chopping the inverter main circuit (22) at predetermined intervals and an output signal for operating the other device, and the microcomputer (4) outputs the signal. A buffer (23) for amplifying the output signal as desired and a buffer (2
3) A signal amplified by the first interface (24) for transmitting the signal amplified by the base amplifier (25) having a different potential and a signal transmitted from the first interface (24) are amplified to the inverter main circuit (22). Supplied from the base amplifier (25) and the rectifier circuit (21) to the inverter main circuit (22)
The first interface (24) by detecting the current supplied to the inverter and detecting the heat generation of the inverter main circuit (22).
A protection circuit (26) for feeding back a predetermined signal to the microcomputer (4) through the microcomputer to protect the inverter main circuit (24) and peripheral circuits, and a second circuit for inputting / outputting signals having different potentials to / from the microcomputer (4). It is composed of an interface (27) and an output buffer (28) for amplifying the output signal output from the microcomputer (4) to supply it to an external device. The respective configurations described above will be briefly described below.

First, the rectifier circuit is composed of a well-known diode bridge circuit, and is for converting commercial alternating current into direct current. In this embodiment, the rectifier circuit is composed of chip parts on the substrate, but when the rectifier circuit is externally attached, it may occur depending on the purpose of use, but the present invention does not cause any problems.

Next, as shown in FIG. 10, the inverter main circuit (22) has two switching elements (22a) connected in series (transistor, MOSFET, IGBT, etc.) connected in parallel (bridge connection). In this embodiment, a transistor element will be used for description. The explanation is continued below.
A flywheel diode is connected between the collector and emitter of each transistor of the main circuit (22), and output terminals (U, V, W) for connecting between each series-connected transistor and the load. Is provided. Also,
(22b) is an input terminal for input.

Next, the microcomputer (4) is, for example, the LM8051P (made by Sanyo) IC
A chip is used.

FIG. 11 is a block diagram showing the basic configuration of the microcomputer,
A CPU (4a) that fetches and executes instructions, a memory unit (4b) that stores predetermined program data, and an I / O port unit (4c) that inputs and outputs data to and from external devices.
It consists of Since the microcomputer (4) itself has nothing new, it will not be described in detail here. Inverter main circuit (2
2) and the desired external device is controlled.

Next, as the buffer (23), an IC chip such as LC4049B (manufactured by Sanyo) is used. The buffer (23) amplifies an output signal from the microcomputer (4) in a predetermined manner.

Next, the first interface (24) is composed of multiple photocouplers, for example, an IC such as PC817 (made by Sharp).
It is composed of chips. As described above, the first interface (24) optically transmits the output signal output from the buffer (23) to the base amplifier (25).

Next, as shown in FIG. 12, the base amplifier (25) receives a signal input terminal (25) to which the signal output from the first interface (24) is input and a signal input from the input terminal (25a). First and third transistors (Tr ₁ ) (Tr ₃ ) that are supplied and turned on and off, and a third transistor (Tr ₃ )
The first transistor (Tr ₁ ) to which the collector and the base of the are connected, and the second transistor (Tr ₂ ) connected between the minus line, the resistor and the diode connected between the power supply lines, and the diode in parallel. It consists of a capacitor connected to. Also, the first and second
An output terminal (25b) is provided for connecting the transistors and the base and emitter of each transistor of the inverter main circuit. For example, when an ON signal is input to the signal input terminal (25a) of the base amplifier (25), the first transistor (Tr ₁ ) and the third transistor (Tr ₃ ) are turned on, and the second transistor (Tr ₂₎ ) Turns off. Then, a desired current is supplied from the power supply V _D to the base of the inverter main circuit (22) via the first transistor (Tr ₁ ) and the control resistor R ₁ .
Further, when the signal is OFF, the first transistor (Tr ₁ ) and the third transistor (Tr ₃ ) are OFF, and the second transistor (Tr ₂ ) is ON. Then, the power supply made up of the diode and capacitor accelerates the turning off of the inverter main circuit (22).

Next, as shown in FIG. 13, the protection circuit (26) is provided in the vicinity of the inverter main circuit (22) and includes a temperature detection unit (diode or the like) configured to detect a temperature rise due to heat generation of the inverter main circuit (22). 26) a, a current detecting section (26b) composed of a resistor for detecting a current supplied from the rectifying circuit (21) to the inverter main circuit (22), and a reference voltage section (26c) forming an internal reference voltage. And the respective detectors (26a) (26
a voltage comparison unit (26d) that compares the output signal from b) with the signal output from the reference voltage unit (26c);
The control signal output section (26e) is provided to feed back the signal from d) to the microcomputer (4).

Next, the second interface (27) is composed of a plurality of photocouplers like the first interface (24), and receives signals input / output from the microcomputer (4) and the input terminals S ₀ and S ₁ by the microcomputer (4). 4).

Finally the output buffer (28) is LC as well as the buffer (23).
An IC chip such as 4049B (manufactured by Sanyo) is used to amplify the signal from the microcomputer (4) and output terminal PO ₀
~ It outputs a signal to PO ₉ .

The operation of the motor drive inverter will be briefly described below.

When commercial AC is input from the terminal (21a), it is converted to DC by the rectifier circuit (21) as described above. The converted direct current is supplied to the inverter main circuit (22). The output terminals (U, V, W) of the inverter main circuit (22) are connected to a load (motor) and supply a desired current to the load.

When a predetermined control or command signal is input from the input / output terminals S ₀ , S ₁ , the digital input terminals D _{0 to} D ₅ , and the analog input terminals A _{0 to} A ₈ , the microcomputer (4) inputs the input signal. Work based on. That is, based on the input signal, the program in the memory stored in the microcomputer (4)
A control signal for performing a predetermined process based on the data is output. The control signal is a buffer (2
It is amplified by 3) and supplied to the base amplifier (25) through the first interface (24).

The signal supplied to the base amplifier (25) is supplied to the base of each transistor element in the inverter main circuit (22), and each transistor element in the inverter main circuit (22) is turned on and off to chop the direct current to generate a pseudo alternating current. Is formed and AC is supplied to the load through the output terminals (U, V, W) to rotate the load at a predetermined rotation speed.

That is, the inverter main circuit (22) chops the direct current based on predetermined program data in the microcomputer (4) and exchanges it with the alternating current. Also, bass amplifier (25)
A separate power supply is always applied to the V _{D1 to} V _D4 terminals.

If the program data in the above-mentioned microcomputer (4) is converted, that is, if it is converted into another microcomputer, it is possible to control the rotation according to the program data contained in the microcomputer.

The signals output from the output terminals PO _{0 to} PO ₉ are microcomputer (4)
The microcomputer (4) outputs a signal based on the result of predetermined signal processing based on the input command input to the. The output signals output from the output terminals PO _{0 to} PO ₉ control external equipment or devices. For example, in the case of an inverter air conditioner, an electromagnetic relay, a valve for adjusting the refrigerant, etc. are controlled in a predetermined manner in response to a temperature change in the room.

When the above-mentioned inverter operation is performed, the inverter system, that is, the temperature on the board (2) is designed to be below the rated maximum temperature, but the system itself is not operated in an abnormal environment (high temperature, high humidity). If used in the lower) or if heat is not radiated normally, the temperature of the inverter main circuit (22) and its surroundings may rise abnormally, which may damage the system or set. The temperature detector (26a) of (26) detects an abnormal temperature and stops the operation of the inverter to suppress heat generation of the inverter and protect the set or system. Also. Although a load is connected to the inverter main circuit (22), a short circuit due to an abnormality in the wiring inside the load, a short circuit in the output terminals (U, V, W),
Alternatively, if the series elements of the inverter main circuit (22) are turned on at the same time due to the malfunction of the microcomputer (4) due to external noise, an abnormally large current will flow into the inverter main circuit (22). The current detection unit (26b) in (26) detects the large current and immediately stops the operation to protect it.

By performing the above-described operation, the operation of the motor drive inverter is performed, and the rotation control of the load (motor) and the operation of the external device are controlled in a predetermined manner to normally operate the control of the inverter air conditioner or the like.

FIG. 14 is a plan view showing a case where the motor driving inverter circuit shown in FIG. 9 is mounted on the substrate (2) of this embodiment, and the reference numerals of the respective circuit elements mounted are the blocks shown in FIG. It is the same as the reference numeral shown in the figure. Since the conductive path connecting the plurality of circuit elements is complicated, it is indicated by an arrow.

As shown in FIG. 14, a plurality of fixing pads (3a) to which the external lead terminals (12) are fixed are provided on the opposing peripheral ends of the substrate (2). A socket (15) mounting a plurality of circuit elements and a microcomputer (4) is fixed at a predetermined position on a conductive path (3) extending from the fixing pad (3a). A plurality of circuit elements other than the microcomputer (4) are fixed on the substrate (2), (22) is an inverter main circuit, (21) is a rectifier circuit, (25) is a base amplifier, and (23).
Is the buffer, (24) is the first interface, (27)
Is the second interface, (28) is the output buffer,
(26) is a protection circuit.

As is clear from Fig. 14, the vicinity of the circuit element most closely related to the microcomputer (4) (here, buffer and output buffer)
A socket (15) on which the microcomputer (4) is mounted is fixed at a position adjacent to. Further, the area surrounded by the one-dot chain line indicates that the case material (8) is fixed by the adhesive sheet.

FIG. 15 shows the case material (8) on the substrate (2) shown in FIG.
FIG. 11 is a plan view of a finished product of the hybrid integrated circuit device for the inverter when the components are fixed, and only the upper surface of the microcomputer (4) is exposed from the upper surface of the case material (8). That is,
All the elements other than the microcomputer (4) are sealed in the sealing space (14) formed by the case material (8) and the substrate (2), and only the upper surface of the microcomputer (4) is exposed. The microcomputer (4) can be freely inserted and removed as needed.

That is, in this embodiment, as shown in FIG. 14, only all peripheral circuits necessary for inverter control are formed on the substrate (2). That is, only the peripheral circuits necessary for controlling the inverter are formed on the substrate (2), and the master ROM type microcomputer (4) inserted in the socket (15) is replaced to obtain one hybrid integrated circuit. It becomes possible to instantaneously mount different microcomputers (4) in the circuit device.

More specifically, it is assumed that the microcomputer (4) having the motor rising waveform (A) shown in FIG. 16 is already inserted in the socket (15), and in this hybrid integrated circuit device (B). When the motor is rotated with the above waveform, by inserting the microcomputer (4) for (B), different rising waveforms, that is, the number of rotations of the motor can be arbitrarily and instantaneously changed in the same hybrid integrated circuit device. Also, of course,
Similarly, the microcomputer (4) having the waveform of (C) is replaced.

As described above, in this embodiment, the minimum peripheral circuits necessary for controlling the inverter are formed on the board (2) and the socket (1
Detachment (replacement) of different microcomputer (4) via 5)
As a result, it becomes possible to implement a microcomputer having different data with one hybrid integrated circuit device. as a result,
It is possible to instantly realize a device having different motor rising waveforms with one hybrid integrated circuit device.

The microcomputer (4) of the hybrid integrated circuit device of the motor drive inverter described in detail above is changed or driven in accordance with the diversification of product specifications, such as the destination, OEM, or in-house sales, which is required by the set manufacturer (user). It is possible to easily cope with a case where a problem such as uneven rotation occurs due to a subtle design error of the motor itself. That is, microcomputer (4)
Other circuit configurations were designed in advance to accommodate various specifications changes.However, when a hybrid integrated circuit is designed based on a specific user or a specific motor specification, the specification may differ due to the error of other users or the motor itself. If there is a mismatch, it is necessary to reexamine the design of the hybrid integrated circuit in the past.

However, in the hybrid integrated circuit device of the present invention, the microcomputer (4) is mounted on the substrate (2) via the socket (15) and its surface is exposed from the hole (7) of the case material (8). Therefore, since the microcomputer (4) can be detached, the user can implement various types of hybrid integrated circuit devices for mounting various types of microcomputers by only selecting and mounting the microcomputer on the user side or after mounting.

According to the present invention, the hole (7) is provided at a desired position of the case material (8), and the socket (15) is provided in the conductive path (3) on the substrate (2) exposed in the hole (7). Through the microcomputer (4)
And the peripheral circuit element (6) is fixed to the sealed space (14) formed by the substrate (2) and the case material (8), thereby providing a device in which the hybrid integrated circuit and the microcomputer are integrated. It has a great feature that it is possible and that the microcomputer can be easily inserted and removed according to need.

Therefore, the different type or the same type of microcomputer (4) prepared in advance can be freely attached and detached in one hybrid integrated circuit device. For example, as shown in FIG. 16, the respective data of the rising waveforms A, B and C of different motors can be obtained. Each microcomputer has (4)
Can be realized without developing a single hybrid integrated circuit device, and the merit thereof is great.

(G) Effect of the Invention As described in detail above, according to the present invention, first, the hole (7) is provided at a desired position of the case material (8), and the substrate (2) exposed through the hole (7). Since the microcomputer (4) is connected to the upper conductive path (3), there is an advantage that the mounting position of the microcomputer (4) can be arbitrarily selected. Therefore, it is possible to arrange the most closely related circuit element in the adjacent position of the microcomputer (4). As a result, the data line for exchanging data between the microcomputer (4) and the circuit element can be arranged with the shortest distance or the layout which is the easiest to design. This can be realized, and the loss of mounting density due to the routing of data lines can be suppressed to a minimum.

Secondly, since the microcomputer (4) is arranged in the hole (7) at a desired position of the case material (8), it is an integrated small-sized one even though a commercially available mold type microcomputer (4) is used. It has an advantage that it can be handled as a hybrid integrated circuit device. Further, by improving the packaging density of the peripheral circuit elements incorporated on the integrated circuit board (2), the conventionally required printed circuit board can be eliminated and one miniaturized microcomputer (4) is detachably incorporated. A hybrid integrated circuit device can be realized.

Thirdly, by providing the socket (15) on the integrated circuit board (2) for the hole (7), only the printed circuit board integrated circuit having only the function of the microcomputer initially mounted can be realized in the mounting structure shown in FIG. However, in the present invention, the microcomputer (4) to be inserted into the socket (15) can be replaced, and different or the same kind of microcomputer (4) can be mounted in one hybrid integrated circuit device. As a result, a single hybrid integrated circuit device can instantaneously provide different control devices.

Fourthly, by using a metal substrate as the integrated circuit board (2), its heat dissipation effect can be greatly improved compared with the printed circuit board, and it can contribute to the improvement of mounting density. Further, by using the copper foil (11) as the conductive path (3), the resistance value of the conductive path (3) can be significantly reduced as compared with the conductive paste, and the mounted circuit can be expanded to a level equal to or larger than that of the printed circuit board.

Fifth, since it is possible to use a dual in-line type, LCC type or QI type that is commercially available as a microcomputer,
There is an advantage that mounting of the microcomputer (4) on the hybrid integrated circuit device can be realized very easily. Further, by making the external shape of the hole (7) and that of the microcomputer (4) the same, the case material (8)
It is possible to realize a hybrid integrated circuit device with a built-in microcomputer that has a very neat shape and can be embedded right in.

Sixth, the peripheral circuit element (6) connected to the microcomputer (4) is incorporated into the sealing space (14) formed by the case material (8) and the integrated circuit board (2) in a die shape or a chip shape. Therefore, compared with a conventional printed circuit board that is resin-molded, the occupied area becomes extremely small, and there is an advantage that the mounting density can be greatly improved.

Seventh, by substantially matching the peripheral edges of the case material (8) and the integrated circuit board (2), almost the entire surface of the integrated circuit board (2) can be used as the sealing space (14), and the packaging density Combined with the improvement, an extremely compact hybrid integrated circuit device can be realized.

Eighth, there is an advantage that a hybrid integrated circuit device having a flat upper surface can be realized by matching the upper surfaces of the case material (8) and the microcomputer (4).

Ninth, the external leads (12) can be led out from one side of the integrated circuit board (2) or the opposite sides, and there is an advantage that an extremely multi-pin hybrid integrated circuit device can be realized.

[Brief description of drawings]

FIG. 1 is a perspective view showing this embodiment, and FIG. 2 is I- in FIG.
I sectional view, FIG. 3 is a sectional view of a substrate used in this embodiment, FIGS. 4 to 7 are perspective views and sectional views showing a resin-molded microcomputer, and FIG. 8 is a peripheral portion of the microcomputer on the substrate. FIG. 9 is an enlarged perspective view of an essential part, FIG. 9 is a block diagram showing a motor driving inverter used in this embodiment, FIG. 10 is a circuit diagram showing a main circuit of the inverter shown in FIG. 9, and FIG. Block diagram showing the microcomputer of the inverter shown in the figure, 12th
9 is a circuit diagram showing a base amplifier of the inverter shown in FIG. 9, FIG. 13 is a block diagram showing a protection circuit of the inverter shown in FIG. 9, and FIG. 14 is a block diagram showing the block diagram shown in FIG. Fig. 15 is a plan view when mounted on top, Fig. 15 is a plan view when the case material is fixed onto the substrate shown in Fig. 14, and Fig. 16 is a characteristic diagram showing the rising waveform of the motor, Fig. 17 and Fig. FIG. 18 is a perspective view showing a conventional microcomputer mounting structure. (1) ... Hybrid integrated circuit device, (2) ... Integrated circuit board, (3) ... Conductive path, (4) ... Microcomputer, (6) Circuit element, (7) ... Hole, (8 ) …… Case material, (15) …… Socket, (16) …… Seal material.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Osamu Nakamoto 2-18 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (72) Koji Nagahama 2-18-2 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuhiro Koike, 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Masao Kaneko 2-18, Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Seiwa Ueno 2-18 Keihan Hondori, Moriguchi City, Osaka Prefecture Sanyo Electric Co., Ltd. (72) Hidefumi Nishito 2-18-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Invention Person Yasuo Saito, 41-1, Omama, Omama-cho, Yamada-gun, Gunma Prefecture, Tokyo Tokyo IC Co., Ltd.

Claims (3)

[Claims] 1. An integrated circuit substrate, a conductive path having a desired pattern formed on the substrate, a microcomputer connected to the conductive path and containing desired program data, and a predetermined circuit from the microcomputer. A peripheral circuit element to which a control output signal of is supplied and which is connected to a conductive path on the substrate, and a case member integrated with the substrate, wherein a hole is provided at a desired position of the case member, A socket is connected to the conductive path on the substrate exposed by a hole, and the dual in-line type, LCC type or QIP type resin-molded microcomputer is inserted into the socket,
A hybrid integrated circuit device, wherein the peripheral circuit element is arranged in a sealed space formed by the substrate and the case. 2. The hybrid integrated circuit device according to claim 1, wherein a plurality of the microcomputers are prepared in advance, and the prepared microcomputers are selected and arbitrarily inserted into the socket. 3. The hybrid integrated circuit device according to claim 1, wherein the microcomputer inserted into the socket is removed, and a microcomputer of a different type or the same type is inserted into the case material.