JPH0371663A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To limit the loss of mounting density due to data lines laid around to an irreducible minimum so as to improve a hybrid integrated circuit device in mounting density by a method wherein a hole is provided to a required position on a board, and a microcomputer is connected to a socket which is fixed to the hole and connected to a required conductive path formed on the board. CONSTITUTION:A hole 4 is bored in a board 2 at a prescribed position, and a microcomputer 6 is inserted into a socket 16, which is fixed to the hole 4 and connected to a conductive path 5 formed on the board 2, to be connected with the conductive path 5. Therefore, the mounting position of the microcomputer 6 can be optionally set, so that it can be efficiently connected to a peripheral built-in circuit element 8 most closely related to it taking the electrical connection of it with the circuit element 8 into consideration and the leading wire of the conductive path 5 can be dispensed with. Moreover, a data line through which the data transmission between the microcomputer 6 and the peripheral circuit element 8 is executed can be reduced to a minimum length. By this setup, the loss of mounting density due to data lines laid around can be limited to an irreducible minimum, so that the mounting of high density can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Industrial Application Field The present invention relates to a hybrid integrated circuit device with a built-in microcomputer, which is formed by mounting a resin-sealed microcomputer on an integrated circuit board.

(Example) Conventional technology Microcomputers with built-in storage information written by mask ROM are often used in various electronic devices.Currently, these microcomputers are used together with control or drive integrated circuits. Most of them are mounted on printed wiring boards.For various electronic devices that require smaller size and lighter weight, semiconductor integrated circuit (IC) chips are mounted on printed wiring boards using a technique called chip-on-board. After the IC chip is directly mounted and the necessary wiring is applied, the IC chip, including the wiring portion, is covered with synthetic resin, making it extremely compact and lightweight.

The mounting structure of such a conventional microcomputer is described in the 18th
To explain according to the drawings, FIG. 18 is a perspective view with a partial cross section of a conventional microcomputer, which is an insulator made of glass, epoxy resin, etc., with a conductive wiring pattern (41) formed on its main surface. A microcomputer (44) incorporated in a deep dip type package is mounted in a through hole (43) of the base board 42. This microcomputer (44) has a header (45)
) and a cap (46), said header (45)
is bonded to the ceramic base material (47) with an external lead (48) or a low melting point glass material.
5) is an element mounting part (50) which is made by sintering so-called gold paste in which a large amount of gold powder is mixed into glass, and is adhered to the above-mentioned low melting point glass material top type or ramic base material (47), and this element mounting part A microcomputer chip (51) is attached to (50), and the electrodes of this chip (51) and the external leads (48) are connected by a thin metal wire (52>.This cap (46>) has a low melting point. A microcomputer chip (51) placed on the header (45>) is sealed with glass.The microcomputer (44) with the microcomputer chip (51) sealed in this way is connected to the through hole of the insulating substrate (42>). The external lead (48>) is inserted into the hole (43) and fixed with solder.This through hole (43>) is provided with the required wiring through the conductive wiring pattern (41), and the end of the insulating substrate A male connector terminal section (55) provided at the section is connected to a female connector (not shown).

Now, in the conventional mounting structure of the microcomputer element, the package external size is extremely large compared to the microcomputer chip (51), and the surface area is three-dimensional, that is, the height is several times the height of the chip. This is extremely disadvantageous for thinning. Furthermore, after inserting the external lead through the through hole (43), it becomes necessary to fix it with solder, etc.A further major drawback is that the microcomputer elements are partially assembled into a package before being mounted on an insulating board. Although we have discussed the deep-dip package type microcomputer elements here, the above-mentioned problems also occur with resin-sealed packages.

The mounting structure shown in FIG. 19 has already been used to solve this problem.

The microcomputer mounting structure shown in FIG. 19 will be explained below.

An insulating substrate (6
0) has a chip mounting area (60c) on which a microcomputer chip (61) is placed, and the wiring pattern (60b> extends from the vicinity of this area to the main surface (60
a) It is routed above and connected to a male connector terminal section (not shown). A microcomputer chip (61) is mounted in the area (60c), and this chip (60c) is equipped with a microcomputer chip (61).
The surface electrode of 1) and the wiring pattern (60b>) are connected by a thin metal wire (62).
One of the wires 2) is wired with the wiring pattern (60b) on which this chip (61) is mounted, in order to connect to the substrate of the chip (61).

As mentioned above, mounting a microcomputer chip directly on a substrate is already known as a well-known technique.

Various types of microcontrollers, for example, three types of microcontrollers, are mounted on the printed circuit board integrated circuit equipped with the microcontroller shown in Figs. 18 and 19 above, and as shown in Fig. 17, (A)
In order to realize a printed circuit board integrated circuit having different motor rise waveforms as shown in (B) and (C),
Naturally, each (A).

Using microcontrollers with built-in data for the rising waveforms in (B) and (C), three
Each printed circuit board had to be developed separately and integrated onto the printed circuit board.

Here, the 17th [ffl shows the pattern of the control force formula for the rotation speed at the time of start-up when rotating the motor, and (A) gives a large rotation speed at the beginning and then stabilizes the rotation. (B) is one that rotates slowly at the beginning and then increases the rotation speed greatly and then stabilizes; (C) is one that gradually increases the rotation speed and stabilizes it.

(8) Problems to be Solved by the Invention In the microcomputer mounting structure shown in FIG. 19, since the microcomputer chip is die-bonded onto the printed circuit board, it goes without saying that it is miniaturized. However, the miniaturization referred to here is only the miniaturization of the microcomputer itself. That is, the 19th
Although it is not clear from the diagram, the peripheral circuit elements fixed around the microcomputer are composed of discrete electronic components, so the system functions as an integrated circuit for the printed circuit board on which the microcomputer is mounted. When viewed as a whole, there is a problem in that the size of the printed circuit board is increased as before, that is, the entire system is increased in size, without any reduction in size. Furthermore, as mentioned above in the microcomputer mounting structure shown in Figure 19, three types of microcomputers are mounted (mounted).
In this case, it is almost impossible to use one printed circuit board for both purposes, and as mentioned above, three printed circuit boards corresponding to three types of microcontrollers are required, and each must be developed separately. Otherwise, a large loss of development time will result, and many problems will occur at high costs.

Furthermore, in the mounting structure shown in Fig. 19, it is almost impossible to remove the microcomputer chip that controls the inverter motor as described above, so the standard for the motor controlled by the microcomputer is lower than the preset standard. There is a problem that vibrations occur due to uneven rotation of the motor when there is a slight shift.

In other words, when manufacturing motors, not only motors used for inverters, certain standards are set in advance.
In reality, when motors are manufactured, they are manufactured with slight deviations from the established specifications. This subtle error causes a problem in that a normal output signal output from the inverter turns into a defective signal, making it impossible to keep the rotation of the remoter constant. Therefore, in the structure shown in Fig. 19, as mentioned above, the microcomputer cannot be removed and removed, which causes errors in the motor itself, and even if problems such as uneven rotation occur when a unit is formed, it can be used as is. Or, even if it is replaced, the entire unit must be replaced, resulting in a problem of large losses in terms of cost and work.

Furthermore, in the mounting structure shown in FIG. 18, the microcomputer mentioned above can be attached and detached from the printed circuit board, so it is relatively easy to replace different types of microcomputers as mentioned above. It's easy to do. However, in the mounting structure shown in FIG. 19, as in FIG. 18, the peripheral circuits of the microcomputer, that is, the circuit elements such as LSI and IC, are composed of discrete electronic components, so the large size of the printed circuit board is required. In other words, the overall system becomes larger, and there is a major problem in that it is impossible to provide integrated circuits equipped with microcomputers that are light, thin, short, and small as required by users.

Furthermore, in the mounting structure shown in FIGS. 18 and 19, the peripheral circuits of the microcomputer to be fixed and mounted are fixed on one large printed circuit board, and the circuit configuration or electronic components corresponding to the electronic equipment used are fixed. A printed circuit board equipped with a microcomputer could only be used in one electronic device. In other words, the peripheral circuits on the printed circuit board used for motor control of inverter air conditioners are configured as peripheral circuits related to inverter air conditioners, so they can only be used for inverter air conditioners and cannot be used for electronic equipment in other fields, such as sewing machines and laundry machines. There is a problem that it cannot be used for machines, brakes, etc.

Furthermore, in the microcomputer mounting structure shown in FIGS. 18 and 19, - as mentioned above, the entire system becomes larger and the conductive patterns that connect the microcomputer and its peripheral circuit elements are exposed. There is a problem of decreased reliability.

Furthermore, in the microcomputer mounting structure shown in Figs. 18 and 19, the microcomputer and its surrounding I/O
Since circuit elements such as C and LSI are exposed, there is a problem that unevenness occurs on the top surface of the board, making it difficult to handle and reducing workability.

2) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems. A hole is provided at a predetermined position on a substrate, and a conductive path formed on the substrate is connected to the inside of the hole. A microcomputer is inserted into the socket, and all other circuit elements are sealed in the sealed space formed by the two substrates and the case material so that only the microcomputer is exposed. Characterized by structure.

Therefore, it is possible to reduce the size of the hybrid integrated circuit equipped with a microcomputer and provide a hybrid integrated circuit device with a built-in microcomputer that is mounted at high density. Further, since the microcomputer is mounted by being inserted into a socket fixed in the hole in the exposed surface of the board provided with the hole, the microcomputer can be easily and freely inserted and removed.

(N) Function As described above, according to the present invention, holes are provided at predetermined positions on the substrate,
Since the microcomputer is connected to the conductive path by inserting it into the socket that is fixed in the hole and connected to the conductive path formed on the board, the microcomputer's v2
The device location can be set arbitrarily, and the microcomputer can be efficiently connected to the most closely related circuit elements by considering the electrical connections with the built-in peripheral circuit elements.
It is possible to eliminate the need for signal lines, that is, routing lines for conductive paths.

Furthermore, the most closely related peripheral circuit elements can be placed adjacent to the microcomputer, and the data lines for exchanging data between the microcomputer and the peripheral circuit elements can be realized at the shortest or minimum distance. Loss in packaging density due to routing is minimized, allowing high-density packaging.

Furthermore, in the present invention, only the microcomputer is exposed to the outside by being inserted into a socket fitted into a hole provided at a predetermined position on the board, and all other circuit elements are sealed by the board and case material. Since it is housed in a space, it is possible to provide a compact and high-density mounted hybrid integrated circuit device.

Furthermore, as described above, in the present invention, since only the microcomputer is placed so as to protrude outside, the microcomputer can be easily attached and detached, and various types of microcomputers can be selectively mounted on one integrated circuit. can do.

(F) Embodiments Below, the hybrid integrated circuit device of the present invention will be explained in detail based on the embodiments shown in FIGS. 1 to 17.

1 to 3 show a hybrid integrated circuit device (1) according to an embodiment of the present invention. This hybrid integrated circuit device (
1) is used as an independent electronic component and is used as an integrated circuit having independent functions in a wide range of inverter motor fields such as inverter air conditioners.

As shown in FIGS. 1 to 3, the hybrid integrated circuit device (1) includes an integrated circuit board (2), a hole (4) provided at a predetermined position of the integrated circuit board (2), and an integrated circuit A conductive path (5) of a desired shape formed on the substrate (2), a socket (16>) fixed in the hole <4> and connected to the conductive path (5>), and a conductive path inserted into the socket (16). (5) and a microcomputer (6) (hereinafter referred to as microcomputer) connected to
The output control signal is supplied from the microcomputer (6) and the board (
It consists of a plurality of peripheral circuit elements (8) connected to the conductive paths (5) on the board (2) and a case material (7) that integrally fixes the board (2).

The integrated circuit board (2) is a hard substrate made of ceramics, glass epoxy, metal, or the like, and in this embodiment, a metal substrate with excellent heat dissipation and mechanical strength is used.

As the metal substrate, for example, an aluminum substrate having a thickness of 0.5 to 1.0111111 is used. As shown in FIG. 4, an aluminum oxide film (9) (alumite layer) is formed on the surface of the substrate (2) by well-known anodic oxidation, and a 10-70μ thick epoxy or polyimide film is formed on the main surface side of the aluminum oxide film (9) (alumite layer). An insulating resin layer (1o) is pasted. Furthermore, an insulating resin layer (1o) is pasted.
10) A copper foil (11) with a thickness of 10 to 70 μm is placed on the roller at the same time as the insulating resin layer (1o).

Or, it is pasted by means such as hot pressing.

On the surface of the copper foil (11) provided on the -main surface of the substrate (2), a conductive path of a desired shape is exposed by screen printing and masked with a resist, and a precious metal (gold, silver, platinum) plating layer is formed. The surface of the copper foil (11) is plated. After that, the resist was removed and copper foil (1
Etching step 1) is performed to form a desired conductive path (5). Here, the thinness of the conductive path (5) by screen printing is limited to 0.5 ohm, so when an ultra-fine wiring pattern is required, the ultra-fine conductive path (5) of up to about 2 μm can be formed using well-known photo-etching technology. Formation becomes possible.

Although not shown, a relatively thin conductive path for small signals and a relatively thick conductive path for large signals are formed on the conductive path (5) formed on the substrate (2>).Further details Then, although the conductive path (5) is not shown, it is formed over the entire area of the substrate (2), and the tip of the conductive path <5> extends to the peripheral edge of the substrate (2). A lead fixing pad is formed on the lead fixing pad.The external lead for high current (
12a) and an external lead (12a) used for a signal system are fixed.

In this embodiment, the external leads (12a) and (12b) have different sizes, but their shapes can be arbitrary as long as they can be connected to an external circuit.

As is well known, a microcomputer (6) is a program processor (
CPU), program memory RAM, ROM,
This is an element that combines an input/output interface with a peripheral device.

As shown in FIGS. 5 and 6, the structure of a general microcomputer (6) is of a DIP (dual in line) type, and can be roughly divided into two types: a resin mold package type and a ceramic package type. If it is a DIP type microcomputer (6>), either a resin mold type or a ceramic type package can be used.As IP type microcontrollers are already well known, detailed explanations will be omitted.Microcomputer The type (6) is basically arbitrary, and for example, a ceramic type or resin molded LCC type, PLCC type, or QIP type package can also be used.

EFROM devices of the LCC and PLCC types each have a structure in which connection electrodes are provided on the four sides of the bottom surface. Further, as shown in FIGS. 7 and 8, in the QIP type package, lead terminals (4a) are led out from each of the four sides and are bent downward at a substantially right angle.

In the present invention, it is possible to use a microcomputer having a DIP type, LCC type, PLCC type, or QIP type package for the microcomputer <6>, but in this embodiment, since a small system is required, QIP
An example using a microcomputer (6) using a type package will be described.

The microcomputer (6>) used in this embodiment will be explained using a mask ROM type microcomputer in which predetermined program data (ROM) is masked in advance.

By the way, in the present invention, holes (4) are formed at predetermined positions on the substrate <2>.
) is provided. This hole (4) is shown in Figures 1 and 2.
As is clear from the figure, the same number of holes (4) as the number of glue-doped pins of the microcomputer (6) are provided. That is,
Since the microcomputer (6) used in this embodiment is of the QIP type, a mouth-shaped hole (4) is formed in the substrate (2). It is assumed that this hole (4) is formed by the board press punching process before the formation of the conductive path (5) described above.The microcontroller (6) used in this example is of the QIP type as described above. However, LCC type, DIP or PLCC
When using a type of microcomputer, holes to be formed in the substrate are not shown, but predetermined holes may be formed to match the microcomputer.

On the other hand, a part of the socket (16) described later is fitted into the hole (4) and is integrally fixed with the board (2).Such a hole (4)
The tip of a part of the conductive path (5) formed on the substrate (2) extends on the peripheral edge of the socket (16), and the tip of the conductive path (5>) and the socket (16) The electrodes are fixedly connected with solder (17) by a predetermined solder reflow process.

As shown in FIGS. 2 and 3, the socket (16) is formed so that its cross section is clog-shaped, and the clog-shaped protrusion (18) fits into the hole (4). The connection electrode of the socket (16) is connected to the conductive path (5) extending from the peripheral end of the hole (4) by solder (17). Hole (
4) When the socket (16) is fitted into the
) The top surface of the clog-shaped protruding portion <18> is arranged so as to be flush with the top surface of the substrate (2) or to slightly protrude from the top surface of the substrate (2). The microcomputer (6) is connected to the protrusion (
18) and is connected to the conductive path (5).

On the other hand, peripheral circuit elements (8) such as ICs, transistors, chip resistors, and chip capacitors to which the control output signals of the microcomputer (6) are supplied are chip components and are soldered or Ag paste onto the desired conductive path (5). The socket (16) into which the microcomputer (6) is inserted and the circuit element (8) are attached by a brazing material such as
) is bonded to. Furthermore, a carbon resistor by screen printing or a nickel-plated resistor by nickel plating is formed as a resistance element between the conductive paths (5).

The substrate (2>) is fixed and integrally fixed by the case material (7).

The case material (7) is made of thermoplastic resin as an insulating member, and, as shown in FIGS. 2 and 3, is box-shaped so that a space is formed when it is fixed to the substrate (2). There is. The peripheral edge of the box-shaped case material (7) is placed approximately at the peripheral edge of the board 2 and is firmly fixed to the board 2 using an adhesive sealant (J sheet: trade name). It will be completely stopped. As a result, a predetermined sealed space (21) is formed between the substrate (2) and the case material (7).

By the way, as mentioned above, one end of a plurality of conductive paths (5) extends at the peripheral end of the hole (4), and the conductive paths (5) and the hole (
4) A socket (16>) into which the microcomputer (6) fitted inside is inserted is fixed.The other end of the conductive path (5) to which the socket (16) is fixed is most closely related to the microcomputer (6). It extends in the vicinity of the circuit element (8>) over a minimum distance and is electrically connected with a bonding wire.

Here, we will discuss the positional relationship between the microcomputer (6) and the most closely related circuit element (8) placed adjacent to it. Figure 9 shows the socket (16) into which the microcomputer (6) is inserted and the circuit elements around it. (8) is an enlarged view of the main parts when placed on one board (2), and shows a socket (16) into which a microcomputer (6) is inserted and a plurality of circuit elements (such as chip-shaped LSIs and ICs). 8) is connected via a large number of conductive paths (5) as shown in FIG.
) In order to shorten the wiring of the microcontroller (6), the circuit elements (8) most closely related to the socket (16>) into which the microcontroller (6> is inserted) are placed adjacent to each other or as close as possible to each other. The conductive path (5) between the socket (16) into which (6) is inserted and the most closely related circuit element (8) can be formed in the shortest distance, allowing effective use of the mounting area on the board. (6>
The chip-shaped circuit element (8) placed near or adjacent to the circuit element (8) is bonded to the tip of the conductive path (5>) extending in the vicinity of the circuit element (8) by a wire, as shown in Fig. 9. It is electrically connected to a socket (16>) into which a microcomputer (6) is inserted.

By the way, the microcomputer (6) will be inserted into the socket (16>) and mounted on the exposed surface of the board (2>), and the entire microcomputer (6) will be exposed to the outside. Only the microcontroller (6) will be mounted outside the board, and all peripheral circuit elements (8) other than the microcontroller (6) will be mounted in the sealed space (2) formed by the board (2) and the case material (7).
1) will be placed within.

As mentioned above, the peripheral circuit elements (8) that are most closely connected to the microcomputer (6) are placed in the sealed space (21) formed by the substrate (2) and the case material (7). To be more specific, all elements including chip-shaped electronic components and resistance elements such as printed resistors and plated resistors are provided within the sealed space (21).

In this embodiment, when replacing the microcomputer (6),
To install the hybrid integrated circuit itself, remove the microcontroller (6〉) from the hybrid integrated circuit while it is attached (fixedly connected) to the board.
It can be easily replaced by inserting a microcomputer (6) containing another ROM.

A specific example of a hybrid integrated circuit device of an inverter for driving a motor using the present invention will be shown below.

A motor drive inverter is used to create an arbitrary alternating current power source from a direct current power source for boat fishing, and to arbitrarily control the rotational speed of a three-phase motor, for example.

That is, a DC power source obtained by rectifying a commercial AC power source using a rectifier circuit is used as a power source. The input DC power source is called the inverter main circuit, and it chops under a predetermined control signal using a three-phase bridge configured switch element to output pseudo AC to the load. By changing the control signal, the voltage and frequency of the output AC can be varied, and the rotation speed and torque of the motor can be variably adjusted.

The motor drive inverter will be briefly explained based on the block diagram shown in FIG.

FIG. 10 is a block diagram when a motor driving inverter is mounted on the integrated circuit board <2>.

The motor drive inverter includes a rectifier circuit (21) that inputs AC power and converts it into DC, and a DC power output from the rectifier circuit (21) that converts the DC power output from the rectifier circuit (21) at predetermined intervals to generate pseudo AC power to the load (motor). The inverter main circuit that supplies
22), a microcomputer (6) (hereinafter referred to as "My Fun") that supplies output signals for chopping the inverter main circuit (22) at predetermined intervals and output signals for operating other devices; a buffer (23) that amplifies the output signal as desired; a first interface (24) that transmits the amplified signal of the buffer (23) to a base amplifier (25) having a different potential; A base amplifier (25) that amplifies and supplies the signal transmitted from the interface (24) to the inverter main circuit (22), and detects the current supplied to the inverter main circuit (22) from the rectifier circuit (21). The heat generated in the inverter main circuit (22) is detected and a predetermined signal is fed back to the microcomputer (6) via the first interface (24).
2> and a protection circuit <26) that protects peripheral circuits, a second interface (27> that inputs and outputs signals with different potentials to and from the microcontroller (6), and a second interface (27) that inputs and outputs signals of different potentials to and from the microcontroller (6), and an external device that outputs output signals from the microcontroller (6). and an output buffer (28) for amplifying the signal to be supplied to the output signal.Each of the above-mentioned configurations will be briefly explained below.

First, the rectifier circuit consists of a well-known diode bridge circuit, which converts commercial alternating current into direct current. In the present embodiment, the rectifier circuit is constructed of chip components on the substrate, but if only the rectifier circuit is constructed externally, this may occur depending on the purpose of use, but there is no problem with the present invention.

Next, the inverter main circuit (22) is as shown in Figure 11.
Two series-connected switching elements (22a) (transistors, MOSFETs, IGBTs, etc.) are each connected in parallel (bridge connection). This embodiment will be explained using a transistor element. The explanation continues below. A flywheel diode is connected between the collector emitter and the lid of each transistor in the main circuit (22), and an output terminal (U, V, (22b) is an input terminal for input.

Next, as the microcomputer (6), for example, an LM8051P (manufactured by Sanyo) made into an IC chip is used.

Figure 12 is a professional diagram showing the basic configuration of a microcomputer, including a CPU (4a) that takes out and executes instructions, and a part of memory (4b) that stores predetermined program data.
) and an I10 port section (4c) for inputting and outputting data with external devices.Since there is nothing new about the microcomputer (6) itself, it will not be explained in detail here. The inverter main circuit (22) and desired external devices are controlled by the microcomputer (6).

Next, as the buffer (23), an IC chip such as LC4049B (manufactured by Sanyo) is used. This buffer (
23> is for amplifying the output signal from the microcomputer (6>) to a predetermined value.

Next, the first interface (24) is composed of a plurality of photocouplers, and is composed of, for example, an IC chip such as PCB 17 (manufactured by Sharp). The first interface (24) is a buffer (23) as described above.
The output signal output from the base amplifier (25) is transmitted by light to the base amplifier (25).

Next, the base amplifier (25) is connected to the first
A signal input terminal (25a) into which the signal output from the interface (24) is input, and an input terminal (25a>
The first circuit is supplied with a signal input from the circuit and is turned ON and OFF.
and a third transistor (ffr, > (Ir,), and a second transistor (Try) connected between the negative line and the first transistor (Try), to which the collector of the third transistor (Tr,) and its base are connected. Transistor (Ir)
, a resistor and a diode connected between the power supply lines, and a capacitor connected in parallel with the diode. Further, an output terminal (25b) is provided that connects between the first and second transistors and the base and emitter of each transistor of the inverter main circuit.
For example, the signal input terminal (25a) of the base amplifier (25)
), the first transistor (rr
t) and the third transistor (Tr,) are ONL, , the second
The transistor (Trs) is turned off. Then, a desired current is supplied from the power supply VD to the base of the inverter main circuit (22) via the first transistor (Trs) and the control resistor R1. Furthermore, when the signal is OFF, the first transistor (Try> and the third transistor ('r
rm) is 0FFL, and the second transistor <Trs> is set to O
Let N. And it speeds up the inverter main circuit (22〉) from the power source made of diodes and capacitors.

Next, the protection circuit (26) is provided near the inverter main circuit (22) as shown in FIG.
22), a temperature detection section (26a) consisting of a diode, etc., which detects a temperature rise due to heat generation, and a rectifier circuit (26a).
a current detection unit (26b) composed of a resistor that detects the current supplied from 1) to the inverter main circuit (22>);
A reference voltage section (26C) that forms an internal reference voltage, and a voltage comparison section (26d) that compares the output signals from the respective detection sections (26a) and (26b) with the signal output from the reference voltage section (26c). , and a protection and control signal output section (26e) that feeds back signals from the voltage comparison section (26d) to the microcomputer (6).

Next, the second interface (27> is composed of a plurality of photocoupler like the first interface (24), and the signals input and output from the microcomputer (6) and the input terminals Ss and St are sent to the microcomputer (6). It is intended to be communicated to the public.

Finally, the output buffer <28> is an IC chip such as LC4049B (manufactured by Sanyo), similar to the buffer (23>), and amplifies the signal from the microcontroller (6) and outputs it to the output terminals PO, ~PO1. It outputs a signal.

The operation of the motor drive inverter will be briefly explained below.

When commercial alternating current is input from the terminal (21a), it is converted into direct current by the rectifier circuit (21) as described above. The converted DC current is supplied to the inverter main circuit (22>. The output terminals (U, V
, W) is connected to the load (motor), 15! to supply the desired current to the load.

Input/output terminals S,, S,, digital input terminals, ~D5,
When a predetermined control or command signal is input from each of the analog input terminals A, ~A, the microcomputer (6) operates based on the input signal.

That is, based on the input signal, a control signal is output that executes a predetermined process based on the program data in the memory stored in the microcomputer (6).The control signal is amplified by the buffer (23). and is supplied to the base amplifier (25>) via the first interface (24).

The signal supplied to the base amplifier (25>) is supplied to the base of each transistor element of the inverter main circuit (22), and the signal is supplied to the base of each transistor element of the inverter main circuit (22).
N, OFF to chop the direct current to form a pseudo alternating current, supply the alternating current to the load via the output terminals (U, V, W), and rotate the load at a predetermined rotation speed.

In other words, the inverter main circuit (22) chops the direct current and converts it into alternating current based on predetermined program data in the microcomputer (6).
A separate power supply is always applied to 5) via the I-VD4 terminal.

If the program data in the microcomputer (6) mentioned above is converted, that is, if it is converted to another microphone, the rotation can be controlled according to the program data stored in the microcomputer.

The signals output from the output terminals PO, ~PO1 are sent to the microcomputer (6) based on the input commands input to the microcomputer (6).
outputs a signal based on the result of predetermined signal processing. Output signals output from output terminals PO0 to PO1 control external equipment or devices. For example, in the case of an inverter air conditioner, electromagnetic relays, valves for adjusting refrigerant, etc. are controlled in a predetermined manner in response to changes in indoor temperature.

While the inverter is operating as described above, the temperature on the inverter system, that is, the board (2), is designed to be below the rated maximum temperature. If used in The temperature detection section (26g) of (26) detects an abnormal temperature and stops the inverter operation to suppress the heat generation of the inverter and protect the center or system. is connected to a load, but there may be a short circuit due to an abnormality in the wiring inside this load, or the output terminals (U, V
, W) or due to external noise.
) If the series connected elements of the inverter main circuit (22) turn ON at the same time due to a malfunction of the inverter main circuit (22), an abnormally large current will flow to the inverter main circuit (22). The section (26b) detects the large current and immediately stops the operation for protection.

By performing the above-described operations, the motor drive inverter is operated, and the rotation of the load (motor) and the operation of external equipment are controlled in a predetermined manner, so that, for example, the control of an inverter air conditioner etc. is operated normally.

FIG. 15 is a plan view showing the case where the motor drive inverter circuit shown in FIG. 10 is mounted on the board (2) of this embodiment, and the reference numeral of each circuit element to be mounted is the block in FIG. 10. The numbers are the same as those shown in the figure. Note that since the conductive paths connecting the plurality of circuit elements are complicated, they are shown by arrows.

As shown in FIG. 15, a plurality of fixing pads (3a) to which external lead terminals (12a, 12b) are fixed are provided at opposing peripheral edges of the substrate (2).Fixing pads (3a) ) A socket (16) on which a plurality of circuit elements and a microcomputer (6) are mounted is fitted and fixed at a predetermined position on the conductive path (5>). Multiple circuit elements other than (6) are fixed, (
22) is the inverter main circuit, (21) is the rectifier circuit, (2
5) is a base amplifier, (23) is a buffer, (24) is a first interface, (27> is a second interface, (28) is an output buffer, and (26) is a protection circuit.

As is clear from FIG. 15, the socket (16) in which the microcomputer (6) is mounted is located adjacent to the circuit element (here, the buffer, output buffer) closely related to the microcomputer (6) and the board (2). ) into the hole (4) provided in the hole (4), and
It is connected to the conductive path (5>). Furthermore, the area surrounded by the - dotted chain line indicates a fixing area to which the case material (7>) is fixed with an adhesive sheet.

Figure 16 shows the case material (
FIG. 7 is a plan view of the completed product of the hybrid integrated circuit device for an inverter when the board (7) is fixed, and only the microcomputer (6) is exposed from the top surface of the board (2). That is, the microcomputer (6) All other elements except for the case material (7) and the board (
The microcomputer (6) is sealed in the sealed space (21) formed by the microcomputer (2) and only the microcomputer (6>) is exposed to the outside.
6> can be inserted and removed as desired.

That is, in this embodiment, as shown in FIGS. 15 and 16, only all the peripheral circuits necessary for inverter control are formed on the substrate (2).
>Only the peripheral circuits necessary for inverter control are formed on the top, and by simply replacing the mask ROM type microcontroller (6) inserted into the socket (16), a single board consisting of two boards can be installed. It becomes possible to instantly install different microcomputers (6) in a hybrid integrated circuit device.

More specifically, as shown in FIG.
Suppose that it is inserted into . If you want to rotate the motor with the waveform of (B) using this hybrid integrated circuit device, by inserting the microcomputer (6) for (B), you can change the rising waveform of the same hybrid integrated circuit device, that is, the rotation speed of the motor, as desired. can be changed instantly.

Furthermore, as a matter of course, the microcomputer (6>) having the waveform of (C) is also replaced in the same way.

As mentioned above, in this embodiment, the minimum peripheral circuitry necessary for inverter control is formed on the board (2), and the socket (1) is formed on the board (2).
Attachment/detachment (replacement) of a different microcomputer (6) via 6>
This makes it possible to implement microcontrollers with different data in one hybrid integrated circuit device. the result,
Devices having different motor rise waveforms can be instantaneously realized with one high-density hybrid integrated circuit device.

In preparation for the diversification of product specifications, the microcontroller (6) of the hybrid integrated circuit device of the motor drive inverter detailed above is used to change specifications or drive as requested by set manufacturers (users) such as destinations, OEMs, and in-house sales. It is possible to easily deal with problems such as uneven rotation due to subtle design errors in the motor itself.
Circuit configurations other than > were designed in advance to accommodate various specification changes, but if a hybrid integrated circuit is designed based on the specifications of a specific user or a specific motor, errors caused by other users or the motor itself may occur. In the past, if the specifications did not match, it was necessary to reconsider the design of the hybrid integrated circuit itself.

However, in the hybrid integrated circuit device of the present invention, the microcomputer (6) is mounted on the exposed surface side of the board (2) via the socket (16), and only the microcomputer (6) is exposed.
Since the microcontroller (6) can be removed, a hybrid integrated circuit device for mounting various types of microcontrollers can be realized with one hybrid integrated circuit device by simply selecting and mounting a microcontroller on the user's side or after mounting.

According to the present invention, the holes (4) are formed at desired positions on the substrate <2>.
and connect it to the conductive path (5), and insert the socket (16) so that the lead pin insertion part faces outward in the hole (4)
The microcomputer (6) is inserted into the socket (16), and all circuit elements (8) are placed in the sealed space (21) formed by the board (2) and the case material (7). By doing so, it is possible to provide a system in which the hybrid integrated circuit and the microcomputer are integrated and downsized, and the microcomputer (6>) can be inserted and removed at will.

Therefore, microcontrollers (6) of different types or the same type prepared in advance can be attached and detached from one hybrid integrated circuit device, and for example, as shown in FIG. Each microcontroller with
6) can be implemented in a single hybrid integrated circuit device, and moreover, without any new development.The merits of this are great.

(G) Effects of the Invention As detailed above, according to the present invention, firstly, the substrate (2
A hole (4) is provided at a desired position in the board (2), and a microcomputer (6) is connected to a socket (16) that is fixed in the hole (4) and connected to a desired conductive path (5) on the board (2). This has the advantage that the mounting position of the microcomputer (6) can be arbitrarily selected. Therefore, the most closely related circuit elements can be placed adjacent to the microcomputer (6).
> and circuit elements can be realized with the shortest distance or the easiest layout to design.
Loss in packaging density due to data line routing can be minimized.

Second, since the microcomputer (6) is placed in the socket (16) fitted into the hole (4) provided at the desired position of the board (2), a commercially available molded microcomputer (6) can be used. It has the advantage that it can be handled as an integrated compact hybrid integrated circuit device.Furthermore, by improving the packaging density of the peripheral circuit elements incorporated on the integrated circuit board (2), The board can be eliminated, and a hybrid integrated circuit device that has one miniaturized microcontroller (6) removably built in can be realized.Furthermore, since only the microcontroller (6) protrudes outside the board and is exposed, the microcontroller (6) can be easily attached and detached.

Thirdly, by fitting the socket (16) into the integrated circuit board (2) and exposing only the microcontroller (6) to the outside, the mounting structure shown in FIG. However, in the present invention, the microcomputer (6) inserted into the socket (16) can be replaced, and a single hybrid integrated circuit device can be used to implement different types of microcontrollers or the same type of microcontroller (6).
> can be installed. As a result, devices with different controls can be instantaneously provided with one hybrid integrated circuit device.

Fourthly, by using a metal substrate as the integrated circuit board <2>, its heat dissipation effect can be greatly improved compared to that of a printed circuit board, which can further contribute to an improvement in packaging density. Furthermore, by using copper foil (11) as the conductive path (5), the resistance value of the conductive path (5) can be significantly reduced compared to conductive paste, and the circuit to be mounted can be expanded to the same level or more than that of a printed circuit board.

Fifth, since a commercially available dual in-line type, LCC type, or QIP type microcomputer can be used, there is an advantage that the microcomputer (6) can be implemented extremely easily in a hybrid integrated circuit device.

Sixth, the microcomputer (6) and its peripheral circuit elements (
8) is incorporated in the sealing space (21) formed by the case material (7) and the integrated circuit board (2) in the shape of a goose or a chip, so compared to a resin molded one like a conventional printed circuit board. This has the advantage that the area occupied is extremely small and the packaging density can be greatly improved.

Seventhly, by substantially matching the peripheral edges of the case material (7) and the integrated circuit board (2), almost the entire surface of the integrated circuit board (2) can be used as a sealed space (21), which reduces the packaging density. Combined with this improvement, an extremely efficient hybrid integrated circuit device can be realized.

Ninth, by inserting the microcomputer (6) into the socket (16) fitted to the board (2), the result is a structure in which only the microcomputer (6) is placed on the exposed surface of the board (2). The microcomputer (6) can be attached and detached with the hybrid integrated circuit attached to the mounting body.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing this embodiment, and Fig. 2 is an I-
3150 is a sectional view taken along I-1 in FIG. 1, FIG. 4 is a sectional view of the board used in this embodiment, and FIGS. 5 to 8 are resin-molded microcontrollers used in this embodiment. 9 is an enlarged perspective view of essential parts showing the vicinity of the microcomputer on the board, FIG. 10 is a block diagram showing the motor drive inverter used in this example, and FIG. 12 is a block diagram showing the microcomputer of the inverter shown in FIG. 10, FIG. 13 is a circuit diagram showing the base amplifier of the inverter shown in FIG. 10, and FIG. The figure is a block diagram showing the inverter protection circuit shown in Fig. 10, and Fig. 15 is a plan view when the block diagram shown in Fig. 10 is mounted on a board.
Figure 16 is 15ei! FIG. 17 is a characteristic diagram showing the rising waveform of the motor, and FIGS. 18 and 19 are perspective views showing a conventional microcomputer mounting structure. (1)...hybrid integrated circuit device, (2>...integrated circuit board, 5>...conducting path, (4)...hole,
8〉・・・Circuit element, (6〉・・・My fan,
(7>... Case material, (16)... Socket. Fig. 3 Fig. 4 Fig. 5 Fig. @ 6 Zuso 7 Fig. 8 Fig. 11 Fig. 2 6 Microcomputer ＼ Fig. 13 Fig. 14 Fig. 17 Figure between PIIT

Claims (10)

[Claims] (1) An integrated circuit board, a conductive path having a desired pattern formed on the board, a resin-sealed microcomputer connected to the conductive path and containing desired program data, and a predetermined program from the microcomputer. a peripheral circuit element to which a control output signal is supplied and connected to a conductive path on the substrate, and a case material integrated with the substrate, a hole is provided at a desired position of the substrate, and a hole is provided in the hole. A hybrid integration characterized in that the microcomputer is inserted into a socket that is fixed and connected to a desired conductive path of the substrate, and the peripheral circuit elements are arranged in a sealed space formed by the substrate and the case. circuit device. (2) The hybrid integrated circuit device according to claim 1, wherein a metal substrate whose surface is insulated is used as the integrated circuit board. (3) The hybrid integrated circuit device according to claim 1, wherein the peripheral edge of the substrate and the peripheral edge of the case material are substantially aligned. (4) The hybrid integrated circuit device according to claim 1, wherein copper foil is used as the conductive path. (5) The hybrid integrated circuit device according to claim 1, wherein the microcomputer is of a dual in-line type, an LCC type, or a QIP type resin molded. (6) The hybrid integrated circuit device according to claim 1, wherein the hole and the socket are mechanically sealed. (7) The hybrid integrated circuit device according to claim 1, wherein a chip resistor or a chip capacitor is used as the peripheral circuit element. (8) The hybrid integrated circuit device according to claim 1, wherein the socket is connected to a conductive path of the substrate. (9) The hybrid integrated circuit device according to claim 1, wherein a plurality of microcomputers are prepared in advance, and one of the prepared microcomputers is selectively and arbitrarily inserted into the socket. (10) The hybrid integrated circuit device according to claim 1, wherein the microcomputer inserted into the socket is removed, and a different type or the same type of microcomputer is inserted into the case material.