JPH0397256A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To eliminate the lead wires of conductive channels by a method wherein a microcomputer is arranged on one side of a case member fixed by forming two sheets of substrates into one body so as to be connected to the conductive channels on the respective substrates. CONSTITUTION:Two sheets of substrates 2, 3 are fixedly formed into one body as if holding a case member 7 while a microcomputer 6 is arranged on one side of the case member 7. That is, the microcomputer 6 is connected to the conductive channels 5 of the respective substrates 2, 3 so as to be mounted on the two sheets of substrates 2, 3. That is, the microcomputer 6 is connected to the conductive channels through the intermediary of a pair of sockets 16 fixed on the conductive channels 5 on the peripheral parts of the respective substrates 2, 3. The case member 7 formed of a thermoplastic resin of an insulating member isolates the two sheets of the substrates 2, 3 at specific interval to be formed in a frame shape in specific thickness so as to form a sealing space 21. Furthermore, a pair of sockets 16, i.e., holes 4 to contain the microcomputer 6, are provided on one side of the case member 7.

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a hybrid integrated circuit device with a built-in microcomputer, in which a resin-sealed microcomputer is mounted on an integrated circuit board.

(B) Conventional technology A microphone T7 computer with built-in memory information written by a mask ROM is often used in various electronic devices.This microcomputer, together with a control or drive integrated circuit, Most of them are mounted on printed wiring boards. Various electronic devices that require smaller size and lighter weight are equipped with semiconductor integrated circuit (IC) chips on printed wiring boards using a technique called chip-on-board. is mounted directly on the microcomputer, and after the necessary wiring is applied, the IC chip, including the wiring, is coated with resin, achieving extremely small size and light weight.The mounting structure of such a conventional microcomputer is 16th
To explain according to the figure, No. 1613U is a perspective view with a partial cross section of a conventional microcomputer, which is an insulating film made of glass, epoxy resin, etc., with conductive wiring bags (41) formed on the main surface. Board (42)
A microcomputer (44) built into a cerdip package is installed in the through hole (43) of the header (44).
45) and a metal tab (46〉), and the header (46〉)
5> is an external lead (48) on the ceramic base material (47).
〉 or bonded with a low melting point glass material. In addition, this header (45) has an element mounting part (50) made of sintered so-called gold paste, which is glass mixed with a large amount of gold powder, which is adhered to the low melting point glass material or ceramic base material (47). A microcomputer chip (51) is mounted on the element mounting portion (50), and the electrodes of this chip (51) and the external leads (48) are connected by thin metal wires (52).This cap (46) The microcomputer chip (51) placed in the header (45>) is sealed with low melting point glass. ) The external lead (48) is inserted into the through hole (43) and fixed with solder.
> is routed as required by a conductive wiring pattern (41), and is connected from a male connector terminal portion (55) provided at the end of the insulating substrate to a female connector (not shown). Now, the mounting structure of such a conventional microcomputer element has an extremely large package external shape compared to a microcomputer chip (51), and has a three-dimensional surface area, that is, a height several times the height of the chip, and is thin. It is extremely disadvantageous for Furthermore, after the external lead is inserted into the through hole <43>, it is necessary to fix it with solder or the like. Another major drawback that should be noted is that the microcomputer elements must be assembled into a package before being mounted on an insulating substrate. Although a cerdip package type microcomputer element has been described here, the above-mentioned problem also occurs in a resin-sealed package.

The implementation structure shown in Figure 17 has already been used to solve this problem. The microcomputer mounting structure shown in Figure 17 will be explained below. An insulating substrate such as a glass or epoxy resin board with a conductive wiring pattern (60b) formed on the main surface (60a) <6
0) has a chip mounting area (60c) for mounting a microcomputer chip (61>), and the wiring pattern (60b) extends from the vicinity of this area to the main surface (60).
a) It is routed above and connected to a male connector terminal (not shown). A microcomputer chip (61) is mounted in the area (60c), and this chip (60c) is equipped with a microcomputer chip (61).
The surface electrode of 1) and the wiring pattern (60b) are connected by a thin metal wire (62>. Of course, the thin metal wire (60b)
One of the wires 2) is wired with the wiring pattern (60b) on which the chip (61) is mounted, in order to connect to the substrate of the chip (61). As mentioned above, mounting a microcomputer chip directly on a substrate is already a well-known technology. Various types of microcomputers, for example, three types of microcomputers are mounted on the microcomputer-mounted printed circuit board integrated circuit shown in FIGS. 16 and 17 above, and as shown in FIG.
In order to realize a printed circuit board integrated circuit having different motor rise waveforms (B) and (C), it is necessary to create a printed circuit board with different motor rise waveforms (A>, (B), and (C)). Using a microcontroller with built-in data, three printed circuit boards corresponding to three types of microcontrollers had to be developed and integrated on each printed circuit board.Here, Figure 15 shows the motor. This shows the patterns of the control method for the rotation speed at startup when controlling the rotation. (A) gives a high rotation speed at the beginning and then obtains stable rotation, (B) the control method starts slowly at the beginning. (C) is one in which the rotation speed is gradually increased and stabilized.

(c) Problems to be Solved by the Invention In the microcomputer mounting structure shown in FIG. 17, since the microcomputer chip is die-bonded onto the printed circuit board, it goes without saying that it is miniaturized. However, the miniaturization referred to here is only the miniaturization of the microcomputer itself. That is, the 17th
Although it is not clear from the diagram, the peripheral circuit elements fixed around the microcomputer are disk J.
Since it is made up of electronic components such as one chip, when looking at the entire system as an integrated circuit for a printed circuit board on which a microcomputer is mounted, there is no miniaturization at all, and the printed circuit board is enlarged as before. There is a problem in that the entire system becomes larger. Furthermore, as mentioned above in the microcomputer mounting structure shown in FIG. This requires three printed circuit boards that are compatible with three types of microcontrollers, and each must be developed separately, resulting in a large loss of development time and many problems that result in high costs. Furthermore, in the mounting structure shown in Fig. 17, as mentioned above, it is almost impossible to remove the microcomputer chip that controls the inverter motor, so the standard for the motor controlled by the microcomputer is a preset standard. There is a problem in that vibrations occur due to uneven rotation of the motor when there is a slight misalignment.

In other words, when manufacturing motors, not only motors used for inverters, certain standards are set in advance.
In reality, when motors are manufactured, they are manufactured with slight deviations from the established specifications. This subtle error causes the normal output signal output from the inverter to become a defective signal, causing the problem that the rotation of the remoter cannot be kept constant. Therefore, in the structure shown in Fig. 17, as mentioned above, the microcomputer cannot be removed and removed, which causes errors in the motor itself, and even if problems such as uneven rotation occur when a unit is formed, it can be used as is. Or, even if it is replaced, the entire unit must be replaced, resulting in a large loss in terms of cost and work. In addition, in the mounting structure shown in FIG. 16, the microcomputer mentioned above can be attached and detached from the printed circuit board, so it is relatively easy to replace different types of microcomputers as mentioned above. It's easy to do. However, in the mounting structure shown in FIG. 17, as in the case of No. 16150, the circuits around the microcomputer, that is, the circuit elements such as LSI and IC, are composed of discrete electronic components, so the printed circuit board becomes larger. In other words, there is a major problem in that the entire system becomes larger and it is not possible to provide integrated circuits equipped with microcomputers that are light, thin, short, and small as required by users. Furthermore, in the mounting structure shown in FIGS. 16 and 17, the peripheral circuits of the microcomputer to be fixed and mounted are fixed on one large printed circuit board, and the circuit configuration or electronic components corresponding to the electronic equipment used are fixed. A printed circuit board equipped with a microcomputer could only be used in one electronic device. In other words, the peripheral circuits on the printed circuit board used for motor control of inverter air conditioners are configured as peripheral circuits related to inverter air conditioners, so they can only be used for inverter air conditioners and cannot be used for electronic equipment in other fields, such as sewing machines and laundry machines. There is a problem that it cannot be used for machines, blowers, etc. Furthermore, in the microcomputer mounting structure shown in FIGS. 16 and 17, the entire system becomes larger as described above, and the conductive patterns that interconnect the microcomputer and its peripheral circuit elements are exposed, making it less reliable. There is a problem of decreased sexual performance. Furthermore, in the microcomputer mounting structure shown in Figures 16 and 17, the microcomputer and its surrounding I/O
Since circuit elements such as C and LSI are exposed, there is a problem that unevenness occurs on the top surface of the board, making it difficult to handle and reducing workability. (2) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and a microcomputer is disposed on one side of a case material that fixes and integrates two integrated circuit boards. It is characterized in that it is connected to a conductive path formed on a substrate, and all its peripheral circuit elements are arranged in a sealed space formed by two substrates and a case material. The mounted hybrid integrated circuit can be miniaturized, and circuit elements can be mounted on the entire surface of two substrates, making it possible to provide a hybrid integrated circuit device with a built-in microcomputer that is mounted in high density. As described above, according to the present invention, the microcomputer is disposed on one side of the case material that fixes and integrates the two boards, and is connected to the conductive path on each board. The mounting position can be set arbitrarily, and considering the electrical connection between the built-in microcomputer and the most related circuit elements, it is possible to efficiently connect the microcomputer and the most related circuit elements. In addition, the most closely related peripheral circuit elements can be placed adjacent to the microcomputer, and data lines for exchanging data between the microcomputer and the peripheral circuit elements can be eliminated. This can be achieved with the shortest distance or minimum distance, and the loss of packaging density due to data line routing can be minimized, allowing for high-density packaging.Furthermore, with the present invention, all elements other than the microcomputer can be mounted on a chip. To provide a hybrid integrated circuit device which is compact and easy to handle because it is mounted on one of two substrates and housed in a sealed space formed by a case material and a substrate. Furthermore, in the present invention, since the microcomputer is arranged on the side of the case material, the microcomputer can be easily attached and detached, and various types of microcomputers can be selected and installed in one integrated circuit. can do.

(F) Embodiment The hybrid integrated circuit device of the present invention will be explained in detail based on the embodiment shown in FIGS. 1 to 15 below. An example hybrid integrated circuit device (1) is shown. This hybrid integrated circuit device (1) is used as an independent electronic component and is used as an integrated circuit having independent functions in a wide range of inverter motor fields such as inverter air conditioners. used.

This hybrid integrated circuit device (1) is formed on two integrated circuit boards (2) and (3), and two integrated circuit boards (2) and (3), as shown in Figures 1 and 2. A conductive path (5) with a desired shape, a microcomputer (6) (hereinafter referred to as microcomputer) connected to the conductive path (5), and a microcomputer (6) connected to the conductive path (5).
) and its peripheral circuit element (6>) which is supplied with a control output signal and connected to the conductive path (5>) on the board (2) (3), and the two boards (2) (3) are separated. It is composed of a case material (7) that is fixed and integrated.

The two integrated circuit boards (2) and (3) are made of hard substrates such as ceramics, glass epoxy, or metal, and in this embodiment, metal substrates with excellent heat dissipation and mechanical strength are used.

For example, the metal substrate is 0.5 to 1. Ql! A III-thick aluminum substrate is used. The two boards (2) (3
As shown in Fig. 4, an aluminum oxide film (9) (alumite layer) is formed on the surface of the aluminum oxide film (9) (alumite layer) by well-known anodic oxidation. 10) is pasted. Further, on the insulating resin layer (10) is a copper foil (11) with a thickness of 10 to 70μ.
is attached simultaneously with the insulating resin layer <10> by means such as a roller or hot press. By the way, the two substrates (2) and (3) are connected to each other with a predetermined distance between them by a flexible insulating resin layer 10). In the wood example, each board (2) (3) is connected using a film, but it is also possible to separate each board (2) (3) without using a film and connect them later with metal leads. It is possible.

Copper foil (
On the 11〉 surface, a conductive path of a desired shape is exposed by screen printing and masked with a resist, and a noble metal (gold, silver, platinum) plating layer is plated on the copper foil (11〉 surface).
After that, the resist is removed and the copper foil <11> is etched using the precious metal plating layer as a mask to form the desired conductive path (5).
〉 is formed. Here, conductive paths (
The thinness of 5〉 is limited to 0.5 mm, so when an ultra-fine wiring pattern is required, a well-known photo-etching technique is used to
It is possible to form ultrafine conductive paths (5) up to μ. Although the conductive path (5) formed on one substrate (2) is not shown, a thick conductive path for the power system for large signals is formed, and a thin conductive path for small signals is formed on the other substrate (3). A conductive path is formed.

The conductive path (5) on the other substrate (3) has a plurality of circuit elements (
8) is mounted, one board (2) and the other board (3
> The surrounding circuit elements (8) are mounted on the conductive path (5) above. In addition, a conductive path (5) is extended to the peripheral edge of one side or the opposing side of both substrates <2) (3), and a plurality of pads for fixing external lead terminals (12) and (13) are formed. has been done. This pad has an external lead terminal <1
2) (13) is fixed with solder. In addition, since the conductive path (5> formed on both substrates (2) and (3) is formed on the flexible resin layer (10>), it is possible to straddle the two substrates (2) and (3). By patterning, both substrates (2) and (3) can be connected at predetermined positions and arbitrarily.In this implementation, flexible resin is used to connect substrates (2) and (3). It is also possible to make connections using metal leads.As is well known, a microcomputer (6) is a program processor (6).
CPU), program memory, RAM, ROM,
This is an element that combines an input/output interface with a peripheral device. The structure of a typical microcontroller (6) is of the DIP (dual in line) type, as shown in Figures 5 and 6, and can be roughly divided into resin mold package type and ceramic package type. ．． If it is a DIP type microcontroller (6), either a resin mold type or a ceramic type package may be used. Since such a DIP type microcomputer is already well known, detailed explanation will be omitted. The type of microcontroller (6) is basically arbitrary; for example, a ceramic type or resin mold type LCC type, PLCC type, or QIP type package can also be used. EFROM devices of each type of LCC and PLCC has a structure in which connection electrodes are provided on the four sides of the bottom surface.In addition, although not shown in the figure, the QIP type package has lead terminals led out from each of the four sides and bent downward at a substantially right angle. There is.

In the present invention, it is possible to use a microcomputer (5) package having any of the DIP type, LCC type, PLCC type, and QIP type, but in this embodiment, the DIP type package, which is highly popular, is used. We will now explain an example using the microcomputer 6). The microcomputer (6) used in this embodiment will be explained using a mask ROM type microcomputer in which predetermined program data (ROM) is masked in advance. It is assumed that the two substrates (2) and (3) used in this example have substantially the same size. Also,
The present invention can be easily carried out even if the sizes are different. On the respective substrates (2) and (3), ICs of circuit elements (8) surrounding the microcomputer (6), }- transistors, chip resistors, chip capacitors, etc. are chip components and the desired conductive path (5)
The circuit element (8) is attached to the top by soldering or a brazing material such as Ag paste, and is connected to the nearby conductive path (5) by bonding. ．． Furthermore, a carbon resistor by screen printing or a nickel-plated resistor by nickel plating is formed as a resistance element between the conductive paths (5). The two boards (2) and (3) mentioned above are fixed and integrated so as to sandwich the case material (7>), and the microcomputer (6) is arranged on one side of the case material (7>). The microcomputer (6) is connected to the conductive paths (5) of the respective substrates (2) and (3), and is mounted on the two substrates (2 and 3). 6> is each board <2>
It will be connected to the conductive path (5) through a pair of sockets (16) fixed on the conductive path (5) at the peripheral end of (3). It is made of plastic resin and is formed into a frame shape with a certain thickness in order to separate the two substrates (2) and (3) by a predetermined distance and form a sealed space (21) as shown in Fig. 3. has been done. A socket (16), that is, a hole (4) for accommodating a microcomputer (6), is provided on one side of the case material (7).

The hole (4) can accommodate the microcomputer (6) and the socket (16), and is formed to have substantially the same external shape as the microcomputer (6). Also, it is made slightly larger than the microcomputer (6) in order to easily insert and remove the microcomputer (6). Furthermore, when the substrates (2) and (3) are placed on the other side of the case material (7) where the hole (4) is provided, the resin layer (
10) is formed into an arc shape so that it can be easily bent. The case material (7) and the two substrates (2) and (3) are fixed together using an adhesive sheet, and the case material (7) is bonded to both substrates (2) and (3) connected by the film resin layer (10). The film resin layer (lO) connecting both substrates (2) and (3) is attached to the case material (7) mentioned above. Since it is bent by coming into contact with the provided arc-shaped part, there is no risk that the conductive path <5> at the bent part will be cut when bent.The case material (7> and both boards (2) and (3) Since the resin layer (10) of the connection part is exposed after integrating the parts, in this embodiment, the exposed connection part is completely sealed with the lid (20). ) is made of the same material as the case material (7>), and is bonded by a predetermined means such as the above-mentioned adhesive sheet.

When the case material (7) and the two boards (2) and (3) are fixed and integrated, the microcomputer ( 6) is arranged. That is, a plurality of conductive paths (5) connected to the microcomputer (6>) are formed at the peripheral edge of the substrate (2) and (3) to which the hole (4) is fixed, A socket (16) for connecting a microcomputer (6) is soldered onto each of the conductive paths (5).The sockets (16) are formed in a pair as shown in Fig. One lead of the type microcomputer (6) is inserted into one socket (16), and the other lead is inserted into the other socket (16>) for connection.

That is, the microcomputer (6) is mounted across both boards (2) and (3) via a pair of sockets (16). ) is extended to the vicinity of the circuit element (8>) most related to the microcomputer (6>) and electrically connected with the bonding wire. 8) is placed near the socket 16) provided on one of the boards.Here, we will discuss the positional relationship between the microcontroller (6>) and the most closely related circuit element (8>) placed adjacent to it. Figure 7 shows one of the sockets (16) into which the microcontroller (6>) is inserted, and the circuit elements (8>) related to the microcontroller (6>).
This is an enlarged view of the main parts when the and is placed on the other board (3), and the microcomputer (6) and multiple circuit elements such as chip-shaped LSIs and ICs (8) are as shown in FIG. Since it is connected via a large number of conductive paths (5), the conductive path (5)
In order to shorten the wiring, one socket (16) into which the microcomputer (6) is inserted and the circuit element (8) most related to the microcomputer (6) should be placed adjacent to each other or as close as possible. Therefore, the microcomputer (6) and the circuit elements related to the microcomputer (6) (8)
The conductive path (5) can be formed with the shortest distance, and the mounting area on the board can be used effectively.
6〉 is inserted into the socket (16〉) and a plurality of chip-shaped circuit elements (
8) is connected by bonding with the tip of the conductive path (5) extending near the circuit element (8) by a wire line, and the microcomputer (6) is inserted into the socket (l6) as shown in Fig. 7. It is electrically connected to the conductive path (5>).

By the way, the microcomputer (6) is housed in the hole (4) made in the case material (7) and connected to the respective boards (2) and (3), so that only the top surface of the microcomputer (6) is exposed to the outside. At this time, the upper surface of the microcomputer (6) and the side surface of the case material (7> should be set when storing the microcomputer (6) in the hole (4) so that they almost match. As a result, Only the microcomputer (6) is exposed through the hole (4), and all other peripheral circuit elements (8) are exposed through the sealed space (21) formed by both substrates (2) (3) and the case material (7). As mentioned above, the most related circuit element (8) connected to the microcontroller (6) and its surrounding circuit elements (8) are placed on two boards (2) and (3). In other words, all elements including chip-shaped electronic components and resistance elements such as printed resistors and plated resistors are sealed. It is provided within the stop space (21>).

By the way, the case material (7) where the microcomputer (6) is exposed
A sealing material (not shown) is glued onto the hole (4) provided on one side, and the microcomputer (6) is completely sealed. In this example, the microcomputer (6) is replaced. If you do,
With the hybrid integrated circuit itself attached (fixedly connected) to the mounting board, remove the microcontroller (6) from the hybrid integrated circuit,
It can be easily replaced by inserting a microcomputer (6) with a different built-in ROM.

A specific example of a hybrid integrated circuit device of an inverter for moke driving using the present invention will be shown below.

A motor drive inverter generally generates an arbitrary alternating current power source from a direct current power source, and arbitrarily controls, for example, the rotation speed of a three-phase motor.

That is, a DC power source obtained by rectifying a commercial AC power source using a rectifier circuit is used as tm. The input DC power source is called the inverter main circuit, which uses switching elements in a three-phase bridge configuration to chop under a predetermined control signal and output pseudo-AC to the load. By changing the load control signal, the voltage and frequency of the output AC can be varied, and the rotation speed and torque of the motor can be variably adjusted. The motor drive inverter will be briefly explained based on the block diagram shown in FIG.

Figure 8 is a block diagram when the motor drive inverter is mounted on the integrated circuit boards (2) and (3). The motor drive inverter has a rectifier circuit (21) that inputs AC power and converts it into DC, and chops the DC power output from the rectifier circuit (21) at predetermined intervals to supply pseudo AC to the load (motor). an inverter main circuit (22),
A microcomputer (6) (hereinafter referred to as microcomputer) that supplies output signals that cause the inverter main circuit (22) to chop at predetermined intervals and output signals that operate other devices; A buffer (23) that amplifies the signal as desired, and a buffer (23) that amplifies the signal as desired.
a first interface (24) that transmits the signal amplified by 3) to a base amplifier (25) with a different potential; and a first interface (24) that transmits the signal amplified by The current supplied to the inverter main circuit (22) from the base amplifier (25) and the rectifier circuit (21) that is amplified and supplied is detected, and the heat generation of the inverter main circuit (22) is detected and the first interface ( A protection circuit <26> protects the inverter main circuit (22) and peripheral circuits by feeding back a predetermined signal to the microcontroller (6) via the microcontroller (6).
), and an output buffer (28) that amplifies the output signal output from the microcomputer (6) in order to supply it to an external device. Each of the above-mentioned structures will be briefly explained below. First, the T-current converter is composed of a well-known die-cut bridge circuit, which converts commercial alternating current into direct current. In the example, the rectifier circuit is constructed of chip parts on the board, but if only the rectifier circuit is constructed externally, this may occur depending on the purpose of use, but there is no problem with the present invention.Next, there is no problem with the present invention. As shown in FIG. 9, the circuit (22) consists of two switching elements (22a) (
Transistors, MOSFETs, IGBTs, etc.) are connected in parallel,! ! (bridge connection). This example will be explained using a transistor element. The explanation continues below. A flywheel die is connected between the collector emitter of each transistor in the main circuit (22), and output terminals (U, V ,W
) is provided. Further, (22b) is an input terminal for input. Next, as the microcomputer (6), for example, an IC chip of LM8051F (manufactured by Sanyo) is used.

FIG. 10 is a block diagram showing the basic configuration of a microcomputer, including a CPU (4a) that takes out and executes instructions;
Part of the memory where a given program data is stored (
4b) and an I/O device for inputting and outputting data with external devices.
It consists of an O port section (4c). Microcomputer (6
) itself is not new, so it will not be explained in detail here. This microcomputer (6) controls the inverter main circuit (22) and desired external devices. Next, the buffer 《23) is LC4049B (
An IC chip (manufactured by Sanyo) or the like is used. This buffer (23) amplifies the output signal from the microcomputer (6) to a predetermined value. Next, the first interface (24) is made up of a plurality of photocouplers, for example, PC817 (manufactured by Shippuu Co., Ltd.).
It is composed of IC chips such as. As described above, the first interface (24) transmits the output signal output from the buffer (23) to the base amplifier (25) by means of light.

Next, the base amplifier (25) is connected to the first
A signal input terminal (25a) into which the signal output from the interface (24) is input, and an input terminal (2!5a)
> first and third transistors (Tr.) (ers) which are turned ON and OFF by being supplied with a signal input from
A first transistor (Ir+) to which the collector of the third transistor (rm>) and its base are connected, a second transistor (Tr.) connected between the negative line, and a resistor connected between the power supply line. and Dai Saiichido,
It consists of a die and a capacitor connected in parallel. Further, an output terminal (25b) is provided for connecting between the first and second transistors and the base and emitter of each transistor in the inverter main circuit. For example, the signal input terminal (25a) of the bass amplifier (25>)
When the ON signal is input to the first transistor ('l'
rt) and the third transistor (Trs) are ONL, and the second transistor (Irt> is OFF.Then,
A desired current is supplied from the power supply VD to the base of the inverter main circuit (22>) via the first transistor (I'r+) and the control resistor R+. Also, when the signal is OFF, the first transistor (τr+) and the 3 transistors (T
rm) turns OFF, and turns on the second transistor (Try). And it speeds up the life of the inverter main circuit (22) from the power source made of diodes and capacitors. Next, the protection circuit (26> is provided near the inverter main circuit (22>) as shown in FIG.
22) and a rectifier circuit (21).
A current detection section (26b) composed of a resistor that detects the current supplied from ) (26b) and a signal output from the reference voltage section (26c); and protection for feeding back the signal from the voltage comparison section (26d) to the microcomputer (6); The second interface (27) is composed of a control signal output section (26e) and a control signal output section (26e).
〉, it is composed of multiple photocouplers and transmits signals input and output from the microcomputer (6) and the input terminal SyusI to the microcomputer (6〉).Finally, the output buffer (28) Similar to (23), an IC chip such as LC4049B (manufactured by Sanyo) is used to amplify the signal from the microcomputer (6) and output the signal to the output terminals PO. to PO. The operation of the motor drive inverter will be briefly explained below.When commercial AC is input from the terminal (21a), it is converted to DC by the rectifier circuit (2l) as described above.The converted DC current is It is supplied to the inverter main circuit (22).The output terminals (U, V
, W) is connected to the load (motor) and supplies the desired current to the load. Input/output terminal S * + S Is digital input terminal D.
~D,, analog input terminal A. ~A. When a predetermined control or command signal is input from each input terminal of the microcomputer (
6) operates based on that input signal. That is, based on the input signal, it outputs a control signal that executes a predetermined process based on the program data in the memory stored in the microcomputer (6). The control signal is amplified by a buffer (23) and supplied to a base amplifier (25) via a first interface (24). The signal supplied to the base amplifier (25>) is supplied to the base of each transistor element of the inverter main circuit (22), and turns on and off each transistor element of the inverter main circuit (22>) to chop the DC and simulate it. It forms an alternating current and supplies the alternating current to the load through the output terminals (U, V, W) to rotate the load at a predetermined rotation speed. That is, based on the predetermined program data in the microcomputer (6). The inverter main circuit (22) chops the DC and converts it to AC.
5), a separate power supply is always applied through the VDI to V■ terminals. By converting the program data in the microcomputer (6) mentioned above, that is, by converting it to another microcomputer, the rotation can be controlled according to the program data built into that microcomputer. Output terminal P O e ~ PO.
The signal output from the microcomputer (6) is based on the result of predetermined signal processing performed by the microcomputer (6) based on the input command input to the microcomputer (6). Output terminal PO. ~P
O. The output signal output from the controller controls an external device or device. For example, in the case of an inverter air conditioner, electromagnetic relays, valves for adjusting refrigerant, etc. are controlled in a predetermined manner in response to changes in indoor temperature.

While the inverter is operating as described above, the temperature on the inverter system, that is, on the boards (2) and (3), is designed to be below the rated maximum temperature. , high humidity) or when heat dissipation is not performed properly, the inverter main circuit (22)
However, in this embodiment, the protection circuit 26 is
The temperature detecting section (26a) of the inverter detects an abnormal temperature and stops the operation of the inverter to suppress heat generation of the inverter and protect the set or system. Also,
A load is connected to the inverter main circuit (22), but a short circuit may occur due to an abnormality in the wiring inside this load, or the output terminal (U
, V, W) or a malfunction of the microcomputer (6) due to external noise, when the series connected elements of the inverter main circuit (22) turn ON at the same time, an abnormally large current flows into the inverter main circuit (22). Even in this case, the current detecting section (26b) in the protection circuit (26) detects the large current and immediately stops the operation for protection.

By performing the above-described operations, the motor drive inverter is operated, and the rotation of the load (motor) and the operation of external equipment are controlled in a predetermined manner, so that, for example, the control of an inverter air conditioner etc. is operated normally.

FIG. 13 is a plan view showing the case where the motor drive inverter circuit shown in FIG. 8 is mounted on the other board (3) of this embodiment, and the symbols of each circuit element to be mounted are shown in FIG. 8. The numbers are the same as those shown in the block diagram. Note that the conductive path connecting each of the plurality of circuit elements is jRH, so it is indicated by an arrow. A plurality of fixing pads (3a) to which external lead terminals (13) are fixed are provided at opposing peripheral ends of the fixing pads (3a).
) is fixed at a predetermined position on the conductive path (5) extending from the other board (3 > A plurality of circuit elements other than the microcomputer (6) are fixed on the top, (21> is a rectifier circuit, (25) is a base amplifier, (23) is a buffer, (24) is a first interface, ( 27) is the second interface, (
28> is an output buffer, and (26) is a protection circuit. In addition, a plurality of conductive paths (5) are connected to one substrate (2) from the substrate (3) via a film resin layer (10) such as polyimide.
is extended, and the inverter main circuit is mounted on the board (2).
Some of the circuits required for inverters such as 22〉 or optional circuits are arranged. As is clear from FIG. 13, one socket (of a pair of sockets) where the microcomputer (6) is mounted in a position adjacent to the circuit element most closely related to the microcomputer (6) (buffer, output buffer in this case) 16> is fixed. Also, the area surrounded by the dashed line is covered with an adhesive sheet and the case material (7
) indicates the fixed area to be fixed.

FIG. 14 is a plan view of the completed product of the hybrid integrated circuit device for an inverter when one substrate (2) is fixed on the other substrate (3) shown in FIG. 13 through a case material (7). Therefore, from the top surface of one substrate (2), only the top surface of the microcomputer (6) placed in the hole (4) of the case material (7) is exposed. All the other elements are sealed in the sealed space <21> formed by the case material (7) and the two substrates (2) and (3), and only the top surface of the microcomputer (6) is exposed. Therefore, the microcomputer (6) can be inserted and removed as needed.In other words, in this embodiment, as shown in FIGS. 13 and 14, the microcomputer (6) is Only all the peripheral circuits necessary for inverter control are formed.In other words, only the peripheral circuits necessary for inverter control are formed on the boards (2) and (3). 1
By simply replacing the mask ROM type microcomputer (6) inserted in the microcomputer (6), it becomes possible to instantly mount a different microcomputer (6) on one hybrid integrated circuit device composed of two substrates.

More specifically, as shown in FIG.
Suppose that it is inserted into . If you want to rotate the motor with the waveform of (B) using this hybrid integrated circuit device, by inserting the microcomputer (6) for (B), you can change the rising waveform of the same hybrid integrated circuit device, that is, the rotation speed of the motor, as desired. can be changed instantaneously to (
The microcontroller (6) having the waveform C) is also replaced in the same way. As mentioned above, in this example, two substrates (2) (3) are used.
) on which the minimum peripheral circuitry required for inverter control is formed, and a different microcomputer (6) is connected via the socket (16).
By making it possible to attach and detach (replace) microcontrollers with different data, it is possible to implement microcontrollers with different data on one hybrid integrated circuit device with two boards (2) and (3). As a result, devices having different motor rise waveforms can be instantaneously realized using one high-density hybrid integrated circuit device.

In preparation for the diversification of product specifications, the microcontroller (6) of the hybrid integrated circuit device of the motor drive inverter detailed above is used to change specifications or drive as requested by the destination, OEM, in-house sales, etc., set manufacturers (users). It is possible to easily deal with problems such as uneven rotation due to subtle design errors in the motor itself.
) The circuit configurations other than ) were designed in advance to accommodate various specification changes, but if a hybrid integrated circuit is designed based on the specifications of a specific user or a specific motor, errors caused by other users or the motor itself may occur. In the past, if something did not match the specifications, it was necessary to reconsider the design of the mixed integrated circuit itself. However, in the hybrid integrated circuit device of the present invention, the microcontroller (6) is mounted on each of the substrates (2) and (3) via a pair of sockets (16) provided on each of the substrates (2 and 3). Moreover, since its surface is exposed through the hole 4) provided on the side of the case material (7), the microcontroller (6) can be removed, allowing the user to select the microcontroller after mounting. A hybrid integrated circuit device for mounting various types of microcontrollers can be realized with a single mixed integrated circuit device by simply mounting the hole (4) on the side surface of the case material (7).
and each substrate (2〉(3) exposed through the hole (4)
) A microcomputer (6>) is connected to the conductive path (5) on the conductive path (5) via a pair of sockets (16), and a sealed space formed by the two substrates (2) (3) and the case material (7) By fixing the peripheral circuit element (8) to (21), it is possible to create a device that integrates the hybrid integrated circuit and the microcomputer, and has the great feature that the microphone can be easily inserted and removed as required.

Therefore, microcomputers (6) of different types or the same type prepared in advance can be attached and detached from one hybrid integrated circuit device, and, for example, as shown in FIG. Each of the microcontrollers 6) can be implemented in a single hybrid integrated circuit device, and moreover, it can be realized without any new development, which is a great advantage. (G) Effects of the Invention As detailed above, according to the present invention, first, a hole (4) is provided on one side of the case material (7), and each substrate exposed through the hole (4) is (2) Since the microcomputer (6) is connected to the conductive path (5) on (3), it has the advantage that the mounting position of the microcomputer (6) can be selected arbitrarily.
The most closely related circuit elements can be placed adjacent to 6), and as a result, the data line for exchanging data between the microcontroller (6) and the circuit elements can be realized with the shortest distance or the easiest layout. Loss in packaging density due to data line routing can be minimized.Furthermore, since it is formed from two substrates <2) (3), it is possible to provide a high-density and compact hybrid integrated circuit device. ．． Second
The microcomputer (6) is placed in the hole <4> made on one side of the case material (7), so even though a commercially available molded microcomputer (6) is used, it is an integrated compact microcomputer. It has the advantage of being handled as a hybrid integrated circuit device. Furthermore, by improving the mounting density of the peripheral circuit elements to be incorporated on the two integrated circuit boards (2) and (3), the conventionally required printed circuit board can be eliminated, resulting in a single miniaturized microcontroller (6). It is possible to realize a hybrid integrated VT circuit device that incorporates a removable VT circuit. Third, the integrated circuit board (2) (3) placed in the hole (4) provided in the case material (7) (
By providing a socket (
The microcontroller (6) inserted into the microcontroller (6) can be replaced, making it possible to install different or the same type of microcontroller (6) in one hybrid integrated circuit device. As a result, devices with different controls can be instantaneously provided with one hybrid integrated circuit device.

Fourthly, by using a metal substrate as the integrated circuit board (2) (3), its heat dissipation effect can be greatly improved compared to a printed circuit board, which can further contribute to an improvement in packaging density. In addition, by using copper foil (11) as the conductive path (5),
The resistance value of the conductive path (5) can be significantly reduced compared to conductive paste, and the mounted circuit can be expanded to the same level or more than that of a printed circuit board. Fifth, since it is possible to use a dual in-line type, LCC type, or QIP type that is commercially available as a microcontroller, it has the advantage that the microcontroller (6) can be implemented extremely easily in a hybrid integrated circuit device. Furthermore, case material (7
By making the outer shape of the hole (4) and the microcomputer (6) the same, it can be perfectly embedded in the frame (18) of the case material (7), creating a microcomputer-embedded hybrid integrated circuit device with an extremely neat shape. Sixth, the microcontroller (6) and its peripheral circuit elements (
8> is a case material (7>) and two integrated circuit boards (2) (3)
) is incorporated in the sealed space (21) formed by It has the advantage that it can be improved. Seventh, the case material (7) and two integrated circuit boards <2><<3
) by substantially matching the peripheral edges of the integrated circuit boards (2) and (3), almost the entire surface of the integrated circuit boards (2) and (3) can be used as the sealed space (21), which, together with improved packaging density, makes it possible to create an extremely compact hybrid integrated circuit device. realizable. Eighth, case material (7)
By aligning the side surface of the microcomputer (6) with the top surface of the microcomputer (6), it has the advantage that a hybrid integrated circuit device with a flat top surface can be realized. Ninth, by connecting the microcontroller (6) through the socket (16), a multifunctional hybrid integrated circuit device can be realized in which various types of microcontrollers (6) can be instantly replaced with one hybrid integrated circuit. Can be done.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing this embodiment, and Fig. 2 is an I-
1 and 3 are perspective views showing the case material used in this example, Figure 4 is a sectional view of the board used in this example, and Figures 5 and 6 show a resin-molded microcomputer. A perspective view and a cross-sectional view, FIG. 7 is an enlarged perspective view of main parts showing the vicinity of the microcomputer on the board, FIG. 8 is a block diagram showing the motor drive inverter used in this example, and FIG. 9 is the same as FIG. A circuit diagram showing the main circuit of the inverter shown in FIG. 10 is a block diagram showing the microcomputer of the inverter shown in FIG.
Figure 1 is a circuit diagram showing the base amplifier of the inverter shown in Figure 8, Figure 12 is a block diagram showing the protection circuit of the inverter shown in Figure 8, and Figure 13 is the block diagram shown in Figure 8. FIG. 14 is a plan view when mounted on the other board, and is a diagram showing the case material mounted on the other board shown in FIG. 13. (1>...hybrid integrated circuit device, (2)(3)...
Integrated circuit board, (5)...conducting path, (6)...microcomputer, (8>...circuit element, <
7>...Case material, (I6)...Socket,

Claims (14)

[Claims] (1) Two integrated circuit boards arranged to face each other, a conductive path having a desired pattern formed on the opposing main surfaces of the board, and a desired program data connected to the conductive path. the microcomputer, peripheral circuit elements connected to conductive paths on the substrate and to which a predetermined control output signal is supplied from the microcomputer, and a case material integrated between the substrates; is arranged on one side of the case material and connected to the conductive path, and the peripheral circuit element is arranged in a sealed space formed by the substrate and the case. (2) The hybrid integrated circuit device according to claim 1, wherein a metal substrate whose surface is insulated is used as the integrated circuit board. (3) The hybrid integrated circuit device according to claim 1, wherein the shapes of both the substrates are substantially the same. (4) The hybrid integrated circuit device according to claim 1, wherein copper foil is used as the conductive path. (5) The hybrid integrated circuit device according to claim 1, wherein the case material is a frame having a constant thickness that substantially coincides with the peripheral edges of both the substrates. (6) The hybrid integrated circuit device according to claim 5, wherein the microcomputer is embedded in a hole provided in the frame. (7) The hybrid integrated circuit device according to claim 5, wherein the size of the microcomputer and the thickness of the frame are approximately equal. (8) The hybrid integrated circuit device according to claim 1, wherein the microcomputer is molded with a dual in-line type, LCC type, or QIP type resin. (9) The hybrid integrated circuit device according to claim 1, wherein a chip resistor or a chip capacitor is used as the peripheral circuit element. (10) The hybrid integrated circuit device according to claim 1, wherein a peripheral edge of the case material substantially coincides with a peripheral edge of the substrate. (11) The frame body is provided with a socket connected to the conductive path, and the dual-inline type, LCC type, or QIP type resin-molded microcomputer is inserted into the socket. Hybrid integrated circuit device. (12) The hybrid integrated circuit device according to claim 11, wherein a plurality of microcomputers are prepared in advance, and one of the prepared microcomputers is selectively and arbitrarily inserted into the socket. (13) The hybrid integrated circuit device according to claim 11, wherein the microcomputer inserted into the socket is removed, and a different or the same type of microcomputer is inserted into the case material. (14) The hybrid integrated circuit device according to claim 1, wherein the connecting body of both the substrates is provided on a different side from the side on which the microcomputer is provided.