JPH0758498A - Method and device for inserting electronic part - Google Patents

Abstract

PURPOSE:To insert an electronic part provided with many leads of the same length in a high density by holding the main body of the electronic part with the many leads by means of a chuck section so that the height of the front end position of each lead of the part can become different from another and successively inserting the leads in descending order of height. CONSTITUTION:A chuck section 20 holding an electronic part 30 having multiple leads is rotated around the psi-axis 58 perpendicular to the phi-axis 54 in a plane parallel to a board and, when each lead is projected upon a plane which includes the psi-axis 58 and is perpendicular to the phi-axis 54, the interval between each lead is made as large as possible. In addition, the chuck section 20 is inclined around the axis 54 so that the axis 58 can form an acute angle against the Z-axis perpendicular to the board so that the height of the front end of each lead of the part 30 can become different from another. Since the leads are successively inserted into the inserting holes of the board in descending order of height, the leads can be reliably inserted even when the number of the leads is large.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component inserting method and apparatus for inserting an electronic component with leads into a board, and more particularly to an electronic component having a plurality of leads extending in the same direction from the main body of the electronic component. The present invention relates to an electronic component insertion method and device for mounting components on a substrate with high accuracy and high density.

[0002]

2. Description of the Related Art Conventionally, a general method for inserting an electronic component is to guide or chuck the lead of the electronic component to be inserted (lead wire or lead terminal etc.) in order to match the insertion hole of the printed circuit board. The lead end and the printed circuit board hole position are aligned and inserted. In the case of such a conventional general insertion method, since the lead below the electronic component body is guided or chucked, after being inserted into the printed circuit board, those guide members or chuck members are allowed to escape beyond the plane outermost dimension of the electronic component body. Need to retreat,
As a space for insertion, a space sufficient for the outermost dimension of the electronic component body is inevitably required. For example, when the electronic components are in close contact with each other, automatic insertion is impossible.

In consideration of this point, the main body of the electronic component is held by a chuck, the leads of the electronic component are cut so as to have different lengths, and the axial center position of the leads having different lengths and the insertion hole of the printed circuit board are cut. Electronic component insertion method for high-density mounting by moving the center position relative to each other and inserting the lead tips in the order of longest and then shortest Has been proposed (Japanese Patent Publication No. 62-55320).

Further, a pusher for pushing the IC is provided between the pair of guides holding the lead portion of the IC so as to be vertically movable, and the IC pushing surface is pushed in a posture in which the IC is inclined at a predetermined angle with respect to the substrate. In addition, an IC insertion head has been proposed in which the IC can be inserted into the printed circuit board with a small insertion force (Jpn. Pat. Appln. KOKAI No. 1-42399).

[0005]

By the way, a method of cutting leads of an electronic component so as to have different lengths and inserting the leads into the insertion holes of the printed circuit board from a long lead is called a variant electronic component. There is a problem that it cannot be applied when the length of the lead is previously cut to a short dimension such as a part or when it is desired to make the length of the lead uniform when cutting the lead.

Further, the structure for pushing the IC in a posture inclined by a predetermined angle with respect to the substrate is premised on guiding the lead portion of the IC, and it is a relief for guiding the IC back after the IC is inserted. It is necessary to secure space.

In view of the above points, the present invention holds the electronic component main body by the chuck portion so that the heights of the lead tip positions of the electronic component having a plurality of leads are different from each other with respect to the substrate, and An object of the present invention is to provide an electronic component insertion method and device that can realize high-density insertion of electronic components having a large number of leads of the same length by sequentially inserting the components from the lowest height into the insertion holes of the substrate. And

[0008]

In order to achieve the above object, in the method for inserting an electronic component of the present invention, the chuck portion holding the electronic component having a plurality of leads is provided in a plane parallel to the substrate. Rotating about a Ψ axis perpendicular to the Φ axis, and inclining the chuck part about the Φ axis so that the Ψ axis forms a predetermined acute angle with the Z axis perpendicular to the substrate. A step of rotating the chuck portion about a Θ axis parallel to the Z axis, and a step of sequentially inserting the leads having the lowest tip position among the plurality of leads into the insertion hole of the substrate after the steps are performed. It has and.

In the method of inserting the electronic component described above,
The position of a plurality of leads of the electronic component held by the chuck part is measured, the positional deviation of each lead from the reference position is detected, and the board is inserted from the lead having the lowest tip position among the plurality of leads. When performing the step of sequentially inserting the leads into the holes, the leads may be sequentially inserted into the insertion holes of the substrate while correcting the positional deviation of the leads.

The electronic component inserting apparatus according to the present invention includes a head portion which is movable at least in the Z-axis direction perpendicular to the substrate, and a chuck portion which is provided on the head portion and holds the electronic component having a plurality of leads. And a mechanism for rotating the chuck portion about a Θ axis parallel to the Z axis as a center, and a Φ axis that rotates in a plane parallel to the substrate by the rotation of the Θ axis. And a mechanism for inclining the chuck part about the Φ axis, and rotating the chuck part about a Ψ axis that is perpendicular to the Φ axis and inclines with the rotation of the Φ axis and forms a predetermined acute angle with the Z axis. And a mechanism.

In the above-mentioned electronic component inserting device,
A configuration may further be provided that further includes a lead position measuring unit that measures a position of a plurality of leads of the electronic component held by the chuck unit and detects a positional deviation of each lead from a reference position.

[0012]

According to the present invention, a chuck portion holding an electronic component having a plurality of leads (for example, a radial type IC having a large number of leads extending in the same direction, an odd-shaped electronic component, etc.) is provided on a surface parallel to the substrate. When the leads are projected on a plane that includes the Ψ axis and is perpendicular to the Φ axis by rotating it around the Ψ axis that is perpendicular to the Φ axis inside, the distance between the projected leads is as large as possible. (The rotation angle ψ about the Ψ axis is set so that the mutual distance between the projected leads is as large as possible.). It is a necessary condition that the projected leads do not overlap.

Next, the chuck portion is tilted about the Φ axis so that the Ψ axis forms a predetermined acute angle with the Z axis perpendicular to the substrate, and each of the electronic components having a plurality of leads. Set the heights of the lead tip positions so that they differ from each other. Then, after rotating the chuck part around the Θ axis parallel to the Z axis in accordance with the direction of the insertion hole formed in the substrate, the substrate from the lead having the lowest tip position among the plurality of leads. Insert into the insertion holes of. In this case, since the chuck part only needs to hold the main body of the electronic component, high-density mounting is possible, and the leads with lower tip positions are sequentially inserted into the insertion holes of the board, which ensures reliable operation even when the number of leads is large. Insertion operation is possible.

When the leads are inserted, the positions of a plurality of leads of the electronic component held by the chuck portion are measured to detect the position deviation of each lead from the reference position, and the position deviation of each lead is corrected. However, if they are sequentially inserted into the insertion holes of the substrate, highly accurate insertion can be realized.

In practice, the rotational drive order in the Ψ-axis, Φ-axis, and Θ-axis directions is arbitrary, and the rotational drive in the Ψ-axis, Φ-axis, and Θ-axis directions may be performed simultaneously.

Next, the principle of the electronic component insertion method of the present invention will be described with reference to FIGS. 24 and 25. In the XY orthogonal coordinate system parallel to the substrate of FIG. 24, the rotation center of the chuck portion holding the electronic component is O (0,0). Generally, the center of the outer shape of the body of the electronic component is made to coincide with the center of rotation O, and at the same time the center of the arrangement pattern of the leads (lead wires, lead terminals, etc.) is set, but it is not necessary to set this position (however, the center of rotation is Space can be used more efficiently when O is centered on the outer shape of the electronic component body.

Setting of the tilt axis direction (rotational movement around the Ψ axis)
Is performed as follows. That is, passing through the rotation center O,
A straight line ι with an inclination of ψ with respect to the X axis is taken. P _1, P ₂ the center position of the lead, ..., when the P _n, the _{P 1, P 2, ...,} P n
The perpendicular line of the leg, which was down in a straight line ι from Q _1, Q _2, ..., and Q _n, Tonaria' was Qi, R ₁ the distance between _{Qj, R 2, ..., R} n-1
And The R _1, R _2, ..., when the smallest of the R _n-1 and R _min, R _min is set the value of [psi (as closer to or maximum) such that the maximum. Straight line at this time
Is the direction of the tilt axis. For example, as shown in FIG. 24, if the lead positions are P ₁ , P ₂ , P ₃ , and P ₄ (aspect ratio of 3: 2), the minimum value R _min of R ₁ , R ₂ , and R ₃ is the maximum ( If R
_The straight line ι that makes ₁ = R ₂ = R ₃ ) is given by ψ = 53.1 °. The rotation amount of the chuck unit about the Ψ axis is set so that this straight line ι is perpendicular to the plane including the Φ axis in the plane parallel to the substrate and the Ψ axis orthogonal to this. This is so that the subsequent rotation (tilting operation) about the Φ axis is performed in the plane including the straight line ι. Since the value of ψ is a set value, it does not necessarily have to be exactly the optimum value, and a convenient value can be set in the device configuration.

The inclination angle is set (rotational movement around the Φ axis) as follows. That is, after setting the rotation amount around the Ψ axis, the foot Q of the perpendicular line drawn from Pi, Pj to the straight line ι
When the distance between i and Qj is maximum, this value is set to R (in the case of FIG. 24, R is the distance between Q ₂ and Q ₃ ). FIG. 25 shows a plane which is perpendicular to the Φ axis and includes the straight line ι in FIG. 24, the R is shown, and the length h of the portion of the lead to be inserted into the board-side insertion hole is shown. When inserting the chuck part holding the electronic parts with an angle φ with respect to the Z-axis perpendicular to the substrate, when the chuck part is lowered until the last lead (the position where the tip is highest) goes to the insertion hole. In addition, it is necessary to keep the tilt of the electronic component constant that the first inserted lead is not completely inserted. From this, assuming that the amount of inclination of the chuck portion (the amount of rotation about the Φ axis) is φ, the relationship of h = Rtanφ holds when φ is maximized. Further, if the total amount of fall of the chuck portion is z, then z = hcosφ.

The coordinate conversion when the above-described rotation operation about the Ψ axis and the rotation operation about the Φ axis are executed is as follows. When the distance from the center T of the slope of the chuck portion in FIG. 25 (the rotation center of the Φ axis) until the lead tip and H, because moved by φ center O of the lead gradient in O _1, O ₁
The coordinates are O ₁ = (Hsinφ · cosψ, Hsinφ · sinψ). Further, the position of the lead P _n (x _pn , y _pn ) is P _n1.
If you have moved to, the coordinates of _{P n1 P n1 = (Hsinφ ·} cosψ + α, Hsinφ · sinψ + β) ... is (1). At this time, α and β are displacement amounts of P _n due to only the inclination φ, and α = x ′ (1-cosφ) + x _pn · cosφ β = y ′ (1-cosφ) + y _pn · cosφ. Here, x ′ = − (btan ψ) / (1 + tan2ψ) y ′ = b / (1 + tan2ψ) b = y _pn −x _pn · tan ψ Note that the preferable rotation amount of the head about the Ψ and Φ axes is the type of electronic component. The data is stored in advance as storage data for each and the Ψ and Φ axes are controlled based on the storage data corresponding to the type of electronic component held by the chuck section.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an electronic component inserting method and apparatus according to the present invention will be described below with reference to the drawings.

FIG. 1 shows the overall construction of an embodiment of an electronic component inserting method and apparatus according to the present invention. In this figure, 1
Is an apparatus base, on which a substrate transfer section 2, a component supply section 3, a triaxial Cartesian coordinate type robot 4 as an XYZ drive system, and a lead position measurement section 5 are installed. . Further, the head unit 40 having the chuck unit 20 is driven by the triaxial Cartesian coordinate type robot 4.

The board carrying section 2 has a function of carrying the printed board 10 into which electronic components are inserted to a predetermined board stop position and positioning and fixing the board. Usually, a loader (not shown) is arranged on the substrate entrance side of the substrate transfer section 2, and an unloader (not shown) is arranged on the substrate exit side,
The board conveying unit 2 conveys the printed boards 10 supplied one by one from the loader to a predetermined board stop position by a conveyor belt (not shown) provided along the pair of board support frames 11 and moves to a predetermined position. The printed circuit board 10 is positioned and fixed by a fixing means (not shown) such as a positioning pin. In addition, the printed circuit board in which the electronic components have been inserted is conveyed to the board output side and discharged to the unloader.

The parts supply unit 3 includes various packing styles (for example, stick magazine (electronic parts are stored in the stick magazine and supplied), taping (electronic parts are arranged and supplied on a mount tape), tray (electronic parts). The component has a function of supplying an electronic component such as (component is placed on a tray and supplied) to a component transfer position F, which is described later, in a constant posture (constant direction) to be received by a chuck section 20. In this embodiment, as an example of the component supply unit 3, one using a stick magazine is illustrated in FIG.

As shown in FIG. 2, the component supply unit 3 holds a stick holder 32 for holding stick magazines (square cylindrical magazines) 31 in a multi-tiered state and an electronic component 30 extruded from the stick holder 32 in a predetermined manner. It has a component guide 33 that leads to the component transfer position F. The bottommost stick magazine 31 connected to the component guide 33 accommodates a large number of electronic components 30 arranged in a row, and the long flexible member 34 wound around a drum (not shown) is fed out. The electronic component 30 can be supplied to the component passing position F by inserting the magazine 31 from one end and pushing out the electronic component 30.

The three-axis Cartesian coordinate type robot 4 serving as an XYZ drive system has an X-axis parallel to the carrying direction of the printed circuit board 10.
Axial direction, Y-axis direction orthogonal to this and parallel to the printed circuit board, and Z perpendicular to the XY plane (perpendicular to the printed circuit board).
It has a function of driving and positioning the head unit 40 in the axial direction. The three-axis Cartesian coordinate type robot 4 has a Y-axis drive system 42 installed on the base 1 and a Y-axis drive system 42 for Y-axis drive system 42.
An X-axis drive system 41 driven in the axial direction, and the X-axis drive system 4
1 and a Z-axis drive system 43 driven in the X-axis direction. The head unit 40 attached to the Z-axis drive system 43 is driven by the Z-axis drive system 43 in the Z-axis direction (vertical direction). It has become.

The head section 40 and the chuck section 20 attached to the head section 40 will be described with reference to FIGS. The head unit 40 can rotate the chuck unit 20 about three rotation center axes (Ψ axis, Φ axis, Θ axis) and position it at an arbitrary angle. For positioning around each axis, three ( Servo motors for Ψ axis, Φ axis, Θ axis) are installed. That is, the head unit 40 includes a head frame 50 attached to the Z-axis drive system 43 of the triaxial Cartesian coordinate type robot 4, a Θ-axis servo motor 51 installed on the head frame 50, and the servo motor 5.
1, the Θ-axis 52 that is rotationally driven, the Θ-axis rotating body 53 that is fixedly connected to the Θ-axis 52, and the Φ that is fixed to the Θ-axis rotating body 53.
A Φ-axis tilting body 55 having a shaft 54 as a rotation center, a Φ-axis servo motor 56 and a Ψ-axis servo motor 57 installed on the Φ-axis tilting body 55, and a Ψ-axis servo motor 57 are rotationally driven. Ψ axis 58. The chuck portion 20 is fixedly connected to the ψ-axis 58.

The Θ-axis 52 is parallel to the Z-axis, and the Θ-axis 5
An annular projection 60 is formed on the outer peripheral surface of the Θ-axis rotating body 53, which rotates integrally with the shaft 2, around the same. The projection 60 is formed by a shaft body 61 erected on the head frame 50. It engages with the groove 62A of the rotatably supported grooved roller 62, and thereby supports the Θ-axis rotating body 53 so as to rotate about the Θ axis.

The Φ axis 54 is orthogonal to the Θ axis 52,
It rotates in a plane parallel to the printed circuit board 10 as the Θ-axis 52 rotates, and is fixed to the Θ-axis rotating body 53. The Φ axis tilting body 55 is pivotally supported by the Φ axis 54,
A rotary shaft 56A of a Φ-axis servomotor 56 fixed to the shaft tilting body 55 side and a Φ shaft 54 are connected by a joint 63. However, in this case, since the Φ-axis 54 is fixed to the Θ-axis rotating body 53, the Φ-axis 5 is driven by the Φ-axis servo motor 56.
The Φ-axis tilting body 55 rotates about 4 as a rotation center (inclining so as to form an acute angle with the Z-axis). A Ψ-axis servomotor 57 is fixed to the inside of the bottom of the bottomed cylindrical portion of the Φ-axis tilting body 55, and a Ψ-axis 58 rotationally driven by the servomotor 57 is perpendicular to the Φ-axis 54. Axial tilting body 55
Forms an acute angle with the Z-axis.

The chuck section 20 includes a pair of racks 22 in which a holding piece (chuck piece) 21 for holding the main body 30A of the electronic component 30 shown by phantom lines in FIG. 5 is integrated, and a pinion engaged with the pair of racks 22. 23 and the pinion 23
And a push rod 24 that also serves as a support shaft.

Each rack 22 has a chuck block 25.
It is arranged so as to be slidable laterally with respect to the lower portion, and is driven by the air cylinders 26, respectively.
That is, when air is supplied to the air supply port 27 of the air cylinder 26, the sandwiching piece 21 integrated with the pair of racks 22 is closed, and when the air is exhausted, the rack 22 is released.
A compression spring 28 arranged between the end and the inner surface of the block 25.
The pair of clamping pieces 21 is thereby opened. The pair of sandwiching pieces 21 move in parallel with each other, and the pressing surface 21A, which is the opposing surface of the pair of sandwiching pieces 21, maintains the state of being parallel to the Ψ axis 58.
Therefore, since it can be kept parallel to the chucked surface of the main body 30A of the electronic component 30, the holding (sandwiching) state does not change due to variations in the size of the main body 30A of the electronic component. In addition, after holding the electronic component 30, the electronic component 3
In order to prevent the position of 0 from being shifted, the parallel movement of the sandwiching piece 21 has the same chuck movement amount, and the center of the electronic component holding position is always fixed even if the size of the electronic component body 30A is somewhat different. As described above, the rack 22 and the pinion 23 are used for the self-centering structure.

The lead 30B of the electronic component 30 is clamped by the clamp piece 2 when the main body 30A is clamped by the pair of clamp pieces 21.
It is parallel to the first pressing surface 21A and also to the Ψ axis 58.

The push rod 24 is attached to the block 25, which is the center of rotation of the pinion 23, so that it can be raised and lowered (it can be raised and lowered on the extension line of the Ψ axis 58).
The upper part of the air cylinder 3 is embedded in the block 25.
6 pistons 38 are formed. Therefore, when air is supplied to the air supply port 37 of the air cylinder 36, the push rod 24 descends, and when air is exhausted, the push rod 24 is provided by the compression spring 39 arranged between the piston 38 above the push rod and the block 25. 24 returns to the raised position.

Although not shown in FIGS. 5 to 7, FIG.
Further, as shown in FIG. 4, a connecting portion 70 is integrated on the chuck block 25 of the chuck portion 20, and the connecting portion 70 is connected and fixed to the Ψ shaft 58. Further, a grooved roller 72 is rotatably supported by a shaft body 71 erected on the block 25, and a groove 72A of the grooved roller 72 goes around the lower outer peripheral surface of the Φ-axis tilting body 55. Engages with the annular protrusion 80 formed as
As a result, the chuck block 25 is supported so as to rotate about the ψ-axis 58.

FIG. 8 shows the structure of the lead position measuring section 5.
The lead position measuring unit 5 includes a semiconductor laser 90 that generates a semiconductor laser beam, a polygon mirror 91 that reflects the semiconductor laser beam emitted from the semiconductor laser 90 and periodically scans the semiconductor laser beam, and a polygon mirror 91. A collimator lens 92 for making the reflected rays parallel rays,
A condenser lens 94 for converging the laser beam emitted from the collimator lens 92 toward the light receiving element 93, and a synchronizing light receiving element 95 for detecting the scanning cycle of the polygon mirror 91.
And a motor 96 for rotating the polygon mirror 91,
And an arithmetic processor 97 for receiving signals from the light receiving elements 93 and 95.

The polygon mirror 91 is a metal or glass multi-faceted mirror having a plurality of optically flat reflecting surfaces, and each reflecting surface is arranged on each surface of a regular polygonal prism. There is. The light receiving elements 93 and 95 output an output signal according to the brightness of light. The motor 96 rotates the polygon mirror 91 at high speed with its central axis (the central axis of the regular polygonal column) as the center of rotation in synchronization with the clock pulse from the arithmetic processing unit 97.

In the lead position measuring section 5, the semiconductor laser beam is reflected by the polygon mirror 91 which rotates at a high speed in synchronization with the clock pulse generated by the arithmetic processing unit 97, and becomes a parallel beam by the collimator lens 92. The leads 30B of the electronic component 30 are scanned at high speed and are collected by the light receiving element 93 by the condenser lens 94. The light receiving element 93 is
An output signal corresponding to the light and shade of the light due to the laser beam being blocked by the lead 30B is generated and output to the arithmetic processing unit 97. In the arithmetic processor 97, the time (timing) shaded by the lead 30B is compared with the synchronizing signal of the synchronizing light receiving element 95 synchronized with the clock pulse, and the time difference between the two is long. Then, the position of the lead 30B is calculated (measured).

Next, the overall operation of the above embodiment will be described.

As shown in FIG. 1, after the printed circuit board 10 is positioned and fixed at a predetermined substrate stop position by the substrate transport unit 2, the head unit 40 transfers the components of the component supply unit 3 by the triaxial Cartesian robot 4. Moved to the position F, the head unit 4
The chucking piece (chuck piece) 21 provided in the chuck portion 20 provided at 0 is closed and the main body 3 of the electronic component 30 is closed as shown in FIG.
Hold the 0A outline.

Electronic component 30 held by chuck section 20
Is transferred to the lead position measuring unit 5 by the triaxial Cartesian coordinate type robot 4 and stopped at a predetermined lead measuring position. At this time, the rotation angle of the chuck portion 20 around the Φ axis 54 is zero, and the rotation angle around the Ψ axis 58 is also zero.
Are positioned on the same straight line, and the height of the electronic component 30 held by the chuck portion 20 is such that the tip of the lead crosses the scanning plane of the laser beam by the lead position measuring unit 5 (lead position. At the time of measurement, the heights of the tips of the leads are uniform.). In order to recognize the position of the lead 30B of the electronic component 30 in the plane coordinate system, it is necessary to measure the position from at least two directions. Therefore, according to the stored data determined in advance for each electronic component, the chuck portion 20 is rotated by the Θ-axis servomotor 51 in two directions around the Θ-axis (the rotation angle is a known amount), and the lead position is measured in different directions. To execute. In addition,
The type of electronic component 30 held by the chuck section 20 is known by the insertion program. As a result, the lead position is recognized for each direction, and thereafter, the X of each lead is calculated by the arithmetic processing of the arithmetic processor 97 of the lead position measuring unit 5.
Converted to XY coordinates in the Y orthogonal coordinate system. Since the measuring direction of the electronic component 30 is set so that the shadows of the laser beams by the leads do not overlap, it differs depending on the arrangement pattern of the leads of the electronic component 30. Further, the two directions do not necessarily need to be orthogonal to each other, and the angle is different depending on the pitch (arrangement interval) of the leads even in the same arrangement pattern.

FIG. 9 to FIG. 11 show examples of measurement directions according to typical lead arrangement patterns.

In FIG. 9, the lead 30B-1 such as a connector is one.
In the case of the electronic component 30-1 in the row, S in the drawing is the lead 3.
A shadow in which the laser beam is blocked at 0B-1 is shown. FIG. 9 (A)
Shows the measurement in the first direction, and FIG. 7B shows the measurement in the second direction.

In FIG. 10, the lead 30B-2 such as a relay has two
In the case of the electronic component 30-2 in the row, S in the drawing is the lead 3.
A shadow in which the laser beam is blocked at 0B-2 is shown. Figure 10
(A) shows the measurement in the first direction, and (B) in the figure shows the measurement in the second direction.

FIG. 11 shows a lead 30B-3 such as a variable resistor.
Is the case of three electronic components 30-3 (triangular arrangement),
In the figure, S indicates a shadow in which the laser beam is blocked by the lead 30B-3. FIG. 11 (A) shows the measurement in the first direction, and FIG. 11 (B).
Indicates the measurement in the second direction.

The measurement result of each lead by the lead position measuring unit 5 as described above is stored in advance at a reference position (corresponding to the lead type in the product type) stored in advance corresponding to the type of electronic component held by the chuck unit 20. The position deviation of the lead is detected in comparison with the (possible position). This lead displacement is X
It is calculated by the arithmetic processor 97 in each of the axial direction and the Y-axis direction.

After the positional deviation of each lead is detected by the lead position measuring section 5, the head section 40 holding the electronic component 30 by the triaxial Cartesian coordinate type robot 4 is moved above the printed circuit board 10. Then, the operation of inserting the lead 30B of the electronic component 30 into the insertion hole of the printed circuit board 10 is performed as shown in FIGS. The plan view of FIG. 12 and the side view of FIG. 13 show that the rotation amount of the head portion 40 about the Ψ axis is zero,
The amount of rotation around the Φ axis is zero, and the Ψ and Θ axes are on the same straight line (Z
This is the posture of the chuck portion 20 when it is in the (axial direction). In this posture, the electronic component 3 is moved from the component transfer position F of the component supply unit 3.
Hold 0 and take it out. Further, the posture of the chuck portion 20 after the measurement of the lead position by the lead position measuring unit 5 may be considered as shown in FIGS. 12 and 13.

From the postures shown in FIGS. 12 and 13, the inclination direction (rotation about the Ψ axis) and the inclination angle (rotation about the Φ axis) of the data stored in advance according to the type of the electronic component 30 held by the chuck section 20. Then, the posture of the chuck portion 20 is set. That is, with respect to the Ψ axis, the Ψ axis 58 of the head unit 40 in FIGS. 3 and 4 is rotationally driven by the Ψ axis servo motor 57, and the chuck is set with the center of rotation as O as shown in the plan view of FIG. 14 and the side view of FIG. The part 20 is rotated, for example, by 40 °. As described in the explanation of the principle of FIG.
When each lead is projected on a plane including the axis and perpendicular to the Φ axis, the distance between the projected leads should be as large as possible (around the Ψ axis so that the distance between the projected leads should be as large as possible). This is for setting the rotation angle of.

With respect to the Φ axis, a Φ axis servo motor 56 is used to rotate the Φ axis 54 of the head portion 40 as a rotation center, and a Φ axis tilting body 55 is provided.
Rotate (tilt). That is, for example, 10 ° is rotated about the T (Φ axis) in the side view of FIG. 17 in a plane including the straight line ι indicating the direction of the tilt axis of the plan view of FIG. This is because the height position of each lead tip with respect to the printed circuit board 10 is different. However, when the chuck part 20 is lowered until the last lead (the highest position of the tip) goes to the insertion hole, it is necessary to ensure that the lead that is inserted first is not completely inserted. There is.

Insertion direction of the electronic component 30 (in this example,
Calculate the correction of the direction of the lead deviated by the rotation about the Ψ axis and the Φ axis in accordance with the counterclockwise direction (90 °).
The rotation angle of 2 is determined, and as shown in FIG. 18 (a perspective view seen from above), the Θ-axis servo motor 51 causes 50.
Rotate 43 °.

After that, as shown in the explanatory view of FIG. 19 and the side view of FIG. 20 (a view taken in the direction of arrow A in FIG. 19), the four leads 30B of the electronic component 30 are connected to the lead L at a low height position.
1, L2, L3, L4 are sequentially inserted into the corresponding insertion holes H1, H2, H3, H4 of the printed circuit board 10 while correcting the position of each lead. This position correction is executed by adding the correction by the lead position deviation from the reference position by the lead position measuring unit 5 to the lead position after the coordinate conversion of the equation (1). Then, after inserting the lead L4 into the insertion hole H4, the electronic component 30 is pushed in parallel to the printed board 10 by lowering the push rod 24 as shown in FIG. Insertion is complete.

Although the insertion hole position of the printed circuit board is stored data corresponding to the electronic component, the actual insertion hole position is measured as necessary to detect the deviation amount from the stored data, The lead amount may be inserted into the insertion hole by further correcting the displacement amount.

22 and 23 show another example of the structure of the lead position measuring section, which is a beam light source 100 for emitting one light beam, a light receiving element 101 for receiving the light beam, and a head 40.
And an encoder 102 for detecting the position of the light beam, and a calculation for receiving the output signal of the light receiving element 101 and the position signal of the head section of the encoder 102 according to the light and shade of the light due to the light beam being blocked by the lead 30B of the electronic component 30. The processor 103 is provided.

In this lead position measuring unit, first, as shown in FIG. 22, the attitude of the electronic component 30 is determined by the rotation operation of the chuck unit 20 around the Θ axis based on the stored data which is predetermined according to the type of the electronic component 30. The head portion 40 is linearly moved in a specific direction (for example, the X-axis direction) so that the lead 30B shields one light beam. Next, as shown in FIG. 23, the attitude of the electronic component 30 is set to the second rotation direction, and similarly, the head unit 40 is linearly moved in the opposite direction, for example. Then, the lead 3 is determined from the time (timing) during which the beam light is shaded by the lead 30B when the head portion 40 reciprocates and the position signal of the head portion 40 from the encoder 102.
The position of 0B is calculated (measured).

In the above embodiment, the rotation operation about the Ψ axis, the rotation operation about the Φ axis, and the rotation operation about the Θ axis are described in this order, but the order of the rotation operation may be arbitrary, and each axis is operated simultaneously. You may let me.

Further, in the above embodiment, the component supply unit 3 is an example of the structure in which the cutting of the lead of the electronic component is unnecessary, but in the case of the component supply unit which supplies the electronic component by taping the electronic component, Each lead may be cut into equal lengths when or after the chuck unit receives the electronic component from the component supply unit.

Further, the case where the head portion can be moved in the three axis directions of XYZ has been described, but the head portion can be moved only in the Z axis direction, and the printed circuit board can be moved in the XY table by the XY table.
It is also possible to adopt a configuration in which the position is moved by moving in the Y-axis direction.

Although the embodiment of the present invention has been described above, it is obvious to those skilled in the art that the present invention is not limited to this and various modifications and changes can be made within the scope of the claims. Let's do it.

[0057]

As described above, according to the electronic component inserting method and apparatus of the present invention, the chuck portion holding the electronic component having a plurality of leads is provided with the Φ axis in the plane parallel to the substrate. When the leads are projected on a plane that includes the Ψ axis and is perpendicular to the Φ axis by rotating about the Ψ axis perpendicular to, the distance between the projected leads should be as large as possible. The rotation angle ψ about the Ψ axis is set so that the mutual spacing is as large as possible), and the chuck portion is centered on the Φ axis so that the Ψ axis forms a predetermined acute angle with the Z axis perpendicular to the substrate. And set so that the heights of the lead tip positions of the electronic component having a plurality of leads are different from each other, and then from the lead having the lowest tip position among the plurality of leads to the insertion hole of the substrate. Can be inserted sequentially Since the leads with the lower tip positions are sequentially inserted into the insertion holes of the substrate, a special device for cutting the leads in different steps is not required, and a reliable insertion operation is possible even when the number of leads is large. Therefore, it is possible to insert an electronic component having a fixed lead shape.

Further, since the chuck portion only needs to hold the main body of the electronic component, high density mounting is possible.

Further, when inserting the leads, the positions of a plurality of leads of the electronic component held by the chuck portion are measured to detect the positional deviation of each lead from the reference position,
High accuracy insertion can be realized by sequentially inserting the leads into the insertion holes of the substrate while correcting the positional deviation of each lead.
Even for electronic components that have unstable lead positions and require lead guides, the electronic component main body can be held to insert leads, eliminating the need for lead guides, reducing dead space, and enabling high-density insertion. It will be possible. Further, there is no need for any means for straightening the lead.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of an electronic component insertion method and device according to the present invention.

FIG. 2 is a side sectional view of a component supply unit in the embodiment.

FIG. 3 is a front cross-sectional view of a head section and a chuck section in the example.

FIG. 4 is a side sectional view of the same.

FIG. 5 is a front view of a chuck portion.

FIG. 6 is a side sectional view of the same.

FIG. 7 is a bottom view of the same.

FIG. 8 is a block diagram of a lead position measuring unit in the example.

FIG. 9 is an explanatory diagram showing lead position measurement of an electronic component in which leads are arranged in one row.

FIG. 10 is an explanatory diagram showing lead position measurement of an electronic component having leads arranged in two rows.

FIG. 11 is an explanatory diagram showing lead position measurement of an electronic component having three leads and arranged in a triangle.

FIG. 12 shows a chuck portion that holds electronic components,
It is a top view before performing rotation operation around the ψ, φ, and Θ axes.

FIG. 13 is a side view of the same.

FIG. 14 shows a chuck part holding electronic parts,
It is a top view after a rotation operation around an axis.

FIG. 15 is a side view of the same.

FIG. 16 shows a chuck portion holding electronic parts,
It is a top view after a rotation operation around an axis.

FIG. 17 is a side view of the same.

FIG. 18 shows a chuck portion holding an electronic component,
It is a top view after a rotation operation around an axis.

FIG. 19 is an explanatory diagram showing the order of inserting the leads of the electronic component into the board-side insertion holes.

FIG. 20 is a side sectional view showing the operation of inserting the lead of the electronic component into the board-side insertion hole.

FIG. 21 is a side cross-sectional view showing a state where the leads of the electronic component are completely inserted into the board-side insertion holes.

FIG. 22 is a block diagram of another configuration example of the lead position measurement unit in a state where the electronic component is set in the first rotation direction.

FIG. 23 is a block diagram showing another configuration example of the lead position measuring unit in a state where the electronic component is set in the second rotation direction.

FIG. 24 is an explanatory diagram showing setting of a tilt direction (a rotation angle around the Ψ axis) in the present invention.

FIG. 25 is an explanatory diagram showing setting of a tilt angle (a rotation angle around the Φ axis) in the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base 2 Board transfer part 3 Component supply part 4 3-axis Cartesian coordinate type robot 5 Lead position measurement part 10 Printed circuit board 20 Chuck part 21 Clamping piece 22 Rack 23 Pinion 24 Push rod 30 Electronic part 30A Main body 30B Lead 40 Head part 50 Head frame 51 Θ-axis servo motor 52 Θ-axis 53 Θ-axis rotating body 54 Φ-axis 55 Φ-axis tilting body 56 Φ-axis servo motor 57 Ψ-axis servo motor 58 Ψ-axis

Claims (6)

[Claims] 1. A step of rotating a chuck portion, which holds an electronic component having a plurality of leads, about a Ψ axis perpendicular to a Φ axis in a plane parallel to the substrate, and the Ψ axis is attached to the substrate. Rotating the chuck about the Φ axis so as to form a predetermined acute angle with respect to the vertical Z axis; rotating the chuck about the Θ axis parallel to the Z axis; After each step is performed, a step of sequentially inserting the lead having a lower tip position among the plurality of leads into the insertion hole of the substrate is performed, the electronic component inserting method. 2. A step of measuring a position of a plurality of leads of an electronic component held by a chuck part to detect a positional deviation of each lead from a reference position, and the chuck part holding the electronic component on a substrate. Rotating about a Ψ axis perpendicular to the Φ axis in a parallel plane; and the chuck about the Φ axis so that the Ψ axis forms a predetermined acute angle with the Z axis perpendicular to the substrate. Rotating the chuck portion, rotating the chuck portion about a Θ axis parallel to the Z axis, and performing the above steps, and then performing the positional deviation from the lead having a lower tip position among the plurality of leads. And a step of sequentially inserting the components into the insertion holes of the substrate while making corrections. 3. A head part which is movable at least in a Z-axis direction perpendicular to the substrate, and a chuck part which is provided on the head part and holds an electronic component having a plurality of leads, wherein the head part is provided. , Θ parallel to the Z-axis
A mechanism that rotates about an axis, a mechanism that rotates the chuck unit about a Φ axis that rotates in a plane parallel to the substrate by rotation about the Θ axis, and a mechanism that is perpendicular to the Φ axis and that An electronic component insertion device, comprising: a mechanism for rotating the chuck portion about a Ψ axis that is inclined with rotation about a Φ axis and forms a predetermined acute angle with the Z axis. 4. A head portion which is movable at least in the Z-axis direction perpendicular to the substrate, a chuck portion which is provided on the head portion and holds an electronic component having a plurality of leads, and a chuck portion which holds the electronic component. A lead position measuring unit that measures a position of a plurality of leads of the electronic component to detect a position shift of each lead with respect to a reference position, and the head unit makes the chuck unit parallel to the Z-axis.
A mechanism that rotates about an axis, a mechanism that tilts the chuck portion about a Φ axis that rotates in a plane parallel to the substrate by rotation about the Θ axis, and a mechanism that is perpendicular to the Φ axis and that An electronic component insertion device, comprising: a mechanism for rotating the chuck portion about a Ψ axis that is inclined with rotation about a Φ axis and forms a predetermined acute angle with the Z axis. 5. The chuck portion is provided with a pair of racks that integrates a sandwiching piece that sandwiches the body of the electronic component, and a pinion that engages with the pair of racks. 5. The electronic component inserting apparatus according to claim 3, wherein the moving directions of the two are mutually opposite and the moving amounts are set equal. 6. The electronic component inserting apparatus according to claim 5, wherein the push rod that pushes down the electronic component also serves as a support shaft of the pinion.