Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba CorpfiledCriticalToshiba Corp
Priority to JP971788UpriorityCriticalpatent/JPH075643Y2/ja
Publication of JPH01115256UpublicationCriticalpatent/JPH01115256U/ja
Application grantedgrantedCritical
Publication of JPH075643Y2publicationCriticalpatent/JPH075643Y2/ja
Hermetically sealed compression bonded circuit assembly having flexible walls at points of application of pressure for compression bonding circuit elements
