JPH075633Y2 - Substrate positioning device for wire bonder - Google Patents
Substrate positioning device for wire bonderInfo
- Publication number
- JPH075633Y2 JPH075633Y2 JP7200389U JP7200389U JPH075633Y2 JP H075633 Y2 JPH075633 Y2 JP H075633Y2 JP 7200389 U JP7200389 U JP 7200389U JP 7200389 U JP7200389 U JP 7200389U JP H075633 Y2 JPH075633 Y2 JP H075633Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heater
- block
- pressing
- rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Description
【考案の詳細な説明】 （産業上の利用分野） 本考案はワイヤボンダーにおける基板の位置決め装置に
関し、詳しくは巾や厚さの異る複数種の基板を、ヒータ
レール上に位置決めするための手段に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a board positioning device for a wire bonder, and more specifically, means for positioning a plurality of kinds of boards having different widths and thicknesses on a heater rail. Regarding
（従来の技術） 第６図は、リードフレームなどの基板と、この基板に搭
載されたベアチップとを、極細の金線などのワイヤによ
り接続する従来のワイヤボンディング手段を示すもので
あって、101はヒータブロック、102はヒータレールであ
り、その上に基板103が載置されている。基板103の両側
部には、基板103の両側端部を上方から押え付けて、基
板103のそりを矯正する押え部材106,107が設けられてお
り、また押え部材106,107には、基板103の両側面に押当
して巾方向の位置決めを行うサイドブロック104,105が
装着されている。押え部材107とサイドブロック105は、
基板103の巾に対応できるように、巾方向Ｎに摺動自在
となっている。(Prior Art) FIG. 6 shows a conventional wire bonding means for connecting a substrate such as a lead frame and a bare chip mounted on the substrate by a wire such as a fine gold wire. Is a heater block, 102 is a heater rail, and the substrate 103 is mounted thereon. On both sides of the substrate 103, pressing members 106 and 107 for pressing the both end portions of the substrate 103 from above to correct the warp of the substrate 103 are provided, and the pressing members 106 and 107 are provided on both side surfaces of the substrate 103. Side blocks 104 and 105 that are pressed and positioned in the width direction are mounted. The pressing member 107 and the side block 105 are
It is slidable in the width direction N so as to correspond to the width of the substrate 103.
108はシリンダから成るヒータブロック101の昇降装置、
109はワイヤボンダーのホーン、110はホーン109の先端
部に保持されたキャピラリ、Ｗはキャピラリ110に通さ
れたワイヤ、Ｐは基板103に搭載されたベアチップであ
る。次に動作を説明する。108 is a lifting device for the heater block 101 consisting of a cylinder,
109 is a wire bonder horn, 110 is a capillary held at the tip of the horn 109, W is a wire passed through the capillary 110, and P is a bare chip mounted on the substrate 103. Next, the operation will be described.
ヒータレール102が下降位置にある状態で、基板103がヒ
ータレール102上に搬送されてくると、昇降装置108が作
動して基板103を押し上げ、基板103の両側端部を押え部
材106,107に押し付けて基板103のそれを矯正する。また
これと同時にサイドブロック105は巾方向Ｎに摺動し、
基板103は両サイドブロック104,105により左右からクラ
ンプされる。When the substrate 103 is conveyed onto the heater rail 102 with the heater rail 102 in the lowered position, the elevating device 108 operates to push up the substrate 103, and press both side ends of the substrate 103 against the pressing members 106 and 107. Correct it on the substrate 103. At the same time, the side block 105 slides in the width direction N,
The board 103 is clamped from the left and right by both side blocks 104 and 105.
次いでワイヤボンダーのキャピラリ110からワイヤＷを
導出しながら、ベアチップＰと基板103を接続する。Next, the bare chip P and the substrate 103 are connected while the wire W is led out from the capillary 110 of the wire bonder.
接続が終了すると、サイドブロック105を側方へ退去さ
せて、基板103のクランプ状態を解除するとともに、昇
降装置108を作動させて、基板103を下降させ、基板103
をヒータレール102から搬出する。When the connection is completed, the side block 105 is retreated to the side, the clamped state of the substrate 103 is released, the elevating device 108 is operated, and the substrate 103 is lowered to move the substrate 103.
Is carried out from the heater rail 102.
（考案が解決しようとする課題） しかしながら上記従来手段は、基板103の両側端部をヒ
ータレール102の側方に突出させ、その側面に押え部材1
06,107の下部に装着されたサイドブロック104,105を押
当してクランプし、巾方向の位置決めを行うようになっ
ていたため、基板103の品種変更に伴い、基板103の巾が
変る場合には、基板巾に応じたヒータレールと交換しな
ければならず、この交換作業のために多大な手間と時間
を要する問題があった。(Problems to be solved by the invention) However, in the above-mentioned conventional means, both side ends of the substrate 103 are projected to the side of the heater rail 102, and the pressing member 1 is attached to the side surface thereof.
Since the side blocks 104 and 105 mounted on the bottom of 06 and 107 are pressed and clamped to perform positioning in the width direction, if the width of the board 103 changes due to the change of the board 103 type, the board width Therefore, the heater rail must be replaced with a new one, and this replacement work requires a lot of labor and time.
また基板の厚さは品種によって異り、また基板によって
は部分的に厚さの異るものもあるが、上記従来手段の押
え部材106,107は、上下方向の柔軟性がなかったため、
厚さの異る基板をしっかり位置決めできない問題があっ
た。In addition, the thickness of the substrate differs depending on the product type, and there are some substrates whose thickness is partially different, but since the pressing members 106 and 107 of the above-described conventional means do not have vertical flexibility,
There was a problem that substrates with different thickness could not be positioned properly.
したがって本考案は、上記従来手段の問題点を解消する
ワイヤボンダーにおける基板の位置決め装置を提供する
ことを目的とする。Therefore, an object of the present invention is to provide a substrate positioning device in a wire bonder that solves the problems of the conventional means.
（課題を解決するための手段） このために本考案は、昇降装置により昇降自在に配設さ
れたヒータブロックと、このヒータブロック上に設けら
れたヒータレールとを備え、このヒータレールの一方の
側部に、ヒータレール上に載置された基板の一方の側面
を位置決めする第１のサイドブロックを設けるととも
に、ヒータレールの他方の側部上に、基板の巾方向に位
置調整自在な第２のサイドブロックを設け、かつこの第
２のサイドブロックと基板の間に、基板を上記第１のサ
イドブロックへ押圧するばね材を介設し、また基板の上
部側方からこの基板の上方に延出して、この基板を下方
に押え付けるばね材から成る押え部材を設け、かつこの
押え部材を基板の巾方向に位置調整自在としたものであ
る。(Means for Solving the Problem) For this purpose, the present invention includes a heater block that is vertically movable by an elevating device, and a heater rail provided on the heater block. A first side block that positions one side surface of the substrate placed on the heater rail is provided on the side portion, and a second side block that is positionally adjustable in the width direction of the substrate is provided on the other side portion of the heater rail. Side block is provided, and a spring member for pressing the substrate to the first side block is provided between the second side block and the substrate, and the spring material extends from the upper side of the substrate to above the substrate. A pressing member made of a spring material that pushes out and presses the substrate downward is provided, and the position of the pressing member is freely adjustable in the width direction of the substrate.
（作用） 上記構成において、基板の品種変更に伴い、基板の巾が
変る場合には、ヒータレールの他方の側部上のサイドブ
ロックを基板の巾方向にスライドさせて位置調整する。
また基板の厚さの変動は、押え部材のばね性により吸収
する。(Operation) In the above configuration, when the width of the board changes due to the change of the board type, the side block on the other side of the heater rail is slid in the width direction of the board to adjust the position.
Further, the fluctuation of the thickness of the substrate is absorbed by the spring property of the pressing member.
（実施例） 次に、図面を参照しながら本考案の実施例を説明する。(Example) Next, the Example of this invention is described, referring drawings.
第１図はワイヤボンダーにおける基板の位置決め装置の
斜視図、第２図は断面図であって、１はヒータブロッ
ク、２はその上に載置されたヒータレール、３はその上
に位置決めされた基板であり、後述するように、ヒータ
ブロック１の伝熱により基板３を加熱し、基板３に搭載
されたベアチップＰの電極と、基板３に形成された電極
を、ワイヤにより接続する。この基板３は複合基板であ
って、アルミニウムなどから成る肉厚の蓄熱板3aの上面
に、ガラエポ板のような薄板3b,3cを装着して形成され
ている。一方の薄板3bは、他方の薄板3cよりもやや厚
く、薄板3bの上面ｂは、薄板3cの上面ｃよりも高くなっ
ている。FIG. 1 is a perspective view of a board positioning device in a wire bonder, and FIG. 2 is a cross-sectional view, in which 1 is a heater block, 2 is a heater rail mounted on the heater block, and 3 is a heater rail positioned on the heater block. As will be described later, the substrate 3 is heated by the heat transfer of the heater block 1, and the electrode of the bare chip P mounted on the substrate 3 and the electrode formed on the substrate 3 are connected by a wire, as will be described later. This substrate 3 is a composite substrate, and is formed by mounting thin plates 3b, 3c such as glass epoxy plates on the upper surface of a thick heat storage plate 3a made of aluminum or the like. One thin plate 3b is slightly thicker than the other thin plate 3c, and the upper surface b of the thin plate 3b is higher than the upper surface c of the thin plate 3c.
ヒータブロック１はプレート５上に配設されている。プ
レート５の下方には、シリンダから成る昇降装置６が設
けられており、そのロッド７は、プレート５の下部に設
けられた係合部８に係合している。13は台板である。プ
レート５の両側部には脚体９が垂設されており、この脚
体９は、スライダ10を介して、側方の支柱21,22に設け
られた昇降ガイド11に昇降自在に装着されている。また
脚体９は、ばね材12により上方に付勢されている。した
がってロッド７が下降すると、ヒータブロック１や基板
３は下降し、またロッド７が上昇すると、基板３はばね
材12のばね力により上昇する。The heater block 1 is arranged on the plate 5. Below the plate 5, an elevating device 6 composed of a cylinder is provided, and its rod 7 is engaged with an engaging portion 8 provided at the lower part of the plate 5. 13 is a base plate. A leg body 9 is vertically provided on both sides of the plate 5, and the leg body 9 is attached via a slider 10 to an elevating guide 11 provided on lateral columns 21 and 22 so as to be vertically movable. There is. The leg body 9 is biased upward by the spring material 12. Therefore, when the rod 7 descends, the heater block 1 and the substrate 3 descend, and when the rod 7 rises, the substrate 3 rises due to the spring force of the spring material 12.
上記一方の支柱21の上部には、第１のサイドブロック23
と、押え部材24が設けられている。サイドブロック23は
支柱21に固定されており、また押え部材24は、長孔25に
ボルト26を挿着して、基板３の巾方向Ｎに位置調整自在
に配設されている。また他方の支柱22の上部にも、押え
部材27が挿着されている。この押え部材27は、ばね性を
有する金属などの可撓性材料により、くの字形に屈曲し
て形成されており（第３図も併せて参照）、基板３の上
部側方から基板３の上方まで延出し、そのばね力により
基板３を下方に押え付けている。28はばね性を付与する
ために形成されたスリットである。この押え部材27は、
長孔29にボルト30を挿着して、支柱22の上部に設けられ
た受部14に固定されており、上記方向Ｎに位置調整自在
となっている。この基板３は、右半部の上面ｃが基準レ
ベルであり、この基準レベルである上面ｃを、一方の押
え部材24により押え付け、基準レベルよりも高い左半部
の上面ｂは、基板３の厚みの変動を吸収可能なばね材か
ら成る押え部材27により押え付けている。The first side block 23 is provided on the upper side of the one pillar 21.
And a pressing member 24 is provided. The side block 23 is fixed to the column 21, and the holding member 24 is arranged so that the position of the holding member 24 can be adjusted in the width direction N of the substrate 3 by inserting the bolt 26 into the long hole 25. A pressing member 27 is also attached to the upper part of the other column 22. The pressing member 27 is formed by bending a dogleg shape with a flexible material such as a metal having a spring property (see also FIG. 3), and the pressing member 27 of the substrate 3 from the upper side of the substrate 3. It extends to the upper side, and its spring force holds the substrate 3 downward. Reference numeral 28 is a slit formed to impart springiness. This pressing member 27 is
A bolt 30 is inserted into the long hole 29 and fixed to the receiving portion 14 provided on the upper portion of the support column 22, and the position thereof can be adjusted in the direction N. The upper surface c of the right half portion of the substrate 3 is the reference level, and the upper surface c which is the reference level is pressed by one pressing member 24. The upper surface b of the left half portion higher than the reference level is the substrate 3 It is held down by a holding member 27 made of a spring material capable of absorbing fluctuations in thickness.
31は第２のサイドブロックであって、上記ヒータレール
２の他方の側部上に、長孔32にボルト33を挿着すること
により、上記方向Ｎに位置調整自在に配設されている。
34はサイドブロック31と基板３の間に介設されたＵ字形
の板ばねから成るばね材であって、そのばね力により、
基板３を上記第１のサイドブロック23に押し付けてい
る。A second side block 31 is arranged on the other side of the heater rail 2 so that its position can be adjusted in the direction N by inserting a bolt 33 into the elongated hole 32.
34 is a spring material composed of a U-shaped leaf spring interposed between the side block 31 and the substrate 3, and by the spring force,
The substrate 3 is pressed against the first side block 23.
35は、基板３の上方に位置するワイヤボンダーのキャピ
ラリ、36はキャピラリ35を保持するホーン、Ｗはキャピ
ラリ35に通されたワイヤ、37は基板３をピッチ送りする
ための送り部材である。Reference numeral 35 is a capillary of a wire bonder located above the substrate 3, 36 is a horn holding the capillary 35, W is a wire passed through the capillary 35, and 37 is a feed member for pitch-feeding the substrate 3.
本装置は上記のような構成より成り、次に動作の説明を
行う。The present apparatus has the above-mentioned configuration, and the operation will be described next.
昇降装置６のロッド７が下降して、ヒータレール２が下
降位置にある状態で、基板３は送り部材37に押さえてヒ
ータレール２上に搬入される。第１図において、矢印Ｍ
は基板３の搬入方向であり、上記板ばね34は、基板３の
搬入の障害とならないように、上述のようにＵ字形に形
成されている。With the rod 7 of the elevating device 6 lowered and the heater rail 2 in the lowered position, the substrate 3 is pressed onto the feed member 37 and is carried onto the heater rail 2. In FIG. 1, arrow M
Is the loading direction of the substrate 3, and the leaf spring 34 is formed in the U-shape as described above so as not to obstruct the loading of the substrate 3.
次いでロッド７が上昇すると、基板３はその両側端部を
押え部材24,27により押え付けられてそりが矯正され、
またサイドブロック23,31により、巾方向の位置決めが
なされる。次にキャピラリ35からワイヤＷを導出しなが
ら、ベアチップＰの電極と基板３に形成された電極を接
続する。接続作業が終了すると、昇降装置６が作動して
基板３は下降し、次の工程へ搬出される。Then, when the rod 7 rises, the board 3 is pressed by the pressing members 24 and 27 at both side ends thereof to correct the warp,
Further, the side blocks 23 and 31 perform positioning in the width direction. Next, while pulling out the wire W from the capillary 35, the electrode of the bare chip P and the electrode formed on the substrate 3 are connected. When the connection work is completed, the elevating device 6 is activated to lower the substrate 3, and the substrate 3 is carried out to the next step.
基板３の品種変更に伴い、基板３の巾が変るときは、ボ
ルト30,33を脱着して、押え部材27とサイドブロック31
を巾方向Ｎにスライドさせて位置を調整する。また基板
３の厚みの変動は、基板３を押し上げるばね材12と、押
え部材27のばね性により吸収される。このように本装置
によれば、基板３の品種にともなう巾や厚みの変動に、
簡単かつ柔軟に対応することができる。When the width of the board 3 changes due to the change of the kind of the board 3, the bolts 30 and 33 are detached, and the holding member 27 and the side block 31 are removed.
Slide in the width direction N to adjust the position. Further, the variation in the thickness of the substrate 3 is absorbed by the spring material 12 that pushes up the substrate 3 and the spring property of the pressing member 27. As described above, according to the present device, variations in width and thickness depending on the type of substrate 3
It can be handled easily and flexibly.
（実施例２） 第４図及び第５図は、押え手段の他の実施例を示すもの
であって、40は板状の押え部材であり、その先端部は２
股状に分岐して、第１の押え部41と、第２の押え部42が
形成されている。一方の押え部41は、他方の押え部42よ
りも長く、押え部41は、その先端下端部41aで基板３の
中央部を押え付け、また他方の押え部42は、その先端下
部42aで基板３の他端部を押え付ける。勿論この押え部
材40も、ばね性を有する金属材などにて形成されてい
る。43は上記受部14に、長孔44、ボルト45により巾方向
Ｎに位置調整自在に装着された受板であり、押え部材40
はボルト46により、この受板43に固定されている。(Embodiment 2) FIGS. 4 and 5 show another embodiment of the holding means, in which 40 is a plate-shaped holding member, the tip of which is 2
A first pressing portion 41 and a second pressing portion 42 are formed by branching in a crotch shape. One pressing portion 41 is longer than the other pressing portion 42, and the pressing portion 41 presses the center portion of the substrate 3 with its lower end portion 41a, and the other pressing portion 42 has its lower end portion 42a with the substrate. Hold the other end of 3. Of course, the pressing member 40 is also formed of a metal material having a spring property. Reference numeral 43 denotes a receiving plate mounted on the receiving portion 14 so as to be positionally adjustable in the width direction N by the long hole 44 and the bolt 45.
Is fixed to the receiving plate 43 with bolts 46.
この押え手段も、上記第１実施例と同様の作用効果を有
する他、押え部41にて基板３の中央部を押え付けること
により、特に巾の大きい基板３のそりを確実に矯正でき
る効果を有する。This pressing means has the same effects as those of the first embodiment, and in addition, by pressing the central portion of the substrate 3 with the pressing portion 41, it is possible to surely correct the warp of the board 3 having a particularly large width. Have.
（考案の効果） 以上説明したように本考案は、昇降装置により昇降自在
に配設されたヒータブロックと、このヒータブロック上
に設けられたヒータレールとを備え、このヒータレール
の一方の側部に、ヒータレール上に載置された基板の一
方の側面を位置決めする第１のサイドブロックを設ける
とともに、ヒータレールの他方の側部上に、基板の巾方
向に位置調整自在な第２のサイドブロックを設け、かつ
この第２のサイドブロックと基板の間に、基板を上記第
１のサイドブロックへ押圧するばね材を介設し、また基
板の上部側方からこの基板の上方に延出して、この基板
を下方に押え付けるばね材から成る押え部材を設け、か
つこの押え部材を基板の巾方向に位置調整自在として成
るので、サイドブロックを位置調整することにより、基
板の品種変更にともなう巾の変動に簡単に対応でき、ま
た押え部材のばね性により、基板の厚さの変動やばらつ
きを吸収して、ヒータレール上にしっかり位置決めする
ことができる。(Effects of the Invention) As described above, the present invention is provided with the heater block that is vertically movable by the lifting device and the heater rail provided on the heater block, and one side portion of the heater rail. Is provided with a first side block that positions one side surface of the substrate mounted on the heater rail, and a second side block that is positionally adjustable in the width direction of the substrate on the other side portion of the heater rail. A block is provided, and a spring member that presses the substrate to the first side block is provided between the second side block and the substrate, and extends from the upper side of the substrate to above the substrate. Since a pressing member made of a spring material for pressing the board downward is provided and the position of the pressing member can be adjusted in the width direction of the board, by adjusting the position of the side block, the board can be adjusted. It is possible to easily deal with the width variation due to the change of the product type, and due to the spring property of the pressing member, it is possible to absorb the variation and the variation of the thickness of the substrate and to firmly position on the heater rail.
図は本考案の実施例を示すものであって、第１図は位置
決め装置の斜視図、第２図は側面図、第３図は押え部材
の斜視図、第４図及び第５図は他の実施例の側面図及び
押え部材の斜視図、第６図は従来装置の側面図である。 第６図は従来装置の側面図である。 １……ヒータブロック ２……ヒータレール ３……基板 ６……昇降装置 23……第１のサイドブロック 24,27,40……押え部材 31……第２のサイドブロック 34……ばね材FIG. 1 shows an embodiment of the present invention. FIG. 1 is a perspective view of a positioning device, FIG. 2 is a side view, FIG. 3 is a perspective view of a holding member, and FIGS. 6 is a side view of the embodiment and a perspective view of the pressing member, and FIG. 6 is a side view of the conventional device. FIG. 6 is a side view of the conventional device. 1 ... Heater block 2 ... Heater rail 3 ... Substrate 6 ... Lifting device 23 ... First side block 24, 27, 40 ... Holding member 31 ... Second side block 34 ... Spring material
Claims (1)
タブロックと、このヒータブロック上に設けられたヒー
タレールとを備え、このヒータレールの一方の側部に、
ヒータレール上に載置された基板の一方の側面を位置決
めする第１のサイドブロックを設けるとともに、ヒータ
レールの他方の側部上に、基板の巾方向に位置調整自在
な第２のサイドブロックを設け、かつこの第２のサイド
ブロックと基板の間に、基板を上記第１のサイドブロッ
クへ押圧するばね材を介設し、また基板の上部側方から
この基板の上方に延出して、この基板を下方に押え付け
るばね材から成る押え部材を設け、かつこの押え部材を
基板の巾方向に位置調整自在としたことを特徴とするワ
イヤボンダーにおける基板の位置決め装置。1. A heater block, which is arranged to be movable up and down by a lifting device, and a heater rail provided on the heater block. One side portion of the heater rail includes:
A first side block for positioning one side surface of the substrate placed on the heater rail is provided, and a second side block whose position is adjustable in the width direction of the substrate is provided on the other side portion of the heater rail. A spring member for pressing the substrate to the first side block is provided between the second side block and the substrate, and extends from the upper side of the substrate to above the substrate. A substrate positioning device for a wire bonder, characterized in that a pressing member made of a spring material for pressing the substrate downward is provided and the pressing member is positionally adjustable in the width direction of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7200389U JPH075633Y2 (en) | 1989-06-20 | 1989-06-20 | Substrate positioning device for wire bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7200389U JPH075633Y2 (en) | 1989-06-20 | 1989-06-20 | Substrate positioning device for wire bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0310536U JPH0310536U (en) | 1991-01-31 |
| JPH075633Y2 true JPH075633Y2 (en) | 1995-02-08 |
Family
ID=31609547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7200389U Expired - Lifetime JPH075633Y2 (en) | 1989-06-20 | 1989-06-20 | Substrate positioning device for wire bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH075633Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52152538U (en) * | 1976-05-15 | 1977-11-18 | ||
| JPS61179245U (en) * | 1985-04-27 | 1986-11-08 |
-
1989
- 1989-06-20 JP JP7200389U patent/JPH075633Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0310536U (en) | 1991-01-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1757176B1 (en) | Screen printing apparatus and screen printing method | |
| US4782589A (en) | Process of connecting lead frame to a semi-conductor device and a device to effect same | |
| JPH10322100A (en) | Method for positioning printed board | |
| JPH075633Y2 (en) | Substrate positioning device for wire bonder | |
| KR100709614B1 (en) | Chip bonding device | |
| JP3395644B2 (en) | Lead frame transfer device | |
| JP4701567B2 (en) | Component mounting method and apparatus | |
| JP4463218B2 (en) | Electronic component pressure connection device and pressure connection method | |
| JPH0831498B2 (en) | Method and apparatus for forming external lead of device | |
| US5154339A (en) | Frame retainer mount used in bonding machines | |
| US4846700A (en) | Lead frame for semi-conductor device | |
| US3896541A (en) | Method and apparatus for supporting substrates during bonding | |
| CN211027859U (en) | Equipment of bending in lead frame pin forming process | |
| TW201204617A (en) | Conveyance device for substrate and conveyance method | |
| CN218447823U (en) | Pressing plate structure for semiconductor packaging | |
| JP2684465B2 (en) | Substrate transfer positioning device | |
| JP3775960B2 (en) | Electronic component crimping apparatus and crimping method | |
| CN214588805U (en) | Device for clamping feeding frame of preheating table | |
| CN217704790U (en) | Keyboard iron plate rubberizing tool | |
| JPH0539630Y2 (en) | ||
| JP2925932B2 (en) | Method and apparatus for applying external electrode paste to chip components | |
| JP3073654B2 (en) | Method and apparatus for adjusting protrusion height of chip component | |
| KR940003584B1 (en) | Fabrication apparatus of semiconductor | |
| JP3741578B2 (en) | Crimping device | |
| JPS5824443Y2 (en) | Lead frame holding device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |