JPH0750138B2 - Defect inspection method for transparent conductive circuit board - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a defect inspection method for a transparent conductive circuit board.

2. Description of the Related Art Liquid crystal display devices are widely used in consumer to industrial applications due to their features such as thinness, light weight, low voltage drive, and low power consumption. For example, high-resolution liquid crystal display devices have come to be used in word processors, personal computers, and the like. Furthermore, with the recent commercialization of color liquid crystal displays, the number of transparent electrodes that are indispensable for liquid crystal display has been reduced to 3 at once.
Double miniaturization is required, and it is becoming very difficult to inspect short-circuits and breaks in transparent electrodes.

The conventional transparent conductive circuit inspection method will be described below. 3 (a) and 3 (b) show a conventional inspection method.
In FIGS. 3A and 3B, 1 is a transparent substrate, 2 is a transparent electrode, 6 is a short-circuited portion, 11 is a broken portion, and 14 is an inspection prober.

First, the short-circuit inspection method between adjacent rod-shaped transparent electrodes 2 is as follows.
The prober was attached to each of the two rod-shaped transparent electrodes that were adjacent to each other.
14 is electrically contacted, and the presence or absence of a short circuit is judged by the resistance value between them. In the disconnection inspection method, a prober 14 is electrically contacted with both ends of one rod-shaped transparent electrode 2, and the presence or absence of disconnection is determined by the resistance value between them.

However, in the conventional method, if the electrode width becomes extremely fine, it becomes very difficult to bring the prober 14 into contact with it accurately. There is also a problem that the position of the short circuit cannot be determined. In view of the above problems, it is an object of the present invention to easily perform the presence / absence inspection of a transparent circuit board having a fine transparent conductive circuit and the position detection of the short circuit.

Means for Solving the Problems In order to achieve the above-mentioned object, the present invention forms a plurality of transparent electrodes made of a transparent conductive film on a transparent substrate, and makes the end shape of the transparent electrode one side long odd On the other side of the transparent electrode, even-numbered lines are drawn long, and one end of the transparent electrode is electrically connected by the first conductor, and the other end is electrically connected by the second conductor. It is characterized in that a magnetic field generated in the transparent electrode is detected by causing a current to flow through the conductor and scanning the magnetic field detection unit so as to be orthogonal to the transparent electrode.

In addition, a plurality of transparent electrodes made of transparent conductive film are formed on a transparent substrate, both ends of all transparent electrodes are electrically connected by conductors, current is passed through each conductor, and the magnetic field detector is orthogonal to the transparent electrodes. The magnetic field generated in the transparent electrode is detected by scanning as described above.

By this method, it is not necessary to bring the prober into contact with each rod-shaped transparent electrode, and the magnetic field generated by the current flowing through the transparent electrode is measured in a non-contact manner by the magnetic field detection unit that scans perpendicularly to the transparent electrode. It is possible to easily inspect the short circuit and disconnection of the transparent electrode circuit. Moreover, the transparent electrode is not damaged.

Further, since the position of the short circuit can be determined by scanning the magnetic field detection unit in the longitudinal direction of the transparent electrode where the short circuit exists, the short circuit portion can be easily corrected.

Embodiment One embodiment of the present invention will be described below with reference to the drawings. In FIGS. 1 and 2, the same parts as those in FIG. 3 are designated by the same reference numerals.

Example 1 FIGS. 1 (a), (b) and (c) are explanatory views of a short circuit inspection method in a first example of the present invention. 1 is a transparent substrate, 2
Is a transparent electrode, 3 is a copper foil, 4 is a magnetic field detector, 5 is a magnetic field, 6
Is a short-circuited portion, 7 is a short-circuit presence / absence inspection direction, 8 is a magnetic field detection portion scanning direction, and 9 and 10 are output signals.

First, at both ends of the transparent electrode 2, odd-numbered transparent electrodes 2 which are long on one side are electrically connected to even-numbered transparent electrodes 2 which are long on the opposite side by copper foils 3, and a voltage is applied. If the short-circuited portion 6 exists between the transparent electrode 2 adjacent to the rod-shaped transparent electrode 2, a current flows between the transparent electrodes 2 where the short-circuited portion 6 exists, and the magnetic field 5 is generated by the current. At this time, as shown in FIG. 1 (b), the magnetic field detection unit 4 is contactlessly scanned on the rod-shaped transparent electrode 2 at right angles (scanning in the short-circuit presence / absence inspection direction 7), as shown in FIG. 1 (c). The output signal 9 is obtained, and it can be seen that the short-circuited portion 6 exists in the portion where the signal is generated. When the magnetic field detection unit 4 is scanned in the longitudinal direction of the rod-shaped transparent electrode 2 with a short circuit (scanning in the short circuit position inspection direction 8), the output signal 10 shown in FIG. 1 (c) is obtained and a signal is generated. The position where it does not stop is the position of the short circuit.

As described above, according to the present embodiment, by measuring the magnetic field generated by the current in the short-circuited portion of the rod-shaped transparent electrode 2 in a non-contact manner, the transparent electrode 2 in which the short-circuited portion 6 in the fine transparent conductive circuit substrate exists can be detected. At the same time as knowing, the position of the short-circuit portion 6 can also be determined.

Embodiment 2 FIG. 2 is an explanatory view of the disconnection inspection method in the second embodiment of the present invention. In FIG. 2, 1 is a transparent substrate, 2 is a transparent electrode, 4 is a magnetic field detector, 5 is a magnetic field, 11 is a disconnection portion, 12 is a disconnection presence / absence inspection direction, and 13 is an output signal, which is different from the first embodiment. Indicates that the copper foils 3 were connected to both ends of all the rod-shaped transparent electrodes 2.

First, the copper foil 3 is electrically contacted with both ends of the rod-shaped transparent electrode 2 to apply a voltage. If the wire-shaped transparent electrode 2 has a disconnection portion 11, no current flows through the transparent electrode 2 and no magnetic field 5 is generated from this transparent electrode portion. At this time, as shown in FIG. 2 (b), the magnetic field detector 4 is contactlessly scanned (disconnection presence / absence inspection direction 12) to obtain an output signal 13 shown in FIG. 2 (c), and a portion where no signal is generated. It can be seen that there is a disconnection portion 11 at.

As described above, according to the present embodiment, by measuring the magnetic field generated by the current in the disconnection portion of the rod-shaped transparent electrode in a non-contact manner,
It is possible to easily know the disconnection point in the fine transparent conductive circuit board.

EFFECTS OF THE INVENTION As described above, according to the present invention, it is possible to know the location of the disconnection and the short circuit in the finely patterned transparent electrode circuit by measuring the magnetic field generated by the current flowing in the rod-shaped transparent electrode. The position can also be determined in.

[Brief description of drawings]

FIG. 1 (a) is a plan view for explaining a short circuit inspection method for a transparent conductive circuit board according to the first embodiment of the present invention, and FIG. 1 (b).
Is a cross-sectional view thereof, FIG. 1 (c) is an output signal waveform diagram at the time of inspecting a short circuit of the substrate, and FIG. 2 (a) is a description of a disconnection inspection method for a transparent conductive circuit substrate in a second embodiment of the present invention. 2B is a sectional view, FIG. 2C is an output signal waveform diagram at the time of inspecting the substrate for disconnection, and FIGS. 3A and 3B are conventional transparent conductive circuits. It is explanatory drawing which shows the inspection method of a board | substrate. 1 ... Transparent substrate, 2 ... Transparent electrode, 3 ... Copper foil, 4 ...
Magnetic field detection part, 5 ... magnetic field, 6 ... short circuit part.

Claims (4)

[Claims] 1. A transparent electrode in which a plurality of transparent electrodes made of a transparent conductive film are formed on a transparent substrate, and the shape of the end of the transparent electrode is such that an odd number is long on one side and an even number is long on the opposite side. One end of the is electrically connected by the first conductor, and the opposite end is electrically connected by the second conductor to apply a voltage to each conductor, and the magnetic field detector is connected to the transparent electrode. A defect inspection method for a transparent conductive circuit board, which comprises detecting a magnetic field generated in a transparent electrode by scanning so as to be orthogonal to each other. 2. A plurality of transparent electrodes made of a transparent conductive film are formed on a transparent substrate, both ends of all transparent electrodes are electrically connected by conductors, and a voltage is applied to each conductor to form a magnetic field detector. A method for inspecting a defect of a transparent conductive circuit board, which comprises detecting a magnetic field generated in the transparent electrode by scanning so as to be orthogonal to the transparent electrode. 3. The method for inspecting a defect of a transparent conductive circuit board according to claim 1, wherein the scanning direction is changed to the longitudinal direction of the transparent electrode when the magnetic field is maximized to detect the position of the short circuit portion. 4. The defect inspection method for a transparent conductive circuit board according to claim 1, wherein a Hall element is used as the magnetic field detection unit.