JPH0749800Y2 - Sealed container for semiconductor package - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hermetically sealed container for a semiconductor package, and more specifically, it is used to protect the built-in electronic circuit from the external environment when it is used in a vehicle or in an outdoor environment. The present invention relates to a hermetically sealed container for a semiconductor package provided with.

[0002]

2. Description of the Related Art Conventionally, this type of hermetically sealed container for a semiconductor package has a structure in which a printed circuit board on which a semiconductor package or the like is mounted by soldering is built in the container. In this case, the heat generated inside the container when the electronic circuit on the printed circuit board is used is transmitted to the outer wall of the container via the gas (air) in the atmosphere and is dissipated to the outside of the container.

[0003]

By the way, in the electronic circuit, the parts that generate a large amount of heat and require a heat dissipation structure have conventionally been limited to specially limited elements such as power ICs.
Recently, many semiconductor packages generate a large amount of heat due to an increase in power consumption due to an increase in the number of clocks used in circuits and an increase in the degree of integration of elements.

Generally, it depends on the parts, but when the temperature rises by 10 ° C., the life is halved (“Thermal Design of Electronic Circuits” Takeshi Ogiso, Written by Industrial Research Board, published). However, when the amount of heat generated by the semiconductor package is high as described above, the life of the semiconductor package itself or the electronic device using the semiconductor package is significantly reduced. Therefore, there is a strong demand for a structure capable of efficiently dissipating the heat generated from the semiconductor package to the outside and effectively suppressing the temperature rise inside the sealed metal container.

That is, in the case of the above-mentioned conventional structure, the heat generated by the semiconductor package mounted on the printed circuit board is mainly transmitted to the container wall through the air layer inside the container and dissipated outside the container. Efficient external radiation is difficult and the temperature rise of the semiconductor package cannot be effectively suppressed.

Therefore, an object of the present invention is to provide a hermetically sealed container for a semiconductor package, which can efficiently dissipate the heat generated by the semiconductor package to the outside of the container.

[0007]

According to the present invention, a heat dissipating structure is provided on the outer side and an insulating coating having an electric circuit is formed on the inner surface, and a heat dissipating structure on the inner side of the container main body. And a socket connector for connecting a semiconductor package, which is arranged in a portion corresponding to the position of and is connected to the electric circuit, wherein the socket connector has a hole for inserting the semiconductor package at a position facing the insulating coating. A hermetically sealed container for a semiconductor package is obtained, in which the heat dissipation surface of the semiconductor package is brought into close contact with the insulating coating.

[0008]

FIG. 1 shows a hermetically sealed container for a semiconductor package according to an embodiment of the present invention. This hermetically-sealed container is constructed by combining a metallic main body 1 and a metallic lid 2 with a fixing screw 3 and sealing with a sealing member 4 such as sealing rubber. The container body 10 is configured by combining the body 1 and the lid body 2. Container body 10
Insulating coatings 11 and 21 formed of an oxide coating or the like are formed on the inner surfaces located in the inner portion of the.

On the outside of the container body 10, for example, a large number of heat dissipation fin-shaped heat dissipation structures 12 and 22 are integrally formed. One or a plurality of socket connectors 5 are arranged inside the container body 10 corresponding to the positions of these heat dissipation structures 12 and 22, respectively. An electric circuit formed of a conductive pattern having an appropriate shape is formed on each of the insulating coatings 11 and 21, and the socket connector 5 and the container body 1 are formed by this electric circuit.
The necessary electrical connections are made between the electrical components 6 mounted on the 0 inner surface.

The electrical circuit formed on the insulating coating 11 on the main body 1 side and the electrical circuit formed on the insulating coating 21 on the lid 2 side are bridged between them to form a connector pair 7
Connected by. Further, these electric circuits are connected to a terminal 81 of a connector 8 provided inside the container body 10 which is sealed on the outer wall of the container body 10 by a seal member 5, and the external electric power is supplied via the connector 8. Connected to circuits and electrical parts.

As shown in detail in FIG. 2, the socket connector 5 is composed of a housing 51 and a lock cover 52 attached to an upper opening of the housing 51. A hole 55 is formed in the lock cover 5. The semiconductor package 9 is mounted inside the housing 51. The heat radiating surface 92 located on the lower side of the semiconductor package 9 in the figure is in close contact with the insulating coating 11 via the hole 54 formed in the socket connector 5. The lead terminal 91 provided around the semiconductor package 9 is in pressure contact with the inner end of the contact 53 integrally formed with the housing 51, and the outer end of the contact 53 is soldered to the electric circuit on the insulating coating 11. Connected by etc.

In the hermetically sealed container having the above structure, the heat generated in the semiconductor package 9 is mainly transmitted from the heat radiation surface 92 to the container wall and the heat radiation structure 12 through the insulating coating 11 as shown in FIG. The heat is dissipated from the heat dissipation structure 12 to the outside of the container. In this sealed container, for example, when the semiconductor package 9 fails and needs to be replaced, the main body 1 and the lid 2 are separated, the lock cover 52 of the socket connector 5 is removed, and the failed semiconductor package 9 is removed.
May be taken out from the socket connector 5 and replaced with a new semiconductor package 9.

[0013]

As described above, according to the present invention,
Since there is no air layer between the inner wall of the container and the heat generated by the built-in semiconductor package, it can be directly transmitted to the metal container. It is possible to provide a hermetically sealed container for a semiconductor package which can be manufactured.

[Brief description of drawings]

FIG. 1 is a sectional view of a hermetically sealed container for a semiconductor package according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing an enlarged main part of the hermetically sealed container for a semiconductor package of FIG. 1 together with the semiconductor package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Main body 2 Lid body 3 Fixing screw 4 Sealing member 5 Socket connector 6 Electric component 7 Connector pair 8 Connector 9 Semiconductor package 10 Container body 11, 21 Insulating coating 12, 22 Heat dissipation structure 53 Contact 54 Hole 91 Lead 92 Heat dissipation surface

Claims (1)

[Scope of utility model registration request] 1. A container body provided with a heat dissipation structure on the outside and an insulating coating having an electric circuit formed on the inner surface, and a container body disposed inside the container body and corresponding to the position of the heat dissipation structure. A socket connector for connecting a semiconductor package, which is connected to an electric circuit, wherein the socket connector has a hole for inserting the semiconductor package at a position facing the insulating coating, and a heat dissipation surface of the semiconductor package. A hermetically sealed container for a semiconductor package, characterized in that it is closely attached to the insulating coating.