JPH0525738U - Airtight container for semiconductor packages - Google Patents

Abstract

(57) [Summary] [Objective] To provide a hermetically sealed container for a semiconductor package capable of efficiently dissipating the heat generated by the built-in semiconductor package to the outside of the container. [Structure] Insulating coatings 11 and 21 are formed on the inner surface of a hermetically sealed container body 10 having heat dissipation structures 12 and 22 on the outside.
An electric circuit is formed on the surface of this insulating film. Inside the container body, there is a socket connector 5 corresponding to the position of the heat dissipation structure.
And arrange the semiconductor package in the socket connector. The heat dissipation surface of the semiconductor package is brought into close contact with the insulating film through the hole formed in the socket connector.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a hermetically sealed container for a semiconductor package, and more particularly, to a semiconductor package having a heat dissipation structure provided for protecting the built-in electronic circuit from the outside when used in a vehicle or an outdoor environment. The present invention relates to an airtight container.

[0002]

[Prior Art]

 In this type of hermetically sealed container for a semiconductor package, conventionally, a structure has been adopted in which a printed circuit board itself on which a semiconductor package or the like is mounted by soldering is built in the container. In this case, the heat generated inside the container when the electronic circuit on the printed circuit board is used is transmitted to the outer wall of the container through the gas (air) in the atmosphere and is dissipated to the outside of the container.

[0003]

[Problems to be solved by the device]

 By the way, in the electronic circuit, the parts that generate a large amount of heat and require a heat dissipation structure have conventionally been limited to specially limited elements such as power ICs. Due to the rise in power consumption due to improvements, the amount of heat generated by many semiconductor packages has recently become high.

[0004] Although it depends on the parts, it is generally said that the life is halved when the temperature rises by 10 ° C. ("Thermal design of electronic circuit", Takeshi Ogiso, published by the Industrial Research Board). As described above, when the amount of heat generated by the semiconductor package is high as described above, the life of the semiconductor package itself or the electronic device using it is significantly reduced. Therefore, there is a strong demand for a structure capable of efficiently dissipating the heat generated from the semiconductor package to the outside and effectively suppressing the temperature rise inside the sealed metal container.

That is, in the case of the above-described conventional structure, the heat generated by the semiconductor package mounted on the printed circuit board is mainly transmitted to the container wall through the air layer inside the container and dissipated outside the container. It is difficult to efficiently externally dissipate the temperature, and it is not possible to effectively suppress the temperature rise of the semiconductor package.

Therefore, an object of the present invention is to provide a hermetically sealed container for a semiconductor package, which is capable of efficiently dissipating the heat generated by the semiconductor package to the outside of the container.

[0007]

[Means for Solving the Problems]

 According to the present invention, a heat dissipating structure is provided on the outer side, and an inner surface is provided with a container main body on which an insulating film having an electric circuit is formed. A socket connector for connecting a semiconductor package, which is arranged and connected to the electric circuit, wherein the socket connector has a hole for inserting the semiconductor package at a position facing the insulating film. A hermetically sealed container for a semiconductor package, characterized in that the heat-releasing surface of (1) is brought into close contact with the insulating coating, is obtained.

[0008]

【Example】

 FIG. 1 shows a hermetically sealed container for a semiconductor package according to an embodiment of the present invention. This hermetically-sealed container is configured by combining a metallic main body 1 and a metallic lid 2 with a fixing screw 3 and sealing with a sealing member 4 such as sealing rubber. The main body 1 and the lid 2 together form a container main body 10. Insulating coatings 11 and 21 formed of an oxide coating or the like are formed on the inner surface located inside the container body 10.

On the outside of the container body 10, for example, a large number of heat dissipation fin-shaped heat dissipation structures 12 and 22 shown in the figure are integrally formed, respectively. Inside the container body 10 corresponding to the positions of these heat dissipation structures 12 and 22, one or a plurality of socket connectors 5 are arranged. An electric circuit formed of a conductive pattern of an appropriate shape is formed on each of the insulating coatings 11 and 21, and the electric circuit mounted on the socket connector 5 and the inner surface of the container body 10 is formed by this electric circuit. The necessary electrical connections are made between the parts 6.

Further, the electric circuit formed on the insulating coating 11 on the main body 1 side and the electric circuit formed on the insulating coating 21 on the lid 2 side are connected to each other by a connector pair 7 Connected by. Further, these electric circuits are connected to a terminal 81 of a connector 8 provided inside the container body 10 which is sealed on the outer wall of the container body 10 by a seal member 5, and the external electric power is supplied via this connector 8. Connected to circuits and electrical parts.

The socket connector 5 is composed of a housing 51 and a lock cover 52 attached to an upper opening of the housing 51, as shown in detail in FIG. A hole 55 is formed in the lock cover 5. The semiconductor package 9 is mounted inside the housing 51. The heat radiation surface 92 located on the lower side of the semiconductor package 9 in the figure is in close contact with the insulating coating 11 through the hole 54 formed in the socket connector 5. The lead terminal 91 provided around the semiconductor package 9 is in pressure contact with the inner end of the contact 53 integrally formed with the housing 51, and the outer end of the contact 53 is soldered to the electric circuit on the insulating coating 11. And so on.

In the hermetically sealed container having the above-described structure, the heat generated in the semiconductor package 9 is mainly transmitted from the heat dissipation surface 92 to the container wall and the heat dissipation structure 12 through the insulating coating 11 as shown in FIG. The heat is dissipated from the heat dissipation structure 12 to the outside of the container. In this sealed container, for example, when the semiconductor package 9 has failed and needs to be replaced, the main body 1 and the lid 2 are separated, the lock cover 52 of the socket connector 5 is removed, and the failed semiconductor package 9 is removed. It is possible to take out the connector from the socket connector 5 and replace it with a new semiconductor package 9.

[0013]

[Effect of the device]

 As described above, according to the present invention, since there is no air layer between the inner wall of the container and the inner wall of the container, the heat generated by the built-in semiconductor package can be directly transmitted to the metal container, which significantly reduces the thermal resistance. Thus, it is possible to provide a hermetically sealed container for a semiconductor package that can efficiently dissipate the heat generated by the semiconductor package to the outside of the container.

[Brief description of drawings]

FIG. 1 is a sectional view of a hermetically sealed container for a semiconductor package according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing an enlarged main part of the hermetically sealed container for a semiconductor package of FIG. 1 together with the semiconductor package.

[Explanation of reference numerals] 1 main body 2 lid 3 fixing screw 4 sealing member 5 socket connector 6 electrical component 7 connector to 8 connector 9 semiconductor package 10 container body 11, 21 insulating coating 12, 22 heat dissipation structure 53 contact 54 hole 91 lead 92 Heat dissipation surface

Claims (1)

[Scope of utility model registration request] 1. A container body provided with a heat dissipation structure on the outer side and an insulating coating having an electric circuit formed on the inner surface, and a container body disposed inside the container body and corresponding to the position of the heat dissipation structure. A socket connector for connecting a semiconductor package, which is connected to an electric circuit, wherein the socket connector has a hole for inserting the semiconductor package at a position facing the insulating coating, and a heat dissipation surface of the semiconductor package. A hermetically sealed container for a semiconductor package, characterized in that it is brought into close contact with the insulating coating.