JPH0748368Y2 - Polishing device for approach part of wire drawing die - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to an improvement of a die polishing apparatus for polishing a die approach portion of a wire drawing die used in a wire drawing machine for drawing a metal wire. is there.

[Conventional technology and its problems]

As shown in FIG. 3, the conventional die approach part is polished by placing the die 3 on the die table 19 in a free state, and inserting the die polishing needle 8 into the center of the die hole. While rotating the die table 19 with the electric motor 20, the die table 19 is moved up and down by the eccentric cam 21 provided at the lower portion to polish the die approach portion 17 of the die 3.

In the polishing apparatus, the contact time between the polishing needle and the die approach section is short, and since the die is placed in a free state, the contact pressure between the polishing needle and the die approach section becomes weak, and the die approach section There is a problem that the polishing processing time becomes long.

[Means for Solving the Problems] The present invention has been made in order to eliminate the above problems, and is provided with a rotary drive device for rotationally driving a die table and a polishing needle holding chuck, respectively. Alternatively, in a die polishing apparatus provided with a vertical drive device for vertically moving one of the polishing needle holding chucks, an elastic body such as a wire spring or a leaf spring for holding the die at the center of rotation is provided on the upper surface of the die table. Providing a die holder, above the die table,
Further, the present invention provides an apparatus for polishing an approach portion of a wire drawing die, characterized in that a polishing needle holding chuck is arranged such that the tip of the polishing needle is slightly eccentric from the center of the die.

〔Example〕

 An embodiment of the present invention will be described below with reference to the drawings.

As shown in FIG. 1, reference numeral 1 is a die table rotatably arranged on a machine frame 2, and a die spring 3 for holding a die 3 at the center of rotation of the die table 1 and a pin 5 are provided on the upper surface thereof. A die holding tool 6 is provided.

Next, 7 is a polishing needle holding chuck rotatably arranged on the machine frame 2 above the die table 1, and holds a polishing needle 8 detachably.

The polishing needle holding chuck 7 is arranged so that the tip of the polishing needle 8 is slightly eccentric to the center of the die 3 with a distance t.

The die table 1 and the polishing needle holding chuck 7 are rotationally driven by a rotational driving device 9 including a motor M, a belt, a pulley and the like.

Further, the die table 1 contacts the cam contact plate 10 having a cam contact surface integrally formed with the die table 1, which is driven to rotate, and the lower surface of the cam contact plate 10. Rotating shaft 12 of die table 1
The die polishing device 15 is configured so as to be driven up and down as indicated by the arrow by the vertical drive device 14 that is configured by the compression spring 13 that is disposed in.

In the above structure, as the die holder 6, as shown in FIG. 2 (a), a plurality of pins 5 are fixed to the upper surface of the die table 1 and the wire spring 4 is stretched between the pins 5. Alternatively, a plurality of pins 5 may be fixed to the upper surface of the die table 1 and a leaf spring 16 may be provided as shown in FIG. It is also possible to center the die using means other than the above.

Further, the rotary drive device 9 and the vertical drive device 14 are not limited to the above-mentioned embodiment, and may be constituted by other means.

Further, although the vertical driving device 14 is arranged on the die table 1, it is also provided on the polishing needle holding chuck 7, and the die table 1 can be rotated only, and the polishing needle holding chuck 7 can be vertically driven to polish the die 3. Is.

By the way, 18 is an adjusting screw for adjusting the distance t between the polishing needle 8 and the center of the die 3. That is, when adjusting the interval t, loosen the fixing screw between the machine frame 2 and the machine base, and adjust the adjustment screw.
By rotating 18, the machine base 2 is moved left and right, and then the fixing screw is tightened.

Next, polishing of the die 3 using the die processing device 15 will be explained.

First, the die 3 is placed on the die table 1 by the die holder 6 at the center of the die table 1.

Next, the die polishing needle 8 is held by the polishing needle holding chuck 7, and the die table 1 and the polishing needle holding chuck 7 are driven. When the die table 1 is lifted by the eccentric cam 11, the polishing needle 8 is inserted not in the center of the die hole but in contact with the die approach portion 17. Dice polishing needle 8
While the die table 1 is rotated by the rotation driving device 9, the die table 1 continues to move up and down by the spring 13 and the eccentric cam 11, and the die 3 is ground. At this time,
The die 3 is pulled by the polishing needle 8 toward the machine frame 2 by the interval t, but at the same time, by the die holder 6,
Returned to the center of the die table.

Therefore, the die approach section 17 always receives the contact pressure. Therefore, unlike the case where the contact pressure works only when the polishing needle is deeply inserted with the die free,
Since the die is always pressed in the state of being pressed against the polishing needle, the polishing processing force becomes stronger.

[Effect of device]

Since the die polishing apparatus of the present invention has the above-described configuration, the die holder made of an elastic body serves as a buffer, so that the die approach surface and the die polishing needle can always be kept in contact with each other. Further, since the die holder is made of an elastic body and always tries to return the die to the center of the die table, the contact pressure between the die polishing needle and the die approach portion is higher than the conventional one, and the polishing force becomes stronger. Also,
Since the die approach surface is constantly pressed against the die polishing needle, the polishing process time can be shortened to 1/2 to 1/5 as compared with the conventional polishing technology. Furthermore, since the die and the polishing needle are in contact with each other while rotating, uneven wear of the die approach surface and the polishing needle does not occur, and it has an excellent practical effect that uniform die polishing is possible. .

[Brief description of drawings]

FIG. 1 is an explanatory view showing an embodiment of a die polishing apparatus of the present invention, and FIGS. 2 (a) and 2 (b) are plan views showing different embodiments of a die holder used in the die polishing apparatus of the present invention. ,
FIG. 3 is an explanatory view of a conventional die polishing apparatus. 1,19 …… Die table, 2 …… Machine frame 3 …… Die, 4 …… Wire spring 5 …… Pin, 6 …… Die holder 7 …… Grinding needle holding chuck, 8 …… Grinding needle 9 …… Rotary drive device, 10 …… Cam contact plate 11 …… Cam, 12 …… Rotary shaft 13 …… Compression spring, 14 …… Vertical drive device 15 …… Die polishing device, 16 …… Plate spring 17 …… Die approach part , 18 …… Adjustment screw 20 …… Electric motor, 21 …… Eccentric cam

Claims (1)

[Scope of utility model registration request] 1. A die polishing comprising a rotary driving device for rotating and driving a die table and a polishing needle holding chuck respectively, and a vertical driving device for vertically driving either the die table or the polishing needle holding chuck. In the apparatus, a die holder made of an elastic body such as a wire spring or a leaf spring for holding the die at the center of rotation is provided on the upper surface of the die table, and is positioned above the die table and slightly eccentric to the center of the die. An approach part polishing apparatus for a wire drawing die, wherein a polishing needle holding chuck is arranged so that the tip of the polishing needle comes to the bottom.