JP3006915U - Thinning device for tabletop drilling machine - Google Patents

Abstract

(57) [Summary] [Purpose] The purpose is to make it possible to perform thinning polishing of an appropriate shape at the position where standard polishing was performed by adjusting the scale of the drill outer diameter. [Configuration] On the positioning block (3) for standard polishing,
A device that can easily and properly perform a series of operations from standard polishing to thinning polishing by correlatively attaching a positioning block (2) for thinning that can be tilted by an appropriate amount and can be moved and set by the outer diameter of the drill.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an apparatus capable of easily and accurately performing a thinning operation as a treatment for improving the cutting property of a drill in a drill polishing process.

[0002]

[Prior art]

 There are several types of thinning shapes, but in the X-type thinning, which has particularly good machinability, the thinning device and standard polishing device are conventionally separate items, and the setup change is not necessary when performing thinning polishing after standard polishing. It was necessary and required time to adjust the diameter of the drill, making it difficult to use.

[0003]

[Problems to be solved by the device]

 Therefore, in order to solve the above-mentioned problems in the desk-top type drill polishing machine, this invention integrates the standard polishing device and the thinning device, and when the standard polishing is completed, the outside diameter of the drill can be set with the dial. The purpose was to be able to easily perform X-type thinning.

[0004]

[Means for Solving the Problems]

 In order to achieve the above-mentioned object, the present invention allows a positioning block for thinning to be adjacent to a standard positioning block for polishing, and the positioning block for thinning can be set to move, and the outer diameter of the drill can be adjusted to the scale. Therefore, a good X-shaped thinning shape can be obtained.

Further, in the present invention, since the positioning block for thinning is tilted by an appropriate amount, it is possible to perform thinning of a predetermined shape by utilizing the upper part of the grindstone simply by aligning the chuck body with the block surface.

[0006]

With the apparatus of the present invention configured as described above, the positioning block for standard polishing performs polishing by aligning the tip of the drill with the corner of the grinding stone, and then the positioning block for thinning is used for the chuck body. By replacing and polishing, the shape of the X-shaped shining can be polished at that position.

[0007]

【Example】

 Examples will be described with reference to the drawings. FIG. 3 shows the state of standard polishing. The standard polishing positioning block (3) in FIG. 3 is shown in FIG. 2 (3) and is located below the thinning positioning block (2). The symmetrical holes of the chuck body (7) are inserted into the pivot pin (6), and the tip of the drill (8) is aligned with the corner of the grindstone (1) for polishing.

FIG. 4 shows a thinning state. The thinning positioning block (2) in FIG. 4 is the positioning block (2) in FIG. 2 and is located on the positioning block for standard polishing, and can be moved back and forth with the drill diameter setting handle (4). . When the drill diameter is adjusted to the scale, insert the chuck body (7) into the pivot pin (5), rotate it against the corner of the grindstone (1) and stop with the pin (9). By performing the operation by reversing the chuck body (7) left and right, a symmetrical thinning shape can be obtained.

[0009]

[Effect of device]

 Since the present invention is configured as described above, it has the following effects. Since the positioning block for standard polishing and the positioning block for thinning correspond to each other to form an integrated device, thinning polishing can be performed immediately after standard polishing without setup change.

[Brief description of drawings]

FIG. 1 is a plan view of the device.

FIG. 2 is a side view of the device.

FIG. 3 is a diagram showing a relationship between a chuck body, a grindstone, and a standard polishing positioning block, which represents a state of standard polishing.

FIG. 4 is a diagram showing the relationship between the chuck body, the grindstone, and the positioning block for thinning, which shows the state of thinning polishing.

FIG. 5 is an X-shaped thinning shape of a cutting edge of a drill polished by this device.

[Explanation of symbols]

 1 Grinding stone 2 Positioning block for thinning 3 Positioning block for standard polishing 4 Drill diameter setting handle 5 Pivot pin 6 Pivot pin 7 Chuck body 8 Drill 9 pin

Claims (1)

[Scope of utility model registration request] 1. A chuck body (7) sandwiching a drill (8) is positioned by a pivot pin (6) attached to a positioning block (3) for standard polishing, and is rotatably attached to a grindstone (1). Contact and rock to perform standard polishing, and then replace the pivot pin (5) attached to the thinning positioning block (2) with a revolving surface that is tilted by an appropriate amount, rocking contact with the upper part of the grindstone (1), and The integral thinning device described above that can polish the X-type thinning optimum for the drill diameter by stopping the rocking at (9).