JPH0744065Y2 - Electronic circuit package mounting structure - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of an electronic circuit package in a device housing that houses the electronic circuit package.

2. Description of the Related Art Conventionally, a device such as a communication device is provided with a plurality of guide grooves corresponding to the facing surfaces of an upper plate and a lower plate of a device housing, and electronic circuit components are mounted using the upper and lower guide grooves. It is configured by mounting a plurality of electronic circuit packages of the same shape. The size of this electronic circuit package is mainly determined by the functional circuit scale, power consumption, etc.
There is a case where a specific electronic circuit package or a power supply package among the electronic circuit packages forming the device is too large and the smaller electronic circuit package is desired to be mixed.

Therefore, in order to mix such electronic circuit packages,
Conventionally, a device housing having a mechanism for mounting a small electronic circuit package in a part of the device housing has been individually designed and manufactured.

However, in order to mount small electronic circuit packages together, it is not possible to design individually in consideration of the mounting efficiency of the device depending on the number of mounted small electronic circuit packages and mounting positions. However, it takes a lot of design man-hours and the standardization of the device housing is not progressing.

The present invention has been made in view of the above-mentioned conventional circumstances,
Therefore, an object of the present invention is to solve the above problems inherent in the conventional technology, and to provide a new structure that enables free mounting of a small electronic circuit package while suppressing a decrease in mounting efficiency as much as possible. is there.

Means for Solving the Problems To achieve the above object, an electronic circuit package mounting structure according to the present invention has an upper surface plate, a lower surface plate, and an opposing surface of the upper surface plate and the lower surface plate of a housing including two side plates. A plurality of front-rear direction guide grooves provided inside the device and mounting a plurality of electronic circuit packages, a first housing selectively fitted into one of the guide grooves of the top plate at an upper end thereof; And a second step bent portion fitted to a corresponding guide groove of the lower surface plate at the lower end, and having a first guide groove corresponding to the guide groove of the upper surface plate on the upper surface. A support plate having a guide plate having a second guide groove corresponding to the guide groove of the lower surface plate on the lower surface is mounted using the guide groove of the apparatus housing, and the upper surface plate and the lower surface plate of the apparatus housing are mounted. The guide groove provided on the guide plate and the guide plate provided on the support plate, By utilizing the first and second guide grooves, a small electronic circuit package is mixedly mounted on the device housing.

That is, according to the present invention, the support plate having the guide plate having the guide groove is mounted on the device casing in the same manner as that for mounting other electronic circuit packages. By using the guide groove and the guide groove of the guide plate provided on the support plate, it is possible to mount the small electronic circuit package.

Embodiment Next, a preferred embodiment of the present invention will be specifically described with reference to the drawings.

FIG. 1 is an overall perspective view showing an essential part of an embodiment of the present invention in a separated manner.

Referring to FIG. 1, an apparatus housing according to the present invention has side plates 1 and 2, an upper surface plate 3 and a lower surface plate 4, and the upper surface plate 3 and the lower surface plate 4 form a pair in the front-rear direction. It is provided with guide grooves 3a, 4a and 3a ', 4a'.

On the other hand, the support plate 5, which is the main part of the present invention, has the same plate thickness as the printed circuit board of the electronic circuit package, and the step-bending part that fits vertically in the guide grooves 3a, 3a ', 4a, 4a'. 5a, 5b, and a guide plate 6 having guide grooves 6a, 6b similar to the guide grooves 3a, 4a provided on the upper plate 3 and the lower plate 4 of the apparatus housing.

As shown in FIG. 1, from the front side of the device housing, align the guide groove 3a of the upper plate 3 and the guide groove 4a of the lower plate 4 of the device housing with the stepped bent portions 5a, 5b of the support plate 5, respectively. And insert it second
It becomes as shown in the figure. In this state, the guide groove 3a 'of the upper plate 3 and the guide groove 6a of the guide plate 6 attached to the support plate 5, and the guide groove 4a' of the lower plate 4 and the guide groove 6b of the guide plate 6 are arranged to face each other. As shown in the front view of FIG. 3, the small electronic circuit package 7 can be mixedly mounted by utilizing the guide grooves 3a 'and 6a and 4a' and 6b.

In the illustrated embodiment, the guide plate 6 is fixed to a substantially central portion of the support plate 5, but the guide plate 6 should be mounted so as to be vertically movable (adjustable) along the support plate 5. This makes it possible to accommodate small electronic circuit packages of various sizes.

As described above, according to the present invention, a structural component having a guide groove for mounting a small electronic circuit package is provided.
By mounting the device in the same way as other electronic circuit packages, it is possible to mix small electronic circuit packages at any position, and the number and position of small electronic circuit packages to be installed. Therefore, it is not necessary to individually design and manufacture the device casing.

Further, according to the present invention, regarding the mounting efficiency of the device housing,
As shown in FIG. 3, the height of the electronic circuit components mounted in the small electronic circuit package is limited by the thickness of the support plate, but since it does not affect other electronic circuit packages at all, Small electronic circuit packages can be mixedly mounted without reducing the mounting efficiency of the device housing.

[Brief description of drawings]

1 and 2 are overall perspective views showing an embodiment of the present invention, of which FIG. 1 is a perspective view showing a support plate, which is a main part of the present invention, separated from a housing, and FIG. Is a perspective view showing a state in which a support plate having a guide plate is mounted on the apparatus housing, FIG. 3 is a front view showing the electronic circuit package mounted in FIG. 2, and an example of mounting the electronic circuit package is shown. It is a front view which shows the state which mounted four electronic circuit packages and two small electronic circuit packages together. 1, 2 ... Side plate, 3 ... Top plate, 3a, 3a '... Guide groove,
4 ... Bottom plate, 4a, 4a '... Guide groove, 5 ... Support plate, 5
a, 5b ... step bending part, 6 ... guide plate, 6a, 6b ... guide groove, 7 ... small electronic circuit package, 8 ... electronic circuit package

Claims (1)

[Scope of utility model registration request] 1. A plurality of electronic circuit packages in which a plurality of front and rear guide grooves are provided inside a facing surface of the upper plate and the lower plate of a housing composed of an upper plate, a lower plate and two side plates. In a device housing for mounting the above, a first step bending portion selectively fitted in one of the guide grooves of the upper plate is provided at an upper end, and the first step bending portion is fitted to a corresponding guide groove of the lower plate at a lower end. A guide plate having a second stepped portion and having a first guide groove on the upper surface corresponding to the guide groove of the upper surface plate and a second guide groove on the lower surface corresponding to the guide groove of the lower surface plate. The supporting plate provided is mounted using the guide groove of the device housing, and the guide grooves provided in the upper plate and the lower plate of the device housing and the first plate formed in the guide plate of the supporting plate are mounted. By using the first and second guide grooves, a small electronic circuit package can be mixed in the device housing. Electronic circuit package mounting structure, characterized by.