JPH02113362U - - Google Patents
Info
- Publication number
- JPH02113362U JPH02113362U JP2045389U JP2045389U JPH02113362U JP H02113362 U JPH02113362 U JP H02113362U JP 2045389 U JP2045389 U JP 2045389U JP 2045389 U JP2045389 U JP 2045389U JP H02113362 U JPH02113362 U JP H02113362U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- spacer component
- electronic
- board device
- device characterized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 10
- 230000006355 external stress Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は、この考案の一実施例に従つた回路基
板装置の回路基板が外装ハウジング内の所定の位
置に配置固定されている状態の一部を拡大して概
略的に示す縦断面図、第２図は、この考案の一実
施例に従つた回路基板装置の回路基板の上面を概
略的に示す斜視図、第３図及び第４図は、上記一
実施例に従つた回路基板装置の回路基板に固定さ
れているスペーサ部品を拡大して概略的に示す平
面図及び側面図、第５図及び第６図は、第２図及
び第１図に示されている回路基板上の所定の位置
に対する第３図及び第４図のスペーサ部品の固定
の２つの状態を概略的に示す平面図、第７図及び
第８図は、高さ調整機構が備えられたスペーサ部
品を概略的に示す平面図及び側面図、第９図は、
１対の外装ハウジングの壁の間に複数枚の回路基
板が配置されたときにおける夫々の回路基板に対
するスペーサ部品の配置の相互関係を概略的に示
す縦断面図、第１０図は、一方の面にのみ種々の
電子／電気部品が配置されている回路基板におけ
るスペーサ部品の配置を示す概略的な縦断面図、
第１１図は、かなりの剛性を有した金属製の回路
基板の両面に種々の電子／電気部品が配置されて
いる場合におけるスペーサ部品の配置を示す概略
的な縦断面図である。
FIG. 1 is an enlarged vertical sectional view schematically showing a part of a circuit board of a circuit board device according to an embodiment of the present invention, which is arranged and fixed at a predetermined position in an exterior housing; FIG. 2 is a perspective view schematically showing the top surface of a circuit board of a circuit board device according to an embodiment of the invention, and FIGS. 3 and 4 are diagrams of a circuit board device according to an embodiment of the invention. The enlarged plan and side views of the spacer components fixed to the circuit board, FIGS. Figures 7 and 8 schematically show a spacer part provided with a height adjustment mechanism; The plan view and side view, Figure 9, are
FIG. 10 is a longitudinal cross-sectional view schematically showing the mutual relationship of the arrangement of spacer components with respect to each circuit board when a plurality of circuit boards are arranged between the walls of a pair of exterior housings. a schematic longitudinal cross-sectional view showing the arrangement of spacer components in a circuit board on which various electronic/electrical components are arranged;
FIG. 11 is a schematic longitudinal cross-sectional view showing the arrangement of spacer components in a case where various electronic/electrical components are arranged on both sides of a metal circuit board having considerable rigidity.
Claims (1)
スペーサ部品を設けたことを特徴とする回路基板
装置。 ２ 電子機器の外部応力によつて変形容易な箇所
に対向して回路基板にスペーサ部品を設けたこと
を特徴とする回路基板装置。 ３ 前記スペーサ部品は同一回路基板に配設され
た他の電子／電気部品よりも高さが高い請求項１
又は２に記載の回路基板装置。 ４ 前記スペーサ部品が高さ調整機構を有する請
求項１又は２に記載の回路基板装置。 ５ 電子機器内の回路基板に配設された電気／電
子部品の少なくとも１つと同様または類似の形状
を有するスペーサ部品が上記回路基板に配設され
ていることを特徴とする回路基板装置。[Claims for Utility Model Registration] 1. A circuit board device characterized in that a spacer component is provided at a portion of the circuit board that is easily deformed by external stress. 2. A circuit board device characterized in that a spacer component is provided on the circuit board facing a location easily deformed by external stress of an electronic device. 3. Claim 1, wherein the spacer component is taller than other electronic/electrical components disposed on the same circuit board.
Or the circuit board device according to 2. 4. The circuit board device according to claim 1 or 2, wherein the spacer component has a height adjustment mechanism. 5. A circuit board device characterized in that a spacer component having the same or similar shape as at least one of the electric/electronic components arranged on a circuit board in an electronic device is arranged on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2045389U JPH02113362U (en) | 1989-02-23 | 1989-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2045389U JPH02113362U (en) | 1989-02-23 | 1989-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02113362U true JPH02113362U (en) | 1990-09-11 |
Family
ID=31236834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2045389U Pending JPH02113362U (en) | 1989-02-23 | 1989-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02113362U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010014872A (en) * | 2008-07-02 | 2010-01-21 | Tabuchi Electric Co Ltd | Electronic device |
| US11350517B2 (en) | 2018-01-25 | 2022-05-31 | Mitsubishi Electric Corporation | Circuit device and power conversion device |
-
1989
- 1989-02-23 JP JP2045389U patent/JPH02113362U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010014872A (en) * | 2008-07-02 | 2010-01-21 | Tabuchi Electric Co Ltd | Electronic device |
| US11350517B2 (en) | 2018-01-25 | 2022-05-31 | Mitsubishi Electric Corporation | Circuit device and power conversion device |