JPH0743242U - IC burn-in equipment - Google Patents

Abstract

(57) [Summary] [Purpose] When performing a burn-in test of a small amount of ICs,
(EN) Provided is an IC burn-in device capable of efficiently performing an IC burn-in test without using a socket without using a large-sized constant temperature bath. [Structure] IC positioning hole and I positioned here
The burn-in board is formed with a circuit pattern to which the C lead is connected, and a pair of holding plates for holding the IC by sandwiching the burn-in board from both side surfaces thereof, and at least one of the holding plates is provided. The IC is heated by a heating plate having a surface heating element.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a burn-in device used for burn-in test of IC.

[0002]

[Prior art]

 In order to stabilize the characteristics of manufactured ICs before putting them on the market, they are actually operated by energizing them for a fixed time under a fixed environment. This process is called burn-in (burn-in, burn-out operation), aging, etc. (hereinafter burn-in). In such a burn-in process, it is necessary to actually electrically connect the IC. For this reason, a board dedicated to this burn-in was prepared, and an IC was set in this board for burn-in.

FIG. 5 is a sectional view showing a conventional jig used in a flat pack type IC, and FIG. 6 is a perspective view of a socket used therein. In these drawings, reference numeral 10 is a socket, which has a lower case 12 and a lid 14. The IC 16 is loaded in the lower case 12, and the IC 16 can be fixed in the socket 10 by closing the lid 14. The IC 16 has a large number of leads 20 protruding in the outer peripheral direction of the package 18. The IC 16 is of a flat pack type such as a SOP type having leads 20 on two opposite sides of the package 18 or a QFP type having leads 20 on each of four sides.

As shown in FIG. 5, one end of the lower case 12 of the socket 10 projects vertically downward of the lower case 12, and the other end of the socket 10 is bent horizontally to face a plurality of pins 20 under each lead 20. 22 have been planted. Therefore, when the IC 16 is loaded into the lower case 12 and the lid 14 is closed, the elastic mat 24 attached to the inner surface of the lid 14 pushes down the package 18, and each lead 20 is pushed against the corresponding pin 22. Reference numeral 26 is a lock for holding the lid 14 in the closed position.

In FIG. 5, reference numeral 28 denotes a burn-in board, and a circuit pattern necessary for burn-in of the IC 16 is formed on the board 28 by printed wiring, and through holes are formed at intervals corresponding to the pins 22 of the socket 10. 30 are formed. 32 is a base, the board 28 is placed on the base 32, and the pins 22 of the socket 10 are aligned and inserted into the respective through holes 30. As a result, the lead 20 of the IC 16 is connected to the burn-in circuit pattern of the board 28 via the pin 22.

The burn-in board 28 is placed in a thermostatic chamber with the socket 10 attached, heated to a constant temperature, and subjected to a burn-in test, that is, a thermal shock test. However, the temperature chamber is usually designed to hold a burn-in board of a certain size, and is generally large enough to test many ICs at once.

[0007]

[Problems of conventional technology]

 As described above, the conventional socket 10 is required for burn-in of the flat pack type IC 16, and it takes time and effort to load and unload the IC 16 into and from the socket 10. Further, the socket 10 must be inserted into the through hole 30 and soldered, which is a problem in that the board manufacturing is troublesome.

Further, the conventional constant temperature oven is large in size, and a large burn-in board must be used when testing a small number of ICs or a small number of ICs, which causes a problem of poor efficiency.

[0009]

[The purpose of the device]

 The present invention has been made in view of the above circumstances, and when testing a small amount of ICs, it is not necessary to use a large temperature chamber, and the burn-in test of the ICs can be performed efficiently without using a socket. It is an object of the present invention to provide an IC burn-in device that can be used.

[0010]

[Constitution of device]

 According to the present invention, an object of the present invention is to provide a burn-in board for performing an IC burn-in test, in which a positioning hole for the IC and a circuit pattern for connecting leads of the IC positioned therein are formed. And a pair of holding plates for sandwiching the burn-in board from both sides thereof to hold the IC, at least one of the holding plates being formed of a heating plate having a surface heating element. Is achieved by a burn-in device.

[0011]

【Example】

 FIG. 1 is an overall conceptual view of an embodiment of the present invention, FIG. 2 is a side sectional view of an essential part, FIG. 3 is an enlarged view of a part thereof, and FIG. 4 is a plan view showing a state in which an IC is mounted on a burn-in board. Is.

2 and 3, reference numeral 50 is a lower pressing plate, 52 is a burn-in board, and 54 is an upper pressing plate. The lower pressing plate 50 is composed of a heating plate as described later. An appropriate number of positioning pins 56 are erected on the lower pressing plate 50, while pin holes are formed on the board 52 and the upper pressing plate 54 to engage with the pins 56 and perform positioning between them. Has been done.

The board 52 is provided with an appropriate number of rectangular positioning holes 62 into which a package 60 of a flat pack type IC, for example, a SOP type IC 58 (see FIG. 4) is dropped. These positioning holes 62 are slightly larger than the outer dimensions of the package 60, and have the function of positioning and holding the IC placed therein.

A large number of terminal patterns 64 extending to the edge of the positioning hole 62 are formed on the upper surface of the board 52 by printed wiring. Each terminal pattern 64 is located below a large number of leads 66 of the IC 58 put in the positioning hole 62, and is connected to the through hole 68 and other circuits by a circuit pattern.

Reference numeral 70 denotes an insulating elastic body projectingly provided on the lower surface of the upper pressing plate 54, which is formed in a bank shape, for example, by a hard rubber. The elastic body 70 is located at a position where the lead 66 of the IC 58 is pressed from above, that is, parallel to the side of the package 60 having the lead 66 and crossing each terminal pattern 64 as shown in FIG.

Therefore, if the board 52 is aligned with the pins 56 and stacked on the base 50, and the package 60 of the IC 58 is dropped into the positioning hole 62 of the board 52 from above, the IC 58 positioned by the hole 62 is positioned. The leads 66 of the above will be mounted on the corresponding terminal patterns 64 of the board 52. Further, when the upper pressing plate 54 is aligned with the pin 56 and overlapped with each other, the elastic member 70 pushes the lead 66 and the lead 66 against the terminal pattern 64.

Next, the lower pressing plate 50 will be described. The lower pressing plate 50 is composed of a heat generating plate as shown in FIG. That is, the lower presser plate 50 has a printed circuit board 102 on which the heater circuit pattern 100 is formed by a printed circuit forming method, and metal cores 104 and 106 made of metal plates laminated on both sides of the circuit board 102. And a second printed wiring board 108 laminated on the lower surface of the lower metal core 106.

On the second printed wiring board 108, a large number of planar temperature sensors including metal foil resistors and platinum sensors are formed, and the temperature distribution can be detected. Further, the heater circuit pattern 100 formed on the printed wiring board 102 is divided into a large number of areas so that the temperature distributions of many divided areas of the wiring board 102 can be controlled separately. The surfaces of the metal cores 104 and 106 are insulated by an insulating layer as needed.

In FIG. 1, 110 is a temperature controller, which controls the current supplied to the heater circuit pattern 100 based on the output of the temperature sensor of the second printed wiring board 108. That is, the temperature set by a temperature setter (not shown) is compared with the output of the temperature sensor of the second printed wiring board 108, and a control signal a corresponding to the difference is output to both.

This signal a is input to a pulse width control circuit (PWM) 112, and this circuit 112 outputs a heater current I whose duty ratio changes according to the voltage of the signal a. Reference numeral 114 denotes a DC power source, and the current output from the power source 114 is intermittently controlled by the PWM 112 at the duty ratio. The heater circuit pattern 100 generates heat due to this current I.

The heat of the heater circuit pattern 100 is transferred to the IC 58, and a predetermined test is performed while the IC 58 is heated. That is, the circuit pattern of the burn-in board 52 guides the output of each terminal of the IC 58 to the IC tester 116, and a predetermined test is performed.

In the above embodiment, only the lower pressing plate 50 is constituted by the heat generating plate. However, only the upper pressing plate 54 may be used as the heating plate, or both the upper and lower pressing plates 50, 54 may be used as the heating plates. Good. The surface heating element is not limited to the heater circuit pattern 100 of this embodiment, and may be any surface heating element that substantially generates surface heating. Further, it is desirable that the heat generating plate is formed by laminating metal cores as in the embodiment, because the heat conductivity is good and the temperature distribution is uniform. However, the present invention also includes those without a metal core.

[0023]

[Effect of device]

 According to the invention of claim 1, as described above, at least one of the pressing plates sandwiching the burn-in board is a heating plate having a surface heating element, and therefore the IC is heated by the heating plate to perform the burn-in test. It can be carried out. Therefore, it becomes possible to efficiently test a small amount of ICs without using a large-sized constant temperature bath.

Here, the heat generating plate can be formed by a printed wiring board having a heater circuit pattern formed thereon (claim 2). This printed wiring board is formed by laminating metal cores so that the temperature distribution is uniform. This is desirable (claim 3). Further, it is desirable that a temperature sensor be provided on this heat generating plate to control the temperature of the heat generating plate at a constant level (claim 4).

[Brief description of drawings]

FIG. 1 is an overall conceptual diagram of an embodiment of the present invention.

FIG. 2 is a side sectional view of a main part thereof.

[Fig. 3] Partly enlarged view

FIG. 4 is a plan view showing a loading state of an IC.

FIG. 5 is a side sectional view showing a conventional jig.

FIG. 6 is a perspective view of a socket.

[Explanation of symbols]

 50 Lower Pressing Plate Made of Heating Plate 52 Burn-in Board 54 Upper Pressing Plate 58 IC 62 Positioning Hole 64 Terminal Pattern as Circuit Pattern 66 Lead 100 Heater Circuit Pattern 102 Printed Wiring Board with Heater 104, 106 Metal Core 108 with Temperature Sensor Printed wiring board

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location H01L 21/66 H 7630-4M D 7630-4M

Claims (4)

[Scope of utility model registration request] 1. A burn-in device for performing an IC burn-in test, comprising: a burn-in board in which a positioning hole of the IC and a circuit pattern to which leads of the IC positioned in the IC are connected; A pair of pressing plates for holding the IC sandwiched from both side surfaces, at least one of the pressing plates is formed by a heating plate having a surface heating element, and the IC is heated by the heating plates. Burn-in equipment. 2. The burn-in device according to claim 1, wherein the heating plate is a printed wiring board on which a heater circuit pattern is formed and formed. 3. The burn-in device according to claim 2, wherein the printed wiring board has an insulating substrate on which a heater circuit pattern is formed and formed, and a metal core laminated on the substrate. 4. The burn-in device according to claim 1, wherein the heat generating plate is provided with a temperature sensor, and the temperature of the heat generating plate is controlled to be constant by a temperature controller.