JPH0735392Y2 - Semiconductor manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a semiconductor manufacturing facility, and further enhances the cleanliness of a clean room.

(Prior Art) A semiconductor test process device for electrically checking a semiconductor product in a wafer state or for checking a circuit of a printed circuit board is conventionally a prober body (test handler) which is a wafer test unit, In response to the measurement start signal from the prober body, it was the basis of the industry to install the tester body for automatic measurement flatly on the same floor in a room with a high degree of cleanliness and to perform a test. This was also to improve workability such as maintenance.

Such conventional manufacturing equipment will be described with reference to FIG. In the figure, reference numeral 1 indicates a room with a high degree of cleanliness (hereinafter referred to as clean room 1). A free access 3 is provided on a floor 2 in the clean room 1, and a prober main body 4 and a tester main body 5 are installed side by side on the free access 3.

Connected to the upper part of the prober main body 4 is a tester main body 5 connected to the tester main body 5 by a signal cable 6, that is, a test head 7 having a probe needle attached thereto. The test head 7 is mechanically connected so as to be movable on the prober body 4 for a wafer test. Further, a part of the signal cable 6 is arranged so as to pass under the free access 3 so that the wafer can be automatically transferred easily. In the figure, 8 is a CR that displays the wafer positioning, etc.
T, 9, 10 are air hoses and vacuum hoses for operating each mechanism in the prober main body, 11 is a power supply for the prober main body 4, 12 is a power supply for the tester main body 5, and 13 is for cooling the inside of the tester main body 5. Intake port, which takes in air for 1
Reference numerals 4 and 15 denote exhaust ports and heat dissipation ports.

(Problems to be solved by the invention) However, with the demand for high integration and high reliability of semiconductors, a clean room with a higher level of test process has been required. Conventionally, the prober body and the tester body are Since they are installed on the same floor in the clean room,
The heat exhausted from the tester body (heat generation amount) and dust do not improve the cleanliness in the clean room further, and the prober body that requires a higher cleanness is adversely affected and the test process is automated. There was a problem that became difficult. Furthermore, if two devices, a prober main body and a tester main body, are provided in the clean room, the volume in the clean room becomes large, which also causes a problem that it is difficult to improve the cleanliness.

Also, when the prober body and the tester body are installed on the same floor, part of the signal cable connecting the test head and the tester body will crawl on the floor or on the free access, and the area around the signal cable will In addition to becoming a pit of dust, the signal cable on free access deprives the wafer of the freedom of automatic transportation. Therefore, under the present circumstances, the tester dedicated room is provided separately on the same floor in the clean room to avoid such a problem.However, if the dedicated room is provided, the signal cable connecting the test head and the tester body becomes long. However, there is a problem that it is easily affected by noise and the like. The present invention has been made for the purpose of improving this point, and provides a semiconductor manufacturing facility with improved cleanliness by separately installing a prober body and a tester body in a vertically constructed room. The purpose is to

(Means for Solving the Problem) As a means for solving the above problems, the present invention partitions a room vertically by a floor 2, and one of the rooms is a room with high cleanliness (clean room 1), In this room with a high degree of cleanliness (clean room 1), the prober body 4 that requires a higher degree of cleanliness is installed, and in the other room (the sub-clean room 16), the tester body 5 is installed. The main body 5 and the main body 5 are connected by a cable (signal cable 6) penetrating the floor 2.

(Operation) As described above, the room is vertically separated, and the prober main body 4 and the tester main body 5 are also installed separately, so that the room (clean room 1) having high cleanliness and the prober main body 4 are It is no longer affected by heat and dust from the main body 5. Therefore, a clean room (clean room 1) can be constructed. Further, by providing the rooms separately, the volume of the room with high cleanliness (clean room 1) can be made smaller than that of the conventional room, which also facilitates the construction of the room with high cleanliness (clean room 1).

Furthermore, since the prober main body 4 and the tester main body 5 are connected in the vertical direction by the cable (signal cable 6) penetrating the floor 2, the cable (signal cable 6) does not crawl on the floor surface, and the clean room ( The degree of freedom of automatic wafer transfer in the clean room 1) is improved.

(Embodiment) An embodiment of the present invention will be described below with reference to FIG. 1 by assigning the same reference numerals to the same members as in FIG. The feature of this embodiment is that the room is divided into upper and lower parts by the floor 2, the room on the upper floor is built in the clean room 1, and the clean room 1 is provided with the prober main body 4 which requires a higher degree of cleanliness. The tester main body 5 is installed in the room directly below the clean room 1, that is, the sub-clean room 16, and the prober main body 4 and the tester main body 5 are connected by the signal cable 6 penetrating the floor 2 that is vertically partitioned. .

The prober body 4 of this embodiment has four units in the clean room 1 on the upper floor, and the tester body 5 has two units in the sub clean room 16 on the lower floor.
It is provided as a combination of stands (see Fig. 2 for the prober body 4). With this installation, the signal cable 6 from the test head 7 is connected to the upper portion of the tester main body 5. This prevents the signal cable 6 from crawling on the floor 2.

When the signal cable 6 is connected in the vertical direction of the clean room 1 and the sub-clean room 16 in this way, the degree of freedom around the prober body is improved, and the automatic wafer transfer is facilitated. Therefore, free access 3 for signal cable 6
Is unnecessary, and the prober body 4 can be directly placed on the antistatic grating floor 2 of the clean room 1. In this embodiment, since the prober main body 4 and the tester main body 5 are separated from each other on the upper floor and the lower floor, the keyboard (not shown) and the CRT 8 are connected to the upper clean room 1 and the lower sub clean room 16. Each is installed to reduce the work load.

With the above configuration, the inside of the clean room 1 and the prober main body 4 are not affected by the heat and dust from the tester main body 5, and the clean room 1 with improved cleanliness can be constructed. Further, since the volume of the clean room 1 is smaller than that of the conventional clean room 1, this also improves the cleanliness of the clean room 1. Furthermore, since the prober main body 4 and the tester main body 5 are vertically connected by the signal cable 6 penetrating the floor 2, the signal cable 6 does not crawl on the floor 2,
The degree of freedom of automatic transfer of wafers in the clean room 1 is improved.

In this embodiment, the prober body 4 is installed on the upper floor and the tester body 5 is installed on the lower floor.
Needless to say, the tester main body 5 may be installed on the upper floor and the prober main body 4 may be installed on the lower floor without doing so.

(Effect of the Invention) As described above, the present invention divides the room into upper and lower parts by the floor, and one of the rooms is made a room with a high degree of cleanliness. In addition to installing the tester main body in the other room and connecting the prober main body and the tester main body with a cable that penetrates the floor, the room and prober main body with high cleanliness Not affected by dust. This allows the construction of a cleaner room.

Further, since the volume of the room having high cleanliness is narrowed, the cleanliness can be improved also by this. Therefore, higher cleanliness can be maintained for a long period of time, and the maintenance cost of cleanliness can be reduced. further,
Since the prober main body and the tester main body are vertically connected by the cable penetrating the floor, the signal cable does not crawl on the floor. As a result, there is no accumulation of dust and the degree of freedom in automatic wafer transfer is improved.

[Brief description of drawings]

FIG. 1 is a partial sectional side view of a semiconductor manufacturing facility according to the present invention, FIG. 2 is a layout view of a prober body, and FIG. 3 is a partial sectional side view of a conventional one. 1 ... Clean room 2 ... Floor 4 ... Prober main body 5 ... Tester main body 6 ... Signal cable

Claims (1)

[Scope of utility model registration request] 1. A room is divided into upper and lower parts by a floor, and one of the rooms is made into a room with high cleanliness, and a prober body requiring higher cleanliness is installed in the room with high cleanliness, while the other is A tester main body is installed in the room, and the prober main body and the tester main body are connected by a cable penetrating the floor.