JPH073370B2 - Thin film sensor - Google Patents

Thin film sensor

Info

Publication number
JPH073370B2
JPH073370B2 JP28897487A JP28897487A JPH073370B2 JP H073370 B2 JPH073370 B2 JP H073370B2 JP 28897487 A JP28897487 A JP 28897487A JP 28897487 A JP28897487 A JP 28897487A JP H073370 B2 JPH073370 B2 JP H073370B2
Authority
JP
Japan
Prior art keywords
thin film
lead wire
layer
insulating layer
strain gauge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP28897487A
Other languages
Japanese (ja)
Other versions
JPH01129128A (en
Inventor
徹 北川
隆治 山下
Original Assignee
東京電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京電気株式会社 filed Critical 東京電気株式会社
Priority to JP28897487A priority Critical patent/JPH073370B2/en
Publication of JPH01129128A publication Critical patent/JPH01129128A/en
Publication of JPH073370B2 publication Critical patent/JPH073370B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Measurement Of Force In General (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、荷重を印加することにより変形する起歪体に
歪ゲージ部を形成し、これらの歪ゲージ部による抵抗変
化を利用して機械的荷重を電気的信号に変換するように
した薄膜センサに係り、特に歪ゲージを薄膜技術で形成
した薄膜センサに関するものでる。
Description: TECHNICAL FIELD The present invention forms a strain gauge portion in a strain-generating body that is deformed by applying a load, and utilizes a resistance change due to these strain gauge portions to apply a mechanical load. The present invention relates to a thin film sensor adapted to convert an electric signal into an electric signal, and particularly to a thin film sensor having a strain gauge formed by a thin film technique.

従来の技術 一般に、この種の薄膜センサにおいて、歪ゲージを薄膜
技術により形成するには、起歪体の表面に絶縁層を形成
し、この絶縁層の上に抵抗温度係数が小さい金属層によ
り歪ゲージ部を形成し、その上に抵抗温度係数の大きい
金属層により温度補償部を形成し、これらの上に電気的
抵抗値の低い金属層を形成してリード線部を形成してい
る。そして、全体の表面に防湿のために樹脂層を形成し
ている。
Conventional technology Generally, in this type of thin-film sensor, in order to form a strain gauge by thin-film technology, an insulating layer is formed on the surface of the strain generating body, and a strain is applied by a metal layer having a small temperature coefficient of resistance on the insulating layer. A gauge portion is formed, a temperature compensation portion is formed on the gauge portion by a metal layer having a large resistance temperature coefficient, and a metal layer having a low electric resistance value is formed on these to form a lead wire portion. Then, a resin layer is formed on the entire surface to prevent moisture.

発明が解決しようとする問題点 防湿のために表面に樹脂層を形成するが、歪ゲージ部や
温度補償部は層間側面から見ると、絶縁層と樹脂層との
間に挟まれた部分に位置する。しかるに、各層間の防湿
性について見ると、絶縁層と樹脂層とは互いに樹脂によ
るものであり、樹脂間の接着性はかなり悪いものであ
る。そのため、樹脂層の表面側からの湿度の浸入がなく
ても絶縁層との接着面からの樹脂の浸入を防ぐことがで
きず、十分な防湿性を得ることができないものである。
Problems to be Solved by the Invention A resin layer is formed on the surface to prevent moisture, but the strain gauge part and the temperature compensating part are located in the part sandwiched between the insulating layer and the resin layer when viewed from the side surface of the interlayer. To do. However, regarding the moisture proof property between the layers, the insulating layer and the resin layer are made of resin, and the adhesiveness between the resins is quite poor. Therefore, even if humidity does not enter from the surface side of the resin layer, the resin cannot be prevented from entering from the adhesive surface to the insulating layer, and sufficient moisture resistance cannot be obtained.

問題点を解決するための手段 荷重が印加されることにより変形する変形部が形成され
た起歪体を設け、この起歪体の表面に絶縁層を形成し、
この絶縁層の上に前記変形部に位置する歪ゲージ部と温
度補償部とこれらを接続するリード線部とを薄膜技術に
より形成し、これらの歪ゲージ部と温度補償部とこれら
を接続するリード線部との外側を囲繞する閉ループ状の
リング状金属層を形成し、前記歪ゲージと前記温度補償
部と前記リード線部と前記リング状金属層と前記絶縁層
の上面に防湿層を形成した。
Means for Solving the Problems Providing a strain-generating body in which a deformable portion that deforms when a load is applied is formed, and an insulating layer is formed on the surface of the strain-generating body.
On this insulating layer, the strain gauge portion located in the deformed portion, the temperature compensation portion, and the lead wire portion connecting them are formed by thin film technology, and the strain gauge portion, the temperature compensation portion, and the lead connecting them are formed. A closed loop ring-shaped metal layer surrounding the wire portion is formed, and a moisture-proof layer is formed on the upper surface of the strain gauge, the temperature compensation portion, the lead wire portion, the ring-shaped metal layer, and the insulating layer. .

作用 樹脂間の接着性は良くないが、樹脂と金属との接着性は
良好であるため、歪ゲージ部と温度補償部とこれらを接
続するリード線部との外側を囲繞する閉ループ状のリン
グ状金属層が絶縁層と樹脂層との間に介在してこの部分
の接着性を高め、これにより、実質的に絶縁層と樹脂層
との境界部の接着が良好に行われたことになり、十分な
防湿性を得ることができるものである。
Function Although the adhesiveness between the resins is not good, the adhesiveness between the resin and metal is good, so a ring-shaped closed loop that surrounds the strain gauge section, temperature compensation section and the lead wire section that connects them The metal layer is interposed between the insulating layer and the resin layer to enhance the adhesiveness of this portion, which means that the boundary between the insulating layer and the resin layer is substantially adhered well. It is possible to obtain sufficient moisture resistance.

実施例 本発明の第一の実施例を第1図乃至第4図に基づいて説
明する。まず、金属性の起歪体1が設けられている。こ
の起歪体1は角柱状で互いに連通した二つの孔2により
上下2ケ所で全体で4ケ所の薄肉状の変形部3が形成さ
れている。そして、一方の端部は固定部4であり、他方
の端部は荷重印加部5である。
Embodiment A first embodiment of the present invention will be described with reference to FIGS. 1 to 4. First, the metallic flexure element 1 is provided. This flexure element 1 has a prismatic shape, and two holes 2 communicating with each other form a thin-walled deformed portion 3 at two upper and lower portions in total. One end is the fixed part 4 and the other end is the load application part 5.

このような起歪体1の一面には、その全体に樹脂による
絶縁層6が形成されている。この絶縁層6の上には抵抗
温度係数の小さい金属薄膜7と、抵抗温度係数の大きい
金属薄膜8と抵抗値が小さい金属薄膜9とが蒸着、スパ
ツタリング等の薄膜技術で順次形成されている。そし
て、これらの各金属薄膜7,8,9をエツチングして抵抗温
度係数の小さい金属薄膜7のみにより歪ゲージ部10が形
成され、この金属薄膜7と抵抗温度係数の大きい金属薄
膜8との二層により温度補償部となるスパン補償部11と
バランス補償部12とが形成されている。また、これらの
上に抵抗値の小さい金属薄膜9を残して三層構造とした
部分でリード線部13が形成されている。そして、これら
の歪ゲージ部10とスパン補償部11とバランス補償部12と
リード線部13との外周を囲繞する閉ループ状のリング状
金属層14が形成されている。このリング状金属層14も前
記リード線部13と同様な三層構造である。
An insulating layer 6 made of resin is formed on the entire surface of the strain-generating body 1. A metal thin film 7 having a small temperature coefficient of resistance, a metal thin film 8 having a large temperature coefficient of resistance, and a metal thin film 9 having a small resistance value are sequentially formed on the insulating layer 6 by a thin film technique such as vapor deposition and sputtering. Then, each of the metal thin films 7, 8 and 9 is etched to form the strain gauge portion 10 only by the metal thin film 7 having a small temperature coefficient of resistance. The layers form a span compensating section 11 and a balance compensating section 12, which are temperature compensating sections. In addition, the lead wire portion 13 is formed in a portion having a three-layer structure while leaving the metal thin film 9 having a small resistance value thereon. Then, a closed loop ring-shaped metal layer 14 surrounding the outer circumferences of the strain gauge portion 10, the span compensation portion 11, the balance compensation portion 12, and the lead wire portion 13 is formed. The ring-shaped metal layer 14 also has the same three-layer structure as the lead wire portion 13.

ついで、このように形成された全体の表面に防湿のため
の樹脂層15が積層形成されている。
Then, the moisture-proof resin layer 15 is laminated on the entire surface thus formed.

このような構成において、樹脂層15自体は防湿性に優れ
た材料を選択しているため、その表面側からの湿度の浸
入はない。しかしながら、側面側からは絶縁層6との間
の接着性が悪いため湿度の浸入のおそれがある。しかし
ながら、樹脂による絶縁層6も樹脂層15もリング状金属
層14の部分では互いに金属との接着になるので、その境
界の接着性は高く、しかも、リング状金属層14は閉ルー
プ状に形成されているので、その内部に位置する歪ゲー
ジ部10、スパン補償部11、バランス補償部12、リード線
部13には、湿度が達することがない。そのため、十分な
防湿性が得られている。
In such a configuration, since the resin layer 15 itself is made of a material having excellent moisture resistance, humidity does not enter from the surface side thereof. However, since the adhesiveness between the side surface side and the insulating layer 6 is poor, there is a possibility that humidity may enter. However, since both the insulating layer 6 and the resin layer 15 made of resin adhere to each other at the portion of the ring-shaped metal layer 14, the adhesiveness at the boundary is high, and the ring-shaped metal layer 14 is formed in a closed loop shape. Therefore, humidity does not reach the strain gauge section 10, the span compensating section 11, the balance compensating section 12, and the lead wire section 13 located inside thereof. Therefore, sufficient moisture resistance is obtained.

つぎに、第5図に基づいて本発明の第二の実施例を説明
する。前記実施例と同一部分は同一符号を用い説明も省
略する。本実施例はリード線部13の一部をリング状金属
層14と兼用したものである。すなわち、リング状金属層
14の外周部に前述の歪ゲージ部10、スパン補償部11、バ
ランス補償部12が存在しなければ、リード線部13の防湿
性は性能に影響がないので、前記実施例と同様な作用を
得ることができるものである。
Next, a second embodiment of the present invention will be described with reference to FIG. The same parts as those in the above-mentioned embodiment are designated by the same reference numerals and the description thereof will be omitted. In this embodiment, part of the lead wire portion 13 is also used as the ring-shaped metal layer 14. That is, the ring-shaped metal layer
If the strain gauge section 10, the span compensating section 11, and the balance compensating section 12 do not exist in the outer peripheral portion of 14, the moisture resistance of the lead wire section 13 does not affect the performance, and therefore the same operation as in the above-described embodiment is performed. Is what you can get.

発明の効果 本発明は上述のように、荷重が印加されることにより変
形する変形部が形成された起歪体を設け、この起歪体の
表面に絶縁層を形成し、この絶縁層の上に前記変形部に
位置する歪ゲージ部と温度補償部とこれらを接続するリ
ード線部とを薄膜技術により形成し、これらの歪ゲージ
部と温度補償部とこれらを接続するリード線部との外側
を囲繞する閉ループ状のリング状金属層を形成し、前記
歪ゲージと前記温度補償部と前記リード線部と前記リン
グ状金属層と前記絶縁層の上面に防湿層を形成したの
で、樹脂間の接着性は良くないが、樹脂と金属との接着
性は良好であるため、歪ゲージ部と温度補償部とこれら
を接続するリード線部との外側を囲繞する閉ループ状の
リング状金属層が絶縁層と樹脂層との間に介在してこの
部分の接着性を高め、これにより、実質的に絶縁層と樹
脂層との境界部の接着が良好に行われたことになり、十
分な防湿性を得ることができるものである。
EFFECTS OF THE INVENTION As described above, the present invention provides a strain-generating body in which a deformable portion that deforms when a load is applied is provided, and an insulating layer is formed on the surface of the strain-generating body. The strain gauge portion located in the deformed portion, the temperature compensation portion, and the lead wire portion connecting them are formed by thin film technology, and the outside of the strain gauge portion, the temperature compensation portion, and the lead wire portion connecting them. A ring-shaped metal layer having a closed loop shape is formed to surround the strain gauge, the temperature compensating portion, the lead wire portion, the ring-shaped metal layer, and a moisture-proof layer on the upper surface of the insulating layer. Although the adhesiveness is not good, because the adhesiveness between resin and metal is good, the closed loop-shaped metal layer surrounding the strain gauge section, the temperature compensation section and the lead wire section connecting them is insulated. The layer and the resin layer are interposed to connect this part. Adhesion is improved, and thereby, the boundary portion between the insulating layer and the resin layer is substantially well adhered, and sufficient moisture resistance can be obtained.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の第一の実施例を示す平面図、第2図は
側面図、第3図は第1図におけるA−A線断面図、第4
図は起歪体の斜視図、第5図は本発明の第二の実施例を
示す平面図である。 1…起歪体、3…変形部、6…絶縁層、10…歪ゲージ
部、11…スパン補償部(温度補償部)、12…バランス補
償部(温度補償部)、13…リード線部、14…リング状金
属層
1 is a plan view showing a first embodiment of the present invention, FIG. 2 is a side view, FIG. 3 is a sectional view taken along the line AA in FIG. 1, and FIG.
FIG. 5 is a perspective view of a flexure element, and FIG. 5 is a plan view showing a second embodiment of the present invention. DESCRIPTION OF SYMBOLS 1 ... Strain element, 3 ... Deformation part, 6 ... Insulating layer, 10 ... Strain gauge part, 11 ... Span compensation part (temperature compensation part), 12 ... Balance compensation part (temperature compensation part), 13 ... Lead wire part, 14 ... Ring-shaped metal layer

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】荷重が印加されることにより変形する変形
部が形成された起歪体を設け、この起歪体の表面に絶縁
層を形成し、この絶縁層の上に前記変形部に位置する歪
ゲージ部と温度補償部とこれらを接続するリード線部と
を薄膜技術により形成し、これらの歪ゲージ部と温度補
償部とこれらを接続するリード線部との外側を囲繞する
閉ループ状のリング状金属層を形成し、前記歪ゲージと
前記温度補償部と前記リード線部と前記リング状金属層
と前記絶縁層の上面に防湿層を形成したことを特徴とす
る薄膜センサ。
1. A strain-generating body having a deformable portion that is deformed when a load is applied is provided, an insulating layer is formed on the surface of the strain-generating body, and the deformable portion is positioned on the insulating layer. Forming a strain gauge part and a temperature compensating part and a lead wire part connecting them by a thin film technique, and enclosing the strain gauge part, the temperature compensating part and the lead wire part connecting them to each other in a closed loop shape. A thin film sensor, wherein a ring-shaped metal layer is formed, and a moisture-proof layer is formed on the upper surface of the strain gauge, the temperature compensation section, the lead wire section, the ring-shaped metal layer, and the insulating layer.
【請求項2】リード線部の一部をリング状金属層と兼用
したことを特徴とする特許請求の範囲第1項記載の薄膜
センサ。
2. The thin film sensor according to claim 1, wherein a part of the lead wire portion is also used as a ring-shaped metal layer.
JP28897487A 1987-11-16 1987-11-16 Thin film sensor Expired - Lifetime JPH073370B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28897487A JPH073370B2 (en) 1987-11-16 1987-11-16 Thin film sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28897487A JPH073370B2 (en) 1987-11-16 1987-11-16 Thin film sensor

Publications (2)

Publication Number Publication Date
JPH01129128A JPH01129128A (en) 1989-05-22
JPH073370B2 true JPH073370B2 (en) 1995-01-18

Family

ID=17737208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28897487A Expired - Lifetime JPH073370B2 (en) 1987-11-16 1987-11-16 Thin film sensor

Country Status (1)

Country Link
JP (1) JPH073370B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114414123B (en) * 2022-01-24 2023-08-25 上海交通大学 Strain sensor chip on special-shaped metal substrate and in-situ preparation method thereof

Also Published As

Publication number Publication date
JPH01129128A (en) 1989-05-22

Similar Documents

Publication Publication Date Title
US5631622A (en) Strain gage and measuring transducer and method of producing the same
EP0107966B1 (en) Load cell and method for its manufacture
JPH0565807B2 (en)
JPH0324793B2 (en)
JPS59196401A (en) Strain gage and manufacture thereof
JPH073370B2 (en) Thin film sensor
JPH0465645A (en) Pressure sensor array
JPH07101747B2 (en) Semiconductor pressure sensor
JPH03214783A (en) Laminated sensor
JPH03251704A (en) Manufacture of strain gauge
JPS62119426A (en) Load cell
JPS6069524A (en) Infrared ray detecting element
JPS5928070B2 (en) semiconductor displacement transducer
JPS5816345B2 (en) Semiconductor pressure transducer
JPH06802Y2 (en) Assembly structure of thermistor
JPH0425729Y2 (en)
JPH05113380A (en) Sensor device
JPS61193492A (en) Piezoelectric element
JPS6011477Y2 (en) Pyroelectric temperature sensing element
JP3835721B2 (en) Platinum temperature sensor
JPH0514576Y2 (en)
JPH09148642A (en) Piezoelectric actuator and its strain gauge bonding method
JPS6259930B2 (en)
JPS6059559U (en) External lead lead structure of electrode board
JPS5936909Y2 (en) solid electrolytic capacitor