JPS6259930B2 - - Google Patents
Info
- Publication number
- JPS6259930B2 JPS6259930B2 JP6016480A JP6016480A JPS6259930B2 JP S6259930 B2 JPS6259930 B2 JP S6259930B2 JP 6016480 A JP6016480 A JP 6016480A JP 6016480 A JP6016480 A JP 6016480A JP S6259930 B2 JPS6259930 B2 JP S6259930B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- metal plate
- adhesive
- plate
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 239000011888 foil Substances 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02094—Means for compensation or elimination of undesirable effects of adherence
Description
【発明の詳細な説明】
本発明は圧電素子を金属板あるいは上面に電極
を有する板体に取付ける装置に関するものであ
り、金属板あるいは板体と圧電素子との電気的接
続を良好にしようとするものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a device for attaching a piezoelectric element to a metal plate or a plate having an electrode on its upper surface, and aims to improve the electrical connection between the metal plate or plate and the piezoelectric element. It is something.
従来は第１図に示すように圧電素子１を金属板
２に接着剤３で接着する場合、圧電素子１または
金属板２に接着剤３を塗布し、圧着して圧電素子
１の電極４と金属板２がポイント接触して電気的
に接続するように接着していたが、このような場
合、接着剤の層が薄く、圧電素子１と金属板２の
膨張率が異なる場合に、ヒートサイクルが何度も
かかつた時、圧電素子１と金属板２の膨張率の差
から起こる歪を接着層が吸収しきれずに、接着層
が剥離し、電気的接続がとれなくなつたり圧電素
子にかかる歪による圧電効果で発生する電圧が圧
電素子１の抗電場を起えた場合、圧電素子１の分
極が取れるような現象があり、第３図のＡに示す
ように共振インピーダンスが初期に比べ大きくな
つたりした。この場合、接着層を厚くすると圧電
素子１の電極３と金属板２とがポイント接触せず
電気的接続ができなくなるため接着剤の厚みをあ
まり大きくすることはできない。 Conventionally, when bonding a piezoelectric element 1 to a metal plate 2 with an adhesive 3 as shown in FIG. The metal plate 2 was bonded so that it made point contact and was electrically connected, but in such a case, if the adhesive layer is thin and the expansion coefficients of the piezoelectric element 1 and the metal plate 2 are different, heat cycle When this occurs many times, the adhesive layer cannot absorb the strain caused by the difference in expansion coefficients between the piezoelectric element 1 and the metal plate 2, and the adhesive layer peels off, resulting in loss of electrical connection and damage to the piezoelectric element. When the voltage generated by the piezoelectric effect due to such strain causes a coercive electric field in the piezoelectric element 1, a phenomenon occurs in which the piezoelectric element 1 becomes polarized, and the resonant impedance becomes larger than the initial value, as shown in A in Figure 3. I felt relaxed. In this case, if the adhesive layer is made thicker, the electrode 3 of the piezoelectric element 1 and the metal plate 2 will not come into point contact and electrical connection will not be possible, so the thickness of the adhesive cannot be made very large.
そこで、本発明は接着剤の厚みを大きくしてか
つ圧電素子と金属板あるいは電極を有する板体と
の電気的接続も十分にとることができるようにし
ようとするものであり、以下本発明の実施例につ
いて図面を参照して説明する。 Therefore, the present invention seeks to increase the thickness of the adhesive and to enable sufficient electrical connection between the piezoelectric element and the metal plate or plate having electrodes. Examples will be described with reference to the drawings.
第２図に示すように、金属板５の上に接着剤６
を塗布し、この接着剤６の上にアルミ箔等の金属
箔７を設け、この金属箔７の上にさらに接着剤１
１を塗布し、この上に圧電素子８の一方の電極９
を接着する。１０は圧電素子８の他方の電極であ
る。金属箔７は圧電素子８の電極９および金属板
５に少なくともポイント接触させて電気的な接続
をする。上記金属板５の代りに上面に電極を有す
る板体を使用することもできる。 As shown in FIG.
A metal foil 7 such as aluminum foil is applied on this adhesive 6, and an adhesive 1 is further applied on this metal foil 7.
1, and one electrode 9 of the piezoelectric element 8 is applied on top of this.
Glue. 10 is the other electrode of the piezoelectric element 8. The metal foil 7 is brought into at least point contact with the electrode 9 of the piezoelectric element 8 and the metal plate 5 for electrical connection. In place of the metal plate 5, a plate having electrodes on its upper surface may be used.
このような構成で圧着すると、圧電素子８の電
極９と金属箔７がポイント接触し、又金属箔７と
金属板５がポイント接触し、圧電素子８の電極９
と金属板５は電気的に接続される。このような構
成にすれば接着剤の厚みは従来のものと比べて厚
くでき、又金属箔７としてアルミ等の硬度の小さ
い材料を選べば、圧電素子８と金属板５の膨張率
の差から生じる歪を、接着剤６，１１と金属箔７
で吸収でき、従来の接着層の剥離や圧電素子の分
極が取れるような問題を解決するのに非常に効果
のある。第３図のＢに示すように共振抵抗も大巾
に増加しない。 When crimped with such a configuration, the electrode 9 of the piezoelectric element 8 and the metal foil 7 come into point contact, and the metal foil 7 and the metal plate 5 come into point contact, and the electrode 9 of the piezoelectric element 8
and metal plate 5 are electrically connected. With this configuration, the thickness of the adhesive can be made thicker than in conventional ones, and if a material with low hardness, such as aluminum, is selected for the metal foil 7, the difference in expansion coefficient between the piezoelectric element 8 and the metal plate 5 can be The resulting strain is removed by the adhesives 6 and 11 and the metal foil 7.
It is extremely effective in solving problems that occur in conventional adhesive layers such as peeling and polarization of piezoelectric elements. As shown in FIG. 3B, the resonance resistance also does not increase significantly.
以上のように本発明によれば接着剤の厚みを大
きくしても充分に圧電素子と金属板あるいは上面
に電極を有する板体との電気的接続を充分にとる
ことができるものである。 As described above, according to the present invention, even if the thickness of the adhesive is increased, a sufficient electrical connection can be made between the piezoelectric element and the metal plate or the plate having an electrode on its upper surface.
第１図は従来例における圧電素子取付装置の断
正面図、第２図は本発明の一実施例における圧電
素子取付装置の断正面図、第３図は本発明説明の
ための特性図である。
５…金属板、６，１１…接着剤、７…金属箔、
８…圧電素子、９…電極。
Fig. 1 is a sectional front view of a piezoelectric element mounting device in a conventional example, Fig. 2 is a sectional front view of a piezoelectric element mounting device in an embodiment of the present invention, and Fig. 3 is a characteristic diagram for explaining the present invention. . 5... Metal plate, 6, 11... Adhesive, 7... Metal foil,
8... Piezoelectric element, 9... Electrode.
Claims (1)
の金属板または上面に電極を有する板体上に塗布
された接着剤と、この接着剤上に設けられた金属
箔上に塗布された接着剤と、この接着剤上に設け
られた圧電素子とを備え、上記金属箔を上記圧電
素子および上記金属板または上面に電極を有する
板体にそれぞれ少なくともポイント接触させたこ
とを特徴とする圧電素子取付装置。1. A metal plate or a plate having an electrode on its top surface, an adhesive applied to the metal plate or the plate having an electrode on its top, and an adhesive applied to a metal foil provided on the adhesive. and a piezoelectric element provided on the adhesive, and the metal foil is brought into at least point contact with the piezoelectric element and the metal plate or a plate having an electrode on its upper surface, respectively. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6016480A JPS56156013A (en) | 1980-05-06 | 1980-05-06 | Attaching device of piezoelectric element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6016480A JPS56156013A (en) | 1980-05-06 | 1980-05-06 | Attaching device of piezoelectric element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56156013A JPS56156013A (en) | 1981-12-02 |
| JPS6259930B2 true JPS6259930B2 (en) | 1987-12-14 |
Family
ID=13134234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6016480A Granted JPS56156013A (en) | 1980-05-06 | 1980-05-06 | Attaching device of piezoelectric element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56156013A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58119219A (en) * | 1982-01-11 | 1983-07-15 | Hitachi Ltd | Surface acoustic wave device |
| JPH0626283B2 (en) * | 1985-08-09 | 1994-04-06 | トヨタ自動車株式会社 | Car antenna device |
-
1980
- 1980-05-06 JP JP6016480A patent/JPS56156013A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56156013A (en) | 1981-12-02 |
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