JPH07336079A - Frame of high-frequency apparatus and manufacture of high-frequency apparatus - Google Patents

Abstract

PURPOSE:To obtain a frame in which the swell of solder to the outer surface of a coupling bar is avoided, in which wasteful labor is omitted and whose manufacturing costs can be reduced. CONSTITUTION:A frame 2 is constituted of a frame body 21 which is attached so as to surround the outer circumference of a circuit board on which a plurality of electronic components are mounted and of a shielding plate 22 which is fitted to the inner circumference of the frame body 21 and by which circuit blocks composed of the plurality of electronic components 4 on the circuit board 1 are shielded from each other. In the frame, the shielding plate 22 is related to at least two shielding-plate pieces 221, 222 which are arranged so as to be faced in parallel. Edges which are situated at an opening end one side of the frame body 21 are coupled integrally by coupling bars 224, and through holes 225 which are passed in the opening direction of the frame body 21 are made in the coupling bars 224.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a frame which is a component of a high frequency device such as an electronic tuner and a method of manufacturing a high frequency device using the frame.

[0002]

2. Description of the Related Art A conventional high-frequency device of this type is shown in FIGS. 6 is a vertical cross-sectional view of a conventional high-frequency device, FIG. 7 is an exploded perspective view of a frame of the same high-frequency device,
8 is a perspective view of the assembling process of the high frequency device before the cover is attached, FIG. 9 is a manufacturing process diagram of the high frequency device, and FIG. 10 is a cross-sectional view showing the vicinity of the connecting bar after the secondary dip of the frame. The high frequency device 50 in the illustrated example includes a circuit board 51, a frame 52, and two covers 53, 53.

The circuit board 51 is composed of a rectangular printed wiring board or the like. Both the front and back surfaces 511 of the circuit board 51 are
A plurality of electronic components 54 are mounted and fixed by soldering at desired positions on a printed wiring (not shown) of 512. On the circuit board 51, an appropriate number of electronic components 54
A required number of circuit blocks are formed as a group.

The frame 52 is a frame main body 521 made of a thin metal plate that is externally fitted and coupled so as to surround the outer periphery of the circuit board 51, and is fitted into the inner periphery of the frame main body 521 and the surface 511 of the circuit board 51. And a shield plate 522 made of a thin metal plate for partitioning and shielding a circuit block made up of a plurality of electronic components 54 on the side. Shield plate pieces 523 and 524 extending toward each other are provided on two opposing long sides of the frame body 521. The shield plate 522 includes three shield plate pieces 5
25, 526, and 527 are formed by bending, and a long shield plate piece 525 and a short shield plate piece 526 that are arranged in parallel and opposite to each other are integrally connected by two connecting bars 528.

The cover 53 is made of a thin metal plate in the shape of a rectangular cylinder with a bottom and having a bottom. The cover 53 is externally fitted to the upper and lower openings of the frame body 521 of the frame 52 so as to close it.

A method of manufacturing the high frequency device 50 will be described with reference to FIG. First, as shown in FIG. 9A, the shield plate 5 is attached to the frame body 521 of the frame 52.
22 of the frame main body 521 is immersed in the solder bath 56 on one opening side, and the frame main body 521, the shield plate pieces 523 to 527, and the shield plate piece 523 to
Solder between 527 (primary dipping process). Figure 9
As shown in (b), the frame body 52 of the frame 52
From the other opening side of 1, the circuit board 51 in which the electronic component 54 is temporarily fixed with an adhesive is fitted into a required portion. Thereafter, as shown in FIG. 9C, the other opening side of the frame body 521 is immersed in the solder bath 56 to solder the frame body 521 and the circuit board 51, and the circuit board 51 and the electronic component 54 (two Next dip process). In this way, the electronic component 54 and the circuit board 51 are fixed, and the frame body 521 and the shield plate 522 are fixed. After that, although not shown, the cover 53 is attached to the frame main body 521 of the frame 52.

[0007]

By the way, in the above-mentioned conventional example, since the connecting bar 528 of the shield plate 522 is located at one open end of the frame main body 521 of the frame 52, the primary dipping step is performed as shown in FIG. As shown
The solder adheres to the outer surface of the connecting bar 528 in a raised state and solidifies. Although the swelled solder is remelted during the secondary dipping process, the swelled state is maintained. Therefore, when the cover is mounted later, the cover 53 cannot be mounted to an appropriate depth due to the solder rising portion on the connecting bar 528, and the cover 53 may come off. It is necessary to increase costs unnecessarily.

[0008] Therefore, it is an object of the present invention to prevent the solder from rising to the outer surface of the connecting bar, to save unnecessary labor, and to reduce the manufacturing cost.

[0009]

A high-frequency frame according to the present invention includes a frame main body mounted so as to surround an outer periphery of a circuit board on which a plurality of electronic components are mounted, and a frame main body fitted to the inner periphery of the frame main body. And a shield plate composed of a plurality of shield plate pieces for partitioning and shielding a circuit block composed of a plurality of electronic components on a circuit board,
In the shield plate pieces arranged to face each other at least parallel to each other, the end faces located at one opening end of the frame body are integrally connected by a connecting bar, and a through hole penetrating the connecting bar in the opening direction of the frame body. Is provided.

A method of manufacturing a high-frequency device according to the present invention comprises a frame, a circuit board on which a plurality of electronic components are mounted,
A method of manufacturing a high-frequency device comprising: two covers fitted and attached to openings at both ends of a frame, wherein a shield plate is combined with a frame body of the frame,
A primary dipping step of immersing one opening side of the frame body in the solder bath, and a secondary dipping step of fitting the circuit board from the other opening side of the frame body and then immersing the other opening side of the frame body in the solder bath Is equipped with.

[0011]

In the frame of the present invention, since the connecting bar of the shield plate located at one opening end of the frame body is provided with the through hole penetrating in the opening direction of the frame body, the frame and the shield plate are joined by soldering. In this case, the solder in the molten state adheres to the outer surface of the connecting bar during the primary dipping process and solidifies in a raised state, but this solder is remelted in the secondary dipping process and is connected from the through hole of the connecting bar. Since the bar is drawn toward the inner surface of the bar and hangs down, it is not necessary to leave the solder on the outer surface of the connecting bar as in the conventional case and to prevent the solder from rising. Therefore, even if you do not perform the conventional solder correction work before mounting the cover,
The cover can be attached to the frame to the proper depth without difficulty.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below with reference to the embodiments shown in FIGS. 1 to 5 relate to an embodiment of the present invention, FIG. 1 is an exploded perspective view of a frame of a high-frequency device, FIG. 2 is a vertical cross-sectional view of a high-frequency device using the frame, and FIG. 5 is a perspective view of the assembling process of the previous high-frequency device, FIG. 4 is a manufacturing process diagram of the high-frequency device, and FIG.
FIG. 6 is a cross-sectional view showing the vicinity of a connecting bar after the secondary dip of the frame.

The high frequency device 10 in the illustrated example includes a circuit board 1 and
It comprises a frame 2 and two covers 3, 3.

The circuit board 1 is composed of a rectangular printed wiring board or the like, and a plurality of electronic components 4 are mounted at required positions on the printed wiring (not shown) on the front and back surfaces 11 and 12 of the circuit board 1. . It should be noted that on the circuit board 1, a required number of circuit blocks are formed with an appropriate number of electronic components 4 as a unit.

The frame 2 according to the present invention includes a circuit board 1
The frame main body 21 made of a thin metal plate that is externally fitted and coupled so as to surround the outer periphery of the plurality of And a shield plate 22 made of a thin metal plate for partitioning and shielding circuit blocks made of electronic components 4 from each other. On the two opposing long sides of the frame body 21, projecting pieces 211, 212 extending toward each other are provided.
Is provided. The shield plate 22 is formed by bending three shield plate pieces 221, 222, and 223. The long shield plate piece 221 and the short shield plate piece 222 arranged in parallel to each other are two connecting bars 224.
Are united together. The connecting bar 224 is provided with a plurality of through holes 225 penetrating in the opening direction of the frame body 21. The through hole 225 has a diameter of 1.5 m, for example.
The round shape is set to m, but the size, shape, and number are not particularly limited.

The cover 3 is made of a thin metal plate having a shallow bottomed rectangular tube shape, and is externally fitted and attached to the upper and lower openings of the frame body 21 of the frame 2 so as to close it.

The high frequency device 10 as described above is manufactured by the flow method described below. The procedure will be described with reference to FIG. 4A to 4C are end views of the high-frequency device 10 on the short side.

As shown in FIG. 4A, the frame 2
The shield plate 22 is combined with the frame body 21 and the one opening side of the frame body 21 is immersed in the solder bath 6 (primary dipping step). As a result, the solder enters a part of the joint between the frame body 21 and the shield plate 22.

The front surface 11 and the back surface 12 of the circuit board 1
The electronic component 4 is temporarily fixed to a required portion of the adhesive with an adhesive. As shown in FIG. 4B, the circuit board 1 is attached to a frame 2
The frame body 21 is fitted from the other opening side.

As shown in FIG. 4C, the other opening side of the frame body 21 is immersed in the solder bath 6 (secondary dipping step). By this secondary dipping process and the above-mentioned primary dipping process, the solder enters almost the entire joint between the frame body 21 and the shield plate 22, and the frame body 2
1, the shield plate 22 is fixed to the electronic component 4, and the electronic component 4 is fixed to the circuit board 1.

Although not shown, the covers 3 and 3 are attached to the upper and lower openings of the frame body 21 of the frame 2.

By the way, after the above primary dipping step, as shown in FIG. 5 (a), although the molten solder adheres to the outer surface of the connecting bar 224 of the frame body 21 and solidifies, this outer surface In the secondary dipping process of solder, by flipping the frame 2 upside down,
As shown in FIG. 5B, the solder solidified on the outer surface of the connecting bar 224 is remelted and drawn from the through hole 225 to the inner surface side of the connecting bar 224 and hang down. For this reason, the solder does not rise and solidify on the outer surface of the connecting bar 224 as in the conventional case. Therefore, the cover 3 can be easily attached to the frame 2 to a proper depth without performing the conventional correction work before attaching the cover.

The present invention is not limited to the above embodiment. For example, although not shown, the connecting bar 224 may be provided so as to connect the shield plate pieces 221 and 223 that are arranged orthogonally to each other.
It is necessary to provide a through hole 225 in No. 4. Further, in the above embodiment, only the circuit block made of the electronic component 4 on the front surface 11 of the circuit board 1 is shielded by the shield plate 22, but the circuit block made of the electronic component on the rear surface 12 side of the circuit board 1 is formed. Can also be shielded with a shield plate. Further, when the burr is generated on the outer surface side of the connecting bar 224 when the through hole 225 is formed, it is preferable to remove the burr by crushing or the like. However,
If the burr at the time of forming the through hole 225 is set so as to occur on the inner surface side of the connecting bar 224, the above-mentioned trouble is unnecessary.

[0024]

According to the present invention, when the frame body of the frame and the shield plate are joined by solder, the solder that adheres to the outer surface of the connecting bar and solidifies in the primary dipping process is remelted in the secondary dipping process. When the cover is attached to the frame main body before attaching the cover, the cover will be pulled to the inner surface side of the connecting bar and hang down. Now you can wear it. Therefore, it is possible to save unnecessary work such as the conventional correction work and contribute to the reduction of manufacturing cost.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of a frame of a high-frequency device according to the present invention.

FIG. 2 is a vertical cross-sectional view of a high frequency device using the frame.

FIG. 3 is a perspective view of the assembling process of the high-frequency device before the cover is attached.

FIG. 4 is a manufacturing process diagram of a high-frequency device.

FIG. 5 is a cross-sectional view showing the vicinity of the connecting bar after the secondary dip of the frame.

FIG. 6 is a vertical cross-sectional view of a conventional high frequency device.

FIG. 7 is an exploded perspective view of a frame of the high-frequency device.

FIG. 8 is a perspective view of the assembling process of the high frequency device before the cover is attached.

FIG. 9 is a manufacturing process diagram of a high-frequency device.

FIG. 10 is a cross-sectional view showing the vicinity of the connecting bar after the secondary dip of the frame.

[Explanation of symbols]

 1 High-frequency equipment 2 Frame 3 Circuit board 4 Electronic component 21 Frame body of frame 22 Shield plate of frame 224 Connection bar of shield plate 225 Through hole of connection bar

Claims (2)

[Claims] 1. A frame body mounted so as to surround an outer periphery of a circuit board on which a plurality of electronic components are mounted, and a circuit block which is fitted to an inner periphery of the frame body and is composed of a plurality of electronic components on the circuit board. A shield plate composed of a plurality of shield plate pieces that partition and shield each other from each other, and in the shield plate pieces that are opposed to each other at least in parallel to each other, a connecting bar is provided between the end faces located at one open end of the frame body. A frame of a high-frequency device, characterized in that the connecting bar is provided with a through hole penetrating in the opening direction of the frame body. 2. A method of manufacturing a high frequency device, comprising: the frame according to claim 1; a circuit board on which a plurality of electronic components are mounted; and two covers that are externally fitted and attached to openings at both ends of the frame, A primary dipping process in which a shield plate is combined with the frame body of the frame and one opening side of this frame body is immersed in a solder bath, and the circuit board is fitted from the other opening side of this frame body, and then the other side of the frame body is inserted. And a secondary dipping step of immersing the opening side in a solder bath.