JPH07335966A - Semiconductor laser module - Google Patents

Abstract

PURPOSE:To provide a semiconductor laser module in which the electrode terminals of a butterfly package are easily connected to the electrode terminals of an optical system unit including a semiconductor laser. CONSTITUTION:After an optical system unit 6 including a semiconductor laser 6a is fixed to the bottom 9 of a butterfly package 4, a printed board 8 is mounted into the package 4 from the side of the cover 10 of the package 4. The optical system electrode terminals 2 (2a-2d) and L-shaped package electrode terminals 1a, 1b, 1c and 1d which are so bent as to be perpendicular to the side wall of the package 4 are inserted into the through-holes 3 (3a-3h) and those electrode terminals are fixed to the through-holes 3 with solder. As a result, the respective optical system electrode terminals 2 and the corresponding package electrode terminals 2a-2d can be connected easily in the narrow space in the butterfly package 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor laser module used as a light source for an optical communication device or the like, and more particularly to the structure of a semiconductor laser module using a butterfly package.

[0002]

2. Description of the Related Art A conventional semiconductor laser module using a butterfly package will be described with reference to an exploded perspective view of FIG.

In this semiconductor laser module, a pre-assembled optical system unit 12 is installed in a butterfly package 16.
It is fixed to the bottom surface 15 of the substrate by soldering or the like. The optical system unit 12 has a semiconductor laser 12a hermetically sealed by a can package at one end thereof. The semiconductor laser 12a receives power for driving from the optical system electrode terminals 11a and 12b, and monitors the driving state of the semiconductor laser 12a from the optical system electrode terminals 11c and 11d. These optical system electrode terminals 11 (11 a to 11 d) are projected from one surface of the unit 12. The optical system unit 12 also optically couples the light from the semiconductor laser 12a and integrates it into the optical fiber 14.
From the other side. The optical fiber 4 is further pulled out from the package 16.

The butterfly package 16 is a rectangular parallelepiped package body that houses the optical system unit 12 between itself and the cover 17. The butterfly package 16 is a butterfly package and has a plurality of package electrode terminals 13 (13a, 13b, 13c, 1).
3d) are formed in the direction perpendicular to the side walls facing each other. The butterfly package 16 and the package electrode terminal 13 are integrated with each other.
Is 1. to the inside of the side wall of the butterfly package 16.
It projects about 5 mm and also projects outward.

The optical system electrode terminals 11a, 11b, 11c and 11d are provided with corresponding package electrode terminals 13a, 13 of the butterfly package 16 before fixing the optical system unit 12 to the bottom surface 15 of the butterfly package 16.
It is preliminarily shaped so as to substantially conform to b, 13c, and 13d. In this semiconductor laser module, while the optical system unit 12 is fixed to the butterfly package 16, the electrodes 11a to 11d are entwined with the corresponding electrodes 13a to 13d and fixed by soldering. The electrodes 13a to 13d and the electrodes 11a to 11d are soldered by connecting the electrode terminals 11a to 11d of the optical system unit 12 to the electrodes 1 of the butterfly package 16.
It is performed after shaping so as to follow 1a to 11d.

FIG. 3 is an exploded perspective view of another example of the conventional semiconductor laser module.

This semiconductor laser module has almost the same structure as that of the semiconductor module of FIG. 2, and includes the main constituent elements designated by the same reference numerals as those of FIG. However, in this semiconductor module, the electrode terminals 11a to 11d and the electrode terminal 1 are
The connection with 3a to 13d is made by another means. That is, the electrode terminals 11a to 11d of the optical system unit 12
Is cut in advance to about 3 mm, and the electrode terminals 11a to 11d and the corresponding electrode terminals 13a to 13d are cut.
d and silver wire 18 are connected to each other.

In the semiconductor laser module of FIGS. 2 and 3, after connecting the electrode terminals 13a to 13d and the electrode terminals 11a to 11d, the opening of the butterfly package 9 is covered with a cover 17, and the contact portions of both are seam welded. Fix with.

[0009]

In the above-mentioned semiconductor laser module, the optical system electrode terminals for the optical system unit are generally arranged on a pitch circle diameter of about 2 to 2.54 mm. The pitch between the package electrode terminals of the enclosed butterfly package is approximately 2.
It is 5 mm. Further, the side wall spacing of the butterfly package is about 11 mm, the width of the optical system unit is about 7 mm, and the length of the package electrode terminal protruding into the butterfly package is about 1.5 mm.

In the semiconductor laser module using this prior art, the connection between the electrode terminals of the optical system unit and the butterfly package uses a gap of about 0.5 mm,
Since the soldering work using the soldering iron is performed, there is a problem that this work requires a lot of time and assembly productivity is poor.

In particular, it is said that the tweezers are used in the above-mentioned gap space to tie the optical system electrode terminals of the optical system unit to the electrode terminals of the butterfly package or the silver wires to the optical system electrode terminals and the package electrode terminals. In the work, not only the soldering quality depends on the skill of the worker, but also the workability is remarkably poor. For this reason, securing a working space and avoiding the entanglement wiring work using tweezers have been problems.

[0012]

A semiconductor laser module according to the present invention comprises a hermetically sealed semiconductor laser, an optical fiber for receiving light from the semiconductor laser, and a plurality of optical circuits for inputting and outputting a power supply and an electric signal to the semiconductor laser. An optical system unit integrated with a system electrode terminal, and a butterfly which incorporates the optical system unit in a rectangular parallelepiped main body and forms butterfly-shaped package electrode terminals in a direction perpendicular to side walls of the main body which face each other. A semiconductor laser module in which the package electrode terminal and the optical system electrode terminal corresponding to the package electrode terminal are respectively connected, and each of the package electrode terminals to be connected to the optical system electrode terminal. Each
Inside the side wall, an L-shape is formed by bending at a right angle toward the cover direction of the butterfly package, and each of the optical system electrode terminals to be connected to the package electrode terminal is a cover of the butterfly package. The L-shaped package electrode terminals and the optical system electrode terminals corresponding to these, which are shaped in the direction, are connected via a printed wiring board.

In the semiconductor laser module, the printed wiring board has through holes for inserting the L-shaped package electrode terminals and the corresponding optical system electrode terminals, the inserted package electrode terminals and these through holes. A configuration having wiring patterns electrically connecting the corresponding optical system electrode terminals to each other can be adopted.

[0014]

The present invention will be described below with reference to the drawings.

FIG. 1 is an exploded perspective view of an embodiment of the present invention.

In this semiconductor module, an optical system unit 6 integrally assembled in advance is fixed to the bottom surface 9 of a butterfly package 4 having a rectangular parallelepiped outer surface and an inner surface by soldering or the like. The optical system unit 6 includes a semiconductor laser 6 hermetically sealed by a can package at one end inside the unit.
a is fixed, and optical system electrode terminals 2a and 2b for receiving a power source for driving the semiconductor laser 6a and an optical system electrode terminal 2 for monitoring the driving state of the semiconductor laser 6a.
c and 2d are projected from one surface. Before fixing the optical system unit 6 to the bottom surface 9 of the butterfly package 4, these four electrode terminals 2 (2a to 2d) are directed toward the opening direction of the butterfly package 4 (that is, toward the cover 10). And are shaped in parallel with each other in advance. Further, on the other surface of the optical system unit 6, an optical fiber 5 for optically coupling the light from the semiconductor laser 6a
Is pulling out. The optical fiber 5 guides the light emitted from the semiconductor laser 6a to an optical communication device or the like.

The butterfly package 4 is a rectangular parallelepiped-shaped package body for accommodating the optical system unit 6 with the cover 10. The butterfly package 4 has a butterfly-shaped package electrode terminal 1 (1a, 1b, 1c, 1d, etc.). The side walls facing each other are projected in the vertical direction. here,
The electrodes 1a, 1b, 1c and 1d of the package electrode terminal 1 have an L-shape that is bent at a right angle toward the opening of the butterfly package 4 in the side wall inward direction of the butterfly package 4. Please be careful. In this semiconductor module, the package electrode terminals 1a, 1b, 1c and 1d and the optical system electrode terminal 2 are used.
a, 2b, 2c and 2d are terminals to be connected in the same sign order.

The package electrode terminals 1a, 1b, 1c and 1d and the optical system electrode terminals 2a, 2b, 2c and 2d are a printed circuit board 8 and a wiring pattern 7 formed thereon.
And through holes 3 (3a, 3b, 3c, 3d, 3e, which connect the wiring pattern 7 and the back surface of the printed circuit board 8).
3f, 3g and 3h) are connected via a printed wiring board.

Here, the printed circuit board 8 is made of an insulating material such as glass epoxy resin or alumina ceramics, and the optical system electrode terminals 2a, 2b, 2c and 2d and the L-shaped package electrode terminals 1a, 1b and 1c. Through holes 3a, 3 corresponding to the positions and numbers of 1 and 1d
b, 3c, 3d, 3e, 3f3g and 3h, and a wiring pattern 7 are provided. The wiring pattern 7 is formed by a method such as etching or metallization so that the optical system electrode terminals 2a, 2b, 2c and 2d and the package electrode terminals 1a, 1b, 1c and 1d can be electrically connected in the same sign order, respectively. It is formed on the printed circuit board 8.

The printed wiring board is an optical system unit 6
Is fixed to the bottom surface 9 of the butterfly package 4, and then mounted so as to be supported by the L-shaped package electrode terminal 1 and the optical system electrode terminal 2 from the direction of the cover 10, that is, the direction of the opening of the butterfly package 4. That is, the printed circuit board 8 is pushed into the butterfly package 4, and the through holes 3a, 3b, 3c, 3d,
3e, 3f, 3g and 3h have optical system electrode terminals 2a, 2
b, 2c and 2d and the package electrode terminals 1a, 1b,
After inserting 1c and 1d, the electrode terminals are fixed to the printed circuit board 8 by soldering. As a result, the wiring inside the butterfly package 4, that is, the package electrode terminal 1
The connection between a, 1b, 1c and 1d and the corresponding optical system electrode terminals 2a, 2b, 2c and 2d is completed. After that, the opening of the butterfly package 4 is covered with the cover 10, the opening is fixed by seam welding, and the optical system unit 6 is hermetically sealed.

As described above, in the semiconductor laser module of this embodiment, after the optical system unit 6 is fixed to the bottom surface 9 of the butterfly package 4 by soldering, the butterfly package 4 is preliminarily parallel to each other in the through hole 3 of the printed board 8. Of the optical system and the electrode terminals 1a to 1 of the L-shaped package, which are shaped toward the opening of the
By inserting "d" and soldering the respective electrode terminals on the printed circuit board 8, simple wiring inside the butterfly package 4 is enabled.

Although the semiconductor laser module of the present embodiment is not cooled by the electronic cooling element, it is obvious that the structure of the present embodiment can be applied to the semiconductor laser module mounted with the electronic cooling element.

[0023]

As described above, according to the present invention, each of the package electrode terminals of the butterfly package to be connected to the optical system electrode terminals of the optical system unit has the butterfly package package electrode terminal inside the side wall of the butterfly package. Each of the optical system electrode terminals to be connected to the package electrode terminal is shaped toward the cover direction of the butterfly package, and has an L-shape that is bent at a right angle toward the cover direction. Since the L-shaped package electrode terminals and the corresponding optical system electrode terminals are connected via a printed wiring board, the electrode terminals are inserted into the through holes of the printed wiring board to perform the printing. The effect that it becomes possible to adopt a simple wiring method of fixing each electrode terminal by soldering on the wiring board There is.

This effect eliminates the need for soldering work in the narrow inner space of the butterfly package, so that there is an effect that the soldering quality and the assembling productivity of the semiconductor laser module can be improved. In particular, in this assembling work, the use of tweezers and the tying work can be avoided, so that the present invention has an effect that the assembling work time can be shortened and the cost of the semiconductor laser module can be reduced.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a semiconductor laser module according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view of a conventional semiconductor laser module.

FIG. 3 is another exploded perspective view of a conventional semiconductor laser module.

[Explanation of symbols]

 1 (1a to 1d, ...) Package electrode terminal 2 (2a to 2d) Optical system electrode terminal 3 (3a to 3h) Through hole 4 Butterfly package 5 Optical fiber 6 Optical system unit 7 Wiring pattern 8 Printed circuit board 9 Bottom surface 10 Cover

Claims (2)

[Claims] 1. An optical system unit in which a hermetically sealed semiconductor laser, an optical fiber for receiving light from the semiconductor laser, and a plurality of optical system electrode terminals for inputting and outputting a power source and electric signals to and from the semiconductor laser are integrated. A butterfly package in which the optical system unit is built in a rectangular parallelepiped main body and butterfly package electrode terminals are formed in a direction perpendicular to side walls of the main body which face each other, the package electrode terminal and the package In the semiconductor laser module to which the optical system electrode terminals corresponding to the electrode terminals are respectively connected, each of the package electrode terminals to be connected to the optical system electrode terminals is the butterfly package inside the side wall. It has an L shape that is bent at a right angle toward the cover direction. Each of the optical system electrode terminals to be connected to the package electrode terminal is shaped toward the cover direction of the butterfly package, and the L-shaped package electrode terminals and the optical system electrodes corresponding thereto are formed. A semiconductor laser module, wherein terminals are connected via a printed wiring board. 2. The printed wiring board has through holes for inserting the L-shaped package electrode terminals and the optical system electrode terminals corresponding thereto, the inserted package electrode terminals and the corresponding package electrode terminals respectively. The semiconductor laser module according to claim 1, further comprising a wiring pattern for electrically connecting the optical system electrode terminal.