JPH07335713A - Board holding device - Google Patents

Abstract

PURPOSE:To remove clean water definitely from a guide groove by decompressing the cleaning water in the guide groove by a pressure reducing means communicating with a hollow part after having cleaned a holding member itself with the cleaning water and sucking up the cleaning water into the hollow part. CONSTITUTION:A board holding device blows off cleaning water remaining in a guide groove 11 by ejecting nitrogen gas from an outer communication hole 8 when having finished submersion cleaning of a holding rod 10 and the guide groove 11 with the cleaning water in a chuck cleaning tank and then continuously sucks up the cleaning water still remaining in the guide groove 11 from the outer communication hole 8 by vacuum suction of the hollow part 10a. It is, therefore, possible to remove the cleaning water from the guide groove 11 definitely and prevent dust or impurities in the clean water from being deposited on the guide groove 11 through the removal of the cleaning water, thereby improving the quality of board treating.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holding device for holding a variety of thin plate substrates such as semiconductor substrates, glass substrates for liquid crystals or photomasks, and more particularly to a guide capable of inserting the outer edge of the substrate. A pair of holding members having grooves are provided so as to be able to approach and separate and the guide grooves face each other, and the substrate is held at the outer edge of the pair of holding members in the guide groove of each holding member. The present invention relates to a substrate holding device.

[0002]

2. Description of the Related Art A substrate holding apparatus of this type is provided in parallel with a substrate processing apparatus for surface-treating a substrate, for example, a substrate processing apparatus for cleaning a substrate or etching a surface thereof, and holds or conveys the substrate. . Since this type of substrate holding device directly holds and conveys the substrate by the chuck without accommodating it in the carrier, in the substrate processing device of the method of immersing the substrate in the processing tank and performing the surface treatment, Since it is unnecessary, each processing tank can be downsized accordingly. Therefore, the amount of chemicals and cleaning liquid is small, and the processing time can be shortened. Also, it is easy to deal with the chucking of substrates whose substrate diameter is increased from 6 inches to 8 inches. Since then, it is spreading rapidly. Moreover, not only the substrate is held and transported between the cleaning layer of the substrate in the substrate processing apparatus and the substrate processing bath, but also when the transport to each bath is completed, the holding member itself that holds the substrate is cleaned. ing.

For example, in Japanese Utility Model Laid-Open No. 5-49290, there is proposed a technique of ejecting a fluid such as nitrogen gas or cleaning water in a guide groove for holding the substrate through the insertion of its outer edge during the cleaning process of the holding member itself. Has been done. By doing so, the dust and dirt accumulated in the guide groove are washed and removed (dust removal).

[0004]

However, even if the inside of the guide groove is cleaned and dust-removed during the cleaning process of the holding member, as in the substrate holding device proposed in the above publication, it will be described below. It has been pointed out that such a problem.

Even if the holding member is immersed in cleaning water and the fluid is jetted from the guide groove during that time, when the holding member is pulled up by the cleaning water, the cleaning water remains in the guide groove. Therefore, various impurities in the cleaning water may adhere to the guide groove after the cleaning water is dried, and the adhered impurities can be a source of contamination of the substrate held by the holding member. In this case, the impurities include, for example, dust and dirt in the immersion cleaning water, floating boron-based gas in the clean room dissolved in the cleaning water, CO ₂ , SO _X , NO _X, and the holding member to be attached to the cleaning water. The substrate processing chemicals brought in can be cited.

[0006] By the way, in view of technological trends in recent years, further densification of semiconductor devices is required, and accordingly, extremely high treatment quality is required for surface treatment of semiconductor substrates, and thus required treatment quality for substrate treatment is high. Improved. For this reason, there is a possibility that the impurities adhering to the guide groove, which would not cause a situation in which the substrate processing quality is poor in the past, adversely affect the substrate processing quality.

Even if the holding member is constructed so that the fluid ejection from the guide groove is continued even after the cleaning water is pulled up,
It is difficult to completely blow off the residual cleaning water from the guide groove, and this is not an essential solution. That is, as shown in FIG. 8, for example, the bottom corner portion 10 of the guide groove 100 is formed.
In many cases, the residual cleaning water of 2 or the tip portion 104 of the convex portion is not removed, because the so-called wraparound of the fluid occurs due to the jet of the fluid at the location. In this case, the bottom corner 10
Even if a fluid ejection port is provided at 2 or the convex tip portion 104, the cleaning water remains around any of the guide grooves 100 depending on the flow of the ejected fluid or the confluence thereof. Therefore, the impurities in this portion may have a bad influence on the substrate processing quality.

The present invention has been made to solve the above problems, and an object thereof is to reliably remove the cleaning water from the guide groove after cleaning the holding member for holding the substrate. To do.

[0009]

In order to achieve the above object, the means adopted in the substrate holding device according to the first aspect is such that a pair of holding members having guide grooves into which the outer edge of the substrate can be inserted are provided close to each other. A substrate holding device that is separable and has the guide grooves facing each other, and holds the substrate in the guide groove of each holding member at the outer edge of the holding member by bringing the pair of holding members close to each other. The hollow portion formed inside is communicated with the guide groove portion to the outside in the guide groove portion, the depressurizing means which is communicated with the hollow portion and depressurizes the inside of the hollow portion, and the holding member itself is washed with washing water. And a control means for driving and controlling the pressure reducing means.

In this case, in the substrate holding apparatus according to the second aspect of the present invention, there is provided gas introducing means that communicates with the hollow portion and pressurizes and introduces an inert gas into the hollow portion. The gas introducing means is drive-controlled prior to the drive control, and then the pressure reducing means is drive-controlled.

Further, in the substrate holding device according to the third aspect,
The depressurizing means has a depressurizing conduit that connects the depressurizing device and the hollow part of the holding member, and the gas introducing means causes the gas jetting device to pressurize and inject an inert gas and the hollow part of the holding member. And a control valve for switching and controlling the gas introduction pipe and the pressure reducing pipe, and the control means includes a gas introduction pipe communicating with the control valve. The gas introduction line and the decompression line are common lines.

[0012]

In the substrate holding apparatus having the above structure, the hollow portion formed inside the holding member is depressurized by the depressurizing means communicating with the hollow portion, and the guide groove is passed through the guide groove communicating hole. Aspirate inside. The drive control of the depressurizing means is performed by the control means after the holding member itself has been washed with washing water, so that the washing water in the guide groove is sucked into the hollow portion from the communication hole in the guide groove.

In the substrate holding apparatus according to the second aspect of the invention, the gas introducing means is driven and controlled by the control means before the cleaning water in the guide groove is sucked by the depressurizing means. Therefore, after cleaning the holding member itself, the inert gas is pressurized and introduced into the guide groove through the hollow portion and the communication hole in the guide groove, and the inert gas is jetted into the guide groove from the communication hole in the guide groove. To do. Therefore, the cleaning water in the guide groove is blown away by the pressure jet of the inert gas and then sucked into the hollow portion.

In the substrate holding apparatus according to the third aspect of the present invention, the depressurizing pipeline for depressurizing the inside of the hollow portion and the gas introducing pipeline for pressurizing and introducing the inert gas into the hollow portion are control valves of the control means from the hollow portion. Since the pipelines up to are common pipelines, only one pipeline may be communicated with the hollow portion of the holding member.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, preferred embodiments of the substrate holding device according to the present invention will be described with reference to the drawings. FIG. 1 is a schematic perspective view of a substrate holding device 1 which is an embodiment of the present invention.
As shown in FIG. 1, the substrate holding device 1 is mounted on a substrate transfer device body 20, and has a pair of left and right chucks 9 facing each other and a pair of holding rods 10 provided on the chuck 9.
Equipped with. The left and right chucks 9 are composed of a chuck piece 9A on the head 14 side and a chuck piece 9B facing the chuck piece 9A,
The holding rod 10 is provided so as to extend between the chuck pieces 9A and 9B. The left and right chucks 9 are assembled by being connected to the head 14 via a rotary shaft 9b, and rotate in the forward and reverse directions about the rotary shaft 9b as indicated by an arrow X in the figure. Therefore, through the forward and reverse rotations of the chuck 9, the pair of holding rods 10 are moved toward and away from each other. Note that the forward and reverse rotations of the chuck 9 and the approach and separation of the holding rod 10 will be described later.

Each of the holding rods 10 is the upper and lower holding rods 1.
0's form a pair, and the guide grooves 11 are formed along the longitudinal direction thereof at equal pitches for the number of holding substrates. That is, the holding bar 10 that makes a pair in the left chuck 9 and the holding bar 10 that makes a pair in the right chuck 9,
It constitutes a set of holding members according to the present invention. When the holding rods 10 of the left and right chucks 9 approach each other and the substrate 2 enters the guide grooves 11 of the four holding rods 10 at their outer edges, the substrate 2 is held by the holding rods 10. . Of course, one holding rod 10 may be provided for each of the left and right chucks 9 as long as the substrate 2 can be held by inserting the outer edge into the guide groove 11.

The head 14 is attached to the vertical portion 21 of the substrate transfer device main body 20 so as to be movable in the vertical direction along the guide groove 21a thereof, and is vertically driven by a driving means (not shown). Further, the substrate transfer device main body 20 can be moved by a driving means (not shown) along the horizontal direction indicated by an arrow Y in the figure.

Next, the detailed structure of the holding rod 10 and the holding rod 1
2 is a schematic front view of the substrate holding device 1 when the holding rod 10 in FIG. 1 is cross-sectionally viewed, and FIG. 2 is a cross-sectional view taken along line 3-3. This will be described with reference to FIG. 3, which is a sectional view.

As shown in FIG. 3, a hollow portion 10a is formed inside the holding rod 10, and this hollow portion 10a is
One end side of the holding rod 10 communicates with the communication hole 9a formed in the chuck piece 9A of the chuck 9. And the communication hole 9a
As shown in FIGS. 1 and 2, the upper end of the tube connection port 1
Since the number is 2, the hollow portion 10a of the holding rod 10 communicates with the connection tube 13 connected to the tube connection port 12 through the communication hole 9a and the tube connection port 12. The hollow portion 10a is closed on the chuck piece 9B side.

As shown in FIG. 3, the guide grooves 11 formed at equal pitches on the holding rod 10 are provided with a taper portion 11a for introducing the outer edge of the substrate 2 and the substrate substantially perpendicular to the longitudinal direction of the holding rod 10. And a guide groove bottom surface portion 11c. The guide groove bottom surface portion 11c of each guide groove 11 is provided with an external communication hole 8 that communicates the hollow portion 10a of the holding rod 10 with the outside.

Silicon carbide is used as the material of the holding rod 10. In the manufacturing method of the holding rod 10, first, a core of the holding rod 10 is formed of coke, and silicon carbide is crystallized around the core so as to cover the core. Then, only the coke is burned and removed. Thereby, the hollow portion 10
The holding bar 10 having a is easily formed. The surfaces of the holding rod 10 and the guide groove 11 are coated with a resin having a high hydrophobicity (for example, polytetrafluoroethylene or the like).

As described above, since the holding rod 10 has a hollow inside, the weight of the entire chuck can be extremely reduced. Therefore, it is possible to reduce the load on each drive unit of the substrate transfer apparatus main body 20 and obtain an effect that the substrate transfer can be smoothly performed.

However, the material of the holding rod 10 is not limited to the above-mentioned silicon carbide, but may be formed of other material having chemical resistance, such as quartz, stainless steel or fluorine resin.

Further, as shown in FIG. 3, the holding rod 10 is
Since the manufacturing process as described above is performed, the holding rod 10 has a hollow portion 10a having a shape similar to the outer shape of the holding rod 10. However, in addition to this, the holding rod 10 having a through hole having a single cross-sectional shape formed therein.
May be Even in this case, one end of the hollow portion 10a is closed by the chuck piece 9B.

The two holding rods 10 which are paired up and down in the left and right chucks 9 are the center lines 2a of the substrate 2 in the horizontal direction.
The upper and lower holding rods 10 are arranged above and below each other with the substrate 2 held therebetween, and between the guide groove bottom surface portion 11c of the guide groove 11 of the upper holding rod 10 and the outer edge of the substrate 2 slightly. It is adjusted to create a gap.

As a result, the substrate holding device 1 brings the holding rods 10 of the left and right chucks 9 close to each other, and holds the substrate 2 by scooping it up from below by the holding rods 10 below. At this time, since the upper holding bar 10 serves only as a guide and restricts the inclination of the substrate in the front-back direction, the substrate 2
It can be held in a stable state without damaging the outer edge of the.

As shown in FIG. 2, the chuck 9 is connected to a chuck drive unit 15 provided in the head 14 via a rotary shaft 9b fixed to the upper end thereof. The chuck drive unit 15 is a drive gear 16 that is fixed to the rotating shaft 9b of the chuck 9 and has a pinion 16a formed in a part thereof.
And a rack 17 that meshes with the drive gear 16, and an actuator 18 that drives the rack 17 up and down. Then, the chuck drive unit 15 is connected to the actuator 1
By driving the rack 17 up and down by 8, the left and right chucks 9 are opened and closed to move the holding rods 10 close to and away from each other.

A substrate holding holder 19 for transferring the substrate 2 to and from the holding rod 10 is provided at the bottom of a processing tank 28, which will be described later. The substrate holding holder 19 has a holding rod. The guide grooves 19a are formed at the same pitch as the guide grooves 11 of No. 10 are formed. Therefore, the substrate 2 is guided by the guide grooves 1 of the three substrate holding holders 19 so that the orientation flat 2b thereof is located below.
It is inserted into 9a and maintained in an organized manner. In this case, the substrate 2 is
Substantially three substrate holding holders 19 are supported by two at both ends, and the central holding holder prevents the substrate 2 from tilting back and forth, and during substrate processing in the processing bath, the substrate 2 is not supported. When it is about to rotate, it engages with the straight portion of the orientation flat 2b and prevents its rotation, thus enabling stable substrate processing in the processing tank.

The connecting tube 13 connected to the tube connecting port 12 of the chuck 9 has a sufficient length so that the opening / closing operation of the chuck 9 and the vertical movement of the head 14 are not hindered. The connection tube 13 is guided downward along the back of the vertical portion 21, is held by a cable carrier (not shown), and reaches an electromagnetic switching valve 24 described later.

Members such as the chuck 9, the rotating shaft 9b, and the head 14 which are in direct contact with the processing liquid or which may be splashed with the processing liquid are made of a resin having corrosion resistance to the processing liquid used. Is formed by.

As shown in FIG. 4, the connection tube 13 is connected to the ventilation port of the electromagnetic switching valve 24, and the vacuum suction pump 25 and the vacuum suction pump 25 are connected to two switching ports which are other ventilation ports of the electromagnetic switching valve 24. The nitrogen gas cylinder 26 is connected via a tube 25a and a tube 26a, respectively. The electromagnetic switching valve 24 normally closes the vent port to which the connection tube 13 is connected, and switches the communication between either the tube 25a or the tube 26a and the connection tube 13 by a control signal from the control device 27. Therefore, the tube 25 is opened by the electromagnetic switching valve 24.
When a and the connection tube 13 are communicated with each other, the vacuum suction pump 25 is communicated with the hollow portion 10a of the holding rod 10, and the inside of the holding rod 10 can be suctioned. Meanwhile, tube 2
When 6a and the connection tube 13 are communicated with each other, the nitrogen gas cylinder 26 is communicated with the hollow portion 10a, and the nitrogen gas can be introduced into the holding rod 10 under pressure (spout). The nitrogen gas cylinder 26 contains compressed and clean nitrogen gas that does not contain dust or dirt. Further, other inert gas (argon gas or the like) can be used instead of nitrogen gas.

The control device 27 includes a CPU, a ROM and a RAM.
The substrate holding device 1 is a well-known electronic control device including
And controls the operation of the entire substrate processing apparatus. Therefore, the electromagnetic switching valve 24 and the vacuum suction pump 25 are operated by receiving an instruction (control signal) from the control device 27.

Of the processing performed by the controller 27 for the entire substrate processing apparatus, the processing performed on the substrate holding apparatus 1 (substrate transfer / chuck cleaning routine) will be described with reference to the flowchart of FIG. A description will be given with reference to FIG. 6 showing a state when cleaning.

Prior to the description of the substrate transfer / chuck cleaning routine, the chuck cleaning tanks 29a and 29b will be described with reference to FIG. As shown in FIG. 6, the chuck cleaning tank 2
9a and 29b are provided adjacent to the left and right sides of the processing bath 28 in which a chemical liquid 31 for performing substrate processing such as etching is stored, and the cleaning liquid 3 is provided in each chuck cleaning bath.
0 is full. The cleaning liquid 30 is regularly exchanged through a pipe (not shown), or is constantly overflowed so as to be kept in a clean state.

The substrate transfer / chuck cleaning routine is performed by transferring the substrate to the processing tank 28 and the chuck cleaning tank 29a described above.
This is for cleaning the holding rod 10 of the chuck 9 at 29b. Then, when the routine is started,
The substrate 2 is held by separating / approaching the holding rod 10 through forward / reverse rotation of the chuck 9, and the substrate 2 is transferred onto the processing tank 22 while the substrate 2 is held, and the chuck 9 is moved. The head 14 is lowered along the guide groove 21a, and the substrate 2 holds the substrate 2 in the processing tank 28.
It is placed on 9 and handed over (step S100). When the substrate 2 is delivered, the holding rod 10 is separated by rotating the chuck 9 in one direction.

Thereafter, the chuck 9 is raised along the guide groove 21a, and the left and right chucks 9 are widely opened so as to be above the chuck cleaning tanks 29a and 29b, and the cleaning standby is performed (step S110). Then, the chuck 9
Is lowered again to immerse each of the left and right chucks 9 in the chuck cleaning tanks 29a and 29b and cleans them with the cleaning liquid 30 (step S120). During this time, the guide groove 11 of the holding rod 10 is cleaned. During the chuck cleaning, the control device 27 switches the electromagnetic switching valve 24 to the nitrogen gas cylinder 26 side to supply the nitrogen gas to the connection tube 13, and the nitrogen is supplied from the external communication hole 8 of the guide groove 11 of the holding rod 10. It can also be configured to bubbling by ejecting gas.

By bubbling in this way, dust, dust, etc. adhering to the inside of the guide groove 11 can be separated from the guide groove 11 during the immersion cleaning. In addition, if the chuck cleaning tanks 29a and 29b are provided with the conventional ultrasonic cleaning and functions such as bubbling from below the chuck 9 and upflow, cleaning of the chuck 9 is almost complete. be able to.

Following the chuck cleaning in step S120, the chuck 9 is raised to move the chuck cleaning tanks 29a, 2a.
9b, the connection tube 13 and the nitrogen gas cylinder 26 are communicated with each other by the electromagnetic switching valve 24, and the nitrogen gas is passed through the hollow portion 10a from the external communication hole 8 to the guide groove 1.
It spouts into 1 (step S130). In this case, the chuck 9 can be raised at a low speed, and the holding bar 1
Since the 0 and the guide groove 11 have a hydrophobic resin coating on their surfaces, they are pulled up and dried. In addition, the cleaning water in the guide groove 11 is blown off by the jetting of nitrogen gas. Therefore, due to the pulling-out drying and the jetting of the nitrogen gas, the holding rod 10 and the guide groove 11 are rapidly dried. The ejection of nitrogen gas is started when a predetermined time has elapsed after the chuck 9 was pulled up.

When the ejection of nitrogen gas is completed, the connection tube 13 and the vacuum suction pump 25 are communicated with each other by the electromagnetic switching valve 24, and the hollow portion 10a is vacuumed through the connection tube 13 (step S140). By performing this suction, the residual cleaning water in the guide groove 11 is sucked into the hollow portion 10a through the external communication hole 8. The suction is continued for a predetermined time.

Subsequent to the vacuum suction of the hollow portion 10a, the substrate transfer apparatus body 20 returns to a substrate holding standby position (not shown) for holding and transferring a new substrate 2 (step S
150), this routine is once ended.

As described above, the substrate holding apparatus 1 of this embodiment has the cleaning liquid 3 in the chuck cleaning tanks 29a and 29b.
When the holding rod 10 and the guide groove 11 have been immersed and cleaned by 0, the residual cleaning water in the guide groove 11 is blown off by the jetting of the nitrogen gas from the external communication hole 8, and the hollow part 10a is vacuum-sucked from the external communication hole 8. The residual cleaning water in the guide groove 11 is continuously sucked. Therefore, according to the substrate holding apparatus 1 of the present embodiment, the cleaning water can be surely removed from the guide groove 11, and dust and impurities in the cleaning water are not attached to the guide groove through the removal of the cleaning water. The quality can be improved.

Further, only the connecting tube 13 is required between the electromagnetic switching valve 24 and the chuck 9. Therefore, according to the substrate holding apparatus 1 of the embodiment, it is possible to simplify the structure of the duct around the chuck 9 that vertically moves and rotates in the forward and reverse directions, and further, the holding rod 10. Moreover, since the holding rod 10 for holding and releasing the substrate 2 can be smoothly moved toward and away from each other, carelessness of the interference between the substrate 2 and the guide groove 11 is eliminated, and a scratch or the like is left on the substrate 2. There is no.

Although one embodiment of the present invention has been described above, the present invention is not limited to such an embodiment and can be implemented in various modes without departing from the scope of the present invention. Of course.

For example, chuck cleaning tanks 29a, 29b
Alternatively, one pair may be provided on each of the processing tanks 28 on the left and right sides, or only one chuck cleaning tank may be provided between the adjacent processing tanks and the chuck cleaning tanks may be shared by both. Further, it may not be provided in all the processing tanks, but may be provided only in the processing tanks that require chuck cleaning.

Further, in this embodiment, the external communication hole 8 is provided only in the portion of the guide groove bottom surface portion 11c of the holding rod 10, but it is not necessary to limit to this portion. That is, as shown in FIG. 7, the tapered portion 11 a of the guide groove 11 and the holding groove 11
The external communication holes 8a and 8b may be formed in b. In this way, the suction effect of the residual cleaning water in the guide groove 11 by the vacuum suction pump 25 and the effect of blowing the residual cleaning water in the guide groove 11 by the nitrogen gas cylinder 26 can be further enhanced, and the cleaning water can be more reliably discharged. Can be removed.

In this embodiment, the chuck 9 is provided with the communication hole 9a and the nitrogen gas is supplied to the holding rod 10 through the communication hole 9a. However, the connection tube 13 is extended downward and directly held. It may be connected to the hollow portion 10a inside the rod 10.

Further, in the above embodiment of the substrate holding apparatus, the holding rod 10 has a circular cross-sectional shape, but the present invention is not limited to this. However, in order to obtain the effect of accelerating the liquid drainage, it is desirable that the cross-sectional shape be circular or a shape close to this.

The mechanism of the chuck drive section 15 is not limited to the pinion rack mechanism described above, and any known chuck drive mechanism may be used, and the actuator may be pneumatic or hydraulic. Besides, it is also possible to use a screw feed mechanism. Further, instead of rotating the chuck 9 to open and close, it is possible to slide the chuck 9 in parallel to open and close it.

Instead of bubbling with nitrogen gas during chuck cleaning, cleaning water may be jetted from the external communication hole 8 to the guide groove 11 during cleaning. In this case, a cleaning liquid supply device that can pump the same cleaning water as the cleaning liquid 30 in the chuck cleaning tanks 29a and 29b is provided, and the cleaning water from the cleaning liquid supply device is supplied to the electromagnetic switching valve 2.
4, the structure is such that it can be ejected from the external communication hole 8 through the connection tube 13 and the hollow portion 10a, and the communication with the connection tube 13 may be switched and controlled by the electromagnetic switching valve 24.

[0050]

As described in detail above, according to the substrate holding apparatus of the first aspect, the cleaning water in the guide groove is sucked into the hollow portion after cleaning by the cleaning water of the holding member itself, so that the guide groove is No wash water remains. In addition, according to the substrate holding device of the first aspect, dust and impurities in the cleaning water are not attached to the guide groove through the removal of the cleaning water, so that the substrate processing quality can be improved.

According to the substrate holding device of the second aspect, since the pressurized jet of the inert gas into the guide groove is performed prior to the suction of the cleaning water, the cleaning water can be more reliably removed from the guide groove. .

According to the substrate holding device of the third aspect, since the conduit communicating with the hollow portion of the holding member can be a single conduit, the structure of the conduit around the holding member can be simplified. You can Moreover, through smoothing of the approaching / separating operation of the holding member for holding and releasing the substrate, carelessness of interference between the substrate and the guide groove is eliminated, and the substrate is not scratched.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a substrate holding device 1.

FIG. 2 is a schematic front view of the substrate holding device 1 with a cross-sectional view of a holding rod 10 in FIG.

FIG. 3 is a cross-sectional view of FIG. 2 taken along the line 3-3.

FIG. 4 is an electromagnetic switching valve 24 to which a connecting tube 13 is connected.
FIG. 3 is a block diagram showing a vacuum suction pump 25, a nitrogen gas cylinder 26, and a control device 27 which are connected to the pump.

FIG. 5: Substrate transportation performed with respect to the substrate holding device 1.
It is a flow chart which shows a chuck cleaning routine.

FIG. 6 is a diagram showing a state of chuck cleaning.

FIG. 7 is a diagram showing another embodiment of the external communication hole 8 formed in the guide groove 11 of the holding rod.

FIG. 8 is an explanatory diagram for explaining a problem in a conventional substrate holding device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Substrate holding device 2 ... Substrate 8 ... External communication hole 8a, 8b ... External communication hole 9 ... Chuck 9A ... Chuck piece 9B ... Chuck piece 9a ... Communication hole 9b ... Rotating shaft 10 ... Holding rod 10a ... Hollow part 11 ... Guide Groove 11a ... Tapered portion 11b ... Holding groove 11c ... Guide groove bottom surface portion 12 ... Tube connection port 13 ... Connection tube 15 ... Chuck drive portion 16 ... Drive gear 18 ... Actuator 19 ... Substrate holding holder 20 ... Substrate transfer device main body 22 ... Processing Tank 24 ... Electromagnetic switching valve 25 ... Vacuum suction pump 26 ... Nitrogen gas cylinder 27 ... Control device 28 ... Processing tanks 29a, 29b ... Chuck cleaning tank 30 ... Cleaning liquid

Claims (3)

[Claims] 1. A set of holding members having a guide groove into which an outer edge of a substrate can be inserted is provided so that the guide grooves face each other such that the guide grooves face each other, and the substrate is brought close to the set of holding members. A substrate holding device for holding the guide groove of each holding member at its outer edge, wherein a hollow portion formed inside the holding member, a guide groove communication hole communicating with the outside in the guide groove portion, A substrate holding device comprising: a depressurizing unit that communicates with the hollow portion and depressurizes the inside of the hollow portion; and a control unit that drives and controls the depressurizing unit after the holding member itself has been washed with washing water. 2. The substrate holding device according to claim 1, further comprising a gas introducing unit that communicates with the hollow portion and pressurizes and introduces an inert gas into the hollow portion, and the control unit includes the depressurizing unit. Substrate holding device, which drives and controls the gas introducing means prior to the drive control of 1. and then drives and controls the depressurizing means. 3. The substrate holding device according to claim 2, wherein the depressurizing unit has a depressurizing conduit that connects the depressurizing device and a hollow portion of the holding member, and the gas introducing unit is inert. It has a gas introduction pipe line that communicates a gas jetting device for jetting gas under pressure and the hollow portion of the holding member, and the control means has a control valve for controlling switching between the gas introduction pipe line and the pressure reducing pipe line. The substrate holding device, wherein the gas introduction pipeline and the decompression pipeline from the hollow portion to the control valve are common pipelines.