JP2008205360A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that can treat a substrate at a high level of cleanness by devising a way of supplying a process liquid and can prevent incomplete drying. <P>SOLUTION: Supply of deionized water is stopped from a left-side jet pipe 7, and deionized water is supplied only from a right-side jet pipe 7. By so setting, a direction in which dried air is supplied and a flow of the deionized water in the vicinity of the fluid level will agree, and thus, stagnation is hard to occur in the flow of the deionized water, and particles are effectively discharged that are separated from a substrate W and are afloat in the deionized water during the cleaning time. As a result, this will prevent the particles from clinging to the substrate W picked up, thus enabling the substrate W to be processed at a high level of cleanness. Further, the fluid level will never rise in the middle part, and dried air will prevent poppling from being generated in the middle of the fluid level, which will prevent splashed liquid from adhering to the substrate W while it is being taken up, thus inhibiting incomplete drying of the substrate W. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus that performs a predetermined process on a glass substrate (hereinafter simply referred to as a substrate) for a semiconductor wafer or a liquid crystal display device, and in particular, while supplying a processing liquid to a processing tank, the processing liquid The present invention relates to a technique for supplying a dry gas in a horizontal direction above a surface and lifting a substrate from a processing liquid to perform a drying process on the substrate.

  Conventionally, as this type of apparatus, a processing tank for storing a processing liquid, an ejection pipe for supplying the processing liquid from the bottom of the processing tank, and a substrate are supported and can be moved up and down over the inside of the processing tank and above the processing tank. The thing provided with the comprised lifter and the nozzle for supplying dry air from the one side to the other side is provided (for example, refer patent document 1).

In the apparatus configured as described above, pure water is supplied from the ejection pipe, and an upward flow of liquid flowing upward from the bottom of the processing tank is formed, thereby overflowing the pure water from the processing tank. Then, the lifter supporting the substrate is lowered to immerse the substrate in pure water, and the lifter is raised from the pure water after the treatment for a predetermined time. At this time, by supplying dry air from the nozzle in the horizontal direction, the substrates sequentially exposed from the liquid surface of pure water are dried.
JP 11-354488 A

However, the conventional example having such a configuration has the following problems.
That is, in the conventional apparatus, the pure water supplied in the upflow rises in the central part of the processing tank, splits to the left and right near the liquid level, and overflows to the left and right of the upper edge of the processing tank. On the other hand, since the dry air supplied from the nozzle is supplied only in one direction from one side to the other side, a portion that opposes the flow of overflowing pure water occurs. Therefore, in the part where the flow of dry air and the flow of pure water are opposite, stagnation occurs in the flow of pure water, and the discharge efficiency of particles in pure water decreases, so the problem is that the substrate being lifted is contaminated with particles There is.

  In addition, the liquid level in the center part rises due to the upflow, and undulations occur in that part due to the dry gas, and the droplets of pure water scatter and adhere to the substrate being pulled up, resulting in water marks and poor drying. There is also a problem that may occur.

  The present invention has been made in view of such circumstances, and provides a substrate processing apparatus that can process with high cleanliness and can prevent poor drying by devising the supply form of the processing liquid. For the purpose.

In order to achieve such an object, the present invention has the following configuration.
That is, the invention according to claim 1 is a substrate processing apparatus that performs a drying process with a dry gas while pulling up a substrate from the processing liquid after processing the substrate with the processing liquid, and a processing tank for storing the processing liquid, and the processing A drying gas supply means for supplying a drying gas from one side to the other side along the processing liquid surface stored in the processing tank at the upper part of the tank, and disposed at both ends of the bottom of the processing tank, A pair of jet pipes for supplying a processing liquid toward the center of the bottom of the tank; a support means configured to support the substrate and to be raised and lowered over a processing position inside the processing tank and a drying position above the processing tank; and the support With the means positioned at the processing position, the substrate is processed by supplying the processing liquid from the pair of ejection pipes, and then the supporting means is raised while supplying the dry gas from the dry gas supply means. In the case of Of the jet pipe, and it is characterized in that it comprises a control means for supplying the processing liquid from only one jet pipe which is located on the discharge side of the drying gas in the drying gas supply means.

  [Operation / Effect] According to the invention described in claim 1, the control means causes the substrate to perform processing by supplying the processing liquid from the pair of ejection pipes in a state where the supporting means is located at the processing position. Thereafter, when the support means is raised while supplying the dry gas from the dry gas supply means, the processing liquid is supplied from only one of the pair of jet pipes located on the dry gas discharge side of the dry gas supply means. To supply. Therefore, during the processing of the substrate, the processing liquid supplied from the pair of ejection pipes rises from the center of the bottom toward the liquid surface and flows toward both sides of the processing tank, and from both upper edges of the processing tank. Discharged. When the substrate is pulled up and dried, the processing liquid is supplied from only one of the pair of jet pipes located on the dry gas discharge side, so that the supplied processing liquid is along the bottom of the processing tank. After going to the other ejection pipe side, it rises along the side wall of the processing tank, and after flowing near the liquid surface toward the discharge side of the dry gas, it overflows from the upper edge of the processing tank and is discharged. Therefore, since the supply direction of the dry gas and the flow of the treatment liquid in the vicinity of the liquid surface coincide with each other, stagnation does not easily occur in the flow of the treatment liquid, and the particles in the treatment liquid are efficiently discharged. As a result, it is possible to prevent particles from adhering to the substrate to be pulled up, and it is possible to process with high cleanliness. In addition, the central part of the liquid level does not swell, and it is possible to prevent the dry gas from causing undulations in the center of the liquid level, thus preventing droplets from adhering to the substrate being pulled up and preventing poor drying. can do.

  The invention described in claim 2 is a substrate processing apparatus that performs a drying process with a dry gas while pulling up the substrate from the processing liquid after processing the substrate with the processing liquid, and a processing tank for storing the processing liquid; A dry gas supply means for supplying a dry gas from one side to the other side along a processing liquid surface stored in the processing tank at the upper part of the tank, and among the bottom ends of the processing tank, the dry gas supply means The first direction is arranged on the dry gas supply side and can switch between a first direction for supplying the processing liquid to the center of the bottom of the processing tank and a second direction for supplying the processing liquid to the upper side of the processing tank. The second ejection pipe and the first ejection pipe are disposed on the opposite side of the bottom of the processing tank, and supply the processing liquid toward the center of the bottom of the processing tank, and the support means From the first jet pipe with the The processing liquid is supplied in the direction of 1 and the substrate is processed by supplying the processing liquid from the second ejection pipe, and then the support means is raised while supplying the dry gas from the dry gas supply means. And a control means for stopping the supply of the processing liquid from the second ejection pipe and supplying the processing liquid from the first ejection pipe in the second direction. It is what.

  [Operation / Effect] According to the invention described in claim 2, the control means supplies the treatment liquid in the first direction from the first ejection pipe in a state where the support means is located at the treatment position. When the substrate is processed by supplying the processing liquid from the second ejection pipe and then the supporting means is raised while supplying the dry gas from the dry gas supply means, the processing liquid from the second ejection pipe is used. Is stopped, and the processing liquid is supplied in the second direction from the first ejection pipe. Therefore, during the processing of the substrate, the processing liquid supplied from the first ejection pipe in the first direction and the processing liquid supplied from the second ejection pipe are processed while rising from the center of the bottom toward the liquid surface. The flow is divided toward both sides of the tank and discharged from both upper edges of the processing tank. When the substrate is pulled up and dried, the processing liquid is supplied only from the second direction of the first ejection pipe, so that the supplied processing liquid rises along the side wall of the processing tank and dries near the liquid surface. After flowing toward the gas discharge side, it overflows from the upper edge of the treatment tank and is discharged. Therefore, since the supply direction of the dry gas and the flow of the treatment liquid in the vicinity of the liquid surface coincide with each other, stagnation does not easily occur in the flow of the treatment liquid, and the particles in the treatment liquid are efficiently discharged. As a result, it is possible to prevent particles from adhering to the substrate to be pulled up, and it is possible to process with high cleanliness. In addition, the central part of the liquid level does not swell, and it is possible to prevent the dry gas from causing undulations in the center of the liquid level, thus preventing droplets from adhering to the substrate being pulled up and preventing poor drying. can do.

  In the present invention, the first ejection pipe communicates with a cylindrical member having a circular longitudinal cross section, a partition member that bisects the internal space of the cylindrical member, and one internal space partitioned by the partition member, A first jet port for supplying the processing liquid in the first direction, and a second jet port for communicating with the other internal space partitioned by the partition member and for supplying the processing liquid in the second direction, It is preferable to provide (Claim 3). The cylinder member is partitioned by a partition member to form a first jet port and a second jet port, and the supply direction of the processing liquid can be switched by simply switching the supply destination of the processing liquid to the first jet pipe. . Therefore, no extra space is required and space saving can be achieved.

  Further, according to the present invention, the first ejection pipe includes a first cylindrical member that supplies the processing liquid in the first direction, and a second cylindrical member that supplies the processing liquid in the second direction. It is preferable that they are configured separately (claim 4). Since the 1st jet pipe is comprised by the separate 1st cylinder member and 2nd cylinder member, the structure of both cylinder members can be simplified.

  Further, the invention according to claim 5 is a substrate processing apparatus that performs a drying process with a dry gas while pulling up the substrate from the processing liquid after processing the substrate with the processing liquid, and a processing tank for storing the processing liquid; A drying gas supply means for supplying a drying gas from one side to the other side along the processing liquid surface stored in the processing tank at the upper part of the tank, and disposed at both ends of the bottom of the processing tank, A pair of jet pipes for supplying the processing liquid toward the center of the bottom of the tank, and the upper side walls of the processing tank, arranged on the supply side of the dry gas supply means, and near the liquid level of the processing tank An upper jet pipe for supplying a treatment liquid toward the discharge side of the dry gas supply means, a support means for supporting the substrate, and configured to be movable up and down over a treatment position inside the treatment tank and a drying position above the treatment tank; The support means was positioned at the processing position In this state, after the processing liquid is supplied from the pair of ejection pipes and the substrate is processed, when the support means is raised while the drying gas is supplied from the drying gas supply means, the pair of ejections And a control means for stopping the supply of the processing liquid from the pipe and supplying the processing liquid from the upper jet pipe.

  [Operation / Effect] According to the invention described in claim 5, the control means causes the substrate to perform processing by supplying the processing liquid from the pair of ejection pipes with the support means positioned at the processing position. Thereafter, when raising the support means while supplying the dry gas from the dry gas supply means, the supply of the processing liquid from the pair of ejection pipes is stopped and the processing liquid is supplied from the upper ejection pipes. Therefore, during the processing of the substrate, the processing liquid supplied from the pair of ejection pipes rises from the center of the bottom toward the liquid surface and flows toward both sides of the processing tank, and from both upper edges of the processing tank. Discharged. When the substrate is pulled up and dried, the supply of the processing liquid from the pair of ejection pipes is stopped and the processing liquid is supplied only from the upper ejection pipe, so that the supplied processing liquid has a dry gas around the liquid surface. After flowing toward the discharge side, it overflows from the upper edge of the treatment tank and is discharged. Therefore, since the supply direction of the dry gas and the flow of the treatment liquid in the vicinity of the liquid surface coincide with each other, stagnation does not easily occur in the flow of the treatment liquid, and the particles in the treatment liquid are efficiently discharged. As a result, it is possible to prevent particles from adhering to the substrate to be pulled up, and it is possible to process with high cleanliness. In addition, the central part of the liquid level does not swell, and it is possible to prevent the dry gas from causing undulations in the center of the liquid level, thus preventing droplets from adhering to the substrate being pulled up and preventing poor drying. can do.

  Further, according to the present invention, instead of stopping the supply of the processing liquid from the pair of ejection pipes, the control means is an ejection located on the supply side of the dry gas supply means among the pair of ejection pipes. It is preferable to stop only the supply of the processing liquid from the pipe (claim 6). Even if only the supply of the processing liquid from the jet pipe located on the supply side of the dry gas supply means is stopped among the pair of jet pipes, the supply direction of the dry gas matches the flow of the processing liquid in the vicinity of the liquid surface. . Since the flow inside the processing tank is not stopped, the discharge of particles inside the processing tank can be continued even when the substrate is pulled up.

  Moreover, this invention is further equipped with the rectification | straightening plate extended toward the center part side of the processing tank from the upper edge in the supply side of the said dry gas supply means among the upper both side walls of the said processing tank. (Claim 7). Since the flow velocity of the dry gas is high and the rectifying plate is provided on the supply side, it is possible to prevent the liquid surface from undulating and prevent the spray of the processing liquid from scattering from the liquid surface.

  According to the substrate processing apparatus of the present invention, during the processing of the substrate, the processing liquid supplied from the pair of ejection pipes rises from the center of the bottom toward the liquid surface and flows toward both sides of the processing tank. Divided and discharged from both upper edges of the treatment tank. When the substrate is pulled up and dried, the processing liquid is supplied from only one of the pair of jet pipes located on the dry gas discharge side, so that the supplied processing liquid is along the bottom of the processing tank. After going to the other ejection pipe side, it rises along the side wall of the processing tank, and after flowing near the liquid surface toward the discharge side of the dry gas, it overflows from the upper edge of the processing tank and is discharged. Therefore, since the supply direction of the dry gas and the flow of the treatment liquid in the vicinity of the liquid surface coincide with each other, stagnation does not easily occur in the flow of the treatment liquid, and the particles in the treatment liquid are efficiently discharged. As a result, it is possible to prevent particles from adhering to the substrate to be pulled up, and it is possible to process with high cleanliness. In addition, the central part of the liquid level does not swell, and it is possible to prevent the dry gas from causing undulations in the center of the liquid level, thus preventing droplets from adhering to the substrate being pulled up and preventing poor drying. can do.

Embodiment 1 of the present invention will be described below with reference to the drawings.
FIG. 1 is a block diagram illustrating a schematic configuration of the substrate processing apparatus according to the first embodiment.

  The substrate processing apparatus according to the first embodiment includes a processing tank 1 that stores a processing liquid. The processing tank 1 is configured to store a processing liquid and accommodate a plurality of substrates W in an upright posture. At the bottom of the processing tank 1, there is a pair of ejection pipes 7 having a long axis along a direction (paper surface direction) in which a plurality of substrates W are aligned and for supplying a processing liquid into the processing tank 1. It is arranged. One end side of the supply pipe 8 is connected to the right ejection pipe 7, and the other end side of the supply pipe 8 is connected to a processing liquid supply source (not shown). One end side of a supply pipe 9 is connected to the left ejection pipe 7, and the other end side of the supply pipe 9 is connected to a processing liquid supply source (not shown). The supply pipes 8 and 9 supply chemical liquid such as hydrofluoric acid, a mixed liquid of sulfuric acid and hydrogen peroxide water, or pure water as a processing liquid. Flow control valves 10 and 11 are attached to the supply pipes 8 and 9, respectively, and the flow rate of the processing liquid supplied from the pair of ejection pipes 7 to the processing tank 1 is adjusted by these.

  The processing tank 1 is surrounded by a chamber 12. The chamber 12 includes an upper cover 13 that can be freely opened and closed. The lifter 15 that supports the plurality of substrates W in a standing posture includes a “standby position” that is above the chamber 12, a “processing position” that is inside the processing tank 1, and an interior of the chamber 12 that is above the processing tank 1. It is configured to be movable across the “drying position”. The lifter 15 includes a support member 16 at the lower part for abutting and supporting a plurality of substrates W.

  The lifter 15 described above corresponds to the support means in the present invention.

  A discharge port 17 is formed at the bottom of the processing tank 1. A QDR valve 19 is attached to the discharge port 17. When the processing liquid in the processing tank 1 is discharged from the discharge port 17, the processing liquid is once discharged to the bottom of the chamber 12. A drain valve 21 is attached to the bottom of the chamber 12, and when the drain valve 21 is opened, the processing liquid discharged into the chamber 12 is discharged to the outside. Further, the processing liquid supplied from the ejection pipe 7 and overflowing the processing tank 1 and discharged into the chamber 12 is also discharged outside through the drain valve 21 in the same manner.

  A supply unit 23 for supplying dry air, which is a dry gas, from the side of the plurality of substrates W supported by the lifter 15 is disposed on the side of the upper edge of the processing tank 1 in the chamber 12. A discharge unit 25 for discharging dry air is disposed at a position facing the supply unit 23 with the processing tank 1 interposed therebetween. The supply unit 23 includes an injection port 27 that ejects dry air so as to open near the liquid level of the processing liquid stored in the processing tank 1, and the discharge unit 25 discharges the dry air to the outside of the chamber 12. A discharge port 29 is provided on the processing tank 1 side.

  The supply unit 23 is connected to the other end of a supply pipe 33 whose one end is connected to the dry air supply device 31. The dry air supply device 31 takes in the air and dehumidifies it, and supplies the dry air adjusted to a predetermined humidity to the supply pipe 33.

  In addition, the supply part 23 mentioned above corresponds to the dry gas supply means in this invention.

  The lifting / lowering operation of the lifter 15, the opening / closing of the QDR valve 19 and the drain valve 21, the flow rate control valves 10 and 11, etc. are comprehensively controlled by the control unit 47 corresponding to the control means in the present invention. In particular, the flow control valves 10 and 11 are characteristically operated as described below.

  Next, operations of the substrate processing apparatus having the above-described configuration will be described with reference to FIGS. FIG. 2 is a schematic diagram showing the time of the cleaning process, and FIG. 3 is a schematic diagram showing the time of the drying process. In the following description, it is assumed that the lifter 15 has already been moved to the processing position.

<During washing process>
The control unit 47 sets the flow rate control valves 10 and 11 to the same flow rate, opens them, and supplies pure water as treatment liquid from the pair of ejection pipes 7 at the same flow rate into the processing total 1. Then, pure water is supplied from both ends of the bottom of the processing tank 1, and moves upward at the center of the bottom, overflows from the processing tank 1 in the vicinity of the liquid level and separates right and left (FIG. 2). By maintaining this state for a predetermined time, the substrate W is cleaned with pure water.

<Drying process>
The controller 47 sets the flow rate of the flow control valve 11 to zero. Thereby, the supply of pure water is stopped from the left jet pipe 7 and pure water is supplied only from the right jet pipe 7. Therefore, after deionized water goes from the bottom right side of the processing tank 1 to the left ejection pipe 7 side along the bottom, it rises along the side wall of the processing tank 1, and the vicinity of the liquid level toward the discharge unit 25 side. After flowing, it overflows from the upper edge of the processing tank 1 and is discharged (FIG. 3). In this state, the control unit 47 supplies dry air from the injection port 27 of the supply unit 23 and raises the lifter 15 toward the drying position. Then, dry air is supplied to the substrate W exposed sequentially from the liquid surface of the pure water, and a drying process is performed on the substrate W.

  The substrate W is dried as described above. However, since the supply direction of the dry air and the flow of pure water in the vicinity of the liquid surface coincide with each other, the flow of pure water hardly causes stagnation and is peeled off from the substrate W during cleaning. Thus, the particles drifting in the pure water and the particles originally existing in the pure water in the treatment tank 1 are efficiently discharged. As a result, it is possible to prevent particles from adhering to the substrate W to be pulled up, and the substrate W can be processed with high cleanliness. In addition, since the central portion of the liquid surface does not rise and it is possible to prevent the air surface from being rippled by dry air, it is possible to prevent the droplets from adhering to the substrate W being pulled up and to dry the substrate W. Defects can be prevented.

Next, Embodiment 2 of the present invention will be described with reference to the drawings.
FIG. 4 is a block diagram illustrating a schematic configuration of the substrate processing apparatus according to the second embodiment, and FIG. 5 is a longitudinal sectional view of a second ejection pipe. In addition, about the structure similar to Example 1 mentioned above, detailed description is abbreviate | omitted by attaching | subjecting a same sign.

  The substrate processing apparatus according to the second embodiment includes a first jet pipe 51 on the left side of the bottom of the processing tank 1 and a second jet pipe 53 on the right side of the bottom of the processing tank 1. The second ejection pipe 53 is connected to the other end side of a supply pipe 55 whose one end side is connected to a processing liquid supply source (not shown). A flow rate control valve 57 for adjusting the flow rate is attached to the supply pipe 55.

  As shown in FIG. 5, the first ejection pipe 51 is formed in a cylindrical member 59 having a circular longitudinal section, a partition member 61 that bisects the internal space of the cylindrical member 59, and the cylindrical member 59. A first jet port 63 capable of supplying a treatment liquid in a first direction toward the center of the bottom of the treatment tank 1 communicated with one of the spaces and a cylindrical member 59, communicated with the other of the internal space, and treated. A second jet port 65 capable of supplying the processing liquid in a second direction extending upward along the side wall of the tank 1, a first supply port 67 communicating with the first jet port 63, and a second jet port 65. And a second supply port 69 in communication therewith.

  The other end side of the supply pipe 71 whose one end side is connected to a treatment liquid supply source (not shown) is connected to the first supply port 67 and the second supply port 69 via a three-way valve 73. That is, the processing liquid is supplied from only one of the first supply port 67 and the second supply port 69 by the operation of the three-way valve 73. A flow rate control valve 75 for adjusting the flow rate is attached to the supply pipe 71.

  The control unit 47 in the second embodiment controls the switching of the three-way valve 73 in addition to the control of the lifter 15 and the like.

  Next, operations of the substrate processing apparatus having the above-described configuration will be described with reference to FIGS. 6 is a schematic diagram showing the time of the cleaning process, and FIG. 7 is a schematic diagram showing the time of the drying process.

<During washing process>
The control unit 47 switches the three-way valve 73 to the first supply port 67 side, sets the flow rate control valves 57 and 75 to the same flow rate, and opens them, so that the first jet pipe 51 and the second jet pipe 53 Pure water is supplied into the treatment tank 1 as a treatment liquid at the same flow rate. Pure water is supplied from the first injection pipe 51 in the first direction. Then, pure water is supplied from both ends of the bottom of the processing tank 1, moves upward at the center of the bottom, divides into right and left near the liquid surface, and overflows from the processing tank 1 (FIG. 6). By maintaining this state for a predetermined time, the substrate W is cleaned with pure water.

<Drying process>
The controller 47 sets the flow rate of the flow rate control valve 57 to zero. As a result, the supply of pure water from the second ejection pipe 53 is stopped. Further, the three-way valve 73 is switched to the second supply port 69 side with the flow rate control valve 75 opened. As a result, pure water is supplied from the first ejection pipe 51 only in the second direction. Therefore, the pure water rises along the side wall of the processing tank 1, flows over the liquid surface toward the discharge side of the dry air, and then overflows and is discharged from the upper edge of the processing tank 1 (FIG. 7). In this state, the control unit 47 supplies dry air from the injection port 27 and raises the lifter 15 toward the drying position. Then, dry air is supplied to the substrate W exposed sequentially from the liquid surface of the pure water, and a drying process is performed on the substrate W.

  Even the substrate processing apparatus according to the second embodiment described above has the same effects as the substrate processing apparatus according to the first embodiment described above. Further, the cylindrical member 59 is partitioned by the partition member 61 to form the first jet outlet 63 and the second jet outlet 65, and the processing liquid supply only to the first jet pipe 51 by switching the supply destination. The supply direction can be switched. Therefore, an extra space is not required in the processing tank 1, and space saving can be achieved.

  In addition, you may comprise the substrate processing apparatus which concerns on Example 2 mentioned above as shown in FIG. FIG. 8 is a block diagram illustrating a modification of the substrate processing apparatus according to the second embodiment.

  That is, the first ejection pipe 51 is configured as a separate body of a first cylindrical member 77 that supplies the processing liquid in the first direction and a second cylindrical member 79 that supplies the processing liquid in the second direction. In that respect, the configuration is different from that of the second embodiment. Even if it is such a structure, there exists the same effect by switching the three-way valve 73 at the timing mentioned above. Moreover, since the 1st ejection pipe | tube 51 is comprised with the two cylindrical members of the same structure, compared with the 1st ejection pipe | tube 51 of Example 2, a structure can be simplified.

Next, Embodiment 3 of the present invention will be described with reference to FIGS.
FIG. 9 is a block diagram illustrating a schematic configuration of the substrate processing apparatus according to the third embodiment, FIG. 10 is a schematic diagram illustrating a cleaning process, and FIG. 11 is a schematic diagram illustrating a drying process. In addition, about the structure equivalent to Example 1 mentioned above, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol.

  The substrate processing apparatus according to the third embodiment includes a pair of ejection pipes 7, and a processing liquid is supplied to the ejection pipes 7 from a supply pipe 8. An upper ejection pipe 81 is disposed on the dry air supply unit 23 side of the upper side walls of the processing tank 1. The upper jet pipe 81 is connected to the other end of a supply pipe 83, one end of which is connected to a processing liquid supply source (not shown), and the upper jet pipe 81 is connected to a discharge portion in the vicinity of the liquid surface of the processing tank 1. The processing liquid is supplied toward the 25 side. A flow rate control valve 85 for adjusting the flow rate is attached to the supply pipe 83.

  During the cleaning process (FIG. 10), the pure water is supplied from the pair of jet pipes 7 with the flow rate of the flow control valve 85 set to zero and the supply of pure water from the upper jet pipe 81 is shut off. Process W. On the other hand, during the drying process (FIG. 11), the flow rate of the flow rate control valve 10 is set to zero to stop the supply of pure water, and the flow rate of the flow rate control valve 85 is set to a predetermined value so that pure water is supplied from the upper jet pipe 81. Supply.

  Even the substrate processing apparatus according to the third embodiment described above has the same effects as the substrate processing apparatuses according to the first and second embodiments described above.

  In the third embodiment, as in the first embodiment, the control unit 47 stops only the supply of pure water from the left jet pipe 7 located on the supply section 23 side of the pair of jet pipes 7. You may do it. Even if it does in this way, while there exists an effect similar to the above and the flow inside processing tank 1 is not stopped, discharge of particles inside processing tank 1 can be continued even when substrate W is pulled up.

  The present invention is not limited to the above embodiment, and can be modified as follows.

  (1) In each of the above-described Examples 1 to 3, the processing tank 1 is configured as a single tank, but a multi-tank type equipped with an inner tank and an outer tank for recovering the processing liquid overflowing from the inner tank. It may be a treatment tank.

  (2) In each of the first to third embodiments described above, dry air is supplied from the supply unit 23. However, instead of this, dry nitrogen or other dry gas may be supplied.

(3) In each of the first to third embodiments, a configuration may be added as in the modification shown in FIG.
That is, of the upper side walls of the processing tank 1, the length that does not interfere with the lifter 15 and the supported substrate W that extends from the upper edge of the side wall of the processing tank 1 toward the discharge section 25 toward the supply section 23. A rectifying plate 87 may be further provided. By providing the current plate 87, it is possible to prevent the liquid surface on the supply unit 23 side from undulating, and to prevent the splash of pure water from scattering from the liquid surface.

1 is a block diagram illustrating a schematic configuration of a substrate processing apparatus according to a first embodiment. It is a schematic diagram which shows the time of a washing process. It is a schematic diagram which shows the time of a drying process. FIG. 6 is a block diagram illustrating a schematic configuration of a substrate processing apparatus according to a second embodiment. It is a longitudinal cross-sectional view of a 2nd ejection pipe. It is a schematic diagram which shows the time of a washing process. It is a schematic diagram which shows the time of a drying process. FIG. 10 is a block diagram illustrating a schematic configuration of a substrate processing apparatus according to a modification of Example 2. FIG. 10 is a block diagram illustrating a schematic configuration of a substrate processing apparatus according to a third embodiment. It is a schematic diagram which shows the time of a washing process. It is a schematic diagram which shows the time of a drying process. It is a schematic block diagram which shows a modification.

Explanation of symbols

W ... Substrate 1 ... Processing tank 7 ... Jet pipe 8, 9 ... Supply pipe 10, 11 ... Flow control valve 12 ... Chamber 15 ... Lifter 23 ... Supply section 25 ... Discharge section 33 ... Supply pipe 47 ... Control section

Claims (7)

In a substrate processing apparatus for performing a drying process with a dry gas while processing a substrate with a processing liquid and then pulling up the substrate from the processing liquid,
A treatment tank for storing the treatment liquid;
Dry gas supply means for supplying dry gas from one side to the other side along the processing liquid surface stored in the processing tank at the upper part of the processing tank,
A pair of ejection pipes disposed on both ends of the bottom of the treatment tank and supplying a treatment liquid toward the center of the bottom of the treatment tank;
A support means configured to support the substrate and to be movable up and down over a processing position inside the processing tank and a drying position above the processing tank;
In a state where the support means is located at the processing position, after the processing liquid is supplied from the pair of ejection pipes and the substrate is processed, the support means is supplied while supplying the dry gas from the dry gas supply means. When raising, control means for supplying the processing liquid from only one of the pair of jet pipes located on the dry gas discharge side in the dry gas supply means,
A substrate processing apparatus comprising: In a substrate processing apparatus for performing a drying process with a dry gas while processing a substrate with a processing liquid and then pulling up the substrate from the processing liquid,
A treatment tank for storing the treatment liquid;
Dry gas supply means for supplying dry gas from one side to the other side along the processing liquid surface stored in the processing tank at the upper part of the processing tank,
A first liquid is disposed on the dry gas supply side of the dry gas supply means among both ends of the bottom of the processing tank, and the processing liquid is supplied to the center of the bottom of the processing tank, and the processing liquid is disposed above the processing tank. A first jet pipe switchable between a second direction for supplying
The first ejection pipe is disposed on the opposite side of the bottom of the treatment tank, and a second ejection pipe that supplies a treatment liquid toward the center of the bottom of the treatment tank;
With the support means positioned at the processing position, the processing liquid is supplied from the first ejection pipe in the first direction, and the processing liquid is supplied from the second ejection pipe to perform processing on the substrate. Then, when raising the support means while supplying the dry gas from the dry gas supply means, the supply of the processing liquid from the second jet pipe is stopped and the first jet pipe is used. Control means for supplying the treatment liquid in the second direction;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 2,
The first ejection pipe communicates with a cylindrical member having a circular longitudinal section, a partition member that bisects the internal space of the cylindrical member, and one internal space partitioned by the partition member, and is processed in the first direction. A first jet port for supplying the liquid, a second jet port for communicating with the other internal space partitioned by the partition member and supplying the processing liquid in the second direction,
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 2,
The first ejection pipe includes a first cylindrical member that supplies the processing liquid in the first direction and a second cylindrical member that supplies the processing liquid in the second direction, and is configured separately. A substrate processing apparatus. In a substrate processing apparatus for performing a drying process with a dry gas while processing a substrate with a processing liquid and then pulling up the substrate from the processing liquid,
A treatment tank for storing the treatment liquid;
Dry gas supply means for supplying dry gas from one side to the other side along the processing liquid surface stored in the processing tank at the upper part of the processing tank,
A pair of ejection pipes disposed on both ends of the bottom of the treatment tank and supplying a treatment liquid toward the center of the bottom of the treatment tank;
Of the upper both side walls of the processing tank, an upper jet pipe that is disposed on the supply side of the dry gas supply means and supplies the processing liquid toward the discharge side of the dry gas supply means in the vicinity of the liquid surface of the processing tank When,
A support means configured to support the substrate and to be movable up and down over a processing position inside the processing tank and a drying position above the processing tank;
In a state where the support means is located at the processing position, after the processing liquid is supplied from the pair of ejection pipes and the substrate is processed, the support means is supplied while supplying the dry gas from the dry gas supply means. When raising, the control means for stopping the supply of the processing liquid from the pair of ejection pipes and supplying the processing liquid from the upper ejection pipes;
A substrate processing apparatus comprising: In the substrate processing apparatus of Claim 5,
The control means, instead of stopping the supply of the processing liquid from the pair of ejection pipes, of the processing liquid from the ejection pipe located on the supply side of the dry gas supply means among the pair of ejection pipes. A substrate processing apparatus, wherein only the supply is stopped. In the substrate processing apparatus according to any one of claims 1 to 6,
The substrate further comprising a rectifying plate extending from an upper edge toward a central portion side of the processing tank on a supply side of the dry gas supply means among both upper side walls of the processing tank. Processing equipment.

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