JPH07335539A - Semiconductor exposing device - Google Patents

Abstract

PURPOSE:To convey an appropriate countermeasure to the operator of a semiconductor exposing device when an error occurs by reading out and displaying the displaying data corresponding to operator data indicating the kind of the operator and error data indicating the kind of the error. CONSTITUTION:When an error occurs, a CPU 8 sends an error code to a console 7 from an exposing device. The console 7 obtains the data of the group to which the person who currently operates the exposing device belongs by reading out the recorded content of a format in a data base on a disk 9. Then the CPU 8 retrieves the data base on the disk 9 by using the error code and the data of the group as a key and displays a relevant 'error message' and the recorded content of 'message and countermeasure for operator' when the person who currently operates the device belongs to Group 1, 'message and countermeasure for engineer' when the person belongs to Group 2, or 'message and countermeasure for service man' when the person belongs to Group 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a semiconductor exposure apparatus for printing a circuit pattern on a wafer, which has improved message display contents when an error occurs.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor exposure apparatus or the like used in a semiconductor manufacturing process, when some kind of error occurs, a signal tower or the like is used to notify an operator of the occurrence of the error, and the type of the error or The content of the error was displayed in a predetermined display area on the operation screen (hereinafter referred to as the console screen) regardless of the level.

[0003]

However, the types of error messages of the semiconductor exposure apparatus, etc., can be dealt with by the operator, those that cannot be dealt with without an engineer level (parameter setting error, equipment readjustment, consumable parts, etc.). There are various types, such as those that can only be dealt with by a serviceman of the manufacturer. In order to deal with these various errors, the operator has to look up the action method by looking at the manual from the error code, etc., so it is difficult for the operator to determine the action method, and when the error occurs, the error code etc. There is a problem that it takes time to deal with it because it is necessary to search the manual from. In addition, in semiconductor manufacturing, equipment costs are high, and therefore the device idle time due to error handling and the like has been a problem.

In consideration of the above circumstances, it is an object of the present invention to promptly notify an operator of an appropriate coping method when an error occurs in a semiconductor exposure apparatus or the like, so that a prompt response can be made. To do.

[0005]

In order to achieve this object, a semiconductor exposure apparatus of the present invention comprises a display means and a storage means for storing display data according to the type of operator and the type of error generated in the apparatus. Data processing for reading the display data corresponding to operator data indicating the type of operator currently set and error data indicating the type of error occurring in the apparatus from the storage means and displaying the read data on the display means And means.

Here, in a more preferable aspect, the operator data is stored in the storage means. The apparatus has means for the operator to change the operator data. The data processing means pops up a dedicated window for displaying the display data when an error occurs in the device, and the display data is a message corresponding to the content of the error and the operator data. The window includes an area for displaying the operator data, an area for displaying the error content, an area for displaying the message data, and an area for displaying operation buttons. The data processing means also has a function of displaying a more detailed message corresponding to an operator different from the current operator indicated by the operator data in response to the operator's input, and the operation button is The message includes an operation button for inputting the error, and the message includes a description of the generated error and a coping method. The apparatus has means for switching the language of the displayed error content and message to the language of any country. The apparatus has means for an operator to add or modify the message data. The message includes the contents of a maintenance manual for the device and a service manual for servicing.

[0007]

According to the present invention, the persons who operate the semiconductor exposure apparatus are divided into several groups (operators, engineers, maker service personnel, etc.), and these operators are classified according to their types and possible errors. The display data (error content, coping method, etc.) according to the prepared data is prepared and stored in advance, and when the error occurs, the display data according to the type of the current operator and the type of the generated error is displayed. In addition, since the operator can change the display content by changing the type of the current operator by an operation such as pressing an operation button provided in the display screen, an error occurs when an error occurs. The optimum instruction that the operator can handle is displayed. Therefore, the operator does not need to search the manual based on the error code, and the error handling time is shortened. In addition, considering that the operator is a maintenance person or a service person, by registering only the necessary parts of the maintenance manual or service manual as display data, it is not necessary to search for the manual, There is no need to bring a manual into the clean room,
A decrease in cleanliness in the clean room is prevented.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic configuration diagram of a semiconductor exposure apparatus according to an embodiment of the present invention. In the figure, 1 is an illuminating device for performing exposure, 2 is a reticle (mask) mounted on a reticle stage (not shown) that is movable in X, Y, and θ directions, and 3 is from the illuminating device 1. A projection lens 4 for reducing and projecting the pattern of the reticle 2 by the exposure light, and a projection lens 3
The wafer on which the pattern of the reticle 2 is projected via
Is a θZ stage that holds the wafer 4 and is movable in θ and Z directions, 6 is an XY stage that is equipped with a θZ stage 5 and is movable in X and Y directions, and 7 is a console such as a workstation (operated by an operator) Part), and 8 and 9 are a CPU and a hard disk connected to the console 7. A database is constructed on the hard disk 9, and error codes, error messages, data (text data) of display contents (coping method, etc.), groups of operators, etc. are recorded.

The causes of errors in such a semiconductor exposure apparatus include the following cases.

(1) There are the following cases, for example, due to a simple operation error of the operator. Wafer carrier is not set correctly. a. You have forgotten to set the carrier or the carrier is misplaced. That is, the carrier set switch provided on the carrier set base does not turn on. b. The wafer inside the carrier is popping out. That is, the sensor for checking the pop-up wafer provided on the carrier set table is turned on. c. Wafer is misaligned in carrier. That is, the sensor for checking the wafers placed in different levels on the carrier set table was turned on. The correct reticle is not set correctly. The reticle specified in the exposure parameters is not inside the reticle storage part of the device. That is, the reticle storage portion (library) of the apparatus is composed of a plurality of reticle storage slots, and the IDs of the reticle contained in each slot are stored. The information such as the reticle ID is stored in the memory of the apparatus.
Is specified, but the information on the memory includes the corresponding reticle ID. There is no. b. The chamber door is not closed properly. That is, the door for opening / closing the door of the wafer carrier setting section and the door of the reticle setting section are not closed.

(2) There are, for example, the following cases in which there is an error in the parameter setting for exposure. A value outside the correction range is set for the focus offset (correction parameter). That is, the drive amount (focus measurement value + focus offset) exceeds the drive range in focusing before exposure. As a mark measurement position for TV pre-alignment, a position where no mark actually exists is set. That is, the TV pre-alignment measurement was attempted, but the mark could not be detected.

(3) There are the following cases when there is a problem on the side of the wafer to be exposed. The amount of warp of the wafer is larger than the standard. That is,
Focus and leveling correction are not possible. The resist is attached to the back side of the wafer. That is,
The wafer cannot be adsorbed on the chuck. Also focus,
Leveling correction cannot be done.

(4) The following are examples of cases where a problem occurs in the utility used by the exposure apparatus. The pressure air pressure has dropped. The vacuum air pressure has dropped. The cooling water for the chamber stopped.

(5) The following are examples of the case where a consumable item of the exposure apparatus is deteriorated or malfunctions. The high-pressure mercury lamp for exposure has run out. In the exposure equipment of the excimer, there was no gas for laser.

(6) There are, for example, the following cases when a unit or the like of the exposure apparatus fails. The position detection photo sensor of the wafer transfer hand failed.

In the case of the above (1), the exposure can be performed as it is if the operator correctly re-sets the setting. In the case of (2), in general, the operator cannot solve the problem alone, and it is necessary to contact the process engineer in charge of the parameter setting and reset the parameter correctly by the process engineer. In case (3), the route that determines how to process the wafer in question differs depending on the user and factory. In case (4), you generally must contact the line utility representative to repair the utility in question. In the case of (5), the person in charge of repair and the procedure after repair (test for confirming repair, etc.) differ depending on the user and the repair target. In case of (6), you must request the repair from the service person of the equipment manufacturer.

FIG. 3 shows a record of information such as an error code, an error message, data (text data) of display contents (handling method, etc.), a group of operators, etc. recorded in the database of the hard disk 9. In the figure,
“A group of people who are currently operating the device” is numerical data, for example, 1: operator, 2: engineer,
3: Serviceman is defined. The default value is "1", that is, the operator.

FIG. 2 is a flow chart showing an algorithm from the occurrence of the above-described error in the semiconductor exposure apparatus to the display of a message such as an error display or a coping method. When an error occurs, the CPU 8 sends an error code from the exposure apparatus to the console 7. This error code is made up of a total of 11 digits, for example, divided into four fields. Upon receiving this error code, the console 7 reads the contents of the record of the format shown in FIG. 3 of the database of the disk 9 and obtains the data of the group of people who are currently operating the device.

Next, the database of the disk 9 is searched using the error code and the group data as a key,
If the corresponding "error message" and the group of people who are currently operating the device are 1, "operator message, coping method", 2 "engineer message, coping method", 3 "serviceman Display the contents of the record of "Message, coping method".

A more specific description will be given. In general, the cause of an error and the coping method are not always immediately known. As such an error, for example, when a wafer is loaded onto a chuck in an exposure apparatus, a wafer suction error may occur. In this case, the cause may be as follows.

1) A resist adheres to the back side of the wafer.

2) The vacuum pressure of the utility is low.

3) The vacuum piping system of the device failed.

4) The vacuum sensor of the device has failed.

When this error occurs, the console 7 gives an "error message" based on the error code sent, and usually "because the group of people currently operating the device is the default value of 1" Display the contents of the record of "Message, coping method". This display is performed, for example, in the manner shown in FIG. Note that this message can be additionally modified on the user side by another editor. Therefore, in the contact information and the like indicated by "XXX ..." In FIG. 4, the name of the engineer in charge, the extension number, etc., which are different depending on the factory, are actually written and displayed.

Next, it is assumed that the operator cannot solve the problem and the engineer in charge is called according to the message. The engineer selects "Operator Group" on the screen with a pointing device such as a mouse of the console 7, and inputs "Engineer" from the keyboard. Then enter the password in the "Passwd" field. This input is not displayed on the screen. If the password is correct, the console 7 displays the "group of people currently operating the device"
Is rewritten to 2 and the corresponding "error message" and "engineer message, coping method" records are read from the database in the disk 9 and the screen is displayed again. Then, the screen changes as shown in FIG.

When the serviceman is called, the serviceman performs the same operation as described above, and the "Operator Group" on the screen is displayed.
Select the location with a pointing device such as a mouse, replace "Engineer" with "Service" and enter the password. If the password is correct, the console 7 sets the "group of people currently operating the device" to 3
The relevant "error message" and "serviceman message, coping method" are read from the database of the disk 9 and displayed again. Then, the screen changes to a screen for service personnel as shown in FIG. When the repair is completed, the serviceman finally rewrites the content of "Operator Group" on the screen to "Operator" by the same operation as described above. Then, the apparatus returns to the operator level setting before the error occurred.

FIG. 7 is a diagram for explaining the error display window (hereinafter referred to as an error window) in more detail. The error window is displayed by a pop-up when an error occurs in the device. The error window is composed of a window title 1, an operator group display area 2, an error content display area 3, a message display area 4, scroll bars 5 and 6, and an operation button group 7 (7-1 to 7-8). It The operator group display area 2 is composed of a group display area 2-1 and an input area 2-2 for changing a group. Scroll bars 5, 6 and operation buttons 7-1 to 7-6
Is for operating (moving) the error content display area 3 and the message display area. Button 7-7 is a toggle button, and if you press it once, "User Inform"
“Futher Inform” when pressed again. “User Inform” is a message for the current operator group. It contains error code, brief error description, error description, and corrective action. Is displayed according to the group of operators, and "Futher Inform" is the "User Inform"
Similarly to, the error code, the error description, the error content description, and the coping method are displayed in the detailed message of the group immediately above the current operator. The Quit button 7-8 is pressed when ending the error window. In FIG. 7, the error message is displayed in English as an example, but the language can be switched to any language by setting the setup editor or the like.

FIGS. 8 to 10 are views showing display examples when another error occurs. FIG. 8 shows an example in which an operator tries to perform exposure, sets a wafer carrier containing a wafer to be exposed in the apparatus, starts the apparatus, and an error occurs that the carrier is not set correctly. Indicates. In FIG. 8, the message is for the operator. The operator, according to the message, reloads the carrier and restarts the device. However, if the placement is correct and the cause of the error is another, the same error will be displayed again. Since a general device operator is not an engineer, it is generally difficult to pursue further causes. In this case, immediately
It is most efficient to contact the engineer in charge. Therefore, the operator will contact the engineer in charge according to the display.

FIG. 9 shows a display example for the engineer in that case. The called engineer checks the deformation of the carrier according to the message. If an abnormality is found here, exposure is started by taking measures such as carrier exchange. However, if there is a hardware failure of the sensor of the device, a serviceman must be called.

FIG. 10 shows a display example for the service person in such a case. In FIG. 10, a part of the manual for the service person is displayed. It should be noted that the manual displayed at this time is, of the entire apparatus, only a part necessary for repairing a portion (unit) in which trouble is currently occurring, among the huge amount of manual.

[0032]

As described above, according to the present invention,
When an error occurs, it is possible to promptly notify the operator of an appropriate coping method, and it is possible to promptly deal with the error. Also, operators, engineers,
The service technician or the like can know how to deal with the error corresponding to each level without opening the manual, so that the error handling time can be shortened. Further, it is not necessary to bring a manual into the clean room, and it is possible to prevent deterioration of cleanliness in the clean room.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a semiconductor exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing an error occurring in the apparatus shown in FIG.
It is a flowchart which shows the process until an error message such as an error or a coping method is displayed on the console screen.

FIG. 3 is a diagram showing a recording format in a hard disk of contents displayed when an error occurs in the apparatus of FIG.

FIG. 4 is a diagram showing a first example of an error window displayed when an error occurs in the device of FIG.

FIG. 5 is a diagram showing a second example of an error window displayed when an error occurs in the device of FIG.

FIG. 6 is a diagram showing a third example of an error window displayed when an error occurs in the device of FIG.

FIG. 7 is a diagram showing a fourth example of an error window for explaining the error display window in more detail in the device of FIG.

8 is a diagram showing a fifth example of an error window displayed when an error occurs in the device of FIG.

9 is a diagram showing a sixth example of an error window displayed when an error occurs in the apparatus of FIG.

10 is a diagram showing a seventh example of an error window displayed when an error occurs in the device of FIG.

[Explanation of symbols]

1: Illuminator, 2: Reticle (mask), 3: Projection lens, 4: Wafer, 5: XY stage, 7: Console,
8: CPU, 9: hard disk.

Claims (8)

[Claims] 1. A display means, a storage means for storing display data according to an operator type and an error type occurring in the apparatus, and an operator data and an apparatus indicating the currently set operator type. A semiconductor exposure apparatus, comprising: data processing means for reading the display data corresponding to error data indicating a type of an error that has occurred from the storage means and displaying the display data on the display means. 2. The semiconductor exposure apparatus according to claim 1, wherein the operator data is stored in the storage means. 3. The semiconductor exposure apparatus according to claim 1, further comprising means for an operator to change the operator data. 4. The data processing means sets up a dedicated window for displaying the display data by pop-up when an error occurs in the device, and the display data includes the content of the error that has occurred and the operator. The window includes data of a message corresponding to data, and the window has an area for displaying the operator data, an area for displaying the error content, an area for displaying the message data, and an area for displaying operation buttons. The semiconductor exposure apparatus according to claim 1, wherein: 5. The data processing means also has a function of displaying a more detailed message corresponding to an operator of a type different from the current operator indicated by the operator data, in response to an operator's input. 5. The semiconductor exposure apparatus according to claim 1, wherein the operation button includes an operation button for making an input therefor, and the message includes a description and a coping method for the error that has occurred. 6. The semiconductor exposure apparatus according to claim 1, further comprising means for switching the language of the displayed error content and message to a language of an arbitrary country. 7. The semiconductor exposure apparatus according to claim 1, further comprising means for an operator to add or correct the message data. 8. The semiconductor exposure apparatus according to claim 1, wherein the message includes contents of an apparatus maintenance manual and a service manual for service.