JPH07330899A - Polyetheresteramide and resin composition - Google Patents

Abstract

PURPOSE:To obtain a polyetheresteramide useful as a molding material and having excellent heat resistance, permanent antistaticity, and mechanical characteristics, and further to obtain a thermoplastic resin composition containing the same. CONSTITUTION:The polyetheresteramide is derivatized from a polyamide having carboxylic groups at both the molecular terminals and a number-average mol.wt. of 500-5,000 and a bisphenol compound-ethylene oxide adduct having a number- average mol.wt. of 1,600-3,000; and the resin composition comprises the polyetheresteramide and a thermoplastic resin. The polyetheresteramide has excellent heat resistance and permanent antistaticity. The resin composition comprising the polyetheresteramide and the thermoplastic resin such as a styrenic resin exhibits excellent heat resistance, permanent antistaticity and mechanical characteristics as a molding material.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyether ester amide having excellent heat resistance and permanent antistatic property and excellent compatibility with a thermoplastic resin, and a resin composition using the polyether ester amide. is there.

[0002]

2. Description of the Related Art Conventionally, polyether ester amides have been known to impart excellent antistatic properties as an antistatic agent for some thermoplastic resins. (1) Polyoxyalkylene glycol is used as the polyether component. For example, heat resistance is low because polyethylene glycol is used,
There was a problem in molding at high temperature. (2) Due to poor compatibility between the polyether ester amide and other thermoplastic resin, delamination may occur or impact strength may be poor, so that a resin composition having desirable mechanical properties cannot be obtained. There was a problem. In order to solve the problem of (2), a method of using a modified vinyl polymer having a carboxyl group in a polyether ester amide as a compatibilizing agent (Japanese Patent Publication No. 4-72855), and a vinyl monomer having a hydroxyl group Of using a rubber-modified styrenic thermoplastic resin having a copolymer as a copolymerization component as a compatibilizing agent (JP-A-2-7)
No. 0739) is known. Although the compatibility problem is improved by these methods, it is necessary to add a large amount of a compatibilizing agent, and there is a drawback that the antistatic property is deteriorated as compared with the case where only two other thermoplastic resins are kneaded. It was Further, by using a polyoxyalkylene glycol, for example, polyethylene glycol and an alkylene oxide adduct of bisphenol having a relatively low molecular weight in combination as a polyether component, a transparent polyether ester amide and a resin composition having excellent permanent charging property can be obtained. A method for obtaining the same (Japanese Patent Laid-Open No. 14417/1989) is known. However, although the compatibility problem has been improved by this method, the use of alkylene oxide adducts of relatively low molecular weight bisphenols and the combined use of polyoxyalkylene glycols such as polyethylene glycol The problem of heat resistance of (1) has not been solved yet.

[0003]

At present, excellent heat resistance,
And polystyrene, polymethylmethacrylate, styrene / acrylonitrile copolymer (SAN resin), acrylonitrile / butadiene / styrene copolymer (ABS resin), methyl methacrylate / butadiene / styrene copolymer (MBS resin) and styrene / methacryl There is a demand for a polyetheresteramide having a good compatibility with a thermoplastic resin such as a methyl acid / acrylonitrile copolymer.

[0004]

Means for Solving the Problems As a result of intensive studies to solve the above problems, the present inventors have found that a polyether derived from an ethylene oxide adduct of a high molecular weight bisphenol as a polyether component with a specific molecular weight polyamide. Ester amide is superior in heat resistance and antistatic property to conventional polyether ester amide; a resin composition comprising this polyether ester amide and a thermoplastic resin is superior in heat resistance, permanent antistatic property and mechanical strength. They have found that they are excellent and have reached the present invention.

That is, according to the present invention, a polyamide (a1) having a carboxyl group at both ends and a number average molecular weight of 500 to 5,000, and an ethylene oxide adduct (a2) of a bisphenol having a number average molecular weight of 1,600 to 3,000. And a reduced viscosity of 0.5 to 4.0 (0.5 wt%
m-cresol solution, 25 ° C.) polyether ester amide (A); and (A) 5 to 40 parts by weight,
A resin composition comprising 95 to 60 parts by weight of a thermoplastic resin (B); and a halide (D) of the (A) and an alkali metal and / or an alkaline earth metal, and (A) and (D) and necessary Thus, the resin composition contains 0.01 to 5% by weight of (D) with respect to the total weight of (B) and / or (C).

As the polyether ester amide (A) of the present invention, a polyamide (a1) having carboxyl groups at both ends is (1) a lactam ring-opening polymer, (2)
It is a polycondensate of aminocarboxylic acid or (3) a polycondensate of dicarboxylic acid and diamine, and examples of the lactam of (1) include caprolactam, enanthlactam, laurolactam, and undecanolactam. As the aminocarboxylic acid of (2), ω-aminocaproic acid, ω-
Examples thereof include aminoenanthic acid, ω-aminocaprylic acid, ω-aminopergonic acid, ω-aminocapric acid, 11-aminoundecanoic acid and 12-aminododecanoic acid.
Examples of the dicarboxylic acid (3) include adipic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid and isophthalic acid, and examples of the diamine include hexamethylenediamine, heptamethylenediamine, octamethylenediamine and decamethylene. Diamine and the like can be mentioned. Examples of the amide-forming monomer are 2
You may use together 1 or more types. Among these, preferred are caprolactam, 12-aminododecanoic acid and adipic acid-hexamethylenediamine, and particularly preferred is caprolactam.

The component (a1) is obtained by using a dicarboxylic acid component having 4 to 20 carbon atoms as a molecular weight modifier and subjecting the above amide-forming monomer to ring-opening polymerization or polycondensation in the usual manner. . As the dicarboxylic acid having 4 to 20 carbon atoms, aliphatic dicarboxylic acids such as succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid and dodecanedioic acid; terephthalic acid, isophthalic acid, Aromatic dicarboxylic acids such as phthalic acid and naphthalenedicarboxylic acid; 1,4-
Cyclohexanedicarboxylic acid, dicyclohexyl-4,
Aliphatic dicarboxylic acids such as 4-dicarboxylic acid; alkali metal salts of 3-sulfoisophthalic acid such as sodium 3-sulfoisophthalate and potassium 3-sulfoisophthalate. Among these, preferred are aliphatic dicarboxylic acids, aromatic dicarboxylic acids and alkali metal salts of 3-sulfoisophthalic acid, and particularly preferred are adipic acid, sebacic acid, terephthalic acid, isophthalic acid and sodium 3-sulfoisophthalate. is there.

The number average molecular weight of the above (a1) is usually 50.
It is 0 to 5,000, preferably 500 to 3,000. When the number average molecular weight is less than 500, the heat resistance of the polyether ester amide itself is lowered, and when it exceeds 5,000, the reactivity is lowered, so that a large amount of time is required for producing the polyether ester amide.

The bisphenols of the ethylene oxide adduct (a2) of bisphenols include bisphenol A (4,4'-dihydroxydiphenyl-2,2-propane), bisphenol F (4,4'-dihydroxydiphenylmethane) and bisphenol S. (4,4′-dihydroxydiphenyl sulfone) and 4,4′-dihydroxydiphenyl-2,2-butane are listed, and among these, bisphenol A is preferable. (A2) is obtained by adding ethylene oxide to these bisphenols by a conventional method. Further, other alkylene oxides (propylene oxide, 1,2-butylene oxide, 1,4-butylene oxide, etc.) can be used together with ethylene oxide, but the amount of the other alkylene oxide is usually 10 based on the amount of ethylene oxide.
It is less than or equal to wt.

The number average molecular weight of the above (a2) is usually 1,
It is 600 to 3,000, and it is particularly preferable to use one having an ethylene oxide addition mole number of 32 to 60.
If the number average molecular weight is less than 1,600, the antistatic property becomes insufficient, and if it exceeds 3,000, the reactivity is lowered, so that a large amount of time is required for producing the polyetheresteramide.

(A2) is used in the range of 20 to 80% by weight based on the total weight of (a1) and (a2). If the amount of (a2) is less than 20% by weight, the antistatic property of the polyetheresteramide (A) will be poor, and if it exceeds 80% by weight, the heat resistance of (A) will be reduced, such being undesirable.

Examples of the method for producing the polyetheresteramide (A) include, but are not limited to, the following production methods or production methods. Production method: A method of reacting an amide-forming monomer and a dicarboxylic acid to form (a1), adding (a2) thereto, and performing a polymerization reaction at high temperature and reduced pressure. Production method: An amide-forming monomer and a dicarboxylic acid and (a2) are simultaneously charged into a reaction vessel, and pressure reaction is performed at high temperature in the presence or absence of water to produce (a1) as an intermediate, and then decompression. A method of performing a polymerization reaction of (a1) and (a2) below.

Known esterification catalysts are usually used in the above polymerization reaction. Examples of the catalyst include antimony catalysts such as antimony trioxide, tin catalysts such as monobutyltin oxide, titanium catalysts such as tetrabutyl titanate, zirconium catalysts such as tetrabutyl zirconate, and acetic acid metal salts such as zinc acetate. A system catalyst etc. are mentioned. The amounts of catalyst used are (a1) and (a
It is usually 0.1 to 5% by weight based on the total weight of 2).

The reduced viscosity of (A) is usually 0.5 to 4.0.
(0.5 wt% m-cresol solution, 25 ° C.), preferably 0.6 to 3.0. If the reduced viscosity is less than 0.5, the heat resistance is poor, and if it exceeds 4.0, the moldability decreases.

In the resin composition of the present invention, the thermoplastic resin (B) has at least one selected from the group consisting of styrenes, (meth) acrylic acid esters, (meth) acrylonitrile and butadiene as a structural unit ( Copolymer (polystyrene, polymethylmethacrylate, styrene / acrylonitrile copolymer, styrene /
Methyl methacrylate copolymer, acrylonitrile / butadiene / styrene copolymer, methyl methacrylate / butadiene / styrene copolymer and styrene / methyl methacrylate / acrylonitrile copolymer); polyolefin (polypropylene, polyethylene etc.); polycarbonate resin (Condensation product of bisphenol A and phosgene,
Condensation products by transesterification of bisphenol A and carbonic acid ester); Polyester (polyethylene terephthalate, polybutylene terephthalate, etc.); Polyamide (nylon 6, nylon 66, nylon 6/12)
Etc.); polyphenylene ethers; thermoplastic polyurethanes; and mixtures of two or more thereof. Of these, preferred are polystyrene, polymethylmethacrylate, styrene / acrylonitrile copolymer,
Styrene / methyl methacrylate copolymer, acrylonitrile / butadiene / styrene copolymer, methyl methacrylate / butadiene / styrene copolymer and styrene /
It is a methyl methacrylate / acrylonitrile copolymer.

When (B) is a (co) polymer having as a constituent unit at least one selected from the group consisting of styrenes, (meth) acrylic acid esters, (meth) acrylonitrile and butadiene, From the viewpoint of further improving the compatibility with the polyether ester amide and the heat resistance, it is preferably used in combination with the polycarbonate resin. The weight ratio of the (co) polymer having a structural unit of at least one selected from the group consisting of styrenes, (meth) acrylic acid esters, (meth) acrylonitrile and butadiene to the polycarbonate resin is usually (10 to 90): (90-10), preferably (30-
70): (70 to 30).

In the resin composition of the present invention, the weight ratio of (A) and (B) is usually (5-40) :( 95-6).
0), preferably (10-35) :( 90-65). If the ratio of (A) is less than 5, the antistatic effect becomes insufficient, and if it exceeds 40, the physical properties of the resin may be impaired.

In the resin composition of the present invention, for the purpose of further improving the compatibility between (A) and (B), a carboxyl group,
At least one selected from the group consisting of an epoxy group, an amino group, a hydroxyl group and a polyalkylene oxide group.
A modified vinyl polymer (C) having different kinds of functional groups may be contained. Examples of the (C) include, for example, JP-A-3-25
Examples thereof include the polymers described in Japanese Patent No. 8850. Further, for example, sulfonic acid (salt) described in Japanese Patent Application No. 5-85616.
A modified vinyl polymer having a group, a block polymer having a polyolefin moiety and an aromatic vinyl polymer moiety, and the like can also be used.

The amount of (C) used is usually 0.1 to 15% by weight, preferably 1 to 15% by weight based on the total weight of (A) and (B).
It is 10% by weight. If the amount of (C) is less than 0.1% by weight, the sufficient effect of improving compatibility is not sufficiently exhibited, and if it exceeds 15% by weight, the physical properties of the resin deteriorate.

For the purpose of further improving the antistatic effect, a metal salt (D) containing a halide of an alkali metal and / or an alkaline earth metal may be contained. Examples of the (D) include lithium chloride, sodium chloride, potassium chloride, magnesium chloride, calcium chloride, sodium bromide, potassium bromide, magnesium bromide and the like. Particularly preferred of these are sodium chloride and potassium chloride. The amount of (D) used is usually 0.01 to 5% by weight, preferably 0.05 to 3% by weight, based on the total weight of (A), (B) and (C). If it is less than 0.01% by weight, the effect is not exhibited and
If it exceeds 5% by weight, it deposits on the resin surface and impairs the appearance of the resin.

The method for adding (D) is not particularly limited, but in order to effectively disperse it in the composition, it is preferable to disperse it in the polyetheresteramide (A) in advance. When (D) is dispersed in (A), it is particularly preferable to add (D) in advance during the polymerization of (A) and disperse it.

The resin composition of the present invention may contain a nonionic, anionic, cationic or amphoteric surfactant to further improve the antistatic property. Of these, preferred are anionic surfactants, and particularly preferred are sulfonates such as alkylbenzene sulfonate, alkyl sulfonate, and paraffin sulfonate.

The resin composition of the present invention can be obtained by kneading the above components using various known mixers. Mixers include, for example, extruders, Brabenders, kneaders and Banbury mixers.

The order of addition of the components during kneading is not particularly limited. For example, a method of blending and kneading (A) to (C); a small amount of (B) and (A) and (C) are blended and kneaded. And then kneading the remaining (B);
A method may be mentioned in which (A) and (C) are blended and kneaded in advance, and then (B) is kneaded. One of these methods is called masterbatch or master pellet. The method is particularly preferable because it has good dispersibility and is excellent in permanent antistatic property and mechanical strength.

The method for obtaining the composition of the present invention via a masterbatch is usually (A) 50 to 90 parts by weight and (B) 50 to 10 parts by weight, preferably (A) 50 to 80 parts by weight.
Parts by weight, (B) 30 to 10 parts by weight and (C) 2 to 30
An example is a method in which parts by weight are blended and kneaded to form a masterbatch, and this masterbatch and (B) are further blended and kneaded to obtain the composition of the present invention. In this method, in particular, a small amount of (A) can be uniformly dispersed in a large amount of (B), so that the resin composition of the present invention is preferably prepared via a masterbatch.

Further, other resin additives may be optionally added to the resin composition of the present invention according to various uses within a range that does not impair the characteristics of the composition. Examples of the additives include pigments, dyes, fillers, nucleating agents, glass fibers, lubricants, plasticizers, release agents, antioxidants, flame retardants, and ultraviolet absorbers.

[0027]

EXAMPLES The present invention will be further described below with reference to examples, but the present invention is not limited thereto. In the examples, "part" means part by weight and "%" means% by weight. The finally obtained resin composition was molded by an injection molding method, and then various physical properties were measured by the following test methods.

Izod impact strength: ASTM D256-56A Tensile strength: ASTM D638 Surface specific resistance value: Using a square test piece having a thickness of 2 mm, it was measured under the following conditions with a super insulation meter (manufactured by Advantest). (A) After molding, the square test piece is kept at 20 ° C. and the humidity is 65%
Leave for 24 hours in RH atmosphere. (B) After molding, the corner test piece was washed with an aqueous solution of a detergent (Mama Lemon; manufactured by Lion Corp.), then thoroughly washed with ion-exchanged water, and then the surface water was removed by drying to 20
Leave for 24 hours in an atmosphere of 65 ° C and 65% RH. Compatibility: Evaluated by bending the molded product and observing its fracture surface. Evaluation Criteria ⊚: Good ∘: Some delamination is observed ×: Many delaminations are observed, poor compatibility

Example 1 A 3 L stainless steel autoclave was charged with 105 parts of ε-caprolactam, 17.1 parts of adipic acid, 0.3 parts of "Irganox 1010" (antioxidant, manufactured by Ciba-Gaiki) and 6 parts of water, After substituting with nitrogen, the mixture was heated and stirred at 220 ° C. under pressure and closed for 4 hours to obtain 117 parts of a polyamide oligomer having a carboxyl group at both ends and a number average molecular weight of 1,000 and an acid value of 110. Next, the number average molecular weight is 2,000.
225 parts of ethylene oxide adduct of bisphenol A and 0.5 part of zirconyl acetate were added, and 245 ° C., 1 m
Polymerization was performed for 5 hours under a reduced pressure of mHg or less to obtain a viscous polymer. The polymer was taken out in a strand form on a belt and pelletized to obtain the polyetheresteramide of the present invention. This product has a reduced viscosity of 2.15.
(0.5 wt% m-cresol solution, 25 ° C.),
The copolymer composition by NMR analysis was as follows. ε-caprolactam residue 28.5% by weight bisphenol A ethylene oxide adduct residue 67.0% by weight adipic acid residue 4.5% by weight Bottom, measured by TG-DTA. further,
With each test piece adjusted by injection molding, Izod impact strength,
The tensile strength and the surface specific resistance were measured. Table 1 shows the measurement results
Shown in. This polyether ester amide is referred to below as [A-
1] is abbreviated.

Example 2 A 3 L stainless steel autoclave was charged with 105 parts of ε-caprolactam, 15.4 parts of adipic acid, 0.3 parts of "Irganox 1010" and 7 parts of water, and after nitrogen substitution, pressurized at 220 ° C. The mixture was heated and stirred for 4 hours in a sealed state to obtain 117 parts of a polyamide oligomer having a carboxyl group at both ends and a number average molecular weight of 1,100 and an acid value of 100. Next, 225 parts of a bisphenol A ethylene oxide adduct having a number average molecular weight of 2,000 and 0.5 part of zirconyl acetate were added, and the mixture was polymerized at 245 ° C. under a reduced pressure of 1 mmHg or less for 5 hours to obtain a viscous polymer. . Then, the same operation as in Example 1 was performed to obtain the polyetheresteramide of the present invention. The copolymer composition by NMR analysis was as follows. Residue of ε-caprolactam 28.0 wt% Residue of bisphenol A ethylene oxide adduct 67.6 wt% Residue of adipic acid 4.4 wt% Physical properties of this polyetheresteramide in the same manner as in Example 1 Was measured. The measurement results are shown in Table 1. This polyetheresteramide is abbreviated as [A-2] below.

Example 3 A composition of polyether ester amide and potassium chloride was performed in the same manner as in Example 2 except that 2 parts of potassium chloride was added together when the bisphenol A ethylene oxide adduct and zirconyl acetate were added. I got a thing. The copolymer composition by NMR analysis was as follows. ε-caprolactam residue 28.0% by weight bisphenol A ethylene oxide adduct residue 67.6% by weight adipic acid residue 4.4% by weight In addition, polyether esteramide and potassium chloride The composition was as follows. Polyetheresteramide 99.4% by weight Potassium chloride 0.6% by weight By the same method as in Example 1, the physical properties of this polyetheresteramide were measured. The measurement results are shown in Table 1. This polyetheresteramide is abbreviated as [A-3] below.

Comparative Example 1 The same operation as in Example 1 was carried out except that 175 parts of polyoxyethylene glycol having a molecular weight of 1,500 was used in place of the bisphenol A ethylene oxide adduct in Example 1, and the comparative polyether ester was used. The amide was obtained.
The physical properties of this polyether ester amide were measured in the same manner as in Example 1. The measurement results are shown in Table 1. This polyetheresteramide is abbreviated as [A-4] below.

Comparative Example 2 The same operation as in Comparative Example 1 was carried out except that 5 parts of potassium chloride was added together when polyoxyethylene glycol and zirconyl acetate were added, and a polyether ester amide and potassium chloride for comparison were added. A composition of The composition of the polyether ester amide and potassium chloride by fluorescent X-ray analysis was as follows. Polyetheresteramide 98.2% by weight Potassium chloride 1.8% by weight In the same manner as in Example 1, the physical properties of this polyetheresteramide were measured. The measurement results are shown in Table 1. This polyetheresteramide is abbreviated as [A-5] below.

[0034]

[Table 1]

[Production of Modified Vinyl Polymer] Production Example 1 Monomer mixture 60 consisting of 72% by weight of methyl methacrylate, 24% by weight of styrene and 4% by weight of 2-hydroxyethyl methacrylate in the presence of 40 parts of polybutadiene latex. Part was emulsion polymerized. The obtained graft copolymer latex is coagulated with sulfuric acid, neutralized with caustic soda, washed,
It was filtered and dried to prepare a modified vinyl polymer [C-1].

Production Example 2 A monomer mixture consisting of 67 parts by weight of styrene, 23 parts by weight of acrylonitrile and 10 parts by weight of maleic anhydride was added to DMF.
After the solution polymerization in the solution, the unreacted monomer and the solvent were distilled off to prepare a modified vinyl polymer [C-2].

Production Example 3 (A) to (C) in the proportions shown in Table 2 were blended in a Henschel mixer for 3 minutes and then in a twin-screw extruder with a vent at 240 ° C., 30 rpm, and a residence time of 5 minutes. And melt-kneaded to obtain master batches (M-1) to (M-6).

[0038]

[Table 2] [B-1]: ABS resin [JS manufactured by Japan Synthetic Rubber Co., Ltd.
R-ABS 10 "]

Examples 4 to 9 Masterbatches (M-1) to (M-6) obtained in Production Example 3
And the thermoplastic resin (B) shown in Table 3 were blended and kneaded under the same conditions as in Production Example 3 to obtain a resin composition of the present invention.
(A) in the composition of the present invention via the masterbatch
~ (C) The final ratio of each component is shown in Table 3.

[0040]

[Table 3] [B-1]: ABS resin [JS manufactured by Japan Synthetic Rubber Co., Ltd.
R-ABS 10 "]

Examples 10 to 20 (A) to (D) shown in Table 4 were blended and kneaded under the same conditions as in Production Example 3 to obtain the composition of the present invention.

[0042]

[Table 4] [B-1]: ABS resin [JS manufactured by Japan Synthetic Rubber Co., Ltd.
R-ABS 10 "] [D-1]: Potassium chloride (added during production of polyetheresteramide) [D-2]: Sodium chloride (added during kneading with a twin-screw extruder) * 1): Metal salt (D) The ratio is the ratio to the total weight of (A) to (C)

Comparative Examples 3 to 8 (A) to (D) shown in Table 5 were blended and kneaded under the same conditions as in Production Example 3 to obtain comparative compositions.

[0044]

[Table 5] [B-1]: ABS resin [JS manufactured by Japan Synthetic Rubber Co., Ltd.
R-ABS 10 "] [D-1]: Potassium chloride (added during the production of polyetheresteramide) * 1): The ratio of the metal salt (D) to the total weight of (A) to (C).

Then, using an injection molding machine, the cylinder temperature is 2
A test piece was molded at 20 ° C. and a mold temperature of 60 ° C., and each physical property was measured. The results are shown in Tables 6 and 7.

[0046]

[Table 6] * 2): Measured by TG-DTA under nitrogen

[0047]

[Table 7] * 2): Measured by TG-DTA under nitrogen

Production Example 4 (A) to (C) in the proportions shown in Table 8 were blended in a Henschel mixer for 3 minutes, and then in a vented twin-screw extruder at 280 ° C., 100 rpm, and a residence time of 5 minutes. And melt-kneaded to obtain master batches (M-7) and (M-8).

[0049]

[Table 8] [B-2]: PC / ABS ["Multilon T-3000" manufactured by Teijin Chemicals Ltd.]

Examples 21 and 22 Masterbatches (M-7) and (M-8), blended with the thermoplastic resin (B) shown in Table 7 under the same conditions as in Production Example 4,
The composition of the present invention was obtained by kneading. Table 9 shows the final proportions of the components (A) to (D) in the composition of the present invention via the masterbatch.

[0051]

[Table 9] [B-2]: PC / ABS ["Multilon T-3000" manufactured by Teijin Kasei Co., Ltd.] [D-1]: Potassium chloride (added during production of polyetheresteramide) * 1): Metal salt (D) The ratio is the ratio to the total weight of (A) to (C)

Examples 23 to 25 and Comparative Examples 9 to 11 (A) to (E) shown in Table 10 were blended and kneaded under the same conditions as in Production Example 4 to obtain the composition of the present invention and the comparative composition. It was

[0053]

[Table 10] [B-2]: PC / ABS ["Multilon T-3000" manufactured by Teijin Kasei Co., Ltd.] [D-1]: Potassium chloride (added during production of polyetheresteramide) [D-2]: Sodium chloride (two Axial extruder added during kneading) [E-1]: anionic surfactant ["Chemistat 3033" manufactured by Sanyo Kasei Co., Ltd.] * 1): The ratio of the metal salt (D) is (A) to (C). Of the total weight

Then, using an injection molding machine, the cylinder temperature is 2
Each test piece was molded at 70 ° C. and a mold temperature of 70 ° C., and each physical property was measured. The results are shown in Table 11.

[0055]

[Table 11] * 3): Measured by TG-DTA under air

[0056]

As is apparent from the above, the polyetheresteramide of the present invention is superior in heat resistance and antistatic property to the conventional polyetheresteramide. A resin composition comprising this polyether ester amide and a thermoplastic resin is excellent in heat resistance, permanent antistatic property and mechanical strength. Because of the above effects, the resin composition containing the polyether ester amide of the present invention is extremely useful as a molding material for housing products for home electric appliances and office automation equipment, various plastic containers, automobile parts and the like.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshitsugu Takai 1-11, Hitotsubashi-honcho, Higashiyama-ku, Kyoto City Sanyo Chemical Industry Co., Ltd.

Claims (6)

[Claims] 1. A derivative derived from a polyamide (a1) having a carboxyl group at both ends and having a number average molecular weight of 500 to 5,000 and an ethylene oxide adduct (a2) of a bisphenol having a number average molecular weight of 1,600 to 3,000, Polyether ester amide (A) having a reduced viscosity of 0.5 to 4.0 (0.5 wt% m-cresol solution, 25 ° C.). 2. Derived from a polyamide (a1) having a carboxyl group at both ends and having a number average molecular weight of 500 to 5,000 and an ethylene oxide adduct (a2) of bisphenol having a number average molecular weight of 1,600 to 3,000, Polyether ester amide (A) having a reduced viscosity of 0.5 to 4.0 (0.5 wt% m-cresol solution, 25 ° C.)
A resin composition comprising 5 to 40 parts by weight and 95 to 60 parts by weight of the thermoplastic resin (B). 3. The (B) is a (co) polymer having as a constituent unit at least one selected from the group consisting of styrenes, (meth) acrylic acid esters, (meth) acrylonitrile and butadiene. The resin composition described. 4. (B) is 10 to 90 parts by weight of a (co) polymer having as a constituent unit at least one selected from the group consisting of styrenes, (meth) acrylic acid esters, (meth) acrylonitrile and butadiene. The resin composition according to claim 2, which is a combination of 90 to 10 parts by weight of a polycarbonate resin. 5. A modified vinyl polymer (C) having at least one functional group selected from the group consisting of a carboxyl group, an epoxy group, an amino group, a hydroxyl group and a polyalkylene oxide group, and (A) The resin composition according to any one of claims 2 to 4, which is contained in an amount of 0.1 to 15% by weight based on the total weight of (B). 6. A composition comprising (A) and a halide (D) of an alkali metal and / or an alkaline earth metal,
And (D) and optionally (B) and / or (C)
A resin composition containing 0.01 to 5% by weight of (D) with respect to the total weight of the above.