JPH07328932A - Abrasive tape and manufacture thereof - Google Patents

Abrasive tape and manufacture thereof

Info

Publication number
JPH07328932A
JPH07328932A JP14548094A JP14548094A JPH07328932A JP H07328932 A JPH07328932 A JP H07328932A JP 14548094 A JP14548094 A JP 14548094A JP 14548094 A JP14548094 A JP 14548094A JP H07328932 A JPH07328932 A JP H07328932A
Authority
JP
Japan
Prior art keywords
polishing
layer
abrasive
tape
polishing layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14548094A
Other languages
Japanese (ja)
Inventor
Takaki Miyaji
貴樹 宮地
Kazuhito Fujii
和仁 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP14548094A priority Critical patent/JPH07328932A/en
Publication of JPH07328932A publication Critical patent/JPH07328932A/en
Pending legal-status Critical Current

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  • Polishing Bodies And Polishing Tools (AREA)

Abstract

PURPOSE:To provide an abrasive tape preventing the fine abrasive chips produced during the polishing work from causing trash abrasion between the abrasive tape and a polished body, capable of applying high-quality polishing with high efficiency, and easy to manufacture. CONSTITUTION:This abrasive tape has an abrasive layer made of a resin layer dispersed with abrasive grains in a binder resin. The abrasive layer is constituted of the wholly solid first abrasive layer and the discontinuous second abrasive layer formed on the first abrasive layer, and a coating agent dispersed with abrasive grains in the binder resin is applied to form the wholly solid first abrasive layer and the discontinuous second abrasive layer respectively.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、主としてフロッピーデ
ィスク、ハードディスク、磁気テープ等の磁気メディア
の仕上げ研磨や、磁気ヘッド、金属ロール、樹脂ロール
等のクリーニングに使用する研磨テープ及びその製造方
法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing tape mainly used for finishing polishing magnetic media such as floppy disks, hard disks, magnetic tapes, etc., and cleaning magnetic heads, metal rolls, resin rolls and the like, and a method for producing the same.

【0002】[0002]

【従来の技術】精密電子部品や精密機械部品等に使用さ
れる磁気ヘッド、金属部品、磁気メディア等の表面は、
ミクロンあるいはサブミクロンオーダー以下の精密表面
に仕上げられることが必要とされている。
2. Description of the Related Art Surfaces of magnetic heads, metal parts, magnetic media, etc. used for precision electronic parts and precision machine parts are
It is required to be finished to a precision surface of micron or submicron order or less.

【0003】これらの精密表面仕上げを行なうのに使用
される研磨テープや、精密表面仕上げされている部品の
表面のゴミや異物等の除去を行なうためのクリーニング
テープとして、合成紙やプラスチックフィルム等の可撓
性フィルムによる研磨テープ用基材と、バインダー用樹
脂に砥粒を分散させた樹脂層からなる研磨層とによる研
磨テープが利用されている。
As a polishing tape used for performing these precision surface finishes, or as a cleaning tape for removing dusts and foreign substances on the surfaces of the components which are precision surface finishes, synthetic paper, plastic film, etc. A polishing tape including a base material for a polishing tape formed of a flexible film and a polishing layer formed of a resin layer in which abrasive grains are dispersed in a binder resin is used.

【0004】従来の研磨テープは、プラスチックフィル
ムや合成紙等の可撓性フィルムによる研磨テープ用基材
に対して、バインダー用樹脂に砥粒を分散させた厚さ1
0〜20μの研磨層を全面ベタに形成したものであった
ため、研磨作業中に発生した研磨屑が研磨テープの表面
や被研磨体の表面に付着し、研磨屑が研磨テープと被研
磨体との間で夾雑摩耗を起こすことから、研磨仕上げ面
に筋状の傷が発生することが多かった。
A conventional polishing tape has a thickness 1 obtained by dispersing abrasive grains in a binder resin with respect to a polishing tape substrate made of a flexible film such as a plastic film or synthetic paper.
Since the polishing layer having a thickness of 0 to 20 μ was formed on the entire surface, polishing debris generated during the polishing operation adheres to the surface of the polishing tape and the surface of the object to be polished, and the polishing debris forms between the polishing tape and the object to be polished. Since scratches were caused between them, streak-like scratches were often generated on the polished surface.

【0005】これを防止するために、研磨層中に帯電防
止剤を含有させたり、あるいは研磨作業中に研磨屑を減
圧で吸引して工程外に排除する等の対策がなされたが、
いずれも十分な効果を得ることができなく、また工程管
理も複雑である等の欠点があった。
To prevent this, measures have been taken such as containing an antistatic agent in the polishing layer or sucking polishing debris under reduced pressure during the polishing work to remove it outside the process.
However, none of them had sufficient effects, and the process management was complicated.

【0006】このため、研磨作業中に発生した研磨屑を
捕集し得るように、表面に凹陥部を有する研磨層の研磨
テープが提案された(特開昭62−255069号公
報、特開平2−83172号公報)。
Therefore, a polishing tape having a polishing layer having a concave portion on the surface thereof has been proposed so as to collect the polishing dust generated during the polishing operation (Japanese Patent Laid-Open No. 255069/1987). -83172 publication).

【0007】[0007]

【発明が解決しようとする課題】ところで、前述の特開
昭62−255069号公報に説明されている研磨テー
プは、無機質成分を多量に含有しているコーティング剤
による塗工層を形成する際の塗工層の乾燥工程におい
て、該塗工層中に発生する”対流セル現象”によるベナ
ードセルの凹凸を研磨層に現出させるものであるため、
形成される凹陥部の形状が平面略六角形のものに限定さ
れ、しかも均等のパターンの凹陥部を形成することが困
難であり、設計通りのパターンの凹陥部を研磨層に形成
することができない。
By the way, the polishing tape described in Japanese Patent Laid-Open No. 62-255069 described above is used for forming a coating layer with a coating agent containing a large amount of an inorganic component. In the coating layer drying step, the unevenness of the Benard cells due to the "convection cell phenomenon" occurring in the coating layer is caused to appear in the polishing layer,
The shape of the recesses to be formed is limited to that of a substantially hexagonal plane, and it is difficult to form recesses with a uniform pattern, and it is not possible to form recesses with a pattern as designed in the polishing layer. .

【0008】また、特開平2−83172号公報に説明
されている研磨テープは、研磨テープの生産効率が悪い
という欠点を有する。
Further, the polishing tape described in Japanese Patent Laid-Open No. 2-83172 has a drawback that the production efficiency of the polishing tape is poor.

【0009】さらにこれらの研磨テープは、高品質の研
磨を高効率で行なうことができない等の欠点を有する。
Further, these polishing tapes have drawbacks such that high quality polishing cannot be performed with high efficiency.

【0010】これに対して本発明は、研磨作業中に発生
する微小な研磨屑が研磨テープと被研磨体との間で夾雑
摩耗を起こすことが無く、高品質の研磨を高効率で行な
うことができ、しかもその製造が容易である等の特徴を
有する研磨テープ、及びその製造方法を提供する。
On the other hand, according to the present invention, minute polishing dust generated during polishing work does not cause contaminating wear between the polishing tape and the object to be polished, and high quality polishing can be performed with high efficiency. (EN) Provided are a polishing tape having the features that it can be manufactured and is easy to manufacture, and a manufacturing method thereof.

【0011】[0011]

【課題を解決するための手段】本発明は、研磨テープ用
基材の表面に形成されている研磨層が、全面ベタの第1
の研磨層と、該第1の研磨層の上に形成されている不連
続状の第2の研磨層とによる研磨テープからなる。
According to the present invention, the polishing layer formed on the surface of the base material for the polishing tape is a solid first surface.
And a discontinuous second polishing layer formed on the first polishing layer.

【0012】また本発明は、不連続状の第2の研磨層同
士の間の幅が、0.3〜3.0mmである研磨テープか
らなる。
The present invention also comprises a polishing tape having a width between the discontinuous second polishing layers of 0.3 to 3.0 mm.

【0013】さらに本発明は、不連続状の第2の研磨層
が、研磨テープの走行方向の10mmに対して少なくと
も1個存在している研磨テープからなる。
Furthermore, the present invention comprises a polishing tape having at least one discontinuous second polishing layer for every 10 mm in the running direction of the polishing tape.

【0014】さらにまた本発明は、研磨テープ用基材
に、バインダー用樹脂に砥粒を分散させたコーティング
剤を全面ベタに塗布することによって第1の研磨層を形
成した後、該第1の研磨層の上に、バインダー用樹脂に
砥粒を分散させたコーティング剤を不連続状に塗布する
ことによって第2の研磨層を形成する研磨テープの製造
方法からなる。
Further, according to the present invention, a first polishing layer is formed by applying a coating agent, in which abrasive grains are dispersed in a binder resin, to a polishing tape substrate to form a solid first surface, and then the first polishing layer is formed. It comprises a method for producing a polishing tape, in which a second polishing layer is formed by discontinuously applying a coating agent in which abrasive grains are dispersed in a binder resin onto the polishing layer.

【0015】前記構成による本発明の研磨テープにおい
て、研磨テープ用基材には、機械的強度,寸法安定性,
耐熱性等において優れた性質を有する合成紙やプラスチ
ックフィルム、例えば、ポリエチレンテレフタレート,
ポリプロピレン,ポリカーボネート,ジ−酢酸アセテー
ト,トリ−酢酸アセテート,ポリエチレン,ポリブチレ
ンテレフタレート,ポリアリレート等のプラスチックフ
ィルムが利用される。
In the polishing tape of the present invention having the above-mentioned structure, the polishing tape base material has mechanical strength, dimensional stability,
Synthetic paper and plastic films with excellent properties such as heat resistance, such as polyethylene terephthalate,
Plastic films such as polypropylene, polycarbonate, di-acetate acetate, tri-acetate acetate, polyethylene, polybutylene terephthalate and polyarylate are used.

【0016】研磨層はバインダー用樹脂に砥粒を分散さ
せた樹脂層からなり、全面ベタの第1の研磨層と、該第
1の研磨層の上に形成されている不連続状の第2の研磨
層とからなる。
The polishing layer is composed of a resin layer in which abrasive grains are dispersed in a binder resin. The first polishing layer has a solid surface and the second discontinuous second layer is formed on the first polishing layer. And a polishing layer.

【0017】研磨層は、バインダー用樹脂液中に、高硬
度の無機質微粉末からなる砥粒、例えば酸化アルミニウ
ム,シリコンカーバイド,酸化クロム,酸化ジルコニウ
ム,ダイヤモンド,酸化鉄,窒化ホウ素,エメリー等に
よる粒径0.1〜60μ程度の砥粒を分散させたコーテ
ィング剤を塗布することによって形成され、第1の研磨
層及び第2の研磨層のそれぞれが3〜100g(dr
y)/m2 程度に形成される。
The polishing layer is composed of abrasive particles made of a high hardness inorganic fine powder in a binder resin liquid, for example, particles of aluminum oxide, silicon carbide, chromium oxide, zirconium oxide, diamond, iron oxide, boron nitride, emery or the like. It is formed by applying a coating agent in which abrasive grains having a diameter of about 0.1 to 60 μm are dispersed, and each of the first polishing layer and the second polishing layer has a thickness of 3 to 100 g (dr.
y) / m 2 is formed.

【0018】研磨層のバインダー用樹脂としては、ポリ
エステル,塩化ビニル・酢酸ビニル共重合体,塩化ビニ
ル・塩化ビニリデン共重合体,アクリル酸エステル共重
合体,メタクリル酸エステル共重合体,ウレタン樹脂等
の熱可塑性樹脂、フェノール樹脂,エポキシ樹脂,ウレ
タン硬化型樹脂,メラミン樹脂等の熱硬化性樹脂、前述
の各熱可塑性樹脂とエポキシ化合物やイソシアネート化
合物等の架矯性結合剤との混合物による反応型樹脂、さ
らには放射線によって重合,架橋する樹脂等が利用され
る。
As the binder resin for the polishing layer, polyester, vinyl chloride / vinyl acetate copolymer, vinyl chloride / vinylidene chloride copolymer, acrylic ester copolymer, methacrylic ester copolymer, urethane resin, etc. may be used. Thermosetting resins such as thermoplastic resins, phenolic resins, epoxy resins, urethane curable resins, melamine resins, etc., and reactive resins prepared by mixing the above-mentioned thermoplastic resins with a bridging binder such as an epoxy compound or an isocyanate compound. Further, a resin or the like which is polymerized and crosslinked by radiation is used.

【0019】尚、前述のバインダー用樹脂における官能
基(−OH,−NH2 ,−COOH等)に対して、トル
イレンジイソシアナート(TDI),キシリレンジイソ
シアナート(XDI), ヘキサメチレジイソシアナー
ト(HMDI)等のイソシアナート系硬化剤を、[イソ
シアナート基(−NCO)/樹脂の官能基]で表示され
る当量比が0.5〜10程度の範囲内となる程度に混合
した研磨層形成用のコーテイング剤を使用することによ
り、バインダー用樹脂における官能基と硬化剤との反応
による熱硬化樹脂層からなる研磨層にすると、耐摩耗性
および耐熱性に極めて優れた作用を奏する研磨層が得ら
れる。
Incidentally, toluylene diisocyanate (TDI), xylylene diisocyanate (XDI), and hexamethylesylisocyanate are added to the functional groups (--OH, --NH 2 , --COOH, etc.) in the binder resin described above. A polishing layer in which an isocyanate-based curing agent such as (HMDI) is mixed to an extent that the equivalent ratio represented by [isocyanate group (-NCO) / functional group of resin] is in the range of about 0.5 to 10 By using a coating agent for formation, a polishing layer composed of a thermosetting resin layer formed by a reaction between a functional group in a binder resin and a curing agent, the polishing layer exhibiting extremely excellent wear resistance and heat resistance. Is obtained.

【0020】研磨層を形成するためのコーテイング剤に
おいて、バインダー用樹脂100重量部に対して砥粒が
100重量部未満になると、研磨作用の良好な研磨層が
得られなくなる恐れがあり、また、バインダー用樹脂1
00重量部に対して砥粒が1400重量部を超えると、
研磨層におけるバインダー成分のバインダー力が不足
し、研磨テープによる研磨作業中に砥粒が脱落する恐れ
がある。
In the coating agent for forming the polishing layer, if the amount of the abrasive particles is less than 100 parts by weight with respect to 100 parts by weight of the binder resin, there is a possibility that a polishing layer having a good polishing action cannot be obtained. Resin for binder 1
When the abrasive grains exceed 1400 parts by weight with respect to 00 parts by weight,
The binder strength of the binder component in the polishing layer is insufficient, and the abrasive grains may fall off during the polishing operation with the polishing tape.

【0021】このため、バインダー用樹脂100重量部
に対して砥粒100〜1400重量部程度を含有するコ
ーテイング剤を使用して研磨層を形成するのが良い。
Therefore, it is preferable to form the polishing layer by using a coating agent containing 100 to 1400 parts by weight of abrasive grains with respect to 100 parts by weight of the binder resin.

【0022】研磨層形成用のコーテイング剤の塗布、乾
燥後には、前記コーテイング剤中のバインダー用樹脂の
種類に応じて、加熱,放射線照射等の後処理が施される
ことは勿論である。
After the coating and drying of the coating agent for forming the polishing layer, it goes without saying that post-treatments such as heating and irradiation are applied depending on the kind of the binder resin in the coating agent.

【0023】[0023]

【実施例】以下、本発明の研磨テープ及びその製造方法
の具体的な構成を、実施例に基づいて説明する。
EXAMPLES The concrete structures of the polishing tape and the method for producing the same according to the present invention will be described below based on examples.

【0024】実施例1 (1) 第1の研磨層形成用のコーティング剤の調製 線状飽和ポリエステル樹脂[東洋紡績 (株) :バイロン
# 530]40重量部とトルエン70重量部とメチルエ
チルケトン20重量部との樹脂溶液中に、酸化アルミニ
ウム微粉末[昭和電工 (株) :WA# 4000]200
重量部を添加し、サンドミルで良く分散させた後、さら
にキシリレンジイソシアナート[ザ・インクテック
(株) :XEL硬化剤(D)]10重量部を添加し、続
いてこれをトルエンとメチルエチルケトンとの等量混合
溶剤で希釈することにより、粘度100cpsの第1の
研磨層形成用のコーティング剤[a]を得た。
Example 1 (1) Preparation of coating agent for forming first polishing layer Linear saturated polyester resin [Toyobo Co., Ltd .: Byron
# 530] 40 parts by weight, toluene 70 parts by weight, and methyl ethyl ketone 20 parts by weight in a resin solution, aluminum oxide fine powder [Showa Denko KK: WA # 4000] 200
After adding 1 part by weight and dispersing well with a sand mill, xylylene diisocyanate [The Inktech]
Co., Ltd .: XEL curing agent (D)] 10 parts by weight, followed by diluting it with an equal amount of a mixed solvent of toluene and methyl ethyl ketone to form a coating agent for forming a first polishing layer having a viscosity of 100 cps. Obtained [a].

【0025】(2) 第2の研磨層形成用のコーティング剤
の調製 線状飽和ポリエステル樹脂[東洋紡績 (株) :バイロン
# 240]60重量部とトルエン70重量部とメチルエ
チルケトン70重量部との樹脂溶液中に、炭化珪素微粉
末[昭和電工 (株) :GC# 8000]200重量部を
添加し、サンドミルで良く分散させた後、さらにキシリ
レンジイソシアナート[ザ・インクテック (株) :XE
L硬化剤(D)]10重量部を添加し、続いてこれをト
ルエンとメチルエチルケトンとの等量混合溶剤で希釈す
ることにより、粘度80cpsの第2の研磨層形成用の
コーティング剤[b]を得た。
(2) Preparation of coating agent for forming second polishing layer Linear saturated polyester resin [Toyobo Co., Ltd .: Byron
# 240] To a resin solution of 60 parts by weight, 70 parts by weight of toluene and 70 parts by weight of methyl ethyl ketone, 200 parts by weight of silicon carbide fine powder [Showa Denko KK: GC # 8000] is added and well dispersed by a sand mill. And then xylylene diisocyanate [The Inktech Co., Ltd .: XE
L curing agent (D)] 10 parts by weight, followed by diluting it with an equal amount mixed solvent of toluene and methyl ethyl ketone to obtain a coating agent [b] having a viscosity of 80 cps for forming a second polishing layer. Obtained.

【0026】(3) 研磨テープの製造 厚さ50μのポリエチレンテレフタレートフィルム[帝
人 (株) :低熱収縮SGタイプ]からなる研磨テープ用
基材の片面に、上記第1の研磨層形成用のコーティング
剤[a]を、3本リバース法にて、50g(dry)/
2 に全面ベタに塗布した後、乾燥し、さらに50℃の
雰囲気中にて2日間のエージング処理を行なうことによ
り、第1の研磨層を形成した。
(3) Manufacture of polishing tape A coating agent for forming the above-mentioned first polishing layer is formed on one surface of a polishing tape base material made of a polyethylene terephthalate film [Teijin KK: low heat shrink SG type] having a thickness of 50 μm. [A] is 50 g (dry) /
The first polishing layer was formed by applying a solid coating on the entire surface of m 2 and then drying and further performing aging treatment for 2 days in an atmosphere of 50 ° C.

【0027】続いて、第1の研磨層の上に、上記第2の
研磨層形成用のコーティング剤[b]を、グラビア印刷
法にて、塗布部分において50g(dry)/m2 に縞
状に塗布した後、乾燥し、さらに50℃の雰囲気中にて
5日間のエージング処理を行なうことにより、第2の研
磨層を形成し、本発明の実施例品である研磨テープを得
た。
Subsequently, the coating agent [b] for forming the second polishing layer is gravure-printed on the first polishing layer by a gravure printing method to form a striped pattern of 50 g (dry) / m 2 at the coated portion. Then, it was dried and further subjected to an aging treatment in an atmosphere of 50 ° C. for 5 days to form a second polishing layer to obtain a polishing tape as an example product of the present invention.

【0028】なお、第2の研磨層の縞状をなす研磨層同
士の間の幅は約1.0mmであり、縞状をなす第2の研
磨層の縞の幅は約2.0mmである。
The width between the striped polishing layers of the second polishing layer is about 1.0 mm, and the striped width of the striped second polishing layer is about 2.0 mm. .

【0029】[0029]

【発明の効果】本発明の研磨テープは、全面ベタの第1
の研磨層と該第1の研磨層の上に形成されている不連続
状の第2の研磨層とによって研磨が行なわれるため、効
率の良い研磨を行なうことができる。
The polishing tape of the present invention has the first solid surface.
Since the polishing is performed by the polishing layer and the discontinuous second polishing layer formed on the first polishing layer, efficient polishing can be performed.

【0030】また本発明の研磨テープにおいては、第1
の研磨層の上に形成されている不連続状の第2の研磨層
同士の間の凹部が、研磨作業中に発生する微小な研磨屑
を捕獲する作用を奏するため、研磨作業中に発生する微
小な研磨屑が研磨テープと被研磨体との間で夾雑摩耗を
起こすことが無く、高品質の研磨を行なうことができ
る。
In the polishing tape of the present invention, the first
The recesses between the discontinuous second polishing layers formed on the second polishing layer have a function of capturing minute polishing dust generated during the polishing operation, and therefore are generated during the polishing operation. It is possible to perform high-quality polishing without causing minute abrasion dust to cause contaminating wear between the polishing tape and the object to be polished.

【0031】さらに本発明の研磨テープは、第1の研磨
層がクッション層としても作用するため、研磨作業中の
圧力不足や圧力過剰による研磨の不均一がなく、かかる
面でも高品質の研磨を行なうことができる。
Further, in the polishing tape of the present invention, since the first polishing layer also functions as a cushion layer, there is no unevenness of polishing due to insufficient pressure or excessive pressure during polishing work, and high quality polishing is also possible in this respect. Can be done.

【0032】さらに本発明の研磨テープの製造方法は、
バインダー用樹脂に砥粒を分散させたコーティング剤の
塗工によって研磨層を形成するものであるため、不連続
状の第2の研磨層同士の間隔の調整が容易であり、かつ
効率良く的確に本発明の研磨テープが得られる。
Furthermore, the method for producing the polishing tape of the present invention is
Since the polishing layer is formed by applying the coating agent in which the abrasive particles are dispersed in the binder resin, it is easy to adjust the distance between the discontinuous second polishing layers, and it is efficient and accurate. The polishing tape of the present invention is obtained.

【0033】さらにまた、第2の研磨層を形成する際の
コーティング剤の塗布量を少なくして該層の厚さを薄く
することにより、第1の研磨層と第2の研磨層との間の
段差を小さくし、且つ、第1の研磨層と第2の研磨層と
における砥粒の粒子径を相違して組み合わせることによ
り、研磨能力の微妙なコントロールを有する研磨テープ
になし得る。
Furthermore, by reducing the coating amount of the coating agent at the time of forming the second polishing layer to reduce the thickness of the layer, the gap between the first polishing layer and the second polishing layer is reduced. By reducing the step difference and combining different particle diameters of the abrasive grains in the first polishing layer and the second polishing layer, a polishing tape having delicate control of polishing ability can be obtained.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 研磨テープ用基材と、バインダー用樹脂
に砥粒を分散させた樹脂層からなる研磨層とによる研磨
テープにおいて、前記研磨層が、全面ベタの第1の研磨
層と、該第1の研磨層の上に形成されている不連続状の
第2の研磨層とからなることを特徴とする研磨テープ。
1. A polishing tape comprising a polishing tape substrate and a polishing layer comprising a resin layer in which abrasive grains are dispersed in a binder resin, wherein the polishing layer is a first polishing layer having a solid surface, A polishing tape comprising a discontinuous second polishing layer formed on a first polishing layer.
【請求項2】 不連続状の第2の研磨層同士の間の幅
が、0.3〜3.0mmであることを特徴とする請求項
1に記載の研磨テープ。
2. The polishing tape according to claim 1, wherein the width between the discontinuous second polishing layers is 0.3 to 3.0 mm.
【請求項3】 不連続状の第2の研磨層が、研磨テープ
の走行方向の10mmに対して少なくとも1個存在して
いることを特徴とする請求項1または請求項2に記載の
研磨テープ。
3. The polishing tape according to claim 1 or 2, wherein at least one discontinuous second polishing layer is present with respect to 10 mm in the running direction of the polishing tape. .
【請求項4】 研磨テープ用基材に、バインダー用樹脂
に砥粒を分散させたコーティング剤を全面ベタに塗布す
ることによって第1の研磨層を形成した後、該第1の研
磨層の上に、バインダー用樹脂に砥粒を分散させたコー
ティング剤を不連続状に塗布することによって第2の研
磨層を形成することを特徴とする研磨テープの製造方
法。
4. A first polishing layer is formed on a polishing tape base material by applying a coating agent, in which abrasive grains are dispersed in a binder resin, on the entire surface to form a first polishing layer, and then the first polishing layer is formed. A method for producing a polishing tape, wherein the second polishing layer is formed by discontinuously applying a coating agent in which abrasive particles are dispersed in a binder resin to the above.
JP14548094A 1994-06-03 1994-06-03 Abrasive tape and manufacture thereof Pending JPH07328932A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14548094A JPH07328932A (en) 1994-06-03 1994-06-03 Abrasive tape and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14548094A JPH07328932A (en) 1994-06-03 1994-06-03 Abrasive tape and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH07328932A true JPH07328932A (en) 1995-12-19

Family

ID=15386236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14548094A Pending JPH07328932A (en) 1994-06-03 1994-06-03 Abrasive tape and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH07328932A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5928394A (en) * 1997-10-30 1999-07-27 Minnesota Mining And Manufacturing Company Durable abrasive articles with thick abrasive coatings

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5928394A (en) * 1997-10-30 1999-07-27 Minnesota Mining And Manufacturing Company Durable abrasive articles with thick abrasive coatings

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