JPH0732296B2 - Double-sided wiring board and manufacturing method thereof - Google Patents
Double-sided wiring board and manufacturing method thereofInfo
- Publication number
- JPH0732296B2 JPH0732296B2 JP6398988A JP6398988A JPH0732296B2 JP H0732296 B2 JPH0732296 B2 JP H0732296B2 JP 6398988 A JP6398988 A JP 6398988A JP 6398988 A JP6398988 A JP 6398988A JP H0732296 B2 JPH0732296 B2 JP H0732296B2
- Authority
- JP
- Japan
- Prior art keywords
- substrates
- wiring board
- double
- hole
- sided wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Adhesive Tapes (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、両面に導体配線層を有し、これらの導体配線
層間をスルーホール接続した両面配線板とこれの製造方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-sided wiring board having conductor wiring layers on both sides and connecting through through-holes between these conductor wiring layers, and a method for manufacturing the same.
従来の技術 従来の両面配線板は、貫通孔が形成されたガラス布基材
のエポキシ樹脂またはポリイミド樹脂基板の両面に配線
層を形成し、これらの配線層間を貫通孔の壁面に銅めっ
き処理で形成した導体層でスルーホール接続した構造で
あった。Conventional technology In conventional double-sided wiring boards, wiring layers are formed on both sides of an epoxy resin or polyimide resin substrate of a glass cloth base material in which through holes are formed, and copper plating is applied to the wall surface of the through holes between these wiring layers. It was a structure in which through holes were connected by the formed conductor layer.
発明が解決しようとする課題 このような構造の両面配線板では、貫通孔の壁面の伸縮
率が銅めっき層の伸縮率よりも大きいため、スルーホー
ル接続用の導体層にクラックが入り易く、時として、断
線事故にまで至る重大事故の原因となる場合があり、ス
ルーホール接続の信頼性に問題があった。また、貫通孔
を形成するための孔加工を打抜き加工で行うことができ
ず、製作作業能率を十分に高めることができない問題も
あった。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention In the double-sided wiring board having such a structure, since the expansion / contraction rate of the wall surface of the through hole is larger than the expansion / contraction rate of the copper plating layer, the conductor layer for through-hole connection is easily cracked, As a result, it may cause a serious accident leading to a disconnection accident, and there is a problem in reliability of through-hole connection. Further, there is also a problem that the punching process cannot be performed for forming the through hole, and the manufacturing work efficiency cannot be sufficiently increased.
課題を解決するための手段 本発明は、従来の両面配線板に存在した問題点を排除で
きる構造を備えた両面配線板とこれの製造方法の提供を
意図してなされたもので、本発明の両面配線板は、パラ
アーラミド（ポリパラフェニレン ３−４′ディフェニ
ールエーテル テレフタラミド）紙に芳香族アミン系硬
化剤配合のエポキシ樹脂を含浸させて形成され、一方の
面に配線層を有する第１および第２の基板の各他方の面
を向い合わせて貼着してなる板状体に貫通孔が穿設さ
れ、さらに、同貫通孔内に導電性塗布物を配設して前記
第１および第２の基板の配線層間を接続した構造とされ
ている。また、この構造を得るために、本発明ではアー
ラミド紙に芳香族アミン系硬化剤配合のエポキシ樹脂を
含浸させてなる第１および第２の基板の各一方の面上に
配線層パターンを形成する工程、前記第１および第２の
基板の各他方の面を向き合わせて加圧，加熱処理を施
し、両基板を貼着して板状体を形成する工程、形成され
た板状体にパンチ加工を施して貫通孔を形成する工程お
よび貫通孔内に導電性塗布物を配設して前記第１および
第２の基板上の配線層間をスルーホール接続する工程か
らなる製造方法を採用している。Means for Solving the Problems The present invention has been made with the intention of providing a double-sided wiring board having a structure capable of eliminating the problems existing in the conventional double-sided wiring board and a manufacturing method thereof. The double-sided wiring board is formed by impregnating a para-aramide (polyparaphenylene 3-4 'diphenyl ether terephthalamide) paper with an epoxy resin containing an aromatic amine-based curing agent, and has a wiring layer on one side. A through-hole is formed in a plate-like body formed by adhering the other surfaces of the two substrates so as to face each other, and further, a conductive coating material is provided in the through-hole to provide the first and second plates. The wiring layers of the substrate are connected to each other. In order to obtain this structure, in the present invention, a wiring layer pattern is formed on each surface of the first and second substrates obtained by impregnating an aramide paper with an epoxy resin containing an aromatic amine curing agent. Step, facing each other surface of the first and second substrates, pressurizing and heat-treating, and adhering both substrates to form a plate-like body, punching the formed plate-like body A manufacturing method is adopted, which includes a step of forming a through hole by processing and a step of disposing a conductive coating material in the through hole and connecting the wiring layers on the first and second substrates through holes. There is.
作用 本発明によれば、アーラミド紙に芳香族アミン系硬化剤
配合のエポキシ樹脂を含浸させた基板の使用によって、
片面に配線層を備えた２枚の基板の貼り合わせが容易と
なり、また、貼着された板状体への貫通孔の形成が打抜
き加工で実現できる。Effect According to the present invention, by using a substrate obtained by impregnating an aramide paper with an epoxy resin containing an aromatic amine-based curing agent,
It becomes easy to bond two substrates having a wiring layer on one surface, and the through hole can be formed in the bonded plate-shaped body by punching.
実施例 以下に図面を参照して本発明を詳細に説明する。Examples The present invention will be described in detail below with reference to the drawings.
第１図は、本発明の両面配線板の断面構造を示す図であ
り、図示するように、パラアーラミド紙に芳香族アミン
系硬化剤配合のエポキシ樹脂を含浸させて形成され、厚
さが0.05〜0.25mm程度の基板１と２の各一方の面には配
線層3,4として厚さ0.035mmの銅箔パターンが形成されて
いる。この基板１と２は、各他方の面を向い合わせて貼
り合わされて一枚の板状体とされ、さらに、この板状体
を貫通する貫通孔５の内部に導電性塗布物６を配設して
配線層３と４の間をスルーホール接続した構造となって
いる。FIG. 1 is a view showing a cross-sectional structure of the double-sided wiring board of the present invention. As shown in the drawing, it is formed by impregnating para-aramide paper with an epoxy resin containing an aromatic amine curing agent and has a thickness of 0.05 to A copper foil pattern having a thickness of 0.035 mm is formed as the wiring layers 3 and 4 on one surface of each of the substrates 1 and 2 having a thickness of about 0.25 mm. The substrates 1 and 2 are bonded to each other with their other surfaces facing each other to form a plate-shaped body, and a conductive coating material 6 is provided inside a through hole 5 penetrating the plate-shaped body. The wiring layers 3 and 4 are connected by through holes.
第２図は、第１図で示した構造の両面配線板を実現する
本発明の製造方法を説明するため、製作過程に対応させ
た断面図である。FIG. 2 is a sectional view corresponding to the manufacturing process for explaining the manufacturing method of the present invention for realizing the double-sided wiring board having the structure shown in FIG.
本発明の製造方法では、先ず、硬化状態がＢステージに
ある基板１と２を準備し、これらの各一方の面に厚さが
約0.035mmの銅箔を直接貼り合わせたのち硬化状態をＣ
ステージとする。次いで、Ｃステージの基板状態で銅箔
にパターンエッチング処理を施すことによって第２図ａ
で示す第１および第２の基板１と２を形成する。次に、
第２図ｂで示すように、第１および第２の基板１と２の
配線層３と４が形成されていない側の面を向い合わせて
当接させ、温度150℃〜170℃、加圧力20〜50Kg/cm2の加
熱加圧条件の下で30〜60分間保持する。この処理によっ
て両基板が接着され、一体化された板状体が形成され
る。こののち、第２図ｃで示すように、打抜き加工によ
って所定の位置に貫通孔５を形成する。最後に、少くと
も貫通孔の内面を覆うように導電性塗布物、たとえば、
市販の銀粉エポキシ樹脂（導電性ペイント）を付着さ
せ、約145℃,30分の加熱処理で硬化させることによって
第１図で示したスルーホール接続がなされた両面配線板
が完成する。In the manufacturing method of the present invention, first, the substrates 1 and 2 in the cured state of the B stage are prepared, and a copper foil having a thickness of about 0.035 mm is directly attached to one surface of each of them, and then the cured state is changed to C.
Let it be a stage. Then, by performing a pattern etching process on the copper foil in the substrate state of the C stage, as shown in FIG.
The first and second substrates 1 and 2 indicated by are formed. next,
As shown in FIG. 2b, the surfaces of the first and second substrates 1 and 2 on which the wiring layers 3 and 4 are not formed are faced to each other and brought into contact with each other at a temperature of 150 ° C. to 170 ° C. Hold for 30 to 60 minutes under heat and pressure conditions of 20 to 50 Kg / cm 2 . By this treatment, the two substrates are adhered to each other to form an integrated plate-shaped body. Then, as shown in FIG. 2C, the through hole 5 is formed at a predetermined position by punching. Finally, a conductive coating, for example, to cover the inner surface of the through hole, for example,
A commercially available silver powder epoxy resin (conductive paint) is attached and cured by heat treatment at about 145 ° C. for 30 minutes to complete the through-hole connection double-sided wiring board shown in FIG.
なお、本発明で用いる基板では打抜き加工によって形成
された貫通孔の壁面に繊維くずの突出がみられなかった
が、単にアーラミド紙とした場合には、良好な穿孔結果
を得ることができなかった。In the substrate used in the present invention, no projection of fiber waste was found on the wall surface of the through hole formed by the punching process, but when aramide paper was simply used, good perforation results could not be obtained. .
また、本発明の両面配線板には可撓性があり、フレキシ
ブル配線板として用いることもできる。さらに、片面の
配線層のみを使用するならば片面配線板としても用いる
ことができる。Further, the double-sided wiring board of the present invention has flexibility and can be used as a flexible wiring board. Furthermore, if only the wiring layer on one side is used, it can be used as a one-sided wiring board.
発明の効果 本発明によれば、スルーホールを打抜き加工で形成する
ことができ、両面配線板の製作能率の大幅な向上がはか
られること、また、アーラミド紙と芳香族アミン系硬化
剤配合のエポキシ樹脂との組み合せで基板を形成したこ
とにより、導電性塗布物と基板との熱による伸縮率を合
わせることが可能となり、スルーホール接続の信頼性を
高めることなどの効果が奏されるばかりでなく、フレキ
シブル配線板として用いること、片面配線板として用い
ることもできるなど利用範囲の広い配線板が実現される
効果も奏される。EFFECTS OF THE INVENTION According to the present invention, it is possible to form a through hole by punching, and it is possible to significantly improve the production efficiency of a double-sided wiring board. Further, the composition of aramide paper and an aromatic amine-based curing agent is used. By forming the board in combination with the epoxy resin, it is possible to match the expansion and contraction rates of the conductive coating material and the board due to heat, and not only the effect of improving the reliability of through-hole connection is achieved. Instead, it can be used as a flexible wiring board or can be used as a single-sided wiring board, so that a wiring board with a wide range of use can be realized.
第１図は本発明の両面配線板の構造を示す断面図、第２
図ａ〜ｃは両面配線板の製造過程に対応させて示した断
面図である。 1,2……基板、3,4……配線層、５……貫通孔、６……導
電性塗布物。FIG. 1 is a sectional view showing the structure of a double-sided wiring board according to the present invention.
FIGS. A to c are cross-sectional views corresponding to the manufacturing process of the double-sided wiring board. 1,2 ... Substrate, 3,4 ... Wiring layer, 5 ... Through hole, 6 ... Conductive coating material.
Claims (2)
配合のエポキシ樹脂を含浸させて形成され、一方の面に
配線層を有する第１および第２の基板の各他方の面を向
い合わせて貼着してなる板状体に貫通孔が穿設され、さ
らに、同貫通孔内に導電性塗布物を配設して前記第１お
よび第２の基板の配線層間を接続したことを特徴とする
両面配線板。1. A para-aramide paper is formed by impregnating an epoxy resin containing an aromatic amine-based curing agent, and has a wiring layer on one surface thereof. A through hole is formed in the plate-shaped body that is attached, and a conductive coating material is further provided in the through hole to connect the wiring layers of the first and second substrates. Double-sided wiring board.
を含浸させてなる第１および第２の基板の各一方の面上
に配線層パターンを形成する工程、前記第１および第２
の基板の各他方の面を向き合わせて加圧，加熱処理を施
し、両基板を貼着して板状体を形成する工程、形成され
た板状体にパンチ加工を施して貫通孔を形成する工程お
よび貫通孔内に導電性塗布物を配設して前記第１および
第２の基板上の配線層間をスルーホール接続する工程を
備えたことを特徴とする両面配線板の製造方法。2. A step of forming a wiring layer pattern on one surface of each of the first and second substrates impregnated with an epoxy resin containing an aromatic amine curing agent, the first and second steps.
The process of applying pressure and heat treatment to the other surfaces of the substrates facing each other and adhering both substrates to form a plate-like body, punching the formed plate-like body to form a through hole And a step of arranging a conductive coating material in the through holes to connect the wiring layers on the first and second substrates through holes, the method for manufacturing a double-sided wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6398988A JPH0732296B2 (en) | 1988-03-17 | 1988-03-17 | Double-sided wiring board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6398988A JPH0732296B2 (en) | 1988-03-17 | 1988-03-17 | Double-sided wiring board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01236683A JPH01236683A (en) | 1989-09-21 |
| JPH0732296B2 true JPH0732296B2 (en) | 1995-04-10 |
Family
ID=13245202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6398988A Expired - Fee Related JPH0732296B2 (en) | 1988-03-17 | 1988-03-17 | Double-sided wiring board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0732296B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2746643B2 (en) * | 1989-04-17 | 1998-05-06 | 住友ベークライト株式会社 | Flexible printed circuit board and method of manufacturing the same |
-
1988
- 1988-03-17 JP JP6398988A patent/JPH0732296B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01236683A (en) | 1989-09-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |