JPH0732218B2 - Cooling device for integrated circuit - Google Patents
Cooling device for integrated circuitInfo
- Publication number
- JPH0732218B2 JPH0732218B2 JP63143130A JP14313088A JPH0732218B2 JP H0732218 B2 JPH0732218 B2 JP H0732218B2 JP 63143130 A JP63143130 A JP 63143130A JP 14313088 A JP14313088 A JP 14313088A JP H0732218 B2 JPH0732218 B2 JP H0732218B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat
- plate
- conducting rod
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は集積回路用冷却装置に関し、特に電子計算機に
おける集積回路用冷却装置に関する。TECHNICAL FIELD The present invention relates to an integrated circuit cooling device, and more particularly to an integrated circuit cooling device in an electronic computer.
［従来の技術］ 従来、この種の冷却装置として、例えば第２図に示すよ
うな冷却装置が特開昭52−53547号公報に記載されてい
る。第２図において、基板３の上に接続部２により集積
回路１がはんだ付けされている。集積回路１を取付けた
基板３は熱伝導板６におおわれている。[Prior Art] Conventionally, as this type of cooling device, for example, a cooling device as shown in FIG. 2 is described in Japanese Patent Laid-Open No. 52-53547. In FIG. 2, the integrated circuit 1 is soldered onto the substrate 3 by the connecting portion 2. The substrate 3 on which the integrated circuit 1 is mounted is covered with the heat conduction plate 6.
この熱伝導板６は集積回路１の対応位置に円筒孔10を有
し、この円筒孔10の内部には摺動可能な熱伝導棒９と、
この熱伝導棒９を集積回路１側に付勢するばね11が設け
てある。The heat conducting plate 6 has a cylindrical hole 10 at a position corresponding to the integrated circuit 1, and a slidable heat conducting rod 9 is provided inside the cylindrical hole 10.
A spring 11 for urging the heat conducting rod 9 toward the integrated circuit 1 is provided.
また、熱伝導棒９の集積回路１の側端面は球面になって
おり、集積回路１が傾いて取付けられた場合にも確実に
接触し得るようになっていた。Further, the side end surface of the heat conducting rod 9 on the side of the integrated circuit 1 is spherical, so that even if the integrated circuit 1 is mounted at an inclination, it can be surely contacted.
更に、熱伝導板６上には冷却板12が取付けてある。Further, a cooling plate 12 is attached on the heat conduction plate 6.
そして、集積回路１が発生する熱は、集積回路１の上か
らばね11により、おし当てられている熱伝導棒９から熱
伝導板６、冷却板12へと伝えられ、冷却板12内を流れる
冷却液により持去られるようになっている。Then, the heat generated by the integrated circuit 1 is transferred from above the integrated circuit 1 by the spring 11 to the heat conducting plate 6 and the cooling plate 12 from the applied heat conducting rod 9 to the inside of the cooling plate 12. It is designed to be carried away by the flowing cooling liquid.
［発明が解決しようとする課題］ 上述した従来の集積回路用冷却装置にあっては、熱伝導
棒９の先端を球面加工し、集積回路１が基板３に対して
傾いて取付けられていても、集積回路１の平面と熱伝導
棒９の球面の接触面積はある程度確保できるという構造
になってはいるものの、球面と平面との接触は原理的に
点接触であるため、最近の集積回路の消費電力増加に対
しては十分な熱伝達能力が得られないという欠点があっ
た。[Problems to be Solved by the Invention] In the conventional integrated circuit cooling device described above, even if the integrated circuit 1 is attached to the substrate 3 with the tip of the heat conducting rod 9 being spherically processed. Although the contact area between the flat surface of the integrated circuit 1 and the spherical surface of the heat conducting rod 9 can be secured to some extent, the contact between the spherical surface and the flat surface is point contact in principle, so There is a drawback in that sufficient heat transfer capacity cannot be obtained with respect to an increase in power consumption.
［課題を解決するための手段］ 本発明は、上記課題を解決するためになしたもので、そ
の解決手段として本発明は、基板と、該基板上に接合部
を介して取付けた複数の集積回路と、上記基板をおおう
熱伝導板と、該熱伝導板上に取付けた冷却板とを備え、
上記熱伝導板の集積回路対応位置に複数の円筒孔を形成
すると共に、該円筒孔の内部に摺動可能な熱伝導棒と、
該熱伝導棒を上記集積回路側に付勢するばねとを設けた
集積回路用冷却装置において、上記熱伝導棒の集積回路
側端面は、球面または円錐面であって、上記熱伝導棒と
集積回路の間には放熱板を有し、該放熱板は上記接合部
よりも融点の低い低融点合金によって上記熱伝導棒に固
着され、上記放熱板と上記集積回路の互いに押し当てら
れる面をそれぞれ平坦な摺動面とした構成としている。[Means for Solving the Problems] The present invention has been made to solve the above problems. As a means for solving the problems, the present invention provides a substrate and a plurality of integrated devices mounted on the substrate via a joint. A circuit, a heat conductive plate covering the substrate, and a cooling plate mounted on the heat conductive plate,
A plurality of cylindrical holes are formed at positions corresponding to the integrated circuit of the heat conductive plate, and a heat conductive rod slidable inside the cylindrical holes,
In an integrated circuit cooling device provided with a spring for urging the heat conducting rod toward the integrated circuit, an end surface of the heat conducting rod on the integrated circuit side is a spherical surface or a conical surface, and the heat conducting rod is integrated with the heat conducting rod. A heat radiating plate is provided between the circuits, and the heat radiating plate is fixed to the heat conducting rod by a low melting point alloy having a melting point lower than that of the joint portion, and the heat radiating plate and the integrated circuit are pressed against each other. The structure is a flat sliding surface.
［実施例］ 次に、本発明の実施例について図面を参照して説明す
る。[Embodiment] Next, an embodiment of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.
この集積回路用冷却装置は、基板３と、この基板３上に
搭載された複数の集積回路１と、上記基板３をおおう熱
伝導板６を備えている。This integrated circuit cooling device includes a substrate 3, a plurality of integrated circuits 1 mounted on the substrate 3, and a heat conduction plate 6 covering the substrate 3.
集積回路１は接続部２によって基板３にはんだ付け固着
され、集積回路１の相互の配線及び他の基板との接続の
ための配線が基板３の内部に構成されている。入出力端
子４は、他の基板との接続のための端子である。尚、こ
こでいう集積回路１はフェイスダウンで基板３に接続さ
れた集積回路チップまたは放熱面が接続部２とは反対面
の構造を有する、ケース入り集積回路チップである。基
板３は金属枠５を介して熱伝導板６でおおわれている。The integrated circuit 1 is soldered and fixed to the substrate 3 by the connecting portion 2, and wirings for mutual wiring of the integrated circuit 1 and connection with another substrate are formed inside the substrate 3. The input / output terminal 4 is a terminal for connection with another substrate. The integrated circuit 1 referred to here is an integrated circuit chip connected face-down to the substrate 3 or a cased integrated circuit chip having a structure in which the heat dissipation surface is the surface opposite to the connection portion 2. The substrate 3 is covered with a heat conduction plate 6 via a metal frame 5.
熱伝導板６内には集積回路１に対応して多数の円筒孔10
があけられている。円筒孔10の中には、ばね11と熱伝導
棒９が挿入され、熱伝導棒９は円筒孔10の内面と微少な
空隙を介して摺動することができ、かつばね11を介して
集積回路１側に付勢されている。A large number of cylindrical holes 10 corresponding to the integrated circuit 1 are provided in the heat conducting plate 6.
Has been opened. A spring 11 and a heat conducting rod 9 are inserted into the cylindrical hole 10, and the heat conducting rod 9 can slide on the inner surface of the cylindrical hole 10 through a minute gap and is integrated via the spring 11. It is biased to the circuit 1 side.
熱伝導棒９の集積回路１側端面は球面に形成してあり、
この端面には放熱板７が低融点はんだ８により固着され
ており、この放熱板７と集積回路１はばね11の働きによ
り互いに押しつけられていて、かつこの互いに対向した
面は、それぞれ平坦に加工されており、摺動可能となっ
ている。The end surface of the heat conducting rod 9 on the integrated circuit 1 side is formed into a spherical surface,
A heat radiating plate 7 is fixed to this end surface by a low melting point solder 8, the heat radiating plate 7 and the integrated circuit 1 are pressed against each other by the action of a spring 11, and the surfaces facing each other are flattened. It is slidable.
このような構成によって、集積回路１で発生する熱は、
放熱板７、低融点はんだ８、熱伝導棒９、熱伝導板６と
伝えられ、最後に熱伝導板６に圧接された冷却板12を通
して冷却液13へと伝達される。With such a configuration, the heat generated in the integrated circuit 1 is
The heat radiating plate 7, the low melting point solder 8, the heat conducting rod 9, and the heat conducting plate 6 are transmitted, and finally to the cooling liquid 13 through the cooling plate 12 pressed against the heat conducting plate 6.
熱伝導棒９と放熱板７の固着構造について更に詳しく説
明すると、熱伝導棒９に固着された放熱板７と、集積回
路１の対向する面が互いに平行な平面となっていれば、
これらは互いに押しつけることにより、密着させること
ができるので、放熱板７から熱伝導棒９への熱伝達は良
好に行なわれる。しかし、集積回路１の基板３への固着
状態は常に放熱板７と平行な平面とはできず、集積回路
1aのように斜めに固着されることがしばしば起こる。熱
伝導棒９と放熱板７との間でも同様の状態が起こり得
る。このような状態の集積回路1aと放熱板7aを互いに押
し当てても、集積回路1aと放熱板7aとの間にはくさび状
の空隙が生じ、これにより熱伝達能力は著しく低下して
しまう。The fixing structure of the heat conducting rod 9 and the heat radiating plate 7 will be described in more detail. If the heat radiating plate 7 fixed to the heat conducting rod 9 and the facing surface of the integrated circuit 1 are planes parallel to each other,
These can be brought into close contact with each other by pressing them against each other, so that the heat transfer from the heat radiating plate 7 to the heat conducting rod 9 is favorably performed. However, the fixed state of the integrated circuit 1 on the substrate 3 cannot always be a plane parallel to the heat sink 7, and
It often happens that it is fixed obliquely like 1a. A similar state may occur between the heat conduction rod 9 and the heat dissipation plate 7. Even if the integrated circuit 1a and the heat radiating plate 7a are pressed against each other in such a state, a wedge-shaped void is generated between the integrated circuit 1a and the heat radiating plate 7a, and the heat transfer capability is significantly reduced.
本実施例では傾いて固着された集積回路1aに対しても放
熱板７を密着させるために、熱伝導棒９と放熱板７とは
低融点合金としての低融点はんだ８により固着してい
る。集積回路1aと放熱板７を密着させるには、この冷却
装置を組立てた後、冷却装置全体を接続部２のはんだは
溶融しない温度で、かつ低融点はんだ８は溶融する温度
以上に加熱し、冷却する。これにより低融点はんだ8aが
溶融し、集積回路1aの傾きにならって放熱板7aが傾いて
から、再び低融点はんだ8aが固着するので、放熱板7aと
集積回路1aは密着した状態を得ることができる。In the present embodiment, the heat conducting plate 9 and the heat radiating plate 7 are fixed to each other by the low melting point solder 8 which is a low melting point alloy so that the heat radiating plate 7 can be closely attached to the integrated circuit 1a which is fixedly inclined. In order to bring the integrated circuit 1a and the heat sink 7 into close contact with each other, after assembling this cooling device, the entire cooling device is heated to a temperature at which the solder of the connecting portion 2 does not melt and the low melting point solder 8 melts or higher, Cooling. As a result, the low melting point solder 8a is melted, the heat radiating plate 7a is tilted according to the inclination of the integrated circuit 1a, and then the low melting point solder 8a is fixed again, so that the heat radiating plate 7a and the integrated circuit 1a are in close contact with each other. You can
低融点はんだ８としては、例えば融点が139℃の錫・ビ
スマス合金、接続部２のはんだとしては、例えば融点が
183℃の錫・鉛はんだを使用することができ、この場合
は冷却装置全体を約160℃に加熱する。As the low melting point solder 8, for example, a tin-bismuth alloy having a melting point of 139 ° C.
183 ° C tin-lead solder can be used, in which case the entire cooling system is heated to about 160 ° C.
このような構造とすることによって、放熱板と集積回路
は密着させることができ、かつ球面と平面の接触部分は
低融点はんだによって、広い面積で固着されているの
で、良好な熱伝達能力が得られる。第１図において熱伝
導棒９の先端の球面加工は円錐型に加工しても同じ効果
が得られる。With such a structure, the heat sink and the integrated circuit can be brought into close contact with each other, and the contact portion between the spherical surface and the flat surface is fixed in a wide area by the low melting point solder, so that a good heat transfer capability can be obtained. To be In FIG. 1, the same effect can be obtained even if the tip of the heat conducting rod 9 is processed into a conical shape.
また、集積回路１と放熱板７の摺動面、円筒孔10と熱伝
導棒９の摺動面に、それぞれ高熱伝導性のオイルを充た
すことにより、接触面の熱伝達能力を改善することがで
きる。Further, by filling the sliding surfaces of the integrated circuit 1 and the heat radiating plate 7 and the sliding surfaces of the cylindrical hole 10 and the heat conducting rod 9 with high heat conductive oil respectively, the heat transfer capability of the contact surface can be improved. it can.
さらに、上記高熱伝導性オイルの代わりに、基板と熱伝
導板とで囲われた空間を気密構造として、ヘリウムガス
等の高熱伝導性気体で充たすことによっても、接触面の
熱伝達能力を改善することができる。Further, instead of the high heat conductive oil, the space surrounded by the substrate and the heat conductive plate is made to have an airtight structure, and the heat transfer capacity of the contact surface is improved by filling the space with a high heat conductive gas such as helium gas. be able to.
［発明の効果］ 以上説明したように本発明の集積回路用冷却装置は、集
積回路に押し当てられる熱伝導棒の集積回路側端面は、
球面または円錐面であって、熱伝導棒と集積回路の間に
は放熱板を有し、該放熱板は接合部よりも融点の低い低
融点合金によって熱伝導棒に固着され、放熱板と集積回
路の互いに押し当てられる面をそれぞれ平坦な摺動面と
したため、低融点合金を溶融して放熱板を集積回路面に
適応した状態にすることができ、放熱板と集積回路とを
面接触させて熱伝達能力を高めることができ、しかも低
融点合金の溶融時には接合部の溶融が生じることがなく
他への影響もないという効果がある。[Effects of the Invention] As described above, in the integrated circuit cooling device of the present invention, the end face of the heat conducting rod on the integrated circuit side, which is pressed against the integrated circuit, is
It has a spherical surface or a conical surface, and has a heat dissipation plate between the heat conduction rod and the integrated circuit. The heat dissipation plate is fixed to the heat conduction rod by a low melting point alloy having a melting point lower than that of the joint, and integrated with the heat dissipation plate. Since the surfaces of the circuit that are pressed against each other are flat sliding surfaces, the low melting point alloy can be melted to bring the heat sink into a state adapted to the integrated circuit surface, and the heat sink and the integrated circuit can be brought into surface contact. Therefore, the heat transfer ability can be enhanced, and further, the melting of the low melting point alloy does not cause the melting of the joint portion, and there is no effect on the other.
第１図は本発明の一実施例に係る集積回路用冷却装置の
断面図、第２図は従来の集積回路用冷却装置の断面図で
ある。 1:集積回路、3:基板 6:熱伝導板、7:放熱板 9:熱伝導棒、10:円筒孔 11:ばね、12:冷却板FIG. 1 is a sectional view of an integrated circuit cooling device according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional integrated circuit cooling device. 1: Integrated circuit, 3: Board 6: Heat conduction plate, 7: Heat dissipation plate 9: Heat conduction rod, 10: Cylindrical hole 11: Spring, 12: Cooling plate
Claims (1)
た複数の集積回路と、上記基板をおおう熱伝導板と、該
熱伝導板上に取付けた冷却板とを備え、上記熱伝導板の
集積回路対応位置に複数の円筒孔を形成すると共に、該
円筒孔の内部に摺動可能な熱伝導棒と、該熱伝導棒を上
記集積回路側に付勢するばねとを設けた集積回路用冷却
装置において、上記熱伝導棒の集積回路側端面は、球面
または円錐面であって、上記熱伝導棒と集積回路の間に
は放熱板を有し、該放熱板は上記接合部よりも融点の低
い低融点合金によって上記熱伝導棒に固着され、上記放
熱板と上記集積回路の互いに押し当てられる面をそれぞ
れ平坦な摺動面としたことを特徴とする集積回路用冷却
装置。1. A substrate, a plurality of integrated circuits mounted on the substrate via joints, a heat conductive plate covering the substrate, and a cooling plate mounted on the heat conductive plate. A plurality of cylindrical holes were formed in the conductive plate at positions corresponding to the integrated circuit, and a heat conductive rod slidable inside the cylindrical hole and a spring for urging the heat conductive rod toward the integrated circuit were provided. In the cooling device for an integrated circuit, the end surface of the heat conducting rod on the integrated circuit side is a spherical surface or a conical surface, and a heat radiating plate is provided between the heat conducting rod and the integrated circuit, and the heat radiating plate is the joint portion. A cooling device for an integrated circuit, which is fixed to the heat conducting rod by a low melting point alloy having a melting point lower than that of the heat dissipation plate, and the surfaces of the heat radiating plate and the integrated circuit pressed against each other are flat sliding surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63143130A JPH0732218B2 (en) | 1988-06-10 | 1988-06-10 | Cooling device for integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63143130A JPH0732218B2 (en) | 1988-06-10 | 1988-06-10 | Cooling device for integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH021959A JPH021959A (en) | 1990-01-08 |
| JPH0732218B2 true JPH0732218B2 (en) | 1995-04-10 |
Family
ID=15331612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63143130A Expired - Lifetime JPH0732218B2 (en) | 1988-06-10 | 1988-06-10 | Cooling device for integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0732218B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013116143A1 (en) * | 2012-01-30 | 2013-08-08 | Alcatel Lucent | A board-level heat transfer apparatus for communication platforms |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19530264A1 (en) * | 1995-08-17 | 1997-02-20 | Abb Management Ag | Power semiconductor module |
| JPH1070219A (en) * | 1996-08-27 | 1998-03-10 | Fujitsu Ltd | Packaged module cooling device |
| CN104812216B (en) * | 2015-04-01 | 2017-05-03 | 太仓陶氏电气有限公司 | Electric welding machine radiator structure |
| CN105280342B (en) * | 2015-10-30 | 2017-09-29 | 国网山东省电力公司东营供电公司 | A kind of heat radiating fin structure of quick detachable transformer |
-
1988
- 1988-06-10 JP JP63143130A patent/JPH0732218B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013116143A1 (en) * | 2012-01-30 | 2013-08-08 | Alcatel Lucent | A board-level heat transfer apparatus for communication platforms |
| US8913391B2 (en) | 2012-01-30 | 2014-12-16 | Alcatel Lucent | Board-level heat transfer apparatus for communication platforms |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH021959A (en) | 1990-01-08 |
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