JPH07310183A - Film forming device - Google Patents

Abstract

PURPOSE:To provide a film forming device which is simplified in the constitution over the entire part, is correspondingly inexpensively produced and is capable of attaining the desired through-put by efficiently using individual load locking chambers. CONSTITUTION:Three pieces of substrate supporting trays 2 are arranged in a vacuum film forming vessel 1 successively provided with the two load locking chambers 17. These trays 2 are formed commonly as caps to close the openings on the inner side of the load locking chambers 17. The trays 2 are successively transported by means of horizontal turning arms 301 having tray supporting parts 302 at both ends. Films are formed on the substrate S carried in from the one (other) locking chamber 17 and, thereafter, the substrate is carried out of the other (one) load locking chamber 17.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ion beam sputtering film formation (IBS) for forming a film by a sputtering method using an ion beam or the like, and an ion vapor deposition thin film formation (IBS) using an ion beam irradiation in combination with vacuum vapor deposition such as sputtering.
VD) film forming apparatus on a substrate by a physical vapor deposition method,
Particularly, the present invention relates to a film forming apparatus which is advantageous as a mass production apparatus.

[0002]

2. Description of the Related Art A film suitable for a purpose is formed on a substrate in order to manufacture various semiconductor devices and improve wear resistance of various mechanical parts. An IBS film forming apparatus will be taken up as a typical example mainly used for mass production, and one example thereof will be described with reference to FIGS. 7 to 9. FIG. 7 is a diagram schematically showing the configuration of the entire apparatus as seen from above, FIG. 8 is a partial sectional view, and FIG. 9 is a time chart showing the operation timing of the main part of the apparatus.

This film forming apparatus includes a vacuum film forming container 1 as shown in FIG. A sputter target 11 is arranged in the container 1, and an ion source 12 that irradiates the sputter target 11 is provided. Below the target 11, there is a film formation position P on the film formation target substrate S, and the container 1 is provided around it.
A cover wall portion 13 (see also FIG. 8) is formed to extend to the inner wall. Further, an exhaust device (not shown) is connected to the container 1, whereby the inside of the container 1 is set to a predetermined film forming vacuum degree.

A total of four load lock chambers 14 are continuously provided on the side surface of the container 1 on the side opposite to the ion source 12 and the like (below the wall 13 in the illustrated example) with the cover wall 13 as a boundary. ing. Each of the load lock chambers 14 has the structure shown in FIG. 8 except that the left-right direction and the arrangement position are different. An opening 141 communicating with the outside of each load lock chamber 14 is opened and closed by a door 15. When the door 15 is closed, the O-ring 151 is attached to the upper end surface around the opening.
Airtightly contact. The inner opening 142 communicating with the container 1 of each load lock chamber 14 is hermetically closed or opened by the square gate valve 16. In addition, each load lock chamber 14
An exhaust pipe 14a and a vent pipe 14b are connected to the exhaust pipe 14a.
4b is connected to a vent gas supply unit (not shown).

Four substrate support trays 2 for supporting the substrate S for film formation are used. Each tray 2 has an upper disc portion 21 and a lower cylindrical leg portion 22 that is integral with the upper disc portion 21 and has an outer diameter smaller than that of the disc portion. On the upper surface of the disc portion 21, a circular concave portion 2 for mounting the substrate S thereon.
3 is formed. Further, the container 1 is provided with a tray transfer arm mechanism 3 for each load lock chamber 14. Each arm mechanism 3 has a bent horizontal arm 31, which is cantilevered at the upper end of a vertical shaft rod 32, and has a circular ring-shaped tray support with a free end partially lacking a ring. 311 is included. The tray 2 can be fitted onto the tray supporting portion 311 at the leg portion 22 thereof from above and can be mounted thereon. Further, by being pushed up from below in this state, the tray support 311 can be lifted up and away from the tray support 311. The shaft rod 32 is reciprocally rotated by a rotation drive unit 33 provided outside the container 1. The tray 2 supported by the arm 31 has a position Q1 facing the substrate receiving position Q3 in one load lock chamber 14 and a position Q2 facing the film forming position P in the container 1 corresponding to the operation of the driving unit 33. You can make a round trip.

A tray elevating mechanism 4 is provided in each load lock chamber 14, and the mechanism 4 supports a tray 2 by a tray supporting member 41 that abuts the lower surface of the tray 2 from below and supports the member at its upper end portion. It includes a vertical shaft rod 42 and an outdoor drive unit 43 for raising and lowering the shaft rod 42. The tray support member 41 has such a shape and size that it can pass through the tray support portion 311 of the horizontal arm 31 of the transport arm mechanism 3 and ascend and descend. The tray support portion 31 of the arm 31 of the transfer arm mechanism 3
The tray 2 supported at 1 and placed at the position Q1 is
When the tray support member 41 is lifted by the operation of the drive unit 43, the tray support member 41 is supported by the tray support member 41 and is pushed up.
Is held at a position Q3 for receiving Further, by operating the drive unit 43 in the reverse direction from that position, the tray 2 at the position Q3 can be lowered and placed on the tray support unit 311 waiting below.

The tray 2 supported by the tray supporting portion 311 of the transfer arm mechanism 3 and arranged at the position Q2 facing the film forming position P is moved to the position Q2 by another tray elevating mechanism 5.
To the film forming position P are driven up and down. The lifting mechanism 5
It has a horizontal arm 51, which is cantilevered at the upper end of a vertical shaft rod 52, and rotatably supports a tray holder 53 by a bearing 54 at its free end. The tray holder 53 has a shape and size capable of penetrating up and down the tray supporting portion 311 of the horizontal arm 31 of the tray transport arm mechanism 3, and can support the tray 2 from below by abutting the lower surface thereof. The shaft rod 52 is driven up and down by a drive unit 55 outside the container 1. The tray 2 supported at the tray support portion 311 of the arm 31 and placed at the position Q2 is supported by the holder 53 being raised by the operation of the drive portion 55 of the elevating mechanism 5, and pushed up to the film formation position P. , Tray 2
The substrate S supported by is placed and held at the position P. Also,
By operating the drive unit 55 in this state in the reverse direction, the substrate S at the position P and the tray 2 supporting the substrate S can be lowered and placed on the tray support unit 311 waiting below.

When the substrate S is placed at the position P, the peripheral portion of the substrate S is covered with the above-mentioned cover wall portion 13 and the portion where the film is to be formed is exposed to the target 11. In this example, the peripheral edge of the substrate S is disposed close to the cover wall 13 without contacting the cover wall 13 in order to rotate the substrate S during film formation. The tray 2 arranged at the position P is rotated by the rotation driving mechanism 6 during the film forming operation, so that the substrate S supported by the tray 2 is also rotated.

The mechanism 6 is a holder 5 of the tray lifting mechanism 5.
The bearing 54 that rotatably supports the arm 3 on the arm 51 is a part of the components, and the rotary shaft 531 that supports the holder 53 further includes an expansion joint 6 by a spline shaft mechanism.
It includes a vertical axis rod 62 connected via 1 and a rotation drive unit 63 outside the container 1 connected to the vertical axis rod 62. That is,
The tray 2 that has been raised to the film formation position P has the drive unit 63.
In this operation, the substrate S is rotated and the substrate S is also rotated, and a film is uniformly formed on the surface thereof.

According to the film forming apparatus described above, film formation is performed according to the time chart shown in FIG. In this time chart, as shown in FIG. 7, the handling machine A is installed in the vicinity of two adjacent load lock chambers 14, 14, and the substrate S on which a film is to be formed is not shown. The substrate S is carried out from the line onto the tray 2 at the substrate receiving position Q3 in the load lock chamber 14, and the film-formed substrate S is carried out from the tray 2 at the same position. As shown in FIG. 1, the handling machine B is installed in the vicinity of the other adjacent load lock chambers 14, 14 and is the same as the machine A.

Further, in the time chart, the numbers after the parts names of the load lock chamber 1, the load lock chamber 2, the rectangular valve 1, the transfer arm 1 and the like are the first load when the part is "1". It is related to the lock chamber 14, and similarly, “2” is in the second load lock chamber, “3” is in the third load lock chamber, and “4” is in the fourth load lock chamber. It is shown that each is related to the second load lock room. Of the four load lock chambers 14, the first, second, third, and fourth ones are (1), (2), (3), and
It is indicated by (4). The “load lock chamber lifting mechanism” is the tray lifting mechanism 4 in the load lock chamber 14.
The “holder lifting mechanism” indicates the tray lifting mechanism 5 for the container 1, the “square valve” indicates the square gate valve 16 in the load lock chamber 14, and the “transport arm” indicates the horizontal arm in the tray transport arm mechanism 3. 31 (or its tray support portion 311) is shown.

When forming a film, the inside of the vacuum film forming container 1 is set to a predetermined film forming vacuum degree by an exhaust device (not shown). Initially, each part is placed in the state shown in FIG. 7 and described next.
First and second load lock chambers 14 (1), 14
Regarding (2). The door 15 and the gate valve 16 are closed, and the arm 31 of the tray transfer arm mechanism 3 is placed in the container 1 at the standby position near the gate valve. Chamber 14 (1),
In 14 (2), the tray 2 is supported by the tray lifting mechanism 4 and is arranged at the substrate receiving position Q3. Room 14
(1) and 14 (2) are atmospheric pressure. About the third load lock chamber 14 (3).

The door 15 and the gate valve 16 are closed.
The arm 31 of the tray transfer arm mechanism 3 is placed in a standby position near the gate valve in the container 1. In the chamber 14 (3), the tray 2 is supported by the tray lifting mechanism 4 and is arranged at the substrate receiving position Q3. The chamber 14 (3) is made to have a vacuum degree substantially equal to that in the container 1 by an exhaust device (not shown) via the exhaust pipe 14 a.

Regarding the fourth load lock chamber 14 (4). The door 15 is closed and the gate valve 16 is opened. The arm 31 of the tray transfer arm mechanism 3 is rotated to the inside of the container 1, and the tray support portion 311 thereof is arranged below the film formation position P. In the chamber 14 (4), the tray supporting member 41 of the tray elevating mechanism 4 is left in an empty position (without supporting the tray 2). The inside of the chamber 14 (4) has the same vacuum pressure as the inside of the container 1. About the tray elevating mechanism 5 for the container 1.

The tray holder 53 supports the tray 2 and holds it at the film forming position P. However, the substrate S is not initially supported. According to the flowchart, the film formation is being performed at this point, but the film forming operation is not initially performed. From the above initial state, for example, for the first load lock chamber 14 (1), the door 15 is opened, the substrate S is loaded by the handling machine A, and placed on the tray 2. Next, the door 15 is closed, the load lock chamber 14 (1) is evacuated through the exhaust pipe 14a, and a vacuum degree substantially equal to that in the container 1 is obtained in te seconds. Subsequently, the gate valve 16 is opened, the arm 31 corresponding to the chamber 14 (1) is pivotally moved into the chamber, the tray support portion 311 of the arm is arranged at the lower position Q1 of the tray 2, and the tray 311 is attached to the tray 311. Place 2. After that, the arm 31 is returned and rotated, and further rotated to dispose the tray support portion 311 and the substrate S supported thereby at the position Q2 below the film formation position P.

In parallel with such an operation, the tray 2 relating to the load lock chamber 14 (4) is lowered from the film forming position P by lowering the tray holder 53 of the tray elevating mechanism 5 in the container 1. Then, the arm 31 is placed on the tray support portion 311 corresponding to the chamber 14 (4), and the arm is rotated to be moved to the load lock chamber 14 (4).

Load lock chamber 1 located at position Q2
The tray 2 related to 4 (1) is raised to the film forming position P by raising the holder 53 in the raising / lowering mechanism 5.
Thus, the substrate S is also arranged at that position. Here, the sputtering target 11 is irradiated with ions from the ion source 12, and the generated sputtered particles are made to fly to the surface of the substrate S to form a film.
Further, during this film formation, the tray 2 is rotated by the rotation drive mechanism 6 and thereby the substrate S is rotated to form a uniform film on the surface of the substrate. The film formation time is about several seconds.

The cover wall portion 13 prevents film deposition on the portion of the tray 2 which does not support the substrate or other mechanical portions. When the film formation is completed, the holder 53 is lowered to move the substrate supporting tray 2 to the tray supporting portion 311 of the arm 31.
Place on. After that, the arm 31 is pivotally moved into the original load lock chamber 14 (1), the tray 2 is arranged at the position Q1, and the tray supporting member 41 of the tray elevating mechanism 4 is raised here, whereby the tray 2 is moved. Is separated from the arm 31 and is raised to the position Q3. After that, the arm 31 is rotated backward to the standby position, the gate valve 16 is closed after the arm 31 is ejected, the vent gas is supplied into the chamber 14 (1) through the vent pipe 14b, and the room pressure is set to the atmospheric pressure. After that, the door 15 is opened, the film-formed substrate S is carried out by the handling machine A, the next substrate S is carried in, and the door 15 is closed again.

The substrate loading, film deposition, and substrate unloading for one load lock chamber are as described above, and the same procedure is performed for the other load lock chambers at the timings shown in the time chart by sequentially following these operations. The substrate is loaded, the film is formed, and the substrate is unloaded. As a result, regarding the film forming operation at the film forming position P, after the completion of one film forming, the next substrate is placed at the film forming position, and the film is formed on the next substrate until the film forming is completed. The time for one cycle is t seconds as shown in the time chart, in other words, the throughput is 1 substrate / t second.

[0020]

However, according to such a film forming apparatus, in order to achieve a desired throughput, the load lock chamber 14, the tray transfer arm mechanism 3, the tray lifting mechanism 4 of the load lock chamber 4, and the gate valve 16 are provided. 4 sets are required, which is expensive, and
Looking at each load lock chamber 14, the substrate S is unloaded and waits until the substrate S is unloaded into the vacuum film deposition container 1 to form a film and returns to the chamber again. It is necessary, and there is a problem that the time during that time is wasted.

[0021] Therefore, an object of the present invention is to provide a film forming apparatus in which the entire structure is simplified, can be manufactured at that low cost, and can efficiently use individual load lock chambers to achieve a desired throughput. .

[0022]

[Means for Solving the Problems] A film forming apparatus of the present invention for solving the above problems comprises a vacuum film forming container in which two load lock chambers for loading and unloading a substrate to be filmed are respectively provided in series, and the inside of the container. A plurality of substrate supporting trays that are also disposed in the load lock chamber and that also serve as an inner lid that opens and closes an inner opening that communicates with the inside of the container of the load lock chamber, and a tray transfer arm mechanism provided for each of the load lock chambers. And an arm provided with a tray support part on one side, and the arm is installed so that one tray support part can face the inner opening of the corresponding load lock chamber and the other tray support part can face the film formation position at the same time. And a tray raising / lowering mechanism provided for each of the load lock chambers, which is rotatably driven, and a tray supporting portion on the arm in the corresponding tray transport arm mechanism. The tray, which is supported and arranged at a position facing the opening on the inside of the load lock, can be raised from the tray supporting portion to be arranged and held at the inner opening closed position, and conversely, the tray arranged at the closed position can be lowered to lower the inner opening. Which can be placed on the tray support part on the arm arranged at a position facing the tray, and a tray lifting mechanism provided for the vacuum film forming container, wherein the tray support on the arm in one tray transfer arm mechanism is provided. It is possible to raise the tray supported at the film forming position and face the film forming position from the tray supporting part to be arranged and held at the film forming position, and conversely lower the tray arranged at the film forming position to lower the tray. The other tray transport arm mechanism arranged at a position facing the film position can be mounted on the tray support portion on the arm.

An elastic ring for airtight sealing is provided around the inner opening or on the tray itself in order to ensure that each substrate supporting tray closes the load lock chamber inner side opening airtightly.
For example, it is desirable to wear an O-ring. When the airtight sealing elastic ring is mounted on the tray itself, the airtight sealing elastic ring of the tray that supports the substrate is hermetically sealed at the film formation position while contacting the peripheral edge of the substrate placed at the position. A ring member for contacting the substrate with the tray and sandwiching the substrate with the tray is provided, and the ring member is provided with a support mechanism around the film forming position, which is usually provided to prevent film formation on other parts. It is conceivable that it is rotatably arranged through. As such a supporting mechanism, as a simple mechanism, for example, a mechanism including a ball bearing in which an outer ring is fixed to the cover portion and an inner ring supports the ring member can be considered.

By adopting such a structure, the substrate arranged at the film formation position has its peripheral portion abutting against the rotatable ring member, and the airtight plate mounted on the tray supporting the substrate. The elastic ring for sealing is elastically and airtightly contacted with the ring member so as to be sandwiched between the ring member and the tray, and when the tray is rotationally driven during the film forming operation, the elastic ring for sealing and the ring member. The ring member is driven to rotate by the frictional force with the substrate. Thus, the substrate is rotatably driven without being slipped on the tray while being sandwiched between the ring member and the tray, and a desired high speed rotation is achieved. In addition, since the elastic ring for airtight sealing contacts the ring member airtightly,
Film deposition on the surface of the elastic ring for airtight sealing, which is involved in closing the opening of the load lock chamber, such as the tray transfer arm mechanism and the tray lifting mechanism, is prevented.

Further, in the case of adopting such a structure, in order to reduce the impact on the substrate when the peripheral edge of the substrate is brought into contact with the ring member, for example, an elastic rubber sheet is attached to the substrate mounting portion of the tray. It is possible to lay such a cushion sheet.

[0026]

Next, the operation of the film forming apparatus according to the present invention will be described, but in order to facilitate understanding, it will be described in parentheses with reference to the reference numerals of parts in the embodiments described later. However, the present invention is not limited to the examples described below. According to the film forming apparatus of the present invention, initially, each load lock chamber (17
The doors (171) for opening and closing the openings of (1) and 17 (2) that open to the outside of the room are closed, and the tray (2) is supported by the tray elevating mechanism (4) in each load lock chamber to open the inside of the load lock chamber. Hold at the closed position (Q3). In addition, the arm (30
1) to the standby position (Q41, Q4) in the vacuum film forming container (1).
Place in 2). Further, the holder (53) of the tray elevating mechanism (5) in the vacuum film forming container (1) is raised to hold the empty tray (2) at the film forming position. Initially, the film forming operation is not yet carried out (see FIG. 1 above).

When forming a film, the inside of the vacuum film forming container (1) is evacuated to a predetermined film forming vacuum degree by an exhaust device. And open the door (171) of one of the load lock chambers (17 (1)),
The substrate (S) on which a film is to be formed is carried in and placed on the tray (2), the door is closed, the load lock chamber is evacuated, and the degree of vacuum is substantially the same as that in the vacuum film forming container. When the degree of vacuum is achieved, the load lock chamber (17
One of the tray support portions (302) of the arm (301) of the tray transfer arm mechanism (30) corresponding to (1)) is rotated to a position (Q2) facing the tray (2) at the film formation position (P). At the same time, the other tray support part (302) is pivotally moved to a position (Q1) facing the tray (2) on which the substrate (S) in the load lock chamber (17 (1)) is placed. Then, the tray elevating mechanism (5) is lowered to move the empty tray (2) at the film forming position to the one tray supporting portion (30).
2) and the load lock chamber (17)
In (1)), the tray elevating mechanism (4) lowers the tray (2) on which the substrate (S) has been placed and places it on the other tray support portion (302).

After that, the arm (301) is rotated so that the other tray supporting portion (302) and the substrate mounting tray (2) supported by the other tray supporting portion (302) face the film forming position (P) (Q).
2) and the one tray support part (30
2) is arranged at a position (Q1) facing the inner opening of the load lock chamber (17 (1)). Here, the substrate loading tray (2) is provided by the tray lifting mechanism (5) provided for the container (1).
Is raised from the other tray support part (302) to be arranged and held at the film forming position (P), and the one tray support part (3) arranged in the load lock chamber (17 (1)) is also held.
02), the empty tray (2) is lifted by the tray lifting mechanism (4) of the chamber, and is held at the position (Q3) where the opening inside the load lock chamber is closed. The empty arm (3
01) is returned to the standby position (Q41) described above, and film formation is started on the substrate (S) placed at the film formation position (P).
During the film formation, the one load lock chamber (17 (1))
At, the indoor pressure was vented to be approximately equal to atmospheric pressure,
In the same manner as described above, the next substrate (S) is loaded and placed on the tray (2) in preparation for the next film formation.

During the above operation, one of the load lock chambers (1
7 (1)), after the substrate is placed on the tray (2), when the inside of the chamber is brought to a predetermined vacuum degree substantially equal to the inside of the container (1), in the other load lock chamber (17 (2)), Similar to the case in one of the load lock chambers (17 (1)), the substrate placement on the tray (2) is completed, and the film formation on the substrate (S) arranged at the film formation position (P) is completed. Around the same time as
The evacuation of the other load lock chamber (17 (2)) is also completed, and the other load lock chamber (17 (2)) is also completed.
The tray supporting portion (302) of one of the arms (301) of the tray transfer arm mechanism (30) corresponding to (2)) is attached to the tray (2) that closes the other load lock chamber (17 (2)). It is arranged at the facing position (Q1) and the other empty tray support portion (302) of the arm is arranged at the lower position (Q2) of the film forming position tray (2).

Thus, the tray (2) supporting the substrate (S) on which the film formation is completed at the film formation position is lowered by the tray elevating device (5) in the container (1) and placed on the tray support section (302) which stands by. Simultaneously with loading, the tray (2) on which the next substrate (S) is loaded is lowered by the tray lifting device (4) in the other load lock chamber (17 (2)) and waits for the tray. Support (302)
Place on.

Then, the arm (301) is rotated,
The substrate on which the film has been formed (S) is placed in the other load lock chamber (17).
The second substrate (S) is arranged at a position (Q1) facing the (2)) and at a position (Q2) facing the film forming position (P). Subsequently, the tray elevating mechanism (4) in the other load lock chamber (17 (2)) raises the substrate support tray (2) for which film formation has been completed, and the load lock chamber (17 (2))
The tray (2) facing the film formation position (P) is moved up and the substrate (S) is placed at the film formation position (P). Start the membrane. Here, the arm (301) is rotated to the standby position (Q42) in the container (1). The other load lock chamber (17
In (2)), the venting operation is performed until the room pressure becomes substantially equal to the atmospheric pressure, the door (171) is opened, the film-formed substrate (S) is unloaded, and the next substrate (S) is loaded. It is placed on the tray (2) and the door (171) is closed again.

When the film formation of the second substrate (S) is completed, it is set in one of the load lock chambers (17 (1)).
Of the tray transfer arm mechanism (30) corresponding to
01), is placed on the tray support portion (302), is conveyed to the one side load lock chamber (17 (1)) side, and is discharged from the load lock chamber. Also, instead of this,
The tray (2) supporting the next substrate (S) that has already been prepared in the one load lock chamber (17 (1)) is loaded to the film formation position (P) side.

The above operation is repeated, and the substrate is carried in from one of the load lock chambers and, after the film formation, is carried out of the other load lock chamber. Then, each load lock chamber is efficiently used.

[0034]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 5 show an embodiment of the present invention,
FIG. 1 is a diagram schematically showing the overall configuration of one embodiment as viewed from above. FIG. 2 is a partial cross-sectional view of the film forming apparatus shown in FIG. 1, showing a state in which the substrate support tray is arranged immediately below the film forming position. FIG. 3 is a sectional view of a part of the film forming apparatus shown in FIG. 1, showing a state in which the substrate support tray is arranged at the film forming position. FIG. 4 is an operation explanatory view of the apparatus shown in FIG. 1, and FIG. 5 is a time chart showing operation timing of the main part of the apparatus shown in FIG. FIG. 6 is a sectional view showing a part of another embodiment of the present invention.

The film forming apparatus shown in FIGS. 1 to 5 is an IBS film forming apparatus. As shown in FIG. 1, this film forming apparatus includes a vacuum film forming container 10 in which two load-lock chambers 17 for loading and unloading a film-forming target substrate S are provided in series, and three vacuum film forming containers 10 arranged in the container 10. Substrate supporting trays 2, a total of two tray transfer arm mechanisms 30 provided for each load lock chamber 17, a total of two tray lifting mechanisms 4 provided for each load lock chamber 17, and a vacuum chamber. A tray elevating mechanism 5 provided for the film container 10 and a rotation driving mechanism 6 for rotating the tray 2 and the substrate S supported by the tray 2 during film formation.

A sputter target 11 is arranged in the container 10, and an ion source 12 for irradiating the sputter target 11 is provided. Below the target 11, there is a film formation position P on the film formation target substrate S, and a cover wall portion 130 (see FIGS. 2 and 3) continuing to the inner wall of the container 1 is formed around the film formation position P. Further, an exhaust device (not shown) is connected to the container 10, whereby the inside of the container 10 is set to a predetermined film forming vacuum degree.

Each of the load lock chambers 17 has the structure shown in FIGS. 2 and 3, except that the left-right direction and the arrangement position are different. An opening 172 communicating with the outside of each load lock chamber 17 is opened and closed by a door 171. Door 171
When the door is closed, is in airtight contact with the O-ring 173 mounted on the upper end surface around the opening. Container 1 of each load lock chamber 17
The inner opening 174 leading to the tray is opened and closed by the tray 2. An exhaust pipe 175 and a vent pipe 176 are connected to each load lock chamber 17, the exhaust pipe 175 is connected to an exhaust device (not shown), and the vent pipe 176 is connected to a vent gas supply unit (not shown). Further, a substrate holding tube 177 capable of holding the substrate S by a negative pressure action is provided on the lower surface of the door 171.
Is provided. This door 17 also serves as a handling arm of the handling machine 1a (2a) installed near each load lock chamber 17 as shown in FIG.
The machine can carry in a substrate S from which a film is to be formed into a load lock chamber 17 from a substrate transfer line (not shown), and can carry out the substrate from the load lock chamber 17. Lock room 17
Can be closed airtightly.

Each tray 2 has substantially the same structure as the conventional tray described above, and has an upper disc portion 21 and a lower cylindrical leg portion 22 integrally formed with the upper disc portion 21 and having a smaller outer diameter than the disc portion. A circular recess 23 for mounting the substrate S is formed on the upper surface of the disc portion 21. However, in this tray, the concave portion 23 is formed deeper than the conventional one, and the cushion rubber sheet 24 is laid on the bottom thereof, and the substrate S is placed thereon. Further, the airtight sealing O-ring 20 is mounted on the upper surface of the peripheral portion of the substrate supporting recess 23. This O-ring 20 is tray 2
When the inner opening 174 of the load lock chamber is closed, the airtight contact is made with the peripheral portion of the opening.

Each tray transfer arm mechanism 30 has a horizontal arm 301, which has a shaft bar 30 whose central portion is in the vertical direction.
3 has a circular ring-shaped tray support portion 302 which is supported by the upper end portion of each of the free end portions and has a ring portion partially cut away. The tray 2 has a tray support 3 at its legs 22.
02 can be fitted from above and can be boarded. Further, in this state, the tray supporting portion 30 is pushed up from below.
It is possible to move away from above 2 and rise. The shaft rod 3
03 is rotated by a rotation drive unit 304 provided outside the container 1. To explain further, the arm 301 is composed of the rotary drive unit 3
At 04, one (or the other) tray support 30
2 is located at the position Q1 facing the inner opening 174 communicating with the container 1 of the corresponding load lock chamber 17, and at the same time, the other (or one) tray support part 302 is located at the position Q2 facing the film forming position P. Further, both tray support parts 302 are rotated so that they can be located at the standby position Q41 (Q42) in the container 1.

It should be noted that the tray support portion 302 is externally fitted to the shaft rod at the cutout portion of the tray support portion even when the lifting shaft rod 42 of the tray lifting mechanism 4 described later is raised, or It can be moved so that it will not fit.
The tray elevating mechanism 4 in each load lock chamber 17 is the tray elevating mechanism 4 of the load lock chamber in the above-described conventional device.
It has the same structure and operation as. The mechanism 4 includes a vertical shaft rod 42 that supports the tray support member 41 at its upper end portion,
An outdoor drive unit 43 for raising and lowering the shaft rod 42 is included. Tray support portion 30 of arm 301 of tray transfer arm mechanism 30
The tray 2 supported by 2 and placed at the position Q1 is
When the tray support member 41 is raised by the driving of the drive unit 43, the tray support member 41 is supported and pushed up by the tray support member 41, and is arranged and held at the position Q3 that closes the opening 174 inside the load lock chamber. Further, by operating the drive unit 43 in the reverse direction from that position, the tray 2 at the position Q3 can be lowered and placed on the tray support unit 302 waiting below. Tray support member 41
The shape and size of the above can pass through the tray support portion 302 of the transfer arm mechanism 30 and can be raised and lowered.

The tray elevating mechanism 5 provided for the container 1 has the same structure and operation as the tray elevating mechanism 5 in the above-mentioned conventional apparatus. This mechanism 5
It has a horizontal arm 51, which is cantilevered at the upper end of a vertical shaft rod 52, and rotatably supports a tray holder 53 by a bearing 54 at its free end. The tray holder 53 has a shape and size capable of penetrating up and down the tray support portion 302 of the arm 301 of the tray transport arm mechanism 30, and can support the tray 2 from below by abutting the lower surface thereof. The shaft rod 52 is driven up and down by a drive unit 55 outside the container 1. The tray 2 placed at the position Q2 supported by the tray support portion 302 of the arm 301 has the lifting mechanism 5
When the holder 53 is raised by the operation of the driving unit 55, the holder 53 is supported by the holder 53 and pushed up to the film formation position P, and the substrate S supported by the tray 2 is arranged and held at the position P. In addition, by driving the drive unit 55 in the reverse direction from that state, the position P
The substrate S and the tray 2 supporting the substrate S can be lowered and placed on the tray support portion 302 waiting below.

The rotation drive mechanism 6 for rotating the tray 2 and the substrate S supported by the tray 2 during film formation has the same structure and operation as the rotation drive mechanism 6 in the above-mentioned conventional apparatus. The description is omitted here. The same parts as the conventional ones are given the same reference numerals. Further, a circular ring member 7 is provided at the film forming position P and is rotatably supported by the cover wall portion 130 via a support mechanism 8.

The circular ring member 7 has a substrate S on the lower surface of the inner peripheral edge.
It has a shallow step portion 71 that abuts the upper surface of the peripheral portion and a flat lower surface 72 that is continuous with the step portion 71. The flat lower surface 72 is a portion on which the O-ring 20 on the tray 2 is pressed. The support mechanism 8 is a ball bearing 81 with a cover.
The outer ring 811 includes an outer peripheral surface and a lower surface of the circular ring-shaped support member 911, and the circular ring-shaped pressing member 91 is screwed to the support member.
The upper surface is pressed by 2. And the support member 91
1 is fixed to the cover wall portion 130 with a screw.

The inner ring 812 of the bearing 81 has an upper surface and an inner peripheral surface surrounded by a circular ring-shaped support member 913.
The ring member 7 is fixed to this member with screws. The upper surface of the rear portion 73 of the ring member 7 is formed in a shallow step portion, and this step portion is pressed against the lower surface of the inner ring 812. Thus, the ring member 7 is the ball bearing 8
It is rotatably supported by the cover wall portion 130 via 1.

According to the film forming apparatus described above, film formation is performed according to the operation description shown in FIG. 4 and the time chart shown in FIG. In the time chart of FIG. 5, the numbers after the parts names of the load lock chamber 1, the load lock chamber 2, the rectangular valve 1, the transfer arm 1, etc. are the parts, and the number "1" is the first load lock chamber. 17 is related to the second load lock chamber 17. Similarly, “2” is related to the second load lock chamber 17. The first and second of the two load lock chambers 17 are shown by (1) and (2) in FIG. In addition, the "load lock chamber lifting mechanism" is the load lock chamber 17
The tray elevating mechanism 4 in FIG. 1, the “holder elevating mechanism” indicates the tray elevating mechanism 5 for the container 1, and the “transport arm” indicates the horizontal arm 3 in the tray transport arm mechanism 30.
01 (or its tray support portion 302) is shown.

In the time chart of FIG. 5, the operation lines of the handling machines 1a and 2a are shown in double layers, that is, while the machine is carrying in and out the substrate to and from the load lock chamber. This is because the substrate is transferred to and from the substrate transfer line. Initially, the door 171 that opens and closes the opening 172 that communicates with the outside of each load lock chamber 17 (1), 17 (2) is closed, and the tray 2 is supported by the tray elevating mechanism 4 in each load lock chamber. The opening 174 is held at the closing position Q3. Further, the arm 301 in each tray transfer arm mechanism 30 is set to the standby positions Q41, Q in the vacuum film forming container 1.
42. Further, in the vacuum film forming container 1, the holder 53 of the tray elevating mechanism 5 is raised to hold the empty tray 2 at the film forming position P. Initially, the film forming operation is not yet carried out (see FIG. 1 above).

Upon film formation, the inside of the vacuum film formation container 1 is evacuated to a predetermined film formation vacuum degree by an exhaust device (not shown). Then, the door 171 of one of the load lock chambers 17 (1) is opened, and the substrate S on which a film is to be formed is handled by the handling machine 1
In a, the tray 2 is loaded, the door is closed, the load lock chamber is evacuated through an exhaust pipe 175 by an exhaust device (not shown) for te seconds in the same manner as the conventional device, and the inside of the vacuum film forming container is closed. The degree of vacuum is approximately equal to.

Around the time when the degree of vacuum is reached, one of the tray supporting portions 302 of the arm 301 of the tray transfer arm mechanism 30 corresponding to the load lock chamber 17 (1) is placed at the film forming position P.
And move it to the position Q2 facing the tray 2 of
The other tray support 302 is attached to the load lock chamber 17 (1).
The substrate S is pivotally moved to a position Q1 facing the mounted tray 2 (see FIG. 4A). Note that in FIG. 4A, “OUT” and “film formation” are described for the substrate, and the film formation state is also in the time chart of FIG. 5, but at this point, the substrate “out” is also “OUT”. No film is formed.

Subsequently, the holder 53 of the tray lifting mechanism 5
And the empty tray 2 at the film formation position is placed on one tray support portion 302, and the load lock chamber 17
In (1), the tray elevating mechanism 4 lowers the tray 2 on which the substrate S has been placed, and places it on the other tray supporting portion 302 (see FIG. 4B). After that, the arm 301 is rotated 180 degrees in the opposite direction, and the other tray support portion 30 is rotated.
2 and the substrate mounting tray 2 supported thereon at the film forming position P
The tray support portion 302 is arranged at a position Q1 facing the inner opening 174 of the load lock chamber 17 (1) (see FIG. 4C).

Here, the holder 53 of the tray elevating mechanism 5 provided for the container 1 is raised to raise the substrate mounting tray 2 from the other tray supporting portion 302, and is arranged and held at the film forming position P and the load lock. The empty tray 2 is raised from the one tray support portion 302 arranged in the chamber 17 (1) by the tray elevating mechanism 4 of the chamber and is held at the position Q3 where the load lock chamber inside opening 174 is closed (FIG. 4).
(D)).

Next, the empty arm 301 is returned to the standby position Q41, while the substrate S placed at the film forming position P is returned.
Then, film formation is started (see FIG. 4E). The film is formed by irradiating the sputtering target 11 with ions from the ion source 12,
The sputtered particles thus generated are carried over to the surface of the substrate S.
During this film formation, in the load lock chamber 17 (1), a vent gas is supplied from a vent gas supply unit (not shown) through the vent pipe 176 to make the chamber pressure substantially equal to the atmospheric pressure, and the next substrate is processed in the same manner as described above. S is carried in and placed on the tray 2 to prepare for the next film formation (see FIG. 4 (F). “IN”)
Indicates loading of the substrate. ). In addition, in FIG.
Although there is a description of "T", at this time, the substrate has not been carried out yet.

During the above operation, the load lock chamber 17 (1)
In the load lock chamber 17 (2), after the first substrate placement on the tray 2 at a predetermined vacuum level substantially equal to that in the container 1, in the same manner as in the chamber 17 (1). The substrate placement on the tray 2 is completed (see FIG. 4B), and the vacuum exhaust in the chamber 17 (2) is completed at the same time as the completion of the film formation on the substrate S arranged at the film formation position P. Further, one tray support portion 302 of the arm of the tray transfer arm mechanism 30 corresponding to the chamber 17 (2) is arranged at a position Q1 facing the tray 2 closing the chamber 17 (2), and the other of the arms is empty. The tray support portion 302 is arranged at the lower position Q2 of the film formation position tray 2 ((A) to (E) of FIG. 4).
reference).

Thus, the tray 2 supporting the substrate S on which the film has been formed at the film forming position is held by the holder 5 of the tray elevating device 5.
At the same time when the tray 3 is placed on the tray support portion 302 which stands by by lowering 3, the tray elevating device 4 in the load lock chamber 17 (2) lowers the tray 2 on which the next substrate S is placed. , Awaiting tray support 302
(See FIG. 4 (F)).

After that, the arm 301 is rotated to move the film-formed substrate S to the position Q1 facing the load lock chamber 17 (2).
And the next substrate S at the position Q2 facing the film formation position P (see FIG. 4G). Then, the tray elevating mechanism 4 in the load lock chamber 17 (2) raises the film-forming substrate support tray 2 to dispose the inner opening 174 of the load lock chamber at the closing position Q3 and at the film formation position P. 2 is raised, the substrate S on it is placed at the film formation position P (see FIG. 4 (H)), and film formation is started. Further, here, the arm 301 is rotated to the standby position Q42 in the container 1. Furthermore, the load lock chamber 17
In (2), the venting operation is performed until the indoor pressure becomes substantially equal to the atmospheric pressure, the door 171 is opened, and the handling machine 2a is opened.
While the film-formed substrate S is carried out by, the next substrate S is carried in and placed on the tray 2, and the door 171 is closed again (FIG. 4).
(See (I) and (J)).

When the film formation on the second substrate S is completed, the second substrate S is placed on the tray support portion 302 of the arm of the tray transfer arm mechanism 30 corresponding to the load lock chamber 17 (1) and the load lock chamber 17 (1). To the side of the load lock chamber. Further, instead of this, the tray 2 supporting the next substrate S already prepared in the load lock chamber 17 (1) is carried in to the film formation position P side (see FIGS. 4 (I) to (L)). ).

The above operation is repeated, the substrate S is carried in from one of the load lock chambers 17 (1) and 17 (2), and after the film formation, the other load lock chamber 17 (2).
It is carried out from (17 (1)). Then, each load lock chamber is efficiently used. Throughput is 1 substrate /
In t seconds, the same throughput as that of the conventional apparatus can be achieved even though the apparatus configuration is simpler than the conventional one.

To further explain the film forming apparatus described above, in order to form a uniform film on the surface of the substrate S, the tray 2 supporting the substrate S and held at the film forming position is rotated by the rotation drive mechanism 6 during film formation. To be done. In this case, the upper surface of the peripheral edge of the substrate S placed at the position Q2, supported by the tray elevating mechanism 5 from below, pushed up and placed at the film forming position P is supported by the support mechanism 8 on the cover wall portion 130. Abutting on the inner peripheral edge step 71 of the ring member 7 rotatably supported by
The airtight sealing O-ring 20 mounted on the tray 2 supporting the substrate S elastically and airtightly contacts the flat lower surface 72 of the ring member 7 to be sandwiched between the ring member 7 and the tray 2 to form a film. When the tray 2 is rotationally driven during operation, the ring member 7 is driven to rotate by the frictional force between the sealing O-ring 20 and the ring member 7, and thus the substrate S is sandwiched between the ring member 7 and the tray 2. Thus, the tray 2 is rotationally driven without slipping, a desired high speed rotation is achieved, and a film is uniformly formed on the substrate S.

Further, since the O-ring 20 is in airtight contact with the ring member 7, film formation on the mechanisms 30, 5, 6 and the like is reliably prevented, and the load lock chamber inner opening 174 is formed.
O-ring 20 for airtight seal on tray involved in blockage
Film is also prevented from being deposited on the surface of the load lock chamber, so that the tray 2 can surely close the load lock chamber inside opening 174 in an airtight manner.

Further, since the cushion rubber sheet 24 is laid under the substrate S on the tray 2, the impact on the substrate S when the substrate S is brought into contact with the ring member 7 is alleviated thereby. Although one embodiment has been described above, FIG. 6 shows another embodiment. This embodiment has the same structure and operation as the above embodiment except for the following points, and the same parts as the above embodiment are designated by the same reference numerals.

In this embodiment, instead of the cover wall portion 130, the same cover wall portion 13 as in the conventional apparatus is used. Then, instead of providing the O-ring 20 for airtight sealing on each tray 2, an O-ring 200 in which the peripheral upper surface of the tray 2 at the position Q3 airtightly contacts the peripheral portion of the inner opening 174 of each load lock chamber 17. It is installed.
Each tray 2 has the same structure as in the conventional apparatus, and the upper surface of the peripheral edge of the substrate S supported by this tray is arranged close to the inner peripheral portion of the cover wall 13 during film formation.

The apparatus of the embodiment described above is a film forming apparatus by ion beam sputtering, but the present invention can also be applied to a film forming apparatus such as an ion vapor deposition thin film forming (IVD) apparatus.

[0062]

According to the present invention, it is possible to provide a film forming apparatus in which the entire structure is simplified and can be manufactured at a low cost, and the individual load lock chambers can be efficiently used to achieve a desired throughput. .

[Brief description of drawings]

FIG. 1 is a diagram schematically showing an overall configuration of an embodiment of the present invention when viewed from above.

2 is a cross-sectional view of a part of the film forming apparatus shown in FIG. 1, showing a state in which a substrate support tray is arranged immediately below a film forming position.

FIG. 3 is a partial cross-sectional view of the film forming apparatus shown in FIG. 1, showing a state in which a substrate support tray is arranged at a film forming position.

FIG. 4 is an operation explanatory diagram of the apparatus shown in FIG.

5 is a time chart showing the operation timing of the main part of the apparatus shown in FIG.

FIG. 6 is a cross-sectional view showing a part of another embodiment of the present invention.

FIG. 7 is a diagram schematically showing the overall configuration of a conventional film forming apparatus as viewed from above.

8 is a cross-sectional view of a portion of the device shown in FIG.

9 is a time chart showing operation timings of main parts of the apparatus shown in FIG.

[Explanation of symbols]

 1 Vacuum Film Forming Container 11 Sputter Target 12 Ion Source 13, 130 Cover Wall 17 Load Lock Chamber 171 Load Lock Chamber Door S Substrate 2 Substrate Support Tray 20, 200 Airtight Seal O-ring 23 Substrate Placement Recess 24 Cushion Rubber Sheet 30 tray transfer arm mechanism 301 horizontal arm of mechanism 30 302 tray support part of arm 301 4 tray elevating mechanism 41 tray supporting member of mechanism 5 tray elevating mechanism 53 tray holder of mechanism 5 6 rotation drive mechanism 7 ring member 71 member 7 Substrate abutting stepped portion 72 O-ring abutting flat surface of the member 7 Support mechanism of the ring member 7 81 Ball bearing 811 Bearing outer ring 812 Bearing inner ring 1a, 2a Handling machine P Film forming position Q1 Position facing inner opening of load lock Q2 film formation position Close the load lock chamber side opening of the position Q3 tray 2 facing the P position Q41, Q42 standby position of the arm 301

Claims (1)

[Claims] 1. A vacuum film forming container in which two load lock chambers for loading and unloading a film formation target substrate are respectively provided in series, and an inner opening of the load lock chamber communicating with the inside of the load lock chamber. A plurality of substrate support trays that also serve as inner lids that are opened and closed, and a tray transfer arm mechanism provided for each of the load lock chambers, each arm having tray support portions at both ends, and one tray support portion Of the load lock chamber, the arm is installed so that the other tray supporting portion can face the film forming position at the same time as facing the inner opening of the corresponding load lock chamber. A tray raising / lowering mechanism that is supported by a tray supporting portion on the arm of the corresponding tray transport arm mechanism and is located at a position facing the load lock indoor opening. The tray support part on the arm can be raised from the tray support part to be arranged and held at the inner opening closed position, and conversely, the tray arranged at the closed position can be lowered to be arranged at a position facing the inner opening. And a tray elevating mechanism provided for the vacuum film forming container, the tray elevating mechanism being disposed at a position facing the film forming position by being supported by a tray supporting portion on an arm of one tray transfer arm mechanism. The tray can be raised from the tray support portion to be arranged and held at the film forming position, and conversely, the tray arranged at the film forming position is lowered to be arranged at a position facing the film forming position. A film forming apparatus comprising: a mechanism that can be placed on a tray support portion on an arm of the mechanism.