JPH07307544A - Hybrid ic printed wiring board - Google Patents

Abstract

PURPOSE:To enable clip terminals to be enhanced in number of pins and lessened in pitch without enlarging an HIC in size. CONSTITUTION:A second pads 6 are provided between first pads 5 which form a pad group. A clip 9 of a clip terminal 3 is fixed to each first pad 5 and second pad 6. The leads 10 of the clip terminals 3 mounted on the first pads 5 and the other leads 10 of the clip terminals 3 mounted on the second pads 6 are not arranged on the same line but in zigzag as a whole.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board for a hybrid IC in which a clip portion of a clip terminal is attached to a plurality of pads provided on at least one side.

[0002]

2. Description of the Related Art In order to realize a lighter, thinner, smaller, and more highly functionalized electric device, it is essential to increase the mounting density of a printed wiring board that constitutes the heart of the electric device. Therefore, in recent years, the number of printed wiring boards mounted with hybrid ICs (hereinafter abbreviated as HICs) has been increasing in place of conventional monolithic ICs.

FIG. 11 shows a circuit module 30 using a resin printed wiring board 31 as an example of the HIC. A plurality of electronic components (not shown) including an IC chip (not shown) are surface-mounted on both front and back surfaces of a printed wiring board 31 which constitutes the circuit module 30. A pad group is formed on one side of the printed wiring board 31. Each of the pads 33 forming the pad group includes a clip portion 35 of the clip terminal 34.
Is installed. Lead portion 36 of clip terminal 34
Is another printed wiring board (so-called motherboard) 37
Are inserted into the through holes 38 provided in a row.
Then, soldering is performed in this state.

[0004]

When manufacturing the circuit module 30 as described above, a metal member called a so-called clip lead frame is generally used. In the case of this metal member, a large number of clip terminals 34 are supported by a band-shaped frame portion at a constant pitch (for example, 2.54 mm, 2.50 mm, 2.00 mm, 1.80 mm). Therefore, normally, the pitch of the pads 33 on the printed wiring board 31 side is set with reference to the pitch of the clip terminals 34. Further, the circuit module 30 is usually manufactured through the steps of mounting the clip portion 35 on the printed wiring board 31, soldering by solder dipping, and cutting the frame portion.

However, in the case of the conventional printed wiring board 31 for the circuit module 30, since the pitch of the pads 33 is restricted by the pitch of the clip terminals 34, the pitch of the clip terminals 34 can be sufficiently narrowed. I couldn't. Moreover, in order to increase the number of pins of the clip terminal 34, the circuit module 30 itself must be increased in size. Furthermore, although some spaces 39 are provided between the pads 33 on the printed wiring board 31 side to secure a distance for insulation, these spaces 39 have not been effectively used.

The present invention has been made in view of the above circumstances. A first object of the present invention is to provide an HIC for a multi-pin narrow pitch clip terminal without increasing the size of the HIC. To provide a printed wiring board. Recently, IC chips have been directly mounted on a substrate and connected by wire bonding.

A second object of the present invention is to provide a printed wiring board for HIC suitable for easily and inexpensively manufacturing a multi-pin narrow-pitch HIC. Further, a third object of the present invention is to provide a printed wiring board for a HIC that can reduce the defective product occurrence rate and improve workability when manufacturing a multi-pin narrow-pitch HIC. .

[0008]

In order to solve the above-mentioned problems, according to the invention described in claim 1, a pad group is provided on at least one side, and each pad constituting the pad group is provided with a clip terminal. In a printed wiring board for an HIC equipped with a clip part, a second pad is provided in a space between the first pads forming the pad group, and a clip part of a clip terminal is attached to the second pad. And a printed wiring board for an HIC in which the lead portion of the clip terminal attached to the first pad and the lead portion of the clip terminal attached to the second pad are arranged on a non-coincident line. I am trying.

The invention according to claim 2 is, in the invention according to claim 1, characterized in that the lead portions are arranged in a zigzag pattern. According to the invention of claim 3,
In the invention according to claim 2, a clip terminal including a clip portion having a pair of contacts and a lead portion provided at a position eccentric to one side of the pair of contacts is used, and the second clip terminal is used. The gist of the invention is that the direction of the contact when the clip portion is attached to the pad is opposite to that when the clip portion is attached to the first pad. According to a fourth aspect of the present invention, in the third aspect of the present invention, a display for identifying the first pad and the second pad is provided in the portion where the pad group is provided. It is a summary.

[0010]

According to the invention described in claims 1 to 4, since the second pad is provided in the space between the first pads, the clip terminal can be further mounted between the existing clip terminals. Further, since the lead portion of the existing clip terminal and the lead portion of the newly provided clip terminal are arranged on a non-coincident line, a predetermined space is secured between the adjacent lead portions.

According to the third aspect of the present invention, since the lead portion uses the clip terminal eccentric to the position on one side of the contact, it is only necessary to reverse the direction of the contact when mounting the clip portion. , It is relatively easy to stagger the leads. Therefore, the step of staggering the lead portions by bending using a die or the like is not required. According to the invention described in claim 4, it is possible to correctly identify whether the pad is the first pad or the second pad by looking at the display attached to the pad.

[0012]

【Example】

[Embodiment 1] Hereinafter, Embodiment 1 in which the printed wiring board for HIC of the present invention is embodied as a printed wiring board for a lead insertion mounting type circuit module, which is a kind of HIC, will be described in detail with reference to FIGS. Explained.

FIG. 1 shows a printed wiring board 2 which constitutes a circuit module 1. In this embodiment, a rectangular resin substrate using glass epoxy as a base material is used. Conductor patterns (not shown) are formed on the front surface S1 and the back surface S2 of the printed wiring board 2 by a conventionally known process such as a subtractive method. Then, on the conductor patterns on the front surface S1 and the back surface S2 of the printed wiring board 2, a plurality of electronic components (all not shown) including an IC chip are mounted in advance.

A pad group for mounting the clip terminal 3 is formed on one of the long sides of the printed wiring board 2. The pad group is the surface S1 of the printed wiring board 2.
And the back surface S2 are formed in the same number. One pad group consists of 20 rectangular pads (10 of each of the first pad 5 and 10 of the second pad 6). The pitch of the first pads 5 forming the pad group is equal to the pitch of the clip terminals 3 in the clip lead frame 7 (2.00 mm in this embodiment).

As shown in FIGS. 1 and 2B, the first
The second pad 6 is provided in the space between the pads 5. The pitch of the second pads 6 is also the same as that of the first pads 5.
Similarly, the pitch is the same as the pitch of the clip terminals 3 in the clip lead frame 7.

3 (a) and 3 (b) show a clip lead frame 7 used in this embodiment. The strip-shaped frame portion 8 forming the clip lead frame 7 supports a large number of clip terminals 3 at a constant pitch. Each clip terminal 3 includes a clip portion 9 having a pair of contacts 11 and 12, and a linear lead portion 10. The clip portion 9 and the frame portion 8 are connected via the lead portion 10. In this embodiment, the widths of the clip portion 9 and the lead portion 10 are both equal and are 0.45 mm.

As shown in FIGS. 2 (a) and 3 (a), the clip portion 9 is formed by bending the tips of metal pieces having the same width protruding from the frame portion 8 at four places. If the first to fourth bent portions F1, F2, F3, and F4 are sequentially arranged from the base end side of the metal piece, the fourth bent portion F
4 serves as the first contact 11 in the clip portion 9. The area between the first bent portion F1 and the second bent portion F2 is the second contact 12 in the clip portion 9.
Becomes As shown in FIGS. 2A and 3A, in the case of the clip terminal 3 of this embodiment, the second contact 12 is used.
The lead portion 10 is provided at a position eccentric to the side.

Between the pair of contacts 11 and 12,
An interval slightly smaller than the thickness of the printed wiring board 2 is maintained. Further, the pair of contacts 11 and 12 have spring properties as a whole. Therefore, the pair of contacts 1
The outer peripheral portions of the printed wiring board 2 can be held by the terminals 1 and 12.

As shown in FIGS. 1 and 2B, the first
The clip portion 9 of the clip terminal 3 is attached to each of the pad 5 and the second pad 6. And
The first pad 5 and the second pad 6 and the clip portion 9 are joined via solder.

As shown in FIGS. 1 and 2B, the second
The directions of the contacts 11 and 12 when the clip portion 9 is attached to the pad 6 are opposite to those when the clip portion 9 is attached to the first pad 5. In the case of this embodiment, the surface S1
The first contact 11 of the clip portion 9 comes into contact with the first pad 5 of the pads 5 and 6 on the side. On the other hand, on the second pad 6 on the surface S1 side,
The second contact 12 of the clip portion 9 comes into contact. Further, on the back surface S2 side of the printed wiring board 2, the opposite relationship is established. Therefore, the first pad 5
The lead portion 10 of the clip terminal 3 attached to the second pad 6 and the lead portion 10 of the clip terminal 3 attached to the second pad 6 are not on the same line. In particular, in the case of this printed wiring board 2, the lead portions 10 are arranged in a so-called zigzag pattern because the first pads 5 and the second pads 6 are arranged alternately.

FIG. 1 shows a mother board 13 for mounting the circuit module 1. Motherboard 1
The lead portion 10 of the circuit module 1 is provided at a predetermined portion of 3.
Twenty through holes 14 are formed in a zigzag pattern so as to correspond to the arrangement. The lead portion 10 is adapted to be soldered while being inserted into these through holes 14.

Next, a procedure for manufacturing the circuit module 1 will be described. First, the surface S of the printed wiring board 2
Electronic components are mounted on 1 and the back surface S2, and if necessary, the electronic components are sealed with resin.

Next, two clip lead frames 7 having 10 clip terminals 3 are prepared. Then, using one of them, each clip portion 9 is attached to the first pad 5. At this time, be careful so that the first contact 11 contacts the first pad 5 on the surface S1 side. After this step, as shown in FIG.
Every ten clip terminals 3 are attached. Then, using the remaining one, each clip part 9 is attached to the second pad 6. At this time, care is taken so that the second contact 12 contacts the second pad 6 on the surface S1 side. After this step, as shown in FIG. 4B, the clip terminals 3 are attached to all the pads 5 and 6.

Next, each clip 9 and the pads 5 and 6 are soldered by performing a solder dip. Here, if necessary, the entire printed wiring board 2 is molded (sealed) with resin. Finally, as shown in FIG. 4C, the lead portion 10 and the frame portion 8 are cut using a mold or the like. Then, the circuit module 1 as shown in FIG. 1 can be obtained.

Now, the function and effect of the printed wiring board 2 for the circuit module 1 of this embodiment will be described. In this printed wiring board 2, the second space is provided in the space between the first pads 5.
Pad 6 is provided. Therefore, if the clip terminal 3 mounted on the first pad 5 is regarded as the existing clip terminal 3, another clip terminal 3 can be mounted between them. Therefore, the number of clip terminals 3 can be doubled and the pitch thereof can be halved (1.00 mm in this embodiment) without particularly changing the size of the printed wiring board 2. Therefore, without increasing the size of the circuit module 1, the clip terminal 3
It is possible to achieve a multi-pin narrow pitch. With the circuit module 1 as described above, the increase in the number of signals enables high-speed signal exchange with the mother board 13.

In the printed wiring board 2, the lead portion 10 of the clip terminal 3 mounted on the first pad 5 is also included.
And the lead portions 10 of the clip terminals 3 attached to the second pads 6 are arranged on a non-coincident line, more specifically in a staggered pattern. Therefore, a predetermined space is secured between the adjacent lead portions 10. Therefore, even when the through holes 14 are provided on the motherboard 13 side, the pitch between the through holes 14 does not become extremely narrow.
Therefore, as compared with the case where the lead portions 10 are provided on the same line, for example, there is an advantage that it is suitable for narrowing the pitch of more pins.

Furthermore, in this printed wiring board 2, the clip terminal 3 in which the lead portion 10 is eccentric to the position on one side of the contacts 11 and 12 is used. For this reason, the lead portions 10 can be formed in a zigzag shape relatively simply by merely reversing the directions of the contacts 11 and 12 when mounting the clip portion 9. Therefore, the step of forming the lead portions 10 in a zigzag shape by bending using a die or the like is not particularly required. Therefore, the circuit module 1 can be manufactured easily and inexpensively as compared with the case where the lead terminal 10 uses the clip terminal 3 located substantially in the center of the contacts 11 and 12.

In the case of this printed wiring board 2, the width of the clip portion 9 is 0.45 mm, which is the same as the width of the lead portion 10. Therefore, the width of the first pad 5 and the second pad 6 can also be narrowed to about 0.45 mm.
Therefore, the second pad 6 is provided in the space between the first pads 5.
Even with the configuration in which the above is provided, a space required for insulation can be secured between the first pad 5 and the second pad 6.

To manufacture the printed wiring board 2, two clip lead frames 7 having the same pitch of the clip terminals 3 are used. Therefore, for example, the clip portion 9 can be attached very easily as compared with the case where the clip terminals 3 in the separated state are attached individually. The clip terminals 3 are supported by the frame portion 8 at a constant pitch, and are further supported with the contacts 11 and 12 oriented in the same direction. Therefore,
A mistake in mounting the clip terminal 3 is unlikely to occur. [Embodiment 2] Next, a printed wiring board 15 for a circuit module of Embodiment 2 will be described in detail with reference to FIG.

The basic structure of the printed wiring board 15 of this embodiment is almost the same as the basic structure of the printed wiring board 2 of the first embodiment. For this reason, common members are given the same numbers, and detailed description thereof is omitted.

A pad group is formed on one of the long sides of the printed wiring board 15. The same number of pads are formed on both the front surface S1 and the back surface S2 of the printed wiring board 15. One pad group consists of 20 rectangular pads (the first pad 5 and the second pad 6 are each 10
Each). First pad 5 forming a pad group
Is equal to the pitch of the clip terminals 3 in the clip lead frame 7 (2.00 mm in this embodiment). The same applies to the pitch of the second pads 6.

In the vicinity of the first pad 5 formed on the surface S1 side of the printed wiring board 15, a circular and filled mark M1 is silk-screen printed.
On the other hand, in the vicinity of the second pad 6 formed on the surface S1 side, a circular mark M2 whose inside is not filled is similarly silk-screen printed. That is, these two types of marks M1 and M2 serve as a display for distinguishing the first pad 5 from the second pad 6.

Next, a procedure for manufacturing the circuit module 16 of the second embodiment will be described. First, the mark M is formed on the printed wiring board 15 on which a conductor pattern (not shown) is formed.
1 and M2 are formed. In this embodiment, the marks M1 and M2 are simultaneously formed when silk-screen printing characters or symbols on the surface S1 side. Therefore, the screen plate and screen ink used are common. next,
Electronic components are mounted on the front surface S1 and the back surface S2 of the printed wiring board 15. Then, if necessary, the electronic component is sealed with resin.

Next, two clip lead frames 7 having 10 clip terminals 3 are prepared. Then, using one of them, each clip portion 9 is attached to the first pad 5. At this time, the first pad 5 on the front surface S1 side, that is, the first pad 5 having the mark M1 attached thereto
Attention should be paid to the first contact 11.
After this step, every ten clip terminals 3 are attached. Then, using the remaining one,
Each clip portion 9 is attached to the second pad 6. At this time, it is noted that the second contact 12 is arranged on the second pad 6 on the surface S1 side, that is, the second pad 6 having the mark M2. After this step, the clip terminals 3 are attached to all the pads 5 and 6.

Next, each clip portion 9 and the pads 5 and 6 are soldered by performing a solder dip. Here, if necessary, the entire printed wiring board 15 is molded (sealed) with resin. Finally, the lead portion 10 and the frame portion 8 are cut using a mold or the like. Then, the circuit module 16 as shown in FIG. 5 is obtained.

Even with the printed wiring board 15 having the above-mentioned structure, it is possible to obtain the same effects as those of the first embodiment. In particular, in the case of this printed wiring board 15, by observing the marks M1 and M2 attached to the pads 5 and 6, it is possible to correctly determine whether the pads 5 and 6 are the first pad 5 or the second pad 6. Can be identified.
Therefore, when the clip terminal 3 is mounted, the probability that the directions of the contacts 11 and 12 are mistaken becomes small. Therefore, it is possible to reduce the defective product generation rate and improve workability when the circuit module 16 is manufactured.

Further, on the printed wiring board 15, marks M1 and M2 are simultaneously formed when silk-screen printing characters and symbols. Therefore, the marks M1 and M2
No special equipment or process is required for printing the. Therefore, the cost is not increased by forming the marks M1 and M2. [Third Embodiment] Next, a printed wiring board 17 for a circuit module of a third embodiment will be described in detail with reference to FIGS.

The basic structure of the printed wiring board 17 of this embodiment is also substantially the same as the basic structure of the printed wiring board 2 of the first embodiment. For this reason, common members are given the same numbers, and detailed description thereof is omitted.

As shown in FIG. 6, the printed wiring board 1
A pad group is formed on one of the long sides of 7.
The pads are the front surface S1 and the back surface S2 of the printed wiring board 17.
The same number is formed on both. One pad group
It is composed of 20 rectangular pads (10 first pads 5 and 10 second pads 6). First
The pitch of the pads 5 and the pitch of the second pads 6 are both 2.00 mm.

In the case of this printed wiring board 17, FIG.
As shown in (a), a clip lead frame 20 having a clip terminal 19 having a side surface shape different from that of the first embodiment is used. The strip-shaped frame portion 21 forming the clip lead frame 20 includes a large number of clip terminals 1
9 is supported at a constant pitch. In this example,
The pitch is 1.00 mm. Each clip terminal 19 includes a clip portion 22 including a pair of contacts 22a and 22b.
And a linear lead portion 23. In this embodiment, the lead portion 23 has a width of 0.45 mm and the clip portion 2 has a width of 0.45 mm.
The width of 2 is 1.00 mm. The clip portion 22
Is formed by pushing the tip of the metal piece protruding from the frame portion 21 to the left and right. As shown in FIG. 7A, in the case of this clip terminal 19, the lead portion 23 is not eccentric to either of the contacts 22a and 22b. Therefore, when the clip terminal 19 is viewed from the side, it is substantially symmetrical with respect to the lead portion 23.

Next, a procedure for manufacturing the circuit module 18 of the third embodiment will be described. First, printed wiring board 1
Electronic components are mounted on the front surface S1 and the back surface S2 of 7. Next, one clip lead frame 20 having 20 clip terminals 19 is prepared, and the clip portions 22 are attached to all the pads 5 and 6. Next, each clip portion 22 and the pads 5 and 6 are soldered by performing a solder dip. Next, as shown in FIG. 7B, the lead portion 23 and the frame portion 21 are cut using a mold or the like. Finally, lead forming is performed as shown in FIG. 7C using a dedicated jig. That is, every other lead portion 23 of each clip terminal 19 is bent in the opposite direction, so that the lead portions 23 are staggered.
Then, the circuit module 18 as shown in FIG. 6 is obtained.

Even with the configuration of the printed wiring board 17 as described above, it is possible to obtain substantially the same operational effects as those of the first embodiment. That is, it is possible to achieve a multi-pin narrow pitch of the clip terminals 19 without increasing the size of the circuit module 18. With the circuit module 18 as described above, signals can be exchanged with the mother board 13 at high speed. Further, since the lead portions 23 are arranged in a zigzag pattern, a predetermined space is secured between the adjacent lead portions 23. Therefore, even when the through holes 14 are provided on the motherboard 13 side, the pitch between the through holes 14 does not become extremely narrow. Therefore, there is an advantage that it is suitable for narrowing the number of pins.

In particular, in the case of this printed wiring board 17, only one clip lead frame 20 having the clip terminals 19 having symmetrical side shapes is used, and each clip portion 22 is mounted at once. Therefore, the mounting of the clip portion 22 does not require labor, and the workability in manufacturing the circuit module 18 is excellent. Moreover, with this configuration, it is not necessary to consider the orientations of the contacts 22a and 22b when mounting the clip portion 22. Therefore, a mistake in mounting the clip terminal 19 is unlikely to occur.

According to the method of manufacturing the printed wiring board 17 as in the third embodiment, the clip terminal 19 is basically used.
There is an advantage that the side shape of irrespective of whether it is symmetrical or asymmetrical. It is also possible to adjust the distance between the lead portions 23 to some extent by changing the lead forming jig.

The present invention is not limited to the above embodiment, but can be modified as follows. (1) A printed wiring board 25 of another example 1 having the clip terminal 24 having a shape as shown in FIGS. 8A and 8B may be used. Similarly, a printed wiring board 27 of another example 2 having a clip terminal 26 having a shape as shown in FIGS. 9A and 9B may be used. These clip terminals 24,
26 has in common that it has clip portions 24a and 26a formed by pushing the tip of the metal piece to the left and right. In addition, it is also common that the side surface shape is asymmetric. Even with the above configuration, it is possible to obtain the same effects as those of the first embodiment.

The width of the clip portion 24a of the first modification is narrower than the width of the clip portion 26a of the second modification.
The width of the clip portion 9 of the first embodiment is narrower than that of the clip portion 24a. Therefore, in the case of the first embodiment, the widths of the pads 5 and 6 can be made narrowest. Therefore, the configuration of the first embodiment is most preferable in order to narrow the pitch of the multi-pins, and then the first and second examples are preferable in this order.

(2) A display different from the marks M1 and M2 illustrated in the second embodiment may be formed. For example, the printed wiring board 2 of another example 3 shown in FIG.
8, solid line marks M3 and dotted line marks M4 are silk screen printed at the first position and the last position where the clip terminal 3 is attached. The solid line mark M3 shows the first pad 5, and the dotted line mark M4 shows the second pad 6. Further, in the printed wiring board 29 of the other example 4 shown in FIG. 10B, the numbers indicating the numbers of the clip terminals 3 for the pads 5 and 6 are “1”, “2”,
Silk screen printing such as "3" ... "20".

Even with the above structure, it is possible to obtain the same effects as those of the second embodiment. That is, in the printed wiring board 28, the direction in which the contacts 11 and 12 should be mounted can be correctly recognized by the difference between the solid line and the dotted line. On the printed wiring board 29, the direction in which the contacts 11 and 12 should be mounted can be correctly recognized by the difference between the odd number and the even number. Of course, these displays may be formed on both surfaces of the printed wiring boards 28 and 29. Further, in addition to the display as in the second embodiment and the third and fourth examples, a display using characters such as Roman letters, katakana, hiragana, and kanji may be used. In addition, the first pad 5
The display color may be changed between the second pad 6 and the second pad 6. The display may be formed by a method other than silk screen printing.

(3) For example, the side shape of the clip portion 9 of the clip terminal 3 mounted on the first pad 5 does not necessarily have to be the same as that of the second pad 6. (4) The positions at which the clip terminals 3, 19 ... Are mounted are not limited to one side of the printed wiring boards 2, 15 ... and may be two or more sides. By adopting a configuration in which the circuit modules 1, 16 and 18 are mounted on two or more sides, it is possible to realize a large number of pins while avoiding an increase in size of the circuit modules 1, 16 and 18.

(5) The pads 5 and 6 are not necessarily provided on both sides of the printed wiring boards 2, 15 ... One by one, but may be provided on only one side. With this configuration, it is possible to achieve a narrower number of pins and a narrower pitch.

(6) The printed wiring boards 2, 15 ... Are not limited to those having a resin substrate as a main material, but may have a ceramic substrate or a metal substrate as a main material. Further, it is of course possible to embody the present invention in a device other than the circuit modules 1, 16 and 18, such as a display tube.

(7) The circuit modules 1, 16 and 18 are not limited to the lead insertion mounting type as in the first to third embodiments, but may be the surface mounting type. The surface mount type does not need to form the through holes 14 on the mother board 13 side, which is convenient for achieving a narrow pitch.

(8) When manufacturing the printed wiring board 17 of Example 3, the lead portions 23 may be cut before the solder dipping. Further, the lead forming and the cutting of the lead portion 23 may be performed at the same time. This method can make the work more efficient.

Here, in addition to the technical ideas described in the claims, the technical ideas grasped by the above-described embodiments and other examples will be listed below together with their effects. (1) The method for manufacturing a printed wiring board for an HIC according to claim 2 or 3, wherein two clip lead frames having the same pitch are used to attach the clip portion of the clip terminal to each pad. With this method, the clip portion can be attached easily and accurately.

(2) After mounting the clip portion of each clip terminal supported by one clip lead frame on each pad, the lead portion is cut from the frame portion, and every other lead portion is reversed. The method of manufacturing a printed wiring board according to claim 2, wherein the printed wiring board is bent in a direction. With this method, it is possible to attach the clip portion without labor and improve workability.

(3) In claims 1 to 3, a clip terminal having a clip portion having a width substantially the same as the width of the lead portion is used. With this configuration, it is possible to more reliably achieve the narrowing of the number of pins.

The technical terms used in this specification are defined as follows. "Clip terminal: Not only a metal member which has a pair of contacts having a pair of contacts capable of sandwiching the outer edge portion of a printed wiring board and a lead portion and has an asymmetric side surface shape, for example, a metal member having a symmetrical side surface shape , Also means a metal member or the like having only one contact. ”

[0058]

As described above in detail, according to the printed wiring board for HIC according to the first to fourth aspects, the clip terminal is also attached to the second pad provided in the space between the first pads. Therefore, it is possible to achieve a multi-pin narrow pitch of the clip terminals without increasing the size of the HIC.

According to the third aspect of the present invention, the lead portions can be formed in a zigzag pattern relatively easily by simply reversing the direction of the contacts when mounting the clip portions. It is possible to easily and inexpensively manufacture the HIC having a narrow pin pitch. Further, according to the invention described in claim 4, since the probability of mistaking the orientation of the contacts is reduced, it is possible to reduce the defective product occurrence rate and improve the workability when manufacturing a multi-pin narrow-pitch HIC. it can.

[Brief description of drawings]

FIG. 1 is a partial schematic perspective view showing a circuit module using a printed wiring board for HIC of Example 1 and a motherboard for mounting the same.

FIG. 2 (a) is a partial schematic side sectional view showing one side of a printed wiring board to which clip terminals are attached, and FIG. 2 (b) is a partial schematic front view thereof.

3A is a side sectional view of a clip lead frame, FIG.
(B) is the partial front view.

4 (a) to (c) are schematic front views showing a procedure for manufacturing the printed wiring board of Example 1. FIG.

FIG. 5 is a partial schematic perspective view showing a circuit module using the printed wiring board for HIC of Example 2 and a motherboard for mounting the same.

FIG. 6 is a partial schematic perspective view showing a circuit module using a printed wiring board for HIC of Example 3 and a motherboard for mounting the same.

7A to 7C are schematic front views showing the procedure for manufacturing the printed wiring board of Example 3.

8A is a partial side sectional view showing a circuit module using a printed wiring board for HIC of another example 1, and FIG. 8B is a partial front view thereof.

9A is a partial side sectional view showing a circuit module using a printed wiring board for HIC of another example 2, and FIG. 9B is a partial front view thereof.

10A and 10B are a third example and a fourth example, respectively.
FIG. 6 is a partially cutaway front view showing a circuit module using the printed wiring board for HIC of FIG.

FIG. 11 is a partial schematic perspective view showing a circuit module using a conventional printed wiring board for HIC and a motherboard for mounting the same.

[Explanation of symbols]

1, 16, 18 ... Circuit module as hybrid IC, 2, 15, 17, 25, 27, 28, 29 ... Printed wiring board, 3, 19, 24, 26 ... Clip terminals, 5
... (first) pad, 6 ... (second) pad, 9, 2
2, 24a, 24a ... Clip portion, 10, 23 ... Lead portion, 11, 12, 22a, 22b ... Contact, M1 ...
M4: Mark as a display.

Claims (4)

[Claims] 1. A printed wiring board for a hybrid IC in which a pad group is provided on at least one side, and a clip portion of a clip terminal is attached to each pad constituting the pad group, wherein the pad group is formed. The second pad is provided in the space between the first pads, the clip portion of the clip terminal is attached to the second pad, and the lead portion of the clip terminal attached to the first pad and the first pad are provided. Two
A printed wiring board for a hybrid IC in which the lead portion of the clip terminal attached to the pad is arranged on a non-coincident line. 2. The lead portions are arranged in a staggered pattern.
A printed wiring board for a hybrid IC as described in 1. 3. A clip portion having a pair of contacts,
A clip terminal including a lead portion provided at a position eccentric to one side of the pair of contacts is used, and the orientation of the contact when the clip portion is attached to the second pad is set to the first direction. The printed wiring board for a hybrid IC according to claim 2, wherein the printed wiring board is mounted in the opposite direction to the one mounted on the pad. 4. A first portion is provided in a portion where the pad group is provided.
The printed wiring board for a hybrid IC according to claim 3, wherein a display is provided to identify the pad and the second pad.