JPH07297372A - Semiconductor integrated circuit, its manufacture and its measuring method - Google Patents

Abstract

PURPOSE:To recognize the condition of each output terminal without probing the output terminal by providing a plurality of output circuits composed of power-potential side switches, ground-potential side switches, and output terminals, and providing conductive measuring wirings on scribe lines. CONSTITUTION:A plurality of output circuits are provided. And one of the output circuits 9 is composed of a power-potential side switch 3, a ground- potential side switch 4, and an output terminal 5 to be connected to both switches 3 and 4. Besides, the output terminal 5 is connected to a conductive measuring wiring 8 made out of aluminum, polycrystalline silicon, or diffusion resistance, etc., formed on scribe lines 7. Incidentally, the constitution of the other output circuits 9 is the same as this. Consequently, it becomes possible to form a semiconductor integrated circuit of high area efficiency by providing output circuits 9 capable of inspecting the output terminals 5 without probing the output terminals 5, and reducing the intervals between the output terminals 5 to a required minimum.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit, a method of manufacturing the same, and a method of measuring the same, and more particularly to a structure of an output circuit and a method of measuring the same.

[0002]

2. Description of the Related Art FIG. 2 is a circuit diagram showing a structure of a conventional semiconductor integrated circuit having a plurality of output circuits. The configuration of the conventional output circuit of the semiconductor integrated circuit and the measuring method thereof will be described with reference to FIG.

Of the semiconductor integrated circuits having a plurality of output circuits, the configuration of one output circuit 9 will be described. The output circuit 9 includes a power supply potential side switch 3 and a ground potential side switch 4
And output terminal 5.

One terminal of the power supply potential side switch 3 is connected to the power supply potential side line 1, the other terminal of the power supply potential side switch 3 is connected to one terminal of the ground potential side switch 4 and the output terminal 5, and The other terminal of the ground potential side switch 4 is connected to the ground potential line 2.

In the method of measuring a semiconductor integrated circuit, all the input terminals (not shown) and the output terminals are probed and the measurement is performed by an external measuring device.

Next, a method of measuring one output circuit 9 in the conventional semiconductor integrated circuit having a plurality of output circuits will be described with reference to FIG.

First, the power supply potential side switch 3 is turned on, and the control signal is input from the input terminal so that the ground potential side switch 4 is turned off, and the potential of the power supply potential line 1 is output to the output terminal 5. .

Comparing the output value of the output terminal 5 with an expected value, the power supply potential side switch 3 is in a controlled conductive state and the ground potential side switch 4 is in a controlled nonconductive state. And the ground potential side switch 4
The leak current and the like are checked and the quality is judged.

The control signal is input from the input terminal so that the power supply potential side switch 3 is made non-conductive and the ground potential side switch 4 is made conductive so that the potential of the ground potential line 2 is output to the output terminal 5. As in the above, the quality is judged.

Further, generally, after the inspection is completed, the scribe line of the semiconductor integrated circuit to be arranged on the wafer is cut, and the semiconductor integrated circuit as a single unit is subjected to the process of commercialization.

[0011]

The input terminal and the output terminal of the semiconductor integrated circuit require a pad having a large area for probing, and the probing pins standing on the input terminal and the output terminal do not come into contact with each other. It is necessary to widen the space between the putts.

In a semiconductor integrated circuit that requires many input terminals and output terminals, the above factors cause
There is a problem that the input terminal and the output terminal cannot be highly integrated and the semiconductor integrated circuit becomes large, or many input terminals and output terminals cannot be integrated in one semiconductor integrated circuit.

An object of the present invention is to solve the above-mentioned problems and to provide an output circuit capable of inspecting an output terminal without probing the output terminal, and minimizing the space between the output terminals to improve the area efficiency. To provide a high semiconductor integrated circuit,
It is to provide a method for manufacturing the semiconductor integrated circuit and a method for measuring the semiconductor integrated circuit.

[0014]

In order to achieve the above object, the structure of the semiconductor integrated circuit of the present invention is as follows.

A plurality of output circuits each composed of a power supply potential side switch, a ground potential side switch, and output terminals connected to the power supply potential side switch and the ground potential side switch,
A conductive wiring for measurement is provided on the scribe line.

Further, a plurality of output circuits composed of a power supply potential side switch, a ground potential side switch, and output terminals connected to the power supply potential side switch and the ground potential side switch, and a conductive line on the scribe line. A semiconductor integrated circuit having a wiring for measurement, wherein the conductive wiring for measurement on the scribe line is connected to all output terminals on the semiconductor integrated circuit.

Further, a plurality of output circuits composed of a power supply potential side switch, a ground potential side switch, and output terminals connected to the power supply potential side switch and the ground potential side switch, and a conductive line on the scribe line. A semiconductor integrated circuit having a measurement wiring, wherein the conductive and measurement wiring on the scribe line is formed separately by a plurality of semiconductor integrated circuits arranged on a wafer.

The semiconductor integrated circuit manufacturing method of the present invention includes a plurality of power source potential side switches, a ground potential side switch, and a plurality of output terminals connected to the power source potential side switch and the ground potential side switch. A semiconductor integrated circuit having an output circuit and a conductive wiring for measurement on a scribe line, which includes an inspection circuit by cutting a plurality of semiconductor integrated circuits arranged on a wafer by the scribe line. It is characterized in that the circuit is equivalent to a semiconductor integrated circuit which does not exist.

The measuring method of the semiconductor integrated circuit of the present invention is as follows.

A power supply potential side switch of one output circuit among a plurality of output circuits composed of a power supply potential side switch, a ground potential side switch, and output terminals connected to the power supply potential side switch and the ground potential side switch. To conduct,
It is characterized in that the ground potential side switches of the other output circuits are made conductive and a current is passed from the power source potential line to the ground potential line to measure the state of the power source potential side switches without probing.

Further, the ground potential of one output circuit among a plurality of output circuits composed of the power supply potential side switch, the ground potential side switch, and the output terminals connected to the power supply potential side switch and the ground potential side switch. The side switch is turned on, the power supply side switches of the other output circuits are turned on, and a current is passed from the power supply potential line to the ground potential line to measure the state of the ground potential side switch without probing. Characterize.

[0022]

The power supply potential side switch of one output circuit is made conductive, and the other output circuit is made the ground potential side switch conductive, or the ground potential side switch of one output circuit is made conductive, and the like. In this output circuit, by turning on the switch on the power supply potential side, the state of the output circuit can be confirmed without probing to each output terminal by measuring the current value flowing from the power supply potential line to the ground potential line. .

[0023]

1 is a circuit diagram showing the configuration of a semiconductor integrated circuit having a plurality of output circuits according to the present invention. The configuration of the output circuit of the semiconductor integrated circuit according to the present invention, its manufacturing method, and its measuring method will be described with reference to FIG.

First, the configuration of one output circuit 9 in the semiconductor integrated circuit having a plurality of output circuits of the present invention will be described. The output circuit 9 is composed of a power supply potential side switch 3, a ground potential side switch 4 and an output terminal 5.

Also, one terminal of the power supply potential side switch 3 is connected to the power supply potential side line 1, and the other terminal of the power supply potential side switch 3 is connected to one terminal of the ground potential side switch 4 and the output terminal 5. The other terminal of the ground potential side switch 4 is connected to the ground potential line 2.

Further, the output terminal 5 is connected to a conductive wiring 8 formed of aluminum or polycrystalline silicon formed on the scribe line 7 or diffusion resistance.

Although the above-mentioned configuration describes the configuration of one output circuit 9, the configuration of the other output circuits 9 is also the same, and the output terminal 5 of each output circuit 9 is formed on the scribe line 7. It is electrically conductive and is connected to the measurement wiring 8.

The terminals for probing the semiconductor integrated circuit of the present invention are a power supply potential terminal (not shown) except the output terminal 5, a ground potential terminal (not shown) and an input terminal (not shown). Connect the terminals to an external measuring device and measure.

Next, a method for measuring a semiconductor integrated circuit according to the present invention will be described with reference to FIG.

In the semiconductor integrated circuit having a plurality of output circuits 9, the power supply potential side switch 3 of one output circuit 9 is made conductive and the ground potential side switch 4 is made nonconductive by the control signal from the input terminal. , The power supply potential side switch 3 of the other output circuit 9 is made non-conductive, and the ground potential side switch 4 of the other output circuit 9 is made conductive.

The current flowing from the power supply potential line 1 in the above operating state passes through the power supply potential side switch 3 and the output terminal 5 which form one output circuit 9, and is a conductive wiring 8 for measurement on the scribe line. To the ground potential line 2 through the respective output terminals 5 and the respective ground potential side switches 4 constituting the other output circuit 9.

As is apparent from the above description of the current path, the current path is configured so that the power supply potential line 1, the power supply potential side switch 3 forming one output circuit, and the other output circuit 9 connected in parallel. The switch 4 is connected to the ground potential side switch 4 and the ground potential line 2.

The quality of the conduction resistance of the power supply potential side switch 3 forming one output circuit 9 is determined by comparing the current flowing through the current path with an expected value predicted in advance.

Similarly to the above description, the power supply potential side switches 3 of the plurality of output circuits 9 are sequentially turned on, and the power supply potential side switches 3 of the respective output circuits 9 are set according to the current value flowing at that time.
It is possible to judge the quality of

The ground potential side switch 4 constituting the output circuit 9 is also subjected to the same measuring method as that of the power supply potential side switch 3 to judge the pass / fail of the ground potential side switch 4 of each output circuit. Is possible.

The above description relates to the structure of one semiconductor integrated circuit, and the conductive and measurement wiring 8 formed on the scribe line 7 is formed separately for each semiconductor integrated circuit formed on the wafer. As a result, the method for measuring the semiconductor integrated circuit can be realized.

Further, after the inspection, a plurality of semiconductor integrated circuits on the wafer are cut by the scribe line 7,
It becomes an individual semiconductor integrated circuit. In this step, the conductive measurement wiring 8 arranged on the scribe line 7 is cut, and the output terminals 5 of the individual semiconductor integrated circuits are completely insulated, which is equivalent to the conventional semiconductor integrated circuit. It becomes a semiconductor integrated circuit.

[0038]

As is apparent from the above description, the semiconductor integrated circuit of the present invention and the measuring method thereof can confirm the state of each output terminal without probing the output terminal, and can also perform probing. It is possible to arrange the output terminals to the minimum required between the output terminals that do not have the above, and it is possible to significantly increase the area efficiency of the semiconductor integrated circuit.

Further, according to the present invention, by arranging the wiring for measurement on the scribe line, the output terminal can be inspected in a non-contact manner without increasing the area of the semiconductor integrated circuit.

[Brief description of drawings]

FIG. 1 is a circuit diagram showing a configuration of a semiconductor integrated circuit having a plurality of output terminals according to an embodiment of the present invention.

FIG. 2 is a circuit diagram of a semiconductor integrated circuit having a plurality of conventional output circuits.

[Explanation of symbols]

 1 power supply potential line 2 ground potential line 3 power supply potential side switch 4 ground potential side switch 5 output terminal 7 scribe line 8 wiring 9 output circuit

Claims (6)

[Claims] 1. A plurality of output circuits each including a power supply potential side switch, a ground potential side switch, and output terminals connected to the power supply potential side switch and the ground potential side switch, and a conductive line on the scribe line. A semiconductor integrated circuit having a wiring for measurement. 2. A plurality of output circuits each including a power supply potential side switch, a ground potential side switch, and output terminals connected to the power supply potential side switch and the ground potential side switch, and a conductive line on the scribe line. A semiconductor integrated circuit having a measurement wiring, wherein the conductive measurement wiring on the scribe line is connected to all output terminals on the semiconductor integrated circuit. 3. A plurality of output circuits each comprising a power supply potential side switch, a ground potential side switch, and output terminals connected to the power supply potential side switch and the ground potential side switch, and a conductive line on the scribe line. A semiconductor integrated circuit having a measurement wiring, wherein the conductive measurement wiring on the scribe line is separately formed by a plurality of semiconductor integrated circuits arranged on a wafer. 4. A plurality of output circuits each including a power supply potential side switch, a ground potential side switch, and output terminals connected to the power supply potential side switch and the ground potential side switch, and a conductive line on the scribe line. A semiconductor integrated circuit having a wiring for measurement, and by cutting a scribe line of a plurality of semiconductor integrated circuits on a wafer, it becomes a circuit equivalent to a semiconductor integrated circuit which is conductive and does not include wiring for measurement. A semiconductor integrated circuit characterized by the above. 5. A plurality of output circuits each including a power supply potential side switch, a ground potential side switch, and output terminals connected to the power supply potential side switch and the ground potential side switch, and a conductive line on the scribe line. A semiconductor integrated circuit having a wiring for measurement, wherein a power supply potential side switch of one output circuit among a plurality of output circuits is made conductive, and other output circuits are made ground potential side switches conductive, A method for measuring a semiconductor integrated circuit, comprising measuring the state of a switch on the power supply potential side without probing by passing a current from the line to the ground potential line. 6. A plurality of output circuits each including a power supply potential side switch, a ground potential side switch, and output terminals connected to the power supply potential side switch and the ground potential side switch, and a conductive line on the scribe line. A semiconductor integrated circuit having a wiring for measurement, wherein a ground potential side switch of one output circuit among a plurality of output circuits is made conductive, and other output circuits make a power supply potential side switch conductive, and a power supply potential side switch is made conductive. A method for measuring a semiconductor integrated circuit, comprising measuring the state of a switch on the ground potential side without probing by passing a current from the line to the ground potential line.