JPH07297091A - Device for manufacturing radial electronic parts - Google Patents

Abstract

PURPOSE:To eliminate element deviation failure by increasing retention force when a lead wire holds an element and at the same time provide a device for manufacturing radial electronic parts where the manufacturing process is simplified. CONSTITUTION:This item consists of an assembly part 2 which is assembled by supplying a pair of lead wire and element and then soldering them, a particle application part 10 for coating resin on the surface of radial electronic parts, a sealing part 16 for sealing on the surface, an inspection part for inspecting the sealing part, a packaging part 19 for packing the sealing part, and a transport part for carrying the radial electronic parts assembled by the assembly part 2 from the powder coating part 10 to the packaging part 19 by retaining the radial electronic parts assembled by the assembly part 2, thus simplifying process and hence providing a manufacturing device for manufacturing high- quality radial electronic parts.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radial electronic component manufacturing apparatus used for manufacturing a radial electronic component.

[0002]

2. Description of the Related Art First, a radial electronic component to which the present invention is applied will be described with reference to FIG.

14 (a) and 14 (b) are a front view and a side cross-sectional view showing a radial electronic component. In FIG. 14, 58 is an element, 59 is a pair of lead wires, 60 is solder, and 61 is a surface coating. Resin.

FIG. 15 is a front view and a side sectional view showing a state in which the above-mentioned radial electronic component is taped. In FIG. 15, 62 is an adhesive tape, 63 is a lead wire, 64 is an element, and 65 is a mount. Is the lead wire 63
Was bent and fixed to a mount 65, the element 64 was held on this and soldered, and resin coating was carried out to produce a radial electronic component.

FIG. 16 is a plan view of a conventional apparatus for manufacturing a radial electronic component. In the figure, 66 is a lead wire supply and forming section, 67 is an element supply section, 68 is an element sending section, 69 is a dancer, 70 is a soldering section, 7
1 is a dancer, 72 is a powder coating section, 73 is a resin crush section, 74 is a marking section, 75 is a main curing furnace, 76 is a reel winding section, 77 is a reel, 78 is a retaping section, 79
Is a reel, 80 is a packaging unit, 81 is a paper tape unwinding reel, and 82 is a lead wire reel.

In the conventional radial electronic component manufacturing apparatus thus configured, first, the lead wire 63 is formed into a U-shape by the lead wire supply and forming section 66 on the mount 65 unwound from the paper tape unwind reel 81. It is formed and supplied, and the lead wire 63 is attached with the adhesive tape 62.

Next, the element feeding unit 67 feeds and holds the element 64 fed from the element feeding unit 68 after the lead wire 63 is opened wider than the thickness of the element 64, and the dancer 69 is attached to the soldering unit. Soldering is performed at 70, preheating and first powder coating are performed at the powder coating unit 72, and then repreheating is performed, and second powder coating is performed.

Thereafter, at the resin crush portion 73, the line A in FIG.
The resin in the portion is crushed, the surface of the resin is imprinted by the imprinting section 74, the resin is fully cured by the main curing oven 75, and the reel winding section 76 temporarily winds the resin on the reel 77, and the worker re-executes it. It was reset to the taping section 78.

Here, the adhesive tape 62 and the mount 65 of FIG.
And discarding the lead wire 63 in the portion attached to these, taping on another paper and winding up on the reel 79,
Further, it was re-applied to the packaging section 80 for packaging.

The operation of the powder coating section 72 will be described in detail with reference to FIG. In FIG. 17, with respect to the height of the fluidized powder surface due to the blowing of air from the bottom of the tank, 83 is the powder surface level when the air pressure is high, 84 is the powder surface level when the overflow is completed when the air pressure is high, and 85 is the air low pressure. Powder level at the time, 86 is the running level at the lower end of the squeegee, 87 is a paper filter, 88 is a porous filter,
89 is a powder preliminary tank, 90 is powder clogging, 91 is a pinch valve, 92 is a powder supply tank, 93 is a squeegee, 9
4 is a work, 95 is a solidified powder, 96 is a hammer, 97
Is a vacuum suction port, and 98 is a powder coating tank main body.

The powder coating section 72 thus constructed is
Resin powder for powder coating is contained in the powder coating tank main body 98, and air is blown up from under the tank. This air passes through the porous filter 88 and the paper filter 87 and is blown up uniformly from the lower surface. As a result, the resin powder is in a fluidized state like a liquid. The height of the upper surface of the powder is increased by increasing the pressure of air, and the height of the upper surface of the powder is decreased by decreasing the pressure (initial state). Similarly to, the air is blown up from below to fluidize the powder.

When a vacuum is applied from the vacuum suction port 97, the powder is sucked from the powder preliminary tank 89. At this time, the pinch valve 91 is opened.

Next, when the pinch valve 91 is closed and air is blown from the vacuum suction port 97, the powder accumulated in the powder supply tank 92 is supplied to the powder coating tank main body 98.

Next, when the air pressure is increased to a high pressure, the powder surface becomes the powder surface level 83 when the air pressure is high. Since the wall surface of the powder coating tank main body 98 is only up to the level of the powder surface level 84 at the time of completion of the overflow at the time of high pressure of the air, the powder surface is from the powder surface level 83 at the time of high pressure of the air to the surface of powder at the completion of overflow at the high pressure of air. It goes down until the level 84 is reached by overflowing powder at Jogo.

Next, when the air pressure is reduced to a low pressure, the powder surface falls to the powder surface level 85 when the air pressure is low. The squeegee 93 moves to this, and the powder on the upper surface of the powder is scraped as shown in the figure, and the powder surface should reach the traveling level height of the lower end of the squeegee 93. Since it is like this, it will soon turn right. In contrast, 170
The work 94 preheated to ℃ is immersed. After raising the work 94, the hammer 96 vibrates the work 94 in order to brush off the powder adhering more than necessary.

[0016]

However, such a conventional apparatus for manufacturing a radial electronic component has the following problems.

(1) The adhesive tape 62, the backing sheet 65, and the lead wires 63 attached to these are unnecessary as a final product. Further, the work 94 is built in while it is being conveyed by the mount 65, but some of them are inevitably defective and must be removed. For this reason, the mount 65 was discarded, and was reattached to another paper tape again so that there would be no missing teeth, and this wasted waste.

(2) When trying to hold the element 64 on the lead wire 63, the element 64 cannot be inserted unless the lead wire 63 is once opened wider than the thickness of the element 64. Therefore, there is a problem that the force of holding the element 64 by the lead wire 63 is weak.

Further, in a product having a large thickness of the element 64, the displacement of the element 64 is likely to occur due to its weight. Therefore, it cannot be produced by the conventional production method, and the element 64 must be manually produced while inserting the element 64 by hand. There was a problem of not becoming.

(3) In the powder coating section 72, powder clogging is likely to occur in the pipe, and there is a problem in the reliability of powder supply.

(4) In the powder coating section 72, there is a problem that powder mass 95 is likely to be generated in the powder supply tank 92. This is because the powder in the pipe is hardened when the pinch valve 91 is closed, or vacuum sucked. On the diagonal side of the bottom of mouth 97,
This is because when the powder adheres, the powder is gradually compacted by its weight. When the powder mass 95 enters the powder coating tank main body 98, there is a problem that the quality of the resin of the product is adversely affected.

(5) Due to the above problems, there is a problem that the powder supply amount itself is not stable. This is because the powder surface level 83 at the time when the air pressure is high, and the powder surface level 84 when the overflow at the high air pressure is completed. It means that the time until it changes to a large value varies greatly, and if this device is incorporated into an automated facility, the powder surface will completely change from the powder surface level 83 when the air pressure is high to the powder surface level when the overflow is completed when the air pressure is high. There is also a case where the air pressure is lowered before reaching 84, and there is a problem that the powder surface level 85 at the time of low air pressure often cannot be reached when the air pressure is eventually lowered.

On the other hand, even if the squeegee 93 was used to scrape the powder, the powder immediately came around and was meaningless. Therefore, the height of the powder surface in the fluidized powder tank cannot be made constant within a certain time, and the position accuracy of the portion A in FIG. Apply to
It had a function to crash the resin.

However, this crash cannot be performed with high accuracy, resulting in a defect that resin residue left after the crash adheres to the lead wire 63 occupying about half of the total defects, or an intermediate state where the resin is not completely cured. If it is not possible to crash, it is necessary to divide the curing furnace into two and install a crash device, which makes the equipment larger and requires additional equipment such as a dust collector and a cover to prevent the dust of the crashed resin. There were many problems that the working environment deteriorated.

[0025]

In order to solve this problem, a manufacturing apparatus for a radial electronic component according to the present invention includes an assembly section for soldering a pair of lead wires to an element to assemble a radial electronic component, and an assembly section for assembling the assembly. A coating part that coats the surface of the radial electronic component that has been subjected to resin coating, a marking part that stamps the surface of this coated resin, an inspection part that inspects the radial electronic component that has been stamped, and the radial electronic component that has been inspected. A packaging unit that wraps parts, a transport unit that holds the radial electronic components assembled by the assembly unit and sequentially transports them from the coating unit to the packaging unit, and a transfer that transfers the radial electronic components from inside the assembly unit to the transport unit. It is composed of parts.

[0026]

With this configuration, it is possible to eliminate the adhesive tape and the backing sheet, which have been conventionally discarded, and also to eliminate the portion to be discarded because the configuration is such that two lead wires are supplied at the time of supply.

In addition, the two lead wires are independently grasped,
By adopting a transfer chuck capable of swinging them independently, it is possible to increase the holding force of the element, eliminate the problem of element displacement, and stably produce a product having a large thickness.

Further, if the transfer chuck is used to transfer from the assembling section to the final packaging section, a large number of complicated and costly transfer chucks (about 3000) are required. The cost of the equipment can be reduced by using the transfer unit to transfer to a low-cost rubber transfer unit.

Further, since the lead wires are independently supplied in a pair to be assembled, the characteristics can be inspected while the product is still attached to the carrying section.

Further, since the powder surface accuracy of the coating portion to be resin-coated can be adjusted within a fixed time, not only the dimensional accuracy at the time of resin coating can be improved, but also the function of crashing the resin can be omitted. Therefore, it is possible to reduce the size of the equipment by eliminating the crashed dust and the curing furnace having the divided structure.

[0031]

【Example】

(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view showing the overall construction of a radial electronic component manufacturing apparatus according to the embodiment.

In FIG. 1, 1 is a lead wire supplying part, 2 is an assembling part, 3 is a forming part, 4 is an element supplying part, 5 is a closed continuous body, 6 is a solder bath, 7 is a transfer chuck, and 8 is transfer. Replacement part, 9 is a preheating furnace, 10 is a powder coating tank, 11 is a repreheating furnace, 12 is a main curing furnace, 13 is a powder coating part, 14 is a holding part, 15 is a closed continuous body, and 16 is a marking part. , 17 is a taping section, 18 is a boxing section, and 19 is a packaging section.

FIG. 2 is a plan view of the assembling section 2 shown for explaining the operation of the assembling section 2 shown in FIG. 1. In FIG. 2, 20 is a lead wire reel, 21 is a flat hammering section, and 22 is element feeding. Reference numeral 23 is a carrier dancer portion, and 6 is a solder bath.

The operation of the assembling unit 2 thus constructed will be described below. First, the lead wire is pulled from the lead wire reel 20 to the lead wire supply unit 1, and the transfer chuck 7 is pulled.
Supply to. Then, the table indexes in the direction of the arrow in the figure, and the adjacent transfer chuck 7 comes to the position of the lead wire supply unit 1. The transfer chuck 7 supplied with the lead wire does not go to the position of the forming unit 3 suddenly, but is indexed several times and then moves to the position of the forming unit 3.

FIG. 3 shows the forming shape of the lead wire 24 formed by the first forming portion 3a for forming the lead wire 24 into a predetermined size, and FIG. 3 shows the forming shape of the lead wire 24 formed by the second forming portion 3b. 4 (a) and (b).

Further, the flat wire portion 21 is used to form the lead wire 24.
FIG. 5 shows a state in which is formed.

In the element supply section 4, the elements flowing from the element sending section 22 are inserted one by one into the lead wire 24, and this operation is shown in FIG.

In FIG. 6, reference numeral 25 is an element, 24 is a lead wire, 7 is a tip of a transfer chuck, and 26 is a lead wire to which an element is supplied. When the element supply unit 4 raises the element 25, it is transferred. The chuck tip 7 is opened, so that the linearly extending lead wire 24 is also opened as shown in FIG. Further, when the element 25 is held, the element 25 is deformed in the thickness direction only after hitting the element 25, and a sufficient holding force can be generated.

On the other hand, in the conventional element supply section 67, in order to grasp the element 25 as described above, it is necessary to deform the lead wire 24 once to make it wider than the thickness of the element 25 and to open the lead wire 24. The holding force was not obtained so much because the element 25 was held by the back force, but the transport chuck 7 according to the present embodiment is excellent in the holding force of the element 25 as is clear from the above description. It is effective.

In the above operation, the elements 25 were processed one by one, but in the solder bath 6, a plurality of dips are simultaneously soldered, and solder is used to absorb the difference in the flow of the work. Transporter dancer sections 23 are provided in front of and behind the tank 6.

7 to 11 show the transfer chuck 7, wherein FIG. 7 is a perspective view of the whole, FIG. 8 is a view taken in the direction of arrow A in FIG. 7, FIG. 9 is a view taken in the direction of arrow B in FIG. 10 is a view on arrow C in FIG. 7,
FIG. 11 is a front view of relevant parts showing a state in which the lead wire 24 is held.

7 to 11, 27 is a chain with extension pins, 28 is a bearing block, 29 is a pin, 30 is a first swing block, 31 is a second swing block, 32 is a compression spring, and 33 is 33. A first lead wire holding claw, 34 is a second lead wire holding claw, 35 is a first lead wire guide claw, and 36.
Is a second lead wire guide claw, 37 is a pin, 38 is a compression spring, 24 is a lead wire, and 26 is an element.

In the present embodiment, the closed continuum 5 is constructed by using a chain, but any closed continuum such as a steel belt or other types of belts may be used.

Further, in this embodiment, one transfer chuck 7 is attached to each Z-link of the chain forming the closed continuum 5, and one element 26 and two lead wires 24 are held on this. It

In FIG. 8, the lead wire 24 is held by the first lead wire guide claw 35 and the first lead wire holding claw 33, and this holding force is generated by the compression spring 32.

In FIG. 9, the lead wire 24 is held by the second lead wire guide claw 36 and the second lead wire holding claw 34, and this holding force is generated by the compression spring 32.

When the lead wire 24 is supplied from below, the first lead wire guide claw 35 and the second lead wire guide claw 36 have V-shaped guides and are smoothly supplied, as shown in FIG. It functions to stabilize the holding position of the lead wire 24, to stabilize the holding force due to three-point support when viewed in cross section, and to make scratches due to the chucking of the lead wire 24 inconspicuous.

Next, the first lead wire holding claw 33 and the second lead wire holding claw 34 gain a lever ratio in a space as small as possible, and the holding force of the lead wire 24 (in the case of this embodiment,
The holding force is required to be about 5 kgf).

The pin 37, which is the fulcrum for holding the lead wire 24, and the pin 29, which is the fulcrum for oscillating the first oscillating block 30, are separately provided, so that the oscillating motion is smooth. Therefore, for the pin 29, only one swing block is hung and rotated, and no shearing force works.

Therefore, this has two effects, one of which is that the pin 29 is not loaded so that it can be made thinner and the overall size can be made smaller. The second one is the lead wire 2 as shown in FIG.
It is also possible to prevent the portion 4 from being broken at the portion held by the first lead wire guide claw 35 and the first lead wire holding claw 33.

Next, in the transfer chuck 7, the work in which the lead wire 24 is soldered to the element 26 in the transfer section 8 is transferred from the transfer chuck 7 to the closed continuous body 15, and the transfer section 8 is reached. The returned transport chucks 7 are sent one by one again.

As described above, the work is conveyed to each of the lead wire supplying section 1, forming section 3, flat striking section 21, and element supplying section 4 as shown in FIG. Sprocket), which is necessary in the conventional example and is required for the lead wire supply and forming unit 66, the element supply unit 67, and the element delivery unit 6
A mechanism for carrying and positioning a work is not required in each of the eight, and this is an excellent effect in terms of downsizing of equipment and cost reduction.

Further, by constructing the transport system with a chain, even if the transport system is cut off, it is easy to carry out repairs on site, and the table can be made into a commercially available sprocket for cost reduction. Also in this respect, an excellent effect can be obtained.

Next, the workpieces thus transferred are preheated to 170 ° C. in the preheating furnace 9 shown in FIG.
The first powder coating was performed at 0, then reheated to 170 ° C. again in the re-preheating furnace 11, the second powder coating was performed again in the powder coating tank 10, and then the main curing furnace 12 Main curing is performed.

Next, the marking is made by the marking unit 16, the work is extracted from the holding unit 14 by the taping unit 17, taped, and the taped product is packaged by the boxing unit 18.

Further, in the present embodiment, the closed continuous body 15 is constructed by using a chain with extension pins, and the shape of the holding portion 14 attached to the chain with extension pins is shown in FIG.
Shown in.

In FIG. 12, 39 is a chain with extension pins, 40 is a holding part, 41 is a work, the tip of the chain 39 with extension pins is stepped, and the material of the holding part 40 is silicon in this embodiment. Although rubber is used, other materials such as fluororubber may be used.

FIG. 13 is a front sectional view showing the structure of the powder coating tank 10. In FIG. 13, 42 is the powder surface level when the air pressure is high, 43 is the running level of the lower end of the squeegee, 4
4 is a powder surface level when air is off, 45 is a powder coating tank body, 46 is a paper filter, 47 is a porous filter,
Reference numeral 48 is a tank partition plate, 49 is a proximity switch, 50 is a double squeegee, 51 is a powder preliminary tank, 52 is a ladle type powder supply section, 53 is a jogo, 54 is air pressure (outside), 5
Reference numeral 5 is an air pressure (medium), 56 is a hammer, and 57 is a foreign matter powder recovery unit.

The operation of the powder coating tank 10 thus constructed will be described. First, the air pressure is low and the proximity switch 4
If the height of the powder surface at 9 is lower than a certain height, this is detected, and the ladle-shaped powder supply unit 52 displays 2 in the figure.
Move in the direction indicated by the dotted line. This allows the Joego 53
To replenish the powder coating tank main body 45 with powder. The signal to start the powder coating operation is received from the dancer in the preheating furnace 9 shown in FIG. Air pressure (outside) 54 and air pressure (inside) 5
When 5 is set to a high pressure, the powder surface height becomes the powder surface level 42 when the air pressure is high.

Next, the air pressure (medium) 55 is switched to a low pressure,
Air pressure (outside) 54 after the powder surface height in the central tank stabilizes
Turn off. Then, the height of the powder surface of the outer tank is from the powder surface level 42 when the air pressure is high to the powder surface level 44 when the air is off.
Go down to. First, the air pressure (middle) 55 is switched from high pressure to low pressure, and later the air pressure (outer) 54 is changed from high pressure to OF.
The reason why the pressure is set to F is that it takes some time to stabilize at a certain height because the powder surface of the central tank is lowered in pressure. Air pressure (middle) 55 and air pressure (outer) 54
If both are turned off at low pressure and off at the same time, the powder surface
This is because it becomes lower than the upper end surface of the tank partition plate 48. Until completely stabilized, the powder surface of the outer tank is higher than the upper end surface of the tank partition plate 48, and powder can be supplied even when the powder surface of the central tank is lower than the upper end surface of the tank partition plate 48. This is because it is necessary to be able to do so. Thereafter, the powder surface of the outer tank is lowered from the powder surface level 42 when the air pressure is high to the powder surface level 44 when the air is off.

Next, the powder surface slightly raised by the surface tension from the upper end surface of the tank partition plate 48 of the central tank is double squeegeeed.
Scratch to 0 in the outer tank. The operation thereafter is the same as the conventional one, in which the work is immersed, and then the powder is knocked off with the hammer 56. However, unlike the conventional one, when the dropped powder falls, do not drop it on the powder coating tank main body 45.
The foreign matter powder collecting section 57 is designed to enter below the work.

According to the above-described embodiment, the ladle-shaped powder supply section 52 improves the reliability of powder supply and eliminates the pinch valve, the hose and the like to reduce the powder mass.

By dividing the tank into three tanks,
It is not necessary to overflow the powder to the outside of the tank each time the powder is applied, and it is also possible to eliminate the need to re-supply the powder each time.

Further, in this embodiment, the powder is supplied about once every 20 minutes and the powder surface is detected by the proximity switch 49, so that an abnormality occurs in the powder supply unit 52. In addition to being able to detect defects, it is possible to make a system that does not cause defects, and because the tank structure is divided into three, overflow can be completed very quickly, which is the very narrow space required for dipping a workpiece. This is because the powder in the region overflows from both the left and right sides.

On the other hand, conventionally, it has been necessary to overflow the powder in a wide range including the region where the powder supply port and the squeegee must be arranged only on one side where the jogo is received.

Further, by making the squeegee a double squeegee and scraping the powder surface once, the powder surface can be scratched again to improve the accuracy of the powder surface height. Part size (height)
An excellent effect can be obtained in terms of improvement of accuracy and improvement of powder quality by adding the foreign matter powder recovery unit 57.

[0068]

Since the radial electronic component manufacturing apparatus of the present invention is configured as described above, it is possible to simplify the process and manufacture a high quality radial electronic component.

[Brief description of drawings]

FIG. 1 is a plan view showing the overall configuration of a radial electronic component manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view showing the configuration of the assembly unit.

FIG. 3 is a perspective view showing a forming shape of a lead wire by the first forming section.

FIG. 4 is a front view showing the forming shape of the lead wire by the second forming part.

FIG. 5 is a perspective view showing a forming shape of a lead wire by the flat striking portion.

FIG. 6 is a front view of the main parts for explaining the operation of the element supply section.

FIG. 7 is a perspective view showing a configuration of the transfer chuck.

FIG. 8 is a view on arrow A in FIG.

FIG. 9 is a view on arrow B in FIG.

FIG. 10 is a view on arrow C in FIG.

FIG. 11 is a front view of an essential part showing the lead wire holding tip portion.

FIG. 12 is a perspective view showing the holding portion.

FIG. 13 is a front sectional view for explaining the operation of the powder coating section.

FIG. 14A is a front view showing the configuration of a radial electronic component, and FIG. 14B is a side sectional view of the same.

FIG. 15A is a front view showing a taping state for explaining a conventional assembling method, and FIG.

FIG. 16 is a plan view showing the overall configuration of a conventional radial electronic component manufacturing apparatus.

FIG. 17 is a front sectional view for explaining the operation of a conventional powder coating section.

[Explanation of symbols]

 1 Lead Wire Supply Section 2 Assembly Section 3 Forming Section 4 Element Supply Section 5 Closed Continuous Body 6 Solder Tank 7 Transfer Chuck 8 Transfer Section 9 Preheating Furnace 10 Powder Coating Tank 11 Repreheating Furnace 12 Main Curing Furnace 13 Powder Painted part 14 Holding part 15 Closed continuum 16 Stamping part 17 Taping part 18 Boxing part 19 Packaging part 20 Lead wire reel 21 Flat part 22 Element feed-out part 23 Carrier dancer part 24 Lead wire 25 Element 26 Element supplied lead Wire 27 Chain with extension pin 28 Bearing block 29 Pin 30 First swing block 31 Second swing block 32 Compression spring 33 First lead wire holding claw 34 Second lead wire holding claw 35 First lead wire Guide claw 36 Second lead wire guide claw 37 Pin 38 Compression spring 39 Chain with extension pin 40 Holding part 41 W 42 Air level of powder surface at high pressure 43 Running level of squeegee bottom edge 44 Powder level at air OFF 45 Powder coating tank body 46 Paper filter 47 Porous filter 48 Tank partition plate 49 Proximity switch 50 Double squeegee 51 Powder reserve tank 52 Ladle type powder supply part 53 Joego 54 Air pressure (outer) 55 Air pressure (middle) 56 Hammer 57 Foreign substance powder recovery part

Claims (5)

[Claims] 1. An assembly section for assembling a radial electronic component by soldering a pair of lead wires to an element, a coating section for resin coating the surface of the assembled radial electronic component, and a surface of the coated resin. The stamping section that stamps the stamp, the inspection section that inspects the radial electronic components that have been stamped, the packaging section that wraps the inspected radial electronic components, and the coating section that holds the radial electronic components assembled in the above assembly section. An apparatus for manufacturing a radial electronic component, comprising: a transport unit for sequentially transporting the electronic component from the packaging unit to a packaging unit; and a transfer unit for transferring the radial electronic component from the assembly unit to the transport unit. 2. The structure of the assembling unit comprises a closed continuous body, in which a plurality of transfer chucks for holding lead wires are attached at predetermined intervals and circulates, and a pair of lead wires is supplied to the transfer chucks. A lead wire supply unit, a forming unit that bends the supplied pair of lead wires at a predetermined angle, and an element supply unit that supplies an element of a radial electronic component,
The supplied element is composed of a soldering portion for soldering the pair of lead wires and a transfer portion for transporting the soldered radial electronic component to the next step. 1. The manufacturing apparatus for radial electronic components described in 1. 3. A structure of a transfer chuck comprises a pair of swing blocks, each of which has a holding surface for holding a lead wire in a lower portion thereof and can swing independently by a fulcrum pin provided in an upper portion thereof. A pair of lead pressing levers arranged to press and hold the lead wires against the lead wire holding surface of the moving block, springs for urging the rocking block and the lead pressing lever, and these parts are closed. 3. The radial electronic component manufacturing apparatus according to claim 2, wherein the radial electronic component is composed of a connecting portion for connecting to the continuous body. 4. A transport unit for holding and transporting a radial electronic component comprises: a closed continuous body composed of a chain with extension pins; and an upper end fitted into the extension pins of the chain with extension pins and a pair of lower ends. The radial electronic component manufacturing apparatus according to claim 1, wherein a plurality of holding portions made of rubber having notches for holding the lead wires are provided at regular intervals. 5. A first storage chamber for storing resin powder for dipping a radial electronic component to perform resin coating on the surface of the coating unit, and an amount of resin powder in the first storage chamber. Second and third adjacently provided for adjustment
Storage chamber, an air section for blowing air from the bottom surface of the first to third storage chambers through a filter, and the first storage chamber.
~ A supply unit for supplying resin powder to any of the third storage chambers, a powder amount detection unit for detecting the amount of the stored resin powder, and a swelling from the upper end surface of the side surface of the first storage chamber. The radial electronic component manufacturing apparatus according to claim 1, wherein the squeegee is configured to scrape off the resin powder.