JPH07294340A - Temperature sensor for multipoint simultaneous measurement - Google Patents

Abstract

PURPOSE: To provide a thermocouple type temperature sensor for simultaneous multipoint measurement which has no risk for damaging a temperature measuring portion inserted into a path of a material whose temperature is to be measured such as fluid resin and which affects the fluidic behavior of the material whose temperature is to be measured. CONSTITUTION: A plurality of through holes semi cross sections are disposed on an end surface of a ceramic thin plate substrate 1 with a designated space and these respective through hole semi cross sections are formed as a coupling part for temperature measurement which comprises joining respective dissimilar metal and most part of both sides of the ceramic thin plate substrate is covered with a thin seathlike metallic sensor cover 11 such that a sensing area 9 formed by the plurality of coupling parts for temperature measurement is exposes.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermocouple-type multi-point simultaneous temperature sensor capable of simultaneously measuring temperatures at a large number of points, and particularly, for example, flowing in a heating cylinder of an in-line screw type injection molding machine. The present invention relates to a temperature sensor for multipoint simultaneous measurement, which is suitable for measuring the temperature of a plasticized resin or the like.

[0002]

2. Description of the Related Art In injection molding, temperature control of a plasticized resin (molten resin) is an important factor for achieving good product molding, and for this purpose, accurate temperature measurement must be performed. However, since the heating cylinder of the in-line screw type injection molding machine is a sealed metal tube, the resin temperature in the heating cylinder cannot be directly measured. Therefore, some methods have been attempted in which a transparent window is provided on a part of the outer circumference of the heating cylinder and the resin temperature of a portion in contact with the transparent window is measured using a radiation thermometer. The measurement method using this radiation thermometer calculates the temperature by adding the emissivity of a known substance surface from the intensity of infrared light radiated from the surface of the substance to be detected, so the temperature of the non-contact Although it can be measured, it can only measure the temperature of the surface of the substance to be detected. That is, there is a problem that the resin temperature in the depth direction orthogonal to the axis of the heating cylinder cannot be measured.

On the other hand, a through hole is formed in a part of the outer periphery of the heating cylinder, and a thermocouple for directly measuring the temperature of the plasticized resin (for measuring the contact type temperature) is inserted from the through hole. If the measurement method is used, the temperature of the fluid resin in the screw groove of the inline screw type injection molding machine can be measured. At this time, if a sensor body equipped with a large number of thermocouples is used, the resin temperature at each point (each point in the screw groove) in the direction orthogonal to the axial center in the heating cylinder can be measured at the same time, and It can greatly contribute to the analysis of liquefaction / melting mechanism and precise resin temperature control during molding operation.

A thermocouple type multi-point simultaneous measurement temperature sensor for simultaneously measuring temperatures at multiple points as described above is
The sensor for measuring the temperature of the molten resin disclosed in JP-A-64-778 discloses a temperature measurement in which linear patterns of different metals are superposed on a flat end face of a substrate. It has a structure in which a plurality of coupling portions are formed.

[0005]

By the way, when considering a thermocouple type multi-point simultaneous measurement temperature sensor inserted in the flow passage of the plasticized resin, the material of the substrate is ceramics in consideration of heat resistance. Is desired. Also, considering the influence on the resin flow, it is desirable to make the projected area of the portion inserted into the plasticized resin as small as possible. For this purpose, a ceramic thin plate with a temperature measuring coupling portion provided on the end face is required. Only the substrate need be inserted into the flowing resin parallel to the flow. However, there is one problem here. That is, if only a thin and fragile ceramics thin plate substrate is put into and taken out of the fluidized resin, there arises a problem that the ceramics thin plate substrate is easily broken due to a slight deviation of the resin resistance or the insertion angle.

Further, in the method of forming the temperature measuring coupling portion by overlapping the linear patterns of different metals on the flat end surface of the substrate as shown in the above-mentioned prior application,
There is also a problem that it is very difficult to form a large number of temperature measurement coupling portions at a fine pitch from the viewpoint of manufacturing technology.

The present invention has been made in view of the above points,
The purpose is to prevent the temperature measurement part inserted into the flow path of the substance to be temperature-measured, such as a flow resin, from being damaged, and the flow behavior of the substance to be temperature-measured. An object of the present invention is to provide a thermocouple-type multi-point simultaneous measurement temperature sensor that has a minimal effect on the temperature. Another object of the present invention is to provide a thermocouple type multi-point simultaneous measurement temperature sensor in which a temperature measurement coupling portion can be formed with a fine pitch.

[0008]

In order to achieve the above-mentioned object, a temperature sensor for multipoint simultaneous measurement according to the present invention is provided with a large number of through-hole half cross-sections at predetermined intervals on an end face of a ceramic thin plate substrate. The half cross section of each through hole is used as a temperature measuring coupling part formed by joining dissimilar metals, and the ceramic thin plate substrate is formed so that the sensing region formed by forming the large number of temperature measuring coupling parts is exposed. Most of the front and back are covered with a thin sheath-shaped metal cover body.

[0009]

The thin ceramic film substrate is provided with a large number of through-hole half cross-sections at predetermined intervals on the end surface thereof, and a thin film forming method using a film forming technique such as vapor deposition and a photolithography technique is used. In addition to patterning, the other surface of the substrate is appropriately patterned with, for example, Ni, and Cu is used in the half cross section of the through hole.
And Ni are joined together to form a temperature measuring coupling portion. As a result, a large number of temperature measuring coupling portions can be formed with a fine pitch of, for example, about 0.3 mm.
Also, for example, a thin sheath cover body made of SUS wraps most of the front and back sides of the ceramic thin plate substrate to protect the substrate so that the sensing region formed by forming a large number of temperature measuring coupling portions is exposed. , By this, the mechanical strength of the temperature measurement part inserted in the flow of the substance to be measured such as the flow resin is increased, and the temperature measurement part is inserted in the flow with large flow resistance. There is no risk of damage. Furthermore, since the ceramic thin plate substrate is covered with a thin sheath-like cover body with a small overall thickness, the projected area of the portion inserted in the flow of the substance to be measured whose temperature is parallel to the flow direction is relatively small. Can and
Flow is achieved by forming a taper in the cover body part in the flow path of the substance whose temperature is to be measured, which tapers gradually from the downstream side to the upstream side of the flow of the substance whose temperature is to be measured. The influence on the behavior can be minimized.

[0010]

EXAMPLES The present invention will be described below with reference to the examples shown in FIGS.

FIG. 1 is a front view of a sensor substrate used in a temperature sensor for multipoint simultaneous measurement according to an embodiment of the present invention, and FIG.
[Fig. 3] is a back view of the sensor substrate. 1 and 2 in FIG.
Is a ceramic thin plate substrate (hereinafter referred to as substrate 1). In this embodiment, a zirconia substrate having a plate thickness of 0.2 mm and outer dimensions of 40 mm × 3 mm is used. At the tip portion of the end face in the longitudinal direction of the substrate 1 (upper left portion of the substrate 1 in FIG. 1),
A large number of through-hole half-sections 2 (8 in this embodiment) are formed at very small intervals, and through-holes 3 are provided at a predetermined interval in the upper central portion when viewed from the surface of the substrate 1. A large number (8 in this embodiment) are formed.

As shown in FIG. 1, on the front surface side of the substrate 1,
The first metal (Ni in this embodiment) is used for each of the through-hole half cross-sections 2, the lead-out pattern section 4 connected to the through-hole half-section section 2, and the external connection connected to the lead-out pattern section 4. The pattern portion 5 is formed. Similarly, on the front surface side of the substrate 1, an external connection pattern portion 6 is formed of a second metal (Cu in the present embodiment), and the external connection pattern portion 6 made of Cu is the through hole 3 Part, and Ni
The external connection pattern portions 5 are alternately formed at predetermined intervals.

On the back surface side of the other substrate 1, as shown in FIG. 2, a lead-out pattern is formed by a second metal (Cu) in each through-hole half-section portion 2 and in a continuous manner with the through-hole half-section portion 2. A portion 7 is formed, and an end portion 7a of the lead-out pattern portion 7 made of Cu is connected to the external connection pattern portion 6 made of Cu through the through hole 3 and is placed in the through hole 3. Cu film is also deposited
Has been formed.

As described above, in each of the through-hole half-section portions 2, Ni and Cu are adhered, and the dissimilar metals (Ni and Cu in this case) are bonded to each other for temperature measurement coupling. A large number of parts 8 (here 8
Are formed). Therefore, corresponding to each of the temperature measuring coupling portions 8, on the front surface side of the substrate 1, external connection pattern portions 5, 6 in which adjacent ones are paired with each other.
8 pairs are provided. In FIG. 1, 9 indicates a sensing area of the substrate 1 provided with eight temperature measuring coupling portions 8, and 10 indicates an external connection pattern area provided with eight pairs of external connection pattern portions 5 and 6. Shows.

Here, the Ni film and the Cu film are formed and patterned by vapor deposition and photolithography, and the inner wall surfaces of the through-hole half-section portion 2 and the through-hole 3 are wrapped around by vapor deposition or are appropriately formed. A metal film is formed by the filling method described above. In some cases, the through hole half cross section 2 is initially formed as a complete through hole, and the Ni film and C are formed on the inner wall surface of the through hole.
After forming the u film by wrapping around by vapor deposition or the like, the outer shape of the substrate 1 may be cut to form the through-hole half cross-section portion 2 to expose the temperature measurement coupling portion 8.

As described above, when the temperature measuring coupling portion 8 is formed in the through hole half cross-section portion 2,
Since a thin film forming technique such as a selective vapor deposition method on the through-hole half-section portion 2 can be adopted, the integration degree in the sensing region 9 can be increased, and the interval between the temperature measuring coupling portions 8 can be set to a fine pitch. Is possible. FIG. 3 is an enlarged view showing a part of the sensing area 9,
In the present embodiment, the radius of the through-hole half cross section 2 is 0.0
The pitch P between the temperature measuring coupling portions 8 is 5 mm, and the pitch P is 0.3 mm.

FIG. 4 is a view showing a sensor cover for accommodating and protecting the substrate 1. The sensor cover 11 is
It is a thin sheath-shaped cover made of metal, and in this embodiment, SUS is used in consideration of strength and heat conduction. The sensor cover 11 is formed with a slit 12 that substantially matches the outer shape of the substrate 1, and the substrate 1 is inserted and fixed in the slit 12. A notch 13 is provided at the tip of the sensor cover 11 for exposing the sensing region 9 of the substrate 1 to the outside, and the external connection pattern of the substrate 1 is provided at the center of the sensor cover 11. A notch 14 is provided for connecting the area 10 to the connector means described below.

In FIG. 4, the sensor cover 11 is shown as A--A.
The cross-sections cut along the lines B-B, C-C, and D-D are also shown, and the sensor cover is shown at each cross section along the lines A-A, B-B, and C-C. The thickness t1 of 11 is 1.5 mm
And the thickness t2 of the sensor cover 11 is 2.0 mm in the cross section taken along the line D-D. Further, the depth d1 of the slit 12 is 2.0 mm in the AA line cross section, and the BB line, C
The depth d2 of the slit 12 is 3.0 mm in the -C line cross section.
Has become. Therefore, in this embodiment, the tip portion of the substrate 1 provided with the sensing region 9 is exposed to the outside by 1.0 mm in the notch 13. Further, in the cross section taken along the line AA and the cross section taken along the line BB, the sensor cover 11 is provided with tapered portions 15 and 16 so as to gradually taper. The length s1 of the portion having the AA line cross section is set to 2.5 mm, and the length s2 of the portion having the BB line cross section is set to 3.5 mm. In FIG. 4, reference numeral 18 is a mounting hole for mounting the sensor cover 11 to a holding means (not shown), and 19 is a positioning hole.

FIG. 5 is a view showing a state in which the substrate 1 is attached to the sensor cover 11. As shown in FIG.
Are covered with the sensor cover 11 except for the sensing area 9 and the external connection pattern area 10. Epoxy resin is applied to the entire surface of the substrate 1 in contact with the sensor cover 11, so that the substrate 1 is bonded and fixed to the sensor cover 11.

FIG. 6 shows the sensor cover 1 to which the substrate 1 is fixed.
It is a figure which shows the state which attached the connector 20 to 1. As shown in the figure, the connector 20 is attached so as to cover the external connection pattern region 10 of the substrate 1 exposed from the sensor cover 11, and each of the lead wires 22 held by the insulative joint cover 21 of the connector 20. The ends are connected to the external connection pattern portions 5 or 6 of the external connection pattern region 10. Then, the other end of each lead wire 22 is guided to a known temperature detection system circuit (not shown), and temperature detection based on voltage detection is performed in the temperature detection system circuit. FIG. 7 is a cross-sectional view of the connector 20 portion. In FIG. 7, 23 is a clip spring for attaching the connector 20 to the sensor cover 11 and crimping the lead wire 22 to the external connection pattern portions 5, 6.

As described above, the substrate 1 and the sensor cover 11
The connector 20 and the connector 20 are integrated, and the integrated sensor block measures the temperature of a substance to be measured, such as a fluid resin. At this time, in the present embodiment, the portion to be inserted into the flow of the substance to be temperature-measured is only the portion corresponding to the cross section along the line AA shown in FIG. 4 or the portion shown in FIG. Only the portion ahead of the portion corresponding to the BB line cross section is made. Further, the sensor block is inserted so that its surface direction is parallel to the flow of the substance to be temperature-measured, and the sensing region 9 is placed on the upstream side of the substance flow with respect to the sensor cover 11. To be done.

FIG. 8 is a schematic view showing a state in which the tip of the sensor block is inserted into, for example, a flowing plasticizing resin. In the example shown in the figure, the line of the sensing region 9 of the substrate 1 is inserted so as to be orthogonal to the flowing direction F of the flowing resin, and the above-mentioned eight temperature measurement coupling portions of the sensing region 9 are inserted. 8 in plasticizing resin 8
The temperature of the point is measured at the same time. At this time, the portion of the substrate that is inserted into the plasticized resin and comes into contact with the resin is only the portion in the vicinity of the sensing area 9 that has a small exposed area, and the other portions are covered and protected by the SUS sensor cover 11. There is no possibility that the substrate 1 will be damaged. Moreover, since the thin cover sensor cover 11 having a small overall thickness covers the substrate 1 and inserts it in parallel with the flowing direction F of the flowing resin, the projected area can be made relatively small, and Since the taper portion 12 which is gradually tapered from the downstream side to the upstream side of the resin flow is formed at the tip portion of the sensor cover 11 placed, the influence on the flow behavior should be minimized. You can

FIG. 9 is a diagram schematically showing another example of a state in which the tip of the sensor block is inserted into a flowing plasticizing resin. In the example shown in the figure, the line of the sensing region 9 of the substrate 1 is inserted at a predetermined angle θ with respect to the line segment orthogonal to the flowing direction F of the flowing resin. Even with such an insertion angle, the substrate 1 of the present embodiment
Since the sensor cover 11 protects and strengthens the substrate 1, there is no possibility of damaging the substrate 1. Similarly, the influence on the flow behavior can be minimized.

FIG. 10 shows a structure for measuring the temperature of the fluid resin in the screw groove of the heating cylinder of the in-line screw type injection molding machine using the sensor block of this embodiment. In the figure, 30 is a heating cylinder in which a band heater is wound around the outer periphery and a nozzle 31 is attached to the tip,
Reference numeral 2 denotes a screw arranged in the heating cylinder 30 so as to be rotatable and forward / backward. The screw (screw body) 32 has a rear end portion with the same pitch shape as the screw 32 at the measurement site in the heating cylinder 30. The reference screw segment 33 is fixed. A through hole is formed in a part of the heating cylinder 30, a part of the sensor support block 34 is fitted into the through hole, and the sensor block 35 of the present embodiment is arranged in the front and rear of the sensor support block 34. It is arranged so that it can advance. Three
Reference numeral 6 denotes a hydraulic cylinder provided on the sensor support block 34, and a rear end of the sensor block 35 (the sensor cover 1 is connected to the piston rod of the hydraulic cylinder 36 through an appropriate connecting member).
1 rear end) is attached. The tip of the sensor block 35 is inserted into the plasticizing resin in the heating cylinder 30, that is, the plasticizing resin in the groove of the screw 32 by the hydraulic cylinder 36.

As is known here, during the plasticizing / measuring process, the screw 32 is driven to rotate,
Each time the rotation of the screw flight sensor block 3
5 passes through the tip insertion position. Therefore, the flight position of the reference screw segment 33 is set to the laser displacement sensor 3
7, the tip of the sensor block 35 is pulled out from the inside of the heating cylinder 30 in synchronization with a predetermined rotation phase of the screw 32. That is, the detection information of the laser displacement sensor 37 and the position sensor 38 of the sensor block 35 is sent to the hydraulic servo amplifier 39, and the hydraulic servo amplifier 39 that operates according to a predetermined control sequence operates the hydraulic cylinder 36 via the hydraulic servo valve 40. The tip of the sensor block 35 is pulled out from the inside of the heating cylinder 30 while being driven and controlled and the screw flight passes, and the tip of the sensor block 35 is positioned in the groove of the screw 32 while there is no flight. By adopting such a configuration, the heating cylinder 30
The resin temperature at each point (each point in the groove of the screw 32) in the direction orthogonal to the inner shaft center can be measured at the same time, and the plasticization / melting mechanism of the resin can be analyzed and the resin temperature can be precisely controlled during the molding operation. Can greatly contribute to

Needless to say, various modifications can be made by those skilled in the art without departing from the spirit of the present invention. For example, the thin sheath-like shape placed in the flow path of the substance whose temperature is to be measured. The tip of the sensor cover 11 of FIG.
As shown in 1, the cross-sectional streamline shape along the flow may be used. Further, as shown in FIG. 12, the sensing region 9 may be exposed in the middle portion of the sensor cover 11.

[0027]

As described above, according to the present invention, there is no risk of damaging the temperature measuring portion inserted into the flow path of the substance to be temperature-measured such as the fluid resin, and It is possible to provide a thermocouple-type multi-point simultaneous measurement temperature sensor that has the least influence on the flow behavior of the substance to be measured. Further, it is possible to realize a thermocouple type multi-point simultaneous measurement temperature sensor in which the temperature measurement coupling portion can be formed at a fine pitch.

[Brief description of drawings]

FIG. 1 is a front view of a sensor substrate used in a temperature sensor for multipoint simultaneous measurement according to an embodiment of the present invention.

FIG. 2 is a back view of a sensor substrate used in a temperature sensor for multipoint simultaneous measurement according to an embodiment of the present invention.

3 is an enlarged view of an essential part showing a part of the periphery of the sensing area of the substrate of FIG. 1 in an enlarged manner.

FIG. 4 is an explanatory diagram showing a sensor cover used for a temperature sensor for multipoint simultaneous measurement according to an embodiment of the present invention.

5 is an explanatory view showing a state in which a substrate is attached to the sensor cover of FIG.

6 is an explanatory view showing a state in which a connector is attached to the sensor cover to which the substrate of FIG. 5 is fixed.

FIG. 7 is a cross-sectional view of FIG. 6 cut at a connector portion.

FIG. 8 is an explanatory view schematically showing one example of a state in which the tip of the sensor block according to one embodiment of the present invention is inserted into a flowing plasticized resin.

FIG. 9 is an explanatory view schematically showing another example of a state in which the tip of the sensor block according to the first embodiment of the present invention is inserted into a flowing plasticized resin.

FIG. 10 is an explanatory diagram showing an outline of a system for measuring a temperature of a fluid resin in a screw groove of an inline screw type injection molding machine using a sensor block according to an embodiment of the present invention.

FIG. 11 is an explanatory diagram showing a tip of a sensor block according to another embodiment of the present invention.

FIG. 12 is an explanatory view showing a sensor block according to still another embodiment of the present invention.

[Explanation of symbols]

 1 Substrate (ceramic thin plate substrate) 2 Through hole half cross section 3 Through hole 4 Drawing pattern made of Ni 5 External connection pattern part made of Ni 6 External connection pattern part made of Cu 7 Drawing pattern made of Cu 8 Temperature measurement Coupling part 9 Sensing area 10 External connection pattern area 11 Sensor cover 12 Slits 13, 14 Notches 15, 16 Tapered part 20 Connector 21 Joint cover 22 Lead wire 23 Clip spring 30 Heating cylinder 32 Screw 34 Sensor support block 35 Sensor block 36 Hydraulic cylinder

Front page continuation (71) Applicant 590000422 Minnesota Mining and Manufacturing Company United States, Minnesota 55144-1000, St. Paul, 3M Center (No address) (71) Applicant 000002174 Sekisui Chemical Co., Ltd. 2-4-4 Nishitenma-ku, Tokyo (71) Applicant 000003001 Teijin Limited 1-6-7 Minamihonmachi, Chuo-ku, Osaka-shi, Osaka (71) Applicant 000003458 Toshiba Machine Co., Ltd. 4--2 Ginza, Chuo-ku, Tokyo No. 11 (71) Applicant 000222587 Toyo Kikin & Metals Co., Ltd. 1-523 Nishinoyama, Fukusato, Futami-cho, Akashi-shi, Hyogo Prefecture (71) Applicant 000003159 2-2-1 Nihombashi Muromachi, Chuo-ku, Tokyo 71) Applicant 000003193 Toppan Printing Co., Ltd. 1-5-1 Taito, Taito-ku, Tokyo (71) Applicant 000227054 Nissei Jushi Kogyo Co., Ltd. 2110 Nanjo, Hanaki-gun, Hanashina-gun, Nagano Prefecture (71) Applicant 3900 08235 FANUC Co., Ltd. 3580 Kobaba, Oshinomura, Minamitsuru-gun, Yamanashi Prefecture (71) Applicant 390006323 Polyplastics Co., Ltd. 2-3-3 Azuchi-cho, Chuo-ku, Osaka-shi, Osaka (71) Applicant 000005887 Mitsui Oil Co., Ltd. Chemical Industry Co., Ltd. 3-5-5 Kasumigaseki, Chiyoda-ku, Tokyo (71) Applicant 390022655 Munekata Co., Ltd. 1-130 Tsujiko, Takatsuki City, Osaka Prefecture (71) Applicant 000010076 Yamaha Motor Co., Ltd. Iwata, Shizuoka Prefecture Shinkai 2500 (72) Inventor Hidetoshi Yokoi 7-22-1, Roppongi, Minato-ku, Tokyo Inside Institute of Industrial Science, University of Tokyo (72) Inventor Akiko Kuroda 523 Nishinoyama, Futari, Futami-cho, Akashi-shi, Hyogo 1 Toyo Kikai Metal Co., Ltd.

Claims (8)

[Claims] 1. A large number of temperature measuring coupling parts formed by joining dissimilar metals are formed at predetermined intervals on or near the end face of a ceramic thin plate substrate, and the large number of temperature measuring coupling parts are formed. A temperature sensor for multipoint simultaneous measurement, characterized in that most of the front and back surfaces of the ceramic thin plate substrate are covered with a thin sheath-shaped metal cover body so that the sensing area is exposed. 2. A ceramic thin plate substrate is provided with a large number of through-hole half-section portions at predetermined intervals on an end surface thereof, and each of the through-hole half-section portions serves as a temperature measuring coupling portion formed by joining dissimilar metals. A temperature sensor for multipoint simultaneous measurement, which is characterized. 3. The cover according to claim 2, wherein a large part of a front surface and a back surface of the ceramic thin plate substrate are covered with a thin sheath-shaped metal cover body so that a sensing region formed of each of the temperature measuring coupling portions is exposed. A multi-point simultaneous measurement temperature sensor characterized by 4. The ceramic thin plate substrate according to claim 1, wherein the sensing region of the ceramic thin plate substrate is positioned in a flow path of a substance as a temperature measurement target, and the sensing region is provided. The temperature sensor for multipoint simultaneous measurement, wherein the part and a part of the thin sheath-shaped metal cover body are arranged substantially parallel to the flow of the substance to be temperature-measured. 5. The flow of the substance to be temperature-measured according to claim 4, wherein the thin-sheath metal cover body part placed in the flow path of the substance to be temperature-measured A temperature sensor for multipoint simultaneous measurement, wherein a taper portion is formed so as to taper gradually from the downstream side to the upstream side. 6. The line according to claim 4, wherein the line of the sensing region provided on the end surface of the ceramic thin plate substrate is arranged so as to be orthogonal or oblique to the flow of the substance to be the temperature measurement target. A temperature sensor for simultaneous multi-point measurement featuring. 7. The drawing pattern according to claim 1, wherein the drawing patterns connected to the respective temperature measuring coupling portions are formed on both surfaces of the ceramic thin plate substrate, and the drawing patterns on both surfaces of the substrate are A temperature sensor for multipoint simultaneous measurement, which is directly or through a through hole connected to an external connection pattern portion arranged in parallel on one surface. 8. The temperature for multipoint simultaneous measurement according to any one of claims 1 to 7, which is used for measuring the temperature of a fluid resin in a screw groove of a heating cylinder of an inline screw type injection molding machine. Sensor.