JPH07290851A - Printing of cream solder - Google Patents

Printing of cream solder

Info

Publication number
JPH07290851A
JPH07290851A JP6089895A JP8989594A JPH07290851A JP H07290851 A JPH07290851 A JP H07290851A JP 6089895 A JP6089895 A JP 6089895A JP 8989594 A JP8989594 A JP 8989594A JP H07290851 A JPH07290851 A JP H07290851A
Authority
JP
Japan
Prior art keywords
cream solder
printing
metal mask
squeegee
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP6089895A
Other languages
Japanese (ja)
Inventor
Toshiyuki Makita
俊幸 牧田
Shinya Nishimoto
晋也 西本
Hisao Wadatsu
久生 和田津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP6089895A priority Critical patent/JPH07290851A/en
Publication of JPH07290851A publication Critical patent/JPH07290851A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Printing Plates And Materials Therefor (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To provide a method for printing a cream solder on a printed substrate uniformly without being influenced by mounted parts when printing a cream solder on the upper surface of the printed substrate with some of mounted parts. CONSTITUTION:A metal mask for printing 1 with a projecting part 3 which is higher than the thickness of a part, is used at a position where the part is mounted in a printed substrate 2 with some of mounted parts. When applying a cream solder 8 to the surface of the printed substrate 2, a squeegee 4 with a notch 5 provided at the position corresponding to the projecting part 3 and a flexible tip, is used and the cream solder 8 is supplied to the spherical surface of the metal mask 1, when the cream solder 8 is applied to the printed substrate 2. In addition, the squeegee 4 is moved in a state that it comes in contact with the metal mask 1. Thus it is possible to apply the cream solder 8 to the surface of a printed wiring board 2.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、一部部品が搭載された
プリント基板にクリーム半田を塗布する、クリーム半田
の印刷方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cream solder printing method for applying cream solder to a printed circuit board on which some components are mounted.

【０００２】[0002]

【従来の技術】従来より、プリント基板へのクリーム半
田の印刷には平らな薄い金属板にエッチングにより必要
な小径をあけたメタルマスクが使用されていた。2. Description of the Related Art Conventionally, for printing cream solder on a printed circuit board, a metal mask having a flat thin metal plate with a required small diameter by etching has been used.

【０００３】しかしながら、このような平らなメタルマ
スクでは、一部部品が搭載されて、表面に凸部のあるプ
リント基板へクリーム半田を塗布しようとすると、メタ
ルマスクがプリント基板に密着することができないの
で、クリーム半田の印刷は不可能である。そこで図４に
示すように、メタルマスク（１）をプリント基板（２）
に密着したときに、プリント基板（２）の上記部品が搭
載された位置にあたる部分に凸部（３）を設け、スキー
ジ（４）を移動することによりクリーム半田を開口部
（６）より通過させてプリント基板（２）に印刷してい
た。However, in such a flat metal mask, when some parts are mounted and the cream solder is applied to a printed circuit board having a convex portion on the surface, the metal mask cannot adhere to the printed circuit board. Therefore, the printing of cream solder is impossible. Then, as shown in FIG. 4, the metal mask (1) is attached to the printed circuit board (2).
When the printed circuit board (2) is in close contact with the above, a convex portion (3) is provided at a position where the above-mentioned component is mounted, and the squeegee (4) is moved to allow the cream solder to pass through the opening (6). Printed on the printed circuit board (2).

【０００４】しかし、スキージ（４）を移動させてメタ
ルマスク（１）の凸部（３）にくると、図に示す如く、
凸部（３）の上にスキージ（４）が持ち上がり、凸部
（３）の周囲に位置する開口部（６）にはクリーム半田
が塗布されなくなる問題があり、スキージ（４）の移動
を方向をかえて互いに直交する２方向に交互に操作する
必要があった。However, when the squeegee (4) is moved to reach the convex portion (3) of the metal mask (1), as shown in the figure,
There is a problem that the squeegee (4) is lifted on the convex portion (3), and the cream solder is not applied to the opening (6) located around the convex portion (3). However, it was necessary to alternately operate in two directions orthogonal to each other.

【０００５】[0005]

【発明が解決しようとする課題】本発明は上記の事情に
鑑みてなされたものであり、その目的とするところは、
一部部品を搭載したプリント基板の上面にクリーム半田
印刷する時に、搭載した部品に影響されることなく、ク
リーム半田を均一にプリント基板に印刷する方法を提供
することにある。The present invention has been made in view of the above circumstances, and its object is to:
It is an object of the present invention to provide a method for uniformly printing cream solder on a printed circuit board without being affected by the mounted components when the cream solder is printed on the upper surface of the printed circuit board on which some components are mounted.

【０００６】[0006]

【課題を解決するための手段】本発明に係るクリーム半
田の印刷方法は、一部部品を搭載したプリント基板
（２）において、部品（７）を搭載した位置に、該部品
（７）の厚みより高い凸部（３）を有する印刷用メタル
マスク（１）を用い、クリーム半田（８）をプリント基
板（２）に塗布する際に、上記凸部（３）に対応する位
置に切り欠き（５）を有し、その先端が可撓性を有する
スキージ（４）を用い、メタルマスク（１）の状面にク
リーム半田（８）を供給し、上記スキージ（４）をメタ
ルマスク（１）に当接して移動することによりプリント
配線板（２）の表面にクリーム半田（８）を塗布するこ
と特徴とするものである。According to the method of printing cream solder according to the present invention, in a printed board (2) having a part mounted thereon, the thickness of the part (7) is placed at the position where the part (7) is mounted. When the cream solder (8) is applied to the printed circuit board (2) using the printing metal mask (1) having the higher protrusions (3), a notch (at a position corresponding to the protrusions (3) is formed. 5) and a squeegee (4) having a flexible tip is used to supply the cream solder (8) to the surface of the metal mask (1), and the squeegee (4) is replaced with the metal mask (1). It is characterized in that the cream solder (8) is applied to the surface of the printed wiring board (2) by being brought into contact with and moving.

【０００７】[0007]

【作用】本発明に係るクリーム半田の印刷方法による
と、一部部品を搭載したプリント基板において、部品を
搭載した位置に、該部品の厚みに応じた凸部を有する印
刷用メタルマスクをプリント配線板の上面に密着し、上
記凸部に対応する位置に切り欠きを形成したスキージを
用いてクリーム半田を塗布するので、スキージが凸部に
かかっても、スキージの先端が可撓性を有し、切り欠き
が形成されているので、凸部に当接したスキージの先端
が可撓して、メタルマスクよりスキージが離れることな
く移動できる。According to the method for printing cream solder according to the present invention, in a printed board on which some components are mounted, a metal mask for printing having a convex portion corresponding to the thickness of the components is printed at the position where the components are mounted. Since the cream solder is applied using a squeegee that is in close contact with the upper surface of the plate and has a notch formed at a position corresponding to the convex portion, even if the squeegee hits the convex portion, the tip of the squeegee has flexibility. Since the notch is formed, the tip end of the squeegee that is in contact with the convex portion is flexible, and the squeegee can move without separating from the metal mask.

【０００８】以下、本発明を添付した図１〜図３に沿っ
て詳細に説明する。Hereinafter, the present invention will be described in detail with reference to FIGS.

【０００９】[0009]

【実施例】図１は本発明の一実施例に係るクリーム半田
の印刷方法を示した斜視図である。図２はクリーム半田
を印刷する時に使用するスキージの斜視図である。図３
は本発明の一実施例に係るクリーム半田の印刷方法を用
いて印刷を行う、印刷用メタルマスクおよびプリント基
板を示す断面図である。1 is a perspective view showing a method of printing cream solder according to an embodiment of the present invention. FIG. 2 is a perspective view of a squeegee used when printing cream solder. Figure 3
FIG. 3 is a cross-sectional view showing a printing metal mask and a printed circuit board for printing using the cream solder printing method according to one embodiment of the present invention.

【００１０】図１〜図３に示す如く、本発明に係るクリ
ーム半田の印刷方法は、例えば、プリント基板（２）に
対し、メタルマスク（１）および、スキージ（４）を用
いてなされる。このプリント基板（２）は、上面にチッ
プ部品（７）が搭載されている。このプリント基板
（２）の上面に密着するメタルマスク（１）は、プリン
ト基板（２）の上面に搭載されるチップ部品の接着位置
にクリーム半田（８）を塗布するために用いるもので、
チップ部品の接着位置に対応して開口部（６）が形成さ
れている。また、上述のように、プリント基板（２）に
はチップ部品（７）が搭載されているので、このメタル
マスク（１）には、チップ部品（７）を覆うように凸部
（３）が形成されている。この凸部（３）を有すること
によりメタルマスク（１）は、プリント基板（２）にチ
ップ部品（７）が搭載されていても、プリント基板
（２）に密着することができ、このメタルマスク（１）
は、ステンレス綱等の薄板が用いられる。As shown in FIGS. 1 to 3, the cream solder printing method according to the present invention is performed, for example, on a printed circuit board (2) using a metal mask (1) and a squeegee (4). This printed circuit board (2) has a chip component (7) mounted on its upper surface. The metal mask (1) adhered to the upper surface of the printed board (2) is used for applying the cream solder (8) to the bonding position of the chip component mounted on the upper surface of the printed board (2).
An opening (6) is formed corresponding to the bonding position of the chip component. Further, as described above, since the chip component (7) is mounted on the printed circuit board (2), the metal mask (1) has the convex portion (3) so as to cover the chip component (7). Has been formed. By having the convex portion (3), the metal mask (1) can be adhered to the printed board (2) even if the chip component (7) is mounted on the printed board (2). (1)
For, a thin plate such as stainless steel is used.

【００１１】このプリント基板（２）にクリーム半田を
塗布するには、プリント基板（２）にメタルマスク
（１）を密着させ、クリーム半田（８）をメタルマスク
（１）の上に供給し、図１の矢印の方向にスキージ
（４）を移動することにより、クリーム半田（８）が開
口部（６）を通過してプリント基板（２）に印刷され
る。このスキージ（４）は、図２に示す如く、上記スキ
ージ（４）には切り欠き（５）が形成されて、その先端
が可撓性を有するので、メタルマスク（１）の凸部
（３）に当接した際に、スキージ（４）の切り欠き
（５）が形成された部分から大きく撓み、スキージ
（４）の先端がメタルマスク（１）に密着したまま移動
することができ、クリーム半田（８）を印刷することが
できる。To apply the cream solder to the printed board (2), the metal mask (1) is brought into close contact with the printed board (2), and the cream solder (8) is supplied onto the metal mask (1). By moving the squeegee (4) in the direction of the arrow in FIG. 1, the cream solder (8) passes through the opening (6) and is printed on the printed board (2). As shown in FIG. 2, this squeegee (4) has a notch (5) formed in the squeegee (4) and its tip has flexibility, so that the convex portion (3) of the metal mask (1) is formed. ), The squeegee (4) is largely bent from the portion where the notch (5) is formed, and the tip of the squeegee (4) can move while being in close contact with the metal mask (1). The solder (8) can be printed.

【００１２】[0012]

【発明の効果】以上、述べたように、本発明のクリーム
半田の印刷方法によると、一部部品を搭載したプリント
基板において、凸部を有するメタルマスクと、切り欠き
を有し、その先端が可撓性を有するスキージを用いてク
リーム半田を印刷することにより、プリント基板に搭載
した部品に影響されることなく、スキージをメタルマス
クに接したまま移動することができ、均一にクリーム半
田を印刷することができる。As described above, according to the method for printing cream solder of the present invention, the printed circuit board on which some components are mounted has the metal mask having the convex portion and the notch, and the tip thereof is By printing the cream solder with a flexible squeegee, the squeegee can be moved while being in contact with the metal mask without being affected by the components mounted on the printed circuit board, and the cream solder can be printed uniformly. can do.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明に係る一実施例のクリーム半田の印刷装
置の斜視図である。FIG. 1 is a perspective view of a cream solder printing apparatus according to an embodiment of the present invention.

【図２】本発明に使用されるスキージの斜視図である。FIG. 2 is a perspective view of a squeegee used in the present invention.

【図３】本発明に係る一実施例のクリーム半田の印刷装
置の断面図である。FIG. 3 is a cross-sectional view of a cream solder printing apparatus according to an embodiment of the present invention.

【図４】従来のクリーム半田の印刷装置の斜視図であ
る。FIG. 4 is a perspective view of a conventional cream solder printing apparatus.

【符号の説明】[Explanation of symbols]

１ メタルマスク ２ プリント基板 ３ 凸部 ４ スキージ ５ 切り欠き ６ 開口部 ７ チップ部品 ８ クリーム半田 1 Metal Mask 2 Printed Circuit Board 3 Protrusion 4 Squeegee 5 Notch 6 Opening 7 Chip Component 8 Cream Solder

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 一部部品を搭載したプリント基板（２）
において、部品（７）を搭載した位置に、該部品（７）
の厚みより高い凸部（３）を有する印刷用メタルマスク
（１）を用い、クリーム半田（８）をプリント基板
（２）に塗布する際に、上記凸部（３）に対応する位置
に切り欠き（５）を有し、その先端が可撓性を有するス
キージ（４）を用い、メタルマスク（１）の状面にクリ
ーム半田（８）を供給し、上記スキージ（４）をメタル
マスク（１）に当接して移動することによりプリント配
線板（２）の表面にクリーム半田（８）を塗布すること
特徴とするクリーム半田の印刷方法。1. A printed circuit board (2) having a part mounted thereon.
At the position where the component (7) is mounted,
When the cream solder (8) is applied to the printed circuit board (2) using a printing metal mask (1) having a convex portion (3) having a thickness higher than the thickness of the convex portion (3), cut at a position corresponding to the convex portion (3). Using a squeegee (4) having a notch (5) and a flexible tip, cream solder (8) is supplied to the surface of the metal mask (1), and the squeegee (4) is replaced with a metal mask (4). 1) A method for printing cream solder, characterized in that the cream solder (8) is applied to the surface of the printed wiring board (2) by contacting and moving with 1).
JP6089895A 1994-04-27 1994-04-27 Printing of cream solder Withdrawn JPH07290851A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6089895A JPH07290851A (en) 1994-04-27 1994-04-27 Printing of cream solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6089895A JPH07290851A (en) 1994-04-27 1994-04-27 Printing of cream solder

Publications (1)

Publication Number Publication Date
JPH07290851A true JPH07290851A (en) 1995-11-07

Family

ID=13983481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6089895A Withdrawn JPH07290851A (en) 1994-04-27 1994-04-27 Printing of cream solder

Country Status (1)

Country Link
JP (1) JPH07290851A (en)

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20010703