JPH0727637Y2 - 浸漬冷却構造 - Google Patents
浸漬冷却構造Info
- Publication number
- JPH0727637Y2 JPH0727637Y2 JP1989147032U JP14703289U JPH0727637Y2 JP H0727637 Y2 JPH0727637 Y2 JP H0727637Y2 JP 1989147032 U JP1989147032 U JP 1989147032U JP 14703289 U JP14703289 U JP 14703289U JP H0727637 Y2 JPH0727637 Y2 JP H0727637Y2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- heat
- substrate
- cooling plate
- generating component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989147032U JPH0727637Y2 (ja) | 1989-12-22 | 1989-12-22 | 浸漬冷却構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989147032U JPH0727637Y2 (ja) | 1989-12-22 | 1989-12-22 | 浸漬冷却構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0387177U JPH0387177U (US08124630-20120228-C00152.png) | 1991-09-04 |
JPH0727637Y2 true JPH0727637Y2 (ja) | 1995-06-21 |
Family
ID=31693565
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989147032U Expired - Lifetime JPH0727637Y2 (ja) | 1989-12-22 | 1989-12-22 | 浸漬冷却構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0727637Y2 (US08124630-20120228-C00152.png) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6771500B1 (en) * | 2003-03-27 | 2004-08-03 | Stmicroelectronics, Inc. | System and method for direct convective cooling of an exposed integrated circuit die surface |
US20090260783A1 (en) * | 2006-03-06 | 2009-10-22 | Tokyo University Of Science Educational Foundation | Boil Cooling Method, Boil Cooling Apparatus, Flow Channel Structure and Applied Product Thereof |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56103453A (en) * | 1980-01-21 | 1981-08-18 | Hitachi Ltd | Lsi apparatus system |
JPS57103338A (en) * | 1980-12-19 | 1982-06-26 | Hitachi Ltd | Boiling cooling device |
-
1989
- 1989-12-22 JP JP1989147032U patent/JPH0727637Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0387177U (US08124630-20120228-C00152.png) | 1991-09-04 |
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