JPH07273167A - Vacuum pincette - Google Patents

Abstract

PURPOSE:To provide a vacuum pincette for handling a wafer having a function for aligning the orientation flat. CONSTITUTION:A vacuum pincette 1 is provided with a wafer rotating roller 11. The wafer rotating roller 11 is rotated by closing a button 5 for supplying vacuum through a vacuum hose 6 into a vacuum head 2 and opening a button 12 for supplying vacuum to the rotary unit for the rotary roller 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to vacuum tweezers for sucking a wafer.

[0002]

2. Description of the Related Art Vacuum tweezers is a manual tool for handling a wafer by using a vacuum source, and has a wafer suction head at the tip of a pipe. Then, there is a button on the handle part that you hold with your hands to control the suction of the head part. Conventional vacuum tweezers have a function of adsorbing a wafer. By the way, when the wafer is inserted into the cassette, it is necessary to align the orientation flat of the wafer. Conventionally, the orientation flat of the wafer is adjusted by manually moving the tweezers to the left or right while changing the suction position of the tweezers having the wafer that is adsorbed.

[0003]

SUMMARY OF THE INVENTION In view of such circumstances, it is an object of the present invention to provide a vacuum tweezers having a function of aligning an orientation flat with a vacuum tweezers for handling a wafer.

[0004]

In order to solve the above problems, the present invention is characterized in that a means for rotating a wafer is attached to vacuum tweezers. The means for rotating the wafer may be a rotating roller, and specifically, a rotating roller using the same vacuum source as the tweezers as a power source, a rotating roller using another power source as a power source, or a manual rotating roller.

[0005]

The vacuum tweezers of the present invention has means for rotating the wafer. Therefore, the orientation flat alignment becomes easy, and it is not necessary to transport the cassette to the orientation flat alignment machine. As a means for rotating the wafer, there is provided a roller which is brought into contact with the edge of the wafer to rotate the wafer. The roller is preferably made of rubber, plastic or the like. This roller
If the rotary power is obtained from the vacuum source of the vacuum tweezers, another power source is unnecessary. In this case, if the vacuum system of the tweezers and the power source of the roller are the same vacuum source, only one power source is required, but it is difficult to perform suction and roller rotation at the same time. In order to enable this at the same time, separate power sources are required, and it is necessary to use two vacuum sources or use electric power to rotate the rollers.
At this time, two operations can be performed simultaneously, which is preferable. The rotation of the rollers may be manual. A known mechanism may be used as the mechanism.

Further, instead of the roller, the suction head itself may be made rotatable, and the wafer may be rotated while suctioning the wafer.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows the vacuum tweezers 1 of the present invention. The vacuum head 2 is a portion for adsorbing a wafer. When the vacuum head 2 is brought into contact with the wafer and the button 5 is pressed by holding the handle 4 by hand, the vacuum hose 6 connected to the vacuum device 3 communicates with the vacuum head 2. Then, the wafer is sucked. In the vacuum tweezers of the present invention, the wafer rotating roller 11 is attached to this conventional mechanism. The wafer rotating roller 11 is rotated by a rotating device 15, as shown in FIGS. In the example shown in FIG. 2, when the button 12 is pressed, the vacuum hose 6 moves to the button 1
2. The rotating device 15 is rotated by communicating with the attached valve 13 and the air passage 14. 4, 5 and 6 use this tweezers to rotate the wafer 100 in the cassette 101 and the orientation flat 102.
FIG. 8 is a diagram of an operation of aligning the positions of. Shows the state of

FIG. 7 shows a vacuum tweezers 1 according to another embodiment of the present invention. The suction port member 21 of the vacuum head 2 can be made rotatable, and the wafer can be rotated while sucking the wafer. The suction port member 21 is provided with a coil 22 that forms a rotating magnetic field, and as shown in FIG. 8, FIG. 9 shows an example in which a bevel gear device 24 is attached to a rotating shaft 26 of a motor 25. FIG. 10 shows a state in which the wafer 100 is rotated using this apparatus. A vacuum source may be used as a power source for rotating the suction port member 21.
FIG. 11 shows an overall view thereof and is provided with two series of vacuum hoses 6 and 7. 12 and 13 show the vacuum system path. The vacuum system path for suction is operated by the operation of the button 5 and sucks the wafer along the center of the axis of the suction port member 31. The vacuum passage for operating the rotating device 32 of the suction port member 31 is opened and closed by operating the button 12. Figure 1
4 is for rotating the suction port member 41 by the manual handle 43. In this example, the handle 43 swings as shown by an arrow 45 by the action of the human force and the spring 46,
A pinion meshes with a fan-shaped gear 44 provided at the tip of the swing, and this pinion shaft 49 rotates the pinion 48.
To the bevel gear 42 to rotate the suction port member 41. This mechanism may use another known manual mechanism for converting reciprocating motion into rotary motion.

Since the vacuum tweezers of the present invention have the mechanism for rotating the wafer, it is not necessary to hang all the cassettes on the wafer orientation flat aligning device.

[0010]

Since the vacuum tweezers of the present invention are configured as described above, the orientation flat alignment can be easily performed when one or two wafers are replenished in the cassette in the wafer handling process. It has an excellent effect of contributing to rationalization of work.

[Brief description of drawings]

FIG. 1 is a perspective view showing a vacuum tweezers of an embodiment.

FIG. 2 is a structural explanatory view of the vacuum tweezers of the embodiment.

FIG. 3 is a structural explanatory view of the vacuum tweezers of the embodiment.

FIG. 4 is an operation explanatory view of the vacuum tweezers of the embodiment.

FIG. 5 is an operation explanatory view of the vacuum tweezers of the embodiment.

FIG. 6 is an operation explanatory view of the vacuum tweezers of the embodiment.

FIG. 7 is a vertical sectional view of a vacuum tweezers of another embodiment.

FIG. 8 is a perspective view showing the vacuum tweezers of the embodiment.

FIG. 9 is a vertical sectional view of a vacuum tweezers of another embodiment.

FIG. 10 is an operation explanatory view of the vacuum tweezers of the embodiment.

FIG. 11 is a perspective view showing the vacuum tweezers of the embodiment.

FIG. 12 is a structural explanatory view of the vacuum tweezers of the embodiment.

FIG. 13 is a structural explanatory view of the vacuum tweezers of the embodiment.

FIG. 14 is a structural explanatory view of the vacuum tweezers of the embodiment.

[Explanation of symbols]

1 Vacuum Tweezers 2 Vacuum Head 3 Vacuum Device 4 Handle 5 Boton 6 Vacuum Hose 7 Vacuum Hose 11 Wafer Rotating Roller 12 Boton 13 Valve 14 Air Passage 15 Rotating Device 21 Suction Port Member 22 Coil 23 Electric Wire 24 Bevel Gear Device 25 Motor 26 Rotating Shaft 31 Suction port member 32 Rotating device 41 Suction port member 42 Bevel gear 43 Handle 44 Fan gear 45 Arrow 46 Spring 47 Pinion 48 Rotation 49 Pinion shaft 100 Wafer 101 Cassette 102 Orientation flat

Claims (6)

[Claims] 1. The vacuum tweezers further comprising means for rotating the wafer. 2. The vacuum tweezers according to claim 1, wherein the means for rotating the wafer is a rotating roller. 3. The vacuum tweezers according to claim 1, wherein the means for rotating the wafer is a rotating roller powered by the same vacuum source as the tweezers. 4. The vacuum tweezers according to claim 1, wherein the means for rotating the wafer is a rotating roller powered by a power source different from a vacuum source of the vacuum tweezers. 5. The vacuum tweezers according to claim 1, wherein the means for rotating the wafer is a manual rotation roller. 6. The vacuum tweezers according to claim 1, wherein the means for rotating the wafer is a suction head formed so as to be rotatable.