JP3981747B2 - Vacuum tweezers - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to vacuum tweezers used when handling a semiconductor wafer.
[0002]
[Prior art]
In some cases, the semiconductor wafer is inspected by being taken out of the storage case and visually observed after the heat treatment. In such a case, the semiconductor wafer is handled manually, but vacuum tweezers that vacuum-suck the semiconductor wafer when handling the semiconductor wafer are used.
[0003]
FIG. 8 is a schematic cross-sectional view showing an example of conventional vacuum tweezers. In the figure, 50 is vacuum tweezers, 51 is a handle, 52 is a motor, 53 is a motor rotating shaft, 54 is a suction pad, 55 is a suction hole, 56 is a space, 57 is a battery, 58 is a valve, and 59 is a switch. . The valve 58 is provided in the handle 51 and opens and closes an exhaust passage communicating with a vacuum source. Normally, the valve 58 is pushed in and the exhaust passage is blocked.
[0004]
When handling the semiconductor wafer by the vacuum tweezers, the valve 58 is pulled out to open the exhaust passage, and the suction pad 54 is applied to the back surface of the semiconductor wafer W as shown in the schematic perspective view of FIG. To do. Next, the switch 59 is operated to operate the motor 52 to rotate the semiconductor wafer W in the direction of arrow R in FIG. Since the suction pad 54 is fixed in parallel to the rotation axis 53 of the motor 52, the rotation axis of the motor 52 is arranged in parallel to the suction surface of the semiconductor wafer W, and the rotation locus of the semiconductor wafer W is three-dimensional. Becomes spherical. By rotating the semiconductor wafer using the motor in this way, the front and back surfaces of the semiconductor wafer are visually inspected.
[0005]
When visually inspecting and inspecting the surface of a semiconductor wafer, in particular, in order to observe the presence or absence of scratches (scratches) that are randomly generated on the surface of the semiconductor wafer, light is focused on the surface of the semiconductor wafer from all directions. It is necessary to observe the light. By the way, generally, as shown in the schematic configuration diagram of FIG. 10, the condenser lamp L is fixed at an upper position with respect to the surface to be inspected of the semiconductor wafer. It is limited to. For this reason, in order for the operator M to observe the entire surface of the semiconductor wafer evenly, the semiconductor wafer W is rotated in the direction of arrow P, and different portions of the surface are sequentially moved with respect to the projection surface of the condenser lamp L. Thus, it is necessary for the operator M to be able to observe.
[0006]
[Problems to be solved by the invention]
However, since the suction pad 54 is fixed to the handle 51 in the configuration of the vacuum tweezers 50 of the above-described conventional example, the semiconductor with respect to the light projecting surface of the condenser lamp L is maintained with the semiconductor wafer fixed to the vacuum tweezers. Different parts of the wafer surface could not be moved. For this reason, the operator turns the handle of the vacuum tweezers and observes a different part of the surface of the semiconductor wafer, or returns the semiconductor wafer to the storage case and sucks the suction pad at another position on the back surface of the semiconductor wafer. It was necessary to observe different parts of
[0007]
Thus, the conventional handling of semiconductor wafers by vacuum tweezers has a problem that workability is poor because the angle of the surface position of the semiconductor wafer is changed by turning the handle of the vacuum tweezers. In addition, when the semiconductor wafer is once returned to the storage case and handled by changing the suction position again, there is a problem that the semiconductor wafer is scratched or the quality deteriorates due to adhesion of fine pieces or particles (particles).
[0008]
The present invention has been made in view of such problems, and improves the workability of handling of a semiconductor wafer, and the semiconductor wafer is scratched or fine particles or particles are attached during handling. The object is to provide vacuum tweezers that prevent the quality from deteriorating.
[0009]
[Means for Solving the Problems]
The present invention relates to a suction pipe having a grip portion at a base and an opening attached to a distal end portion of the ventilation pipe and having an opening communicating with the opening of the ventilation pipe to adsorb a semiconductor wafer surface by a vacuum pressure in the ventilation pipe. the vacuum tweezers comprising a pad, the vent tube, to fix the motor with a rotary drive shaft extending perpendicularly against the extending direction of the vent pipe, the suction pad to the distal end portion of the rotary drive shaft While fixing, the opening of the said ventilation pipe and the opening of the said suction pad are connected via the elastic ring, It is characterized by the above-mentioned.
[0010]
In the present invention, when the semiconductor wafer is attracted to the suction pad, the drive shaft to which the motor power is transmitted extends in a direction perpendicular to the suction surface of the semiconductor wafer, so the semiconductor wafer rotates in a plane. Will be. For this reason, when the position of the condenser lamp is fixed and the projection surface is limited to a certain range, the surface of the semiconductor wafer can be moved sequentially to the position of the projection surface, so that the entire surface of the semiconductor wafer is observed. Thus, movement of the gripping member at the time of inspection becomes unnecessary, and handling workability is improved. In addition, since there is no need to return the semiconductor wafer to the storage case and take it out again, it is possible to prevent the quality of the semiconductor wafer from being deteriorated during handling.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to FIG. FIG. 1 is a side view showing a partial cross section of a vacuum tweezers according to an embodiment of the present invention. In FIG. 1, the vacuum tweezers 1 has a suction pad 2 provided with a space portion 3 and an air vent hole 4 communicating with the space portion 3, a connection tube 8, and a handle 9. The handle 9 is provided with a fixing portion 9 a of the connection pipe 8, an air passage 9 b, a vacuum adsorption switch 10, and a motor drive switch 11. The space 3 of the adsorbing member 2, the air vent hole 4, the air passage 8 a formed inside the connecting pipe 8, and the air passage 9 b of the handle 9 are connected to a vacuum source (not shown) to form an exhaust passage. Yes.
[0012]
Reference numeral 5 denotes a thin small motor, and a drive shaft 6 to which the power of the motor 5 is transmitted is fixed to the suction pad 2 and extends in a direction perpendicular to the suction surface of the semiconductor wafer of the suction pad 2. Rotate. A battery 7 serves as a power source for the small motor, but an external power source can be connected to supply power to the small motor. FIG. 2 is a schematic bottom view of the suction pad 2 of FIG. 1 viewed from the direction of arrow A. As shown in FIG. 2, the air vent hole 4 provided in the suction pad 2 is formed so as to surround a portion through which the drive shaft 6 passes.
[0013]
When the motor drive switch 11 provided on the handle 9 of the vacuum tweezers 1 is operated, the small motor 5 rotates and the suction pad 2 fixed to the drive shaft 6 to which the power is transmitted rotates. An elastic ring 12 is arranged between the connecting pipe 8 and the suction pad 2 to allow the suction pad 2 to rotate and air leaks from the communicating part of the air vent hole 4 of the suction pad 2 and the air passage 8a of the connecting pipe 8. There is elastically pressed contact with the suction pad 2. The rotation speed of the small motor 5 is set to a low speed.
[0014]
3 to 6 are schematic bottom views showing a state in which the suction pad 2 is rotated by the rotation of the small motor 5 as viewed from the back side of the suction pad 2. When the small motor 5 is driven with the suction pad 2 fixed to the drive shaft 6 as shown in FIG. 3, the suction pad 2 starts to rotate in the direction of arrow P. 4 shows a state rotated 90 degrees from the initial state of FIG. 3, FIG. 5 shows a state rotated 180 degrees from the initial state of FIG. 3, and FIG. 6 shows a state rotated 270 degrees from the initial state of FIG. Further, when the suction pad 2 is rotated 90 degrees, the state shown in FIG. 3 is restored.
[0015]
One surface, for example, the back surface of the semiconductor wafer is brought into contact with the position of the space 3 of the suction pad 2 and a vacuum suction force is applied to the exhaust path by operating the vacuum suction switch 10, so that the semiconductor is applied to the suction pad 2 of the vacuum tweezers 1. Adsorb wafer. At this time, the drive shaft 6 to which the power of the motor is transmitted extends in a direction perpendicular to the suction surface of the semiconductor wafer, and when the small motor 5 rotates as described with reference to FIGS. Rotates and the semiconductor wafer also rotates. FIG. 7 is a schematic plan view of an example in which the back surface of the semiconductor wafer 12 is sucked by the suction pad 2 and rotated with the front side facing up. The rotation direction of the semiconductor wafer 12 is appropriately selected in the clockwise direction P as viewed in the direction P or the counterclockwise direction Q as viewed in the direction Q. Selection of such a rotation direction is easily performed by switching the rotation direction of the small motor 5.
[0016]
As described above, in the vacuum tweezers of the present invention, when the semiconductor wafer is attracted to the suction pad, the drive shaft for transmitting the power of the motor extends to the suction surface so as to extend in a right angle direction, and the semiconductor rotates with the rotation of the semiconductor. The surface of the wafer becomes a two-dimensional motion that rotates in a plane. For this reason, when the vacuum tweezers are used when the surface of the semiconductor wafer is inspected by the fixed condenser L as shown in FIG. 10, the surface of the semiconductor wafer differs from the projection surface of the condenser L. The parts can be moved sequentially for inspection.
[0017]
In the example of FIG. 1, the small motor 5 is disposed opposite to the surface of the suction pad 2 opposite to the suction surface of the semiconductor wafer, and the suction pad 2 is fixed to the drive shaft 6 to which the rotational driving force of the motor is transmitted. The output shaft of the motor is directly used as the drive shaft. The mounting position of the small motor is not limited to being disposed so as to face the surface of the suction pad 2 opposite to the suction surface of the semiconductor wafer. A small motor is displaced from the position of the suction pad 2 in the direction of the connection pipe 9 and is arranged on the upper side of the connection pipe 9. It can also be set as the structure rotated in a plane.
[0018]
In the example of FIG. 1, the connecting pipe and the handle are configured as separate members, but may be configured as an integral gripping member. The vacuum tweezers of the present invention can be used when handling is required in addition to inspection after heat treatment of a semiconductor wafer.
[0019]
【The invention's effect】
As described above, according to the vacuum tweezers of the present invention, when the semiconductor wafer is attracted to the suction pad, the drive shaft for transmitting the power of the motor is arranged to extend in the perpendicular direction to the suction surface of the semiconductor wafer. The semiconductor wafer is rotated in a plane. For this reason, when the position of the condenser lamp is fixed and the projection surface is limited to a certain range, the handling work is not required when the entire surface of the semiconductor wafer is observed and inspected. Improved. In addition, since there is no need to return the semiconductor wafer to the storage case and take it out again, it is possible to prevent the quality of the semiconductor wafer from being deteriorated during handling.
[Brief description of the drawings]
FIG. 1 is a schematic side view showing a partial cross section of a vacuum tweezers according to an embodiment of the present invention.
FIG. 2 is a bottom view of the adsorbing member of FIG.
FIG. 3 is a schematic bottom view showing the rotation state of the suction member as seen from the back side.
FIG. 4 is a schematic bottom view showing the rotation state of the adsorption member as seen from the back side.
FIG. 5 is a schematic bottom view showing the rotation state of the suction member as seen from the back side.
FIG. 6 is a schematic bottom view showing the rotation state of the adsorption member as seen from the back side.
FIG. 7 is a schematic plan view showing a rotation state of a semiconductor wafer. FIG. 8 is a cross-sectional view of a conventional vacuum tweezers.
FIG. 9 is a schematic perspective view showing a rotation state of a conventional semiconductor wafer. FIG. 10 is a schematic configuration diagram showing a positional relationship between a condenser lamp and a semiconductor wafer.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Vacuum tweezers 2 Adsorption pad 3 Space part 4 Air vent hole 5 Small motor 6 Rotation drive shaft 7 Battery 8 Connection pipe 9 Handle 10 Adsorption switch 11 Motor switch 12 Elastic ring

Claims (1)

A vent pipe having a grip portion at a base, and a suction pad attached to a tip portion of the vent pipe and having an opening communicating with the opening of the vent pipe and adsorbing a semiconductor wafer surface by a vacuum pressure in the vent pipe the vacuum tweezers comprising Te, the vent pipe, with fixing the motor having a rotary drive shaft extending perpendicularly against the extending direction of the vent pipe, said fixed suction pads at the distal end of the rotary drive shaft, A vacuum tweezers characterized in that the opening of the vent pipe and the opening of the suction pad are communicated through an elastic ring .

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