JPH07272993A - Dry scrubber - Google Patents

Abstract

PURPOSE:To efficiently remove dusts from a substrate by a drying method by forming a dry scrubber by a substrate chuck for holding the outer circumference of substrate, a dust removing means for removing dust on at least either surface of the substrate, and a destaticization means for the substrate. CONSTITUTION:A dry scrubber A is comprised of a substrate chuck 6 for holding the outer circumference of a substrate 1, a dust removing means that is prepared in a dust removing part E for the substrate 1 and removes dusts on at least either surface of the substarte 1, and a destaticization means J for destaticizing the substarte 1 charged with electrostatic electricity. Further, it is provided with a substrate chuck rotating means for rotating the substrate 1 on its horizontal plane. Thus, the rear surface or both surfaces of the substrate can be kept clean thanks to its excellent dust-removal performance and the generation of failure due to adhered fine dusts can be also prevented during handling or processing of the substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dry scrubber which chucks only a peripheral portion of a substrate and neutralizes the substrate to effectively remove fine dust adhering to one surface or both surfaces thereof. .

[0002]

2. Description of the Related Art Semiconductors are currently used in ultra LSIs and ultra LSs.
I has been developed, and extremely fine circuits formed by applying the ultra-precision photoengraving technique are densely formed on the surface thereof. As for such semiconductor substrates, the equipment forming the line is being dried at present, and the chuck device for fixing the substrate to the base is shifting from the vacuum suction method to the electrostatic chuck method. Is often used in.

When an electrostatic chuck is used, the substrate is charged by static electricity, and even if the dust in the room is purified to the limit, suspended dust in the air still exists, and extremely fine dust is present on both front and back surfaces of the substrate. Tend to adhere during transfer, which appears as a circuit defect in the semiconductor circuit, resulting in reduced yield.
As mentioned above, if the circuit structure of the semiconductor substrate becomes more precise, the manufacturing cost per wafer will increase, and the improvement in yield will greatly contribute to cost reduction. Has become an important issue.

Further, as an apparatus installed on a semiconductor manufacturing line, there is an ultra-precision apparatus such as a stepper. However, in the stepper, if extremely fine dust exists between the chuck base and the semiconductor substrate, the substrate surface is focused. There is a problem that they are not connected and cause product defects. This is because, due to the influence of the electrostatic chuck, the substrate is transferred while being charged, and floating dust in the air adheres during the transfer, so the fine dust adhering to the electrostatic chuck moves to the back surface of the substrate. it is conceivable that. As a method of cleaning the substrate, there is a wet method using a cleaning liquid, but since the manufacturing line is being dried as described above, it was necessary to remove dust from the substrate by the dry method.

[0005]

The problem to be solved by the dry scrubber according to the present invention is to effectively remove dust from a substrate by a dry method.

[0006]

A dry scrubber (A) according to claim 1 comprises: a substrate chuck (6) for holding an outer periphery of a substrate (1) and at least one surface of the substrate (1) for removing dust. And a static eliminator (J) for eliminating static electricity on the substrate (1) charged with static electricity. ”

As a result, the charged substrate (1) is electrically neutralized and discharged by the charge eliminating means (J) to facilitate the removal of dust adhering to it due to static electricity.
At least one surface of (1) is removed by suction or mechanical contact with the dust removing means (E1).

The dry scrubber (A) according to claim 2 comprises a substrate chuck (6) for holding the outer periphery of the substrate (1),
Dust removal means (E1) for removing dust on at least one surface of (1),
Static elimination means for eliminating static electricity on the substrate (1)
(J) and a substrate chuck rotating means (K) for rotating the substrate (1) in its horizontal plane ”.

In this case, dust is removed by the same action as in claim 1, but since the substrate (1) is rotated in the horizontal plane by the substrate chuck rotating means (K), the substrate ( By making line contact between 1) and the dust removing means (E1), effective dust removal can be performed.

The dry scrubber (A) of claim 3 is a "substrate (1)"
A substrate chuck (6) for holding the outer periphery of the substrate, a dust removing means (E1) for removing dust on at least one surface of the substrate (1), and a static eliminating means (J) for removing the static electricity on the substrate (1). ) And the board
It is composed of a dust removing means moving mechanism (L) for moving the dust removing means (E1) in parallel with the dust removing surface (1a) of (1).

In this case as well, dust is removed by the same action as in claim 1, but in this case, the dust removing means moving mechanism.
By moving the dust removing means (E1) in parallel with (L) the dust removing surface (1a) of the substrate (1), the substrate (1) can be effectively removed.

A fourth aspect of the present invention is that "a claw member of a substrate chuck (6) is engaged with a beveling portion of a substrate (1) having a beveled peripheral edge.
The height of (5) is smaller than the height to the dust removal surface (1a) of the beveling part of the substrate (1), and the claw body (5) is formed so as not to come out of the dust removal surface (1a). ' Characterize.

As a result, since the entire surface of the dust removing surface (1a) of the substrate (1) is exposed, the entire surface of the dust removing surface (1a) can be removed by a physical method such as suction or brushing.
Dust can be completely removed.

A fifth aspect of the invention is characterized in that "the dust removing means (E1) is a suction nozzle (83) which is opened in the vicinity of the dust removing surface (1a) of the substrate (1)".

As a result, the dust adhering to the surface of the dust removing surface (1a) is sucked together with the suction gas, and the dust can be removed without contact.

The sixth aspect is characterized in that "the dust removing means (E1) is a brush body (M) for contacting the dust removing surface (1a) of the substrate (1) to remove the dust on the dust removing surface (1a)". And

As a result, the dust-removing surface (1a) is physically brushed to remove dust, and dust that is difficult to remove can be effectively removed.

A seventh aspect of the present invention is that the "brush body (M) is formed in a cylindrical shape and is arranged in parallel with the substrate (1) and rotates about its rotation axis (40). Scraper that sucks dust that has contacted the body (M) and transferred to the brush body (M)
(87) is provided ”.

The dust effectively removed by brushing can be further removed by the scraper (87), and the dust transferred to the brush body (M) can be removed.
Can be kept clean.

[0020]

EXAMPLES Hereinafter, the dry scrubber (A) according to the present invention will be described together with examples. In addition, in the one shown in the figure, the substrate
Although a semiconductor wafer will be described as an example of (1), it goes without saying that it can be applied to other thin plates such as glass plate, alumina, quartz plate, ceramic plate, sapphire plate, aluminum disk and others. Dry scrubber shown in Figure 1
(A) is a transfer robot (C) for loading and unloading the substrate (1) into and from the dust removal section (E), a loader (B) for supplying the substrate (1) to the transfer robot (C), and dust removal The unloader (D) for storing the completed substrate (1), the dust removing unit (E) for removing dust from the substrate (1), and the main charge removing unit for removing charge from the substrate (1) in the dust removing unit (E)
(J), a secondary static eliminator (I) for neutralizing the substrate (1) at the home position of the transfer robot (C), a controller (F) for controlling the entire apparatus, and an apparatus main body on which these mechanical sections are mounted.
It is composed of (G) and.

The loader (B) sets the unprocessed substrate (1) stored in the cassette (54), and raises or lowers one step at a time according to the removal of the transfer robot (C).
(1) is moved to a predetermined take-out position. On the contrary, the unloader (D) is dedusted by the dust removal unit (E), and the transfer robot
A cassette (54) for storing the substrate (1) transferred in (C)
It is for mounting the board.
This is for preparing an empty storage portion of the cassette (54) by moving up or down step by step.

The transfer robot (C) takes out the unprocessed substrate (1) from the loader (B) and supplies it to the dust removing section (E), and
This is for taking out the treated substrate (1) from which dust has been removed in (E) from the dust removing section (E) and transferring it to the unloader (D).
At the home position of the transfer robot (C), a sub charge removal means (I) for removing the charge of the substrate (1) being transferred is provided. These loader (B), unloader (D) and transfer robot
Since (C) has a known structure, its details are omitted.

2 and 3 are cross-sectional views of the first embodiment of the dust removing unit (E) and the chuck rotating means (K) according to the present invention, in which the substrate chuck (6) is rotated through the slider (9). It is slidably mounted in the housing (10). The substrate chuck (6) has a ring shape and is divided into three parts so that the chuck diameter can be expanded and contracted as shown in FIGS. A self-aligning clamp groove (4) is formed on the inner circumference of the substrate chuck (6) so that the whole circumference of the thin plate substrate (1) whose peripheral edge is beveled can be chucked.

FIG. 7 is a partially enlarged sectional view of the self-aligning clamp groove (4) formed on the inner peripheral side surface of the substrate chuck (6). The self-aligning clamp groove (4) is formed on the substrate (1). ), The inner side surface (4a) that abuts the outer peripheral surface, and the claw body (5) that is located below the inner side surface (4a) and supports the lower tapered surface of the beveling portion of the substrate (1), and the upper slide inclined surface located above it It is composed of (4b) and.

In the embodiment of FIG. 7, the upper slide inclined surface (4
The shape of b) is formed by a curved surface whose cross section is gently curved with convex and concave portions, and the cross-sectional shape is formed into an S shape, and the inner surface (4a) is formed. It is connected gently. This allows the self-aligning clamp groove
(4) The peripheral edge of the board (1) fitted inside is slid slightly along the upper slide inclined surface (4b), fits inside the inner side surface (4a), and is lowered by the claw body (5). The tapered surface will be retained. The claw body (5) only slightly engages with the lower tapered surface of the beveling part on the peripheral edge of the substrate (1) (in other words, the claw body (5) is the lower taper of the beveling part of the substrate (1). Smaller than the height of the surface}, the lower surface of the claw body (5) does not protrude from the dust removal surface (1a) which is the lower surface of the substrate (1).

The substrate chucks (6) are connected to each other by the expansion / contraction guides (12) fixed to the mounting block (70b), and the substrate chucks (6) adjacent to the slide part (12a) of the expansion / contraction guides (12). It is slidably held in the slide hole (71a) formed in the mounting block (70a) of the expansion cylinder head (14) between the expansion rollers (13) provided on the pair of adjacent substrate chucks (6). ) Is inserted to increase the distance between the substrate chucks (6) as shown in FIG. At this time, the slide portion (70a) moves in the direction of coming out of the slide hole (71a).

The expansion / contraction of the substrate chuck (6) is performed via the sliders (9) arranged on the lower surface of the substrate chuck (6). Expansion of the chuck diameter of the substrate chuck (6) is performed by the expansion cylinder head (14) as described above, but contraction of the chuck diameter is expanded cylinder head.
Chuck diameter shrinking cylinder (15) opposite to (14)
Done by That is, the chuck diameter shrinking cylinder (1
By activating 5) to press the substrate chuck (6), the slide part (12a) is pushed back into the slide hole (71a), and the whole substrate chuck (6) is closed as shown in FIG. . At this time, the expansion cylinder head (14) is pulled back to the rear. When the substrate chuck (6) is closed as described above and the peripheral edge of the substrate (1) is clamped in the self-aligning clamp groove (4), one of the expansion / contraction guides (12) is locked by the lock mechanism (H). The substrate chuck (6) is prevented from opening due to centrifugal force during rotation. The lock mechanism (H) will be described later.

The rotary upper housing (10) is connected to the rotary cylinder (17) through the rotary head cover (16). A driven pulley (18) is attached to the rotary cylinder (17) and is connected to a drive pulley (20) of a substrate rotation drive motor (21) via a drive belt (19). As a result, the rotational force of the substrate rotation drive motor (21) is transmitted to the driven pulley (18), and the substrate chuck (6) rotates. A positioning cam (22) is attached to the driven pulley (18), and the positioning cam follower (23) fits into the groove of the positioning cam (22), and the substrate chuck (6) is always forced at a predetermined position. The positioning sensor (23a) constantly senses the stop position to ensure that the positioning cam follower (23) fits correctly into the groove of the positioning cam (22) at all times. Has been done. Since this means is also a conventional means, detailed description is omitted.

Reference numeral (24) is a fixed housing fitted to the outside of the rotary cylinder (17), and rotatably holds the rotary cylinder (17) via a bearing. Reference numeral (25) is a fixed cover provided on the upper end of the fixed housing (24). Lower Base Plate (26)
A pillar (27) is erected on the top of the
(29) is fixed. Reference numeral (28) is a fixed head cover which is attached to the upper end of the fixed block (29) and covers the rotary head cover (16) from above.

A substrate receiving cylinder rod (30) is slidably inserted in the center of the fixed block (29), and a substrate receiving working cylinder installed below the fixed block (29).
It can be moved up and down by (31).
A base bearing intermediate member (32) having a V-shaped cross section is attached to the upper end of the substrate receiving cylinder rod (30), and a substrate receiving rod (33) is erected from the base bearing intermediate member (32). In this embodiment, the number of the substrate receiving rods (33) is four, and the receiving head (35) is fitted to the tip of the substrate receiving rods (33) via the cushioning material (34).

Next, the dust removing means (E
1) and the first embodiment of the dust removing means moving mechanism (L) will be described with reference to FIG. On the base bearing intermediate member (32), for example, a rotary cylinder (80) for swinging the swing arm (82) at a predetermined angle is installed, and the swing arm (82) is used to swing the swing arm (82). Install the suction nozzle (83) protruding from the tip of (82)
It is designed to be moved from the center of (1) to the periphery. In this embodiment, the swing arm (82) and the swing shaft (81) are hollow and communicate with the suction nozzle (83).
It is connected to (84).

Next, the main charge eliminating means (J) used in the present invention will be described. In the window of the rotating upper housing (10),
The transparent member (85) is fitted therein, and the main charge eliminating means (J) is installed so as to face the transparent member (85). Transparent material (85)
For example, transparent glass or transparent resin is used.
Further, as the main charge eliminating means (J), lamps such as a deuterium lamp, a mercury lamp and a barrier lamp (86) are used in this embodiment. (Of course, the static elimination means is not limited to this, static elimination by ionizer using corona discharge, static elimination by isotope, static elimination by electron beam irradiation, plasma static elimination, static elimination by soft X-ray irradiation, etc., but use of lamps is also possible. Is the most convenient and does not generate harmful dust during use.) Here, an example will be described in which dust-free static elimination is performed by using the lamp that emits ultraviolet rays.

Next, the static elimination mechanism by the lamp 86 will be briefly described. The lamp (86) emits ultraviolet rays, but when the wavelength of ultraviolet rays is short, the gas around the irradiated portion is ionized to remove the dust removal surface (1) of the substrate (1).
It will electrically neutralize a). Ultraviolet rays with a long wavelength are neutralized by generating photoelectrons. When using a deuterium lamp, use MgF as the window material (= transparent member (85))
_{Since 2} is used, light with a wavelength of 115 nm or less is emitted. In this case, it will be water cooled. In the case of mercury lamps, there are three types: ultra high pressure, high pressure, and low pressure. A low-pressure mercury lamp is suitable when using short wavelength ultraviolet light. Barrier lamps generate different spectra depending on the gas filled, but one that is generally available is 1.
72 nm (Xe ₂ ), 222 nm (KrCl), 308 nm (XeCl)
Is.

When the wavelength of the light emitted from the lamp (86) is converted into energy, it is expressed by the following equation. E = 1,239.5 / λ (nm) eV / photon The energy in Table 2 is the converted value. Table 2 shows the ionization energy and dissociation energy of various gases. As can be seen from this table, at a wavelength shorter than 200 nm, ozone is generated in the presence of oxygen. hv O ₂ → O + O O ₂ + O → O ₃ However, at a wavelength of 220 nm or more, ozone also absorbs light and returns to O ₂ . In the deuterium lamp, O ₂
It does not directly ionize N ₂ and N ₂ , but makes NO ions. This NO ion pair erases the charge on the dust-removing surface (1a) of the substrate (1). Ions are not created with light of a longer wavelength. Ultraviolet rays generate photoelectrons from the sealed tube (86a) and the glass member (85) attached to the window, which causes the substrate
The positive charge of (1) is erased, and the ultraviolet rays are charged by the charged body {=
It is considered that the charged body (1) itself strikes the substrate (1) to generate photoelectrons to erase the negative charge.

Therefore, it is important to directly irradiate the charged substrate (1) to eliminate static electricity by ultraviolet rays, and since the photoelectron generation increases as the energy increases, the wavelength should be short and the irradiation intensity should be high. In the case of FIG. 2, for the convenience of drawing,
The light from the lamp (86) is perpendicular to the substrate (1), but the light from the lamp (86) is supposed to be applied to the substrate (1).

Next, the wavelength and energy of various lamps (86)
The relationship is shown in Table 1, and the ionization and dissociation energy of various gases
Table 2 shows the relationship between the two. ... Table 1 ...Lamp wavelength (nm) Energy (eV) Deuterium lamp 112 11 Low pressure mercury lamp 184.9 6.7 253.7 4.9 Barrier lamp 172 (Xe) 7.2 (Excimer laser) 222 (KrCl) 5.5  308 (XeCl) 4.0  ... Table 2 ...Gas Ionization energy (eV) Dissociation energy (eV) O ₂ 12.2 5.08 N ₂ 15.6 7.32 Ar 15.8 NO 9.25 6.4 H ₂ 0 12.6 9.5 Here, the barrier lamp (172 nm) is the most suitable.
It

In FIG. 1, (I) is a secondary static eliminator, and in principle, the same lamp (86) as the main static eliminator (J) is used, and the back surface (1a) {and / or front surface (1a) of the substrate (1) is directly attached. 1a)} is irradiated with, for example, ultraviolet rays to eliminate static electricity generated by contact with air during the movement of the substrate (1).

FIG. 5 shows a second embodiment of the suction nozzle (83a).
A slit-shaped suction port that is open from the center to the peripheral edge of the substrate (1) is formed. According to this, unlike the first embodiment, it is not necessary to swing the thin suction nozzles 83. Further, FIG. 6 shows that the ring-shaped lamp (86a) of the second embodiment is installed below the substrate (1), and the dust removing means (E1) is used.
This is an example of using a brush body (M) as. In addition to the rotating cylindrical brush (83b), the brush body (M) is of a desk type and is arranged in parallel with the substrate (1), and brushes are brushed on the parallel surface (not shown) and various other types. There is something.

After the transfer robot (C) transfers the substrate (1) to the dust removing section (E) and then returns to the home position, the suction nozzle (83) waiting below the substrate (1) is moved to the dust removing member. Operate the lifting cylinder (38) to raise it, bring the suction port of the suction nozzle (83) close to the dust removal surface (1a) of the substrate (1), and then activate the rotary cylinder (80) to suck the suction nozzle (83). ) Is moved from the center of the dust removal surface (1a) of the substrate (1) to the peripheral portion. At the same time, activate the vacuum, through the vacuum piping (84),
The suction nozzle (83) sucks the dust-removing surface (1a) of the substrate (1) to remove dust.

The substrate (1) is chucked by the substrate chuck (6) during this period, and the entire circumference thereof is chucked by the substrate chuck (6) by operating the substrate rotation drive motor (21). It is rotated in the state. Therefore, the suction nozzle (8
By synchronizing the reciprocating motion of 3) and the rotational motion of the substrate (1) (in other words, by making one rotation of the substrate (1) to move the suction nozzle (83) one pitch, the substrate (1) The entire dust removal surface (1a) can be evenly sucked.) The entire dust removal surface (1a) of the substrate (1) is uniformly sucked.

Further, here, in order to enhance the dust removal effect, the lamp (86) is directly irradiated to the dust removal surface (1a) of the substrate (1), and photoelectrons are generated in the substrate (1) by irradiation ultraviolet rays,
Erase the negative charge on the substrate (1). At the same time, the irradiation ultraviolet rays hit the transparent member (85) for the window in FIG. 2 to generate photoelectrons, thereby extinguishing the positive charge of the substrate (1). As a result, the substrate (1) is kept in an electrically neutralized state, and dust is effectively removed by the suction nozzle (83). As shown in FIG. 6, when the annular lamp 86a is housed in the rotating upper housing 10, photoelectrons are emitted from the sealed tube 86a.

The above is an example of dust removal by the first embodiment of the present invention {nozzle type suction nozzle (83)}, but the dust removal method is not limited to this, and it is a fixed type as shown in FIG. substrate
A suction nozzle (83a) that opens from the center to the periphery of (1) may be used, or as shown in FIG. 6, for example, a cylindrical brush (83b) may be used.

Next, the case of using the cylindrical brush (83b) will be briefly described. (However, the portions that overlap with the description of the suction nozzle (83) are omitted.) In FIGS. A dust removing member lifting cylinder (38) is attached to the lower end of the bar (37), and the dust removing member sliding bar (3
It is designed to move up and down 7). Dust removal member lifting bar (37)
The dust removing member attaching member (39) is attached to the upper end of
A cylindrical brush (83b) is rotatably held on the upper end of the dust removing member mounting member (39).

The cylindrical brush (83b) is rotatably held around the rotary shaft (40), and a brush driven pulley (41) is attached to one end of the rotary shaft (40). Brush driven pulley
A brush drive belt (42) is suspended on (41) and is connected to the brush drive pulley (43) of the dust removing member drive motor (44), and the rotational force of the brush drive pulley (43) is applied to the cylindrical brush (83b).
It is supposed to be transmitted to. A buff is used for the cylindrical brush (83b) in this embodiment. (Of course, it is not limited to this, and those with long bristles or conversely short bristles are used as appropriate according to the application.) In this case, fine particles attached to the cylindrical brush (83b) are used. In order to remove various dusts, a scraper (87) that comes into contact with the cylindrical brush (83b) to suck and remove the dust is installed, and the suction port of the scraper (87) comes into contact with the rotation of the cylindrical brush (83b). , Cylindrical brush (83
The dust wiped off by b) is physically suctioned and removed from the cylindrical brush (83b) by the scraper (87), and the cylindrical brush (83
b) is always kept clean.

Next, the lock mechanism (H) will be described in detail.
(H) is the structure of the entire lock mechanism, which holds the guide lock portion (12c) of the expansion / contraction guide (12) to prevent expansion due to centrifugal force during rotation of the substrate chuck (6). Substrate chuck
The joint (6a) of (6) is provided with a pair of mounting blocks (70a) (70b), one of which is the mounting block (70b).
The lock block (70c) is integrally connected to
An insulating groove (68) is formed between the mounting block (70b) and the lock block (70c). A lock shaft body (67) is erected on the upper end of the rotating upper housing (10) and penetrates the opening side of the lock block (70c). Above the lock block (70c) is an inverted U-shaped actuating lever (61).
The lock shaft (66) is inserted through the lock horizontal shaft (62) arranged horizontally on the operating lever (61), and the lock shaft (66) is inserted by the adjusting nut (62a). )
The height of is fixed so that it can be adjusted. The lock shaft
(66) and the lock shaft body (67) are integrated.

A lock lever mounting bar (62b) is further fixed to the lock horizontal shaft (62) so as to rotate together with the rotation of the lock shaft (62). A lock roller (63) is rotatably installed on the lower end of the lock lever mounting bar (62b) by a roller mounting shaft (64) so as to press the opening side of the lock block (70c). . A block mount (6
5) The locking block (72) is installed on the top, the locking groove (72a) is recessed on the side surface, and the locking bolt (73) protruding from the lower part of the locking block (70c) is ) Is designed to fit in. The lever operation block (74) is installed above the locking block (72).
The lock cylinder (6
0) is mounted, the lock block (72) is mounted with the cylinder rod (60a) of the lock cylinder (60), and the lever operating block (74) is moved up and down. A lever operating groove (74a) is formed in the lever operating block (74) so that the operating lever (61) can be fitted therein. An elevating guide (75) is provided upright on the locking block (72), and a lever operating block (74) is slidably inserted therein to serve as a guide for moving the lever operating block (74) up and down.

Reference numeral (7) is a back pressure paddle arranged directly on the substrate (1), and when the brush body (M) is used, that is, the substrate (1)
This is effective when a force is applied from below to the above, and is unnecessary when suction is performed as in the first embodiment. This back pressure paddle (7) moves up and down toward the board (1),
A gas ejection port (7a) containing a neutralizing gas for dust removal such as ions and ozone is formed at the center thereof. The gas outlet (7a) is the substrate
A hole-like material may be provided at one place in the center of the substrate (1) immediately above (1), but a large number may be formed in one row along the longitudinal direction of a cylindrical brush (3) described later. However, it may be formed on the slit.

In this embodiment, a slit-shaped gas ejection port (7a) is formed on the lower surface of the back pressure paddle (7), and the back pressure / dust removal gas flows along the grooved gas ejection port (7a). It is supposed to be leaked. As described above, the back pressure / dust removing gas may be dustless air containing ozone or NO, or an inert gas such as nitrogen gas.

Reference numeral (49) is a displacement sensor mounted in the back pressure paddle (7), which is input to one terminal of a comparator (not shown) and compared with a reference voltage to measure the displacement amount of the substrate (1). The output of the comparator is input to the driver, drives the regulator, and is blown out from the gas ejection port (7a) Back and dust removal gas (2)
The blowing pressure of is adjusted.

Depending on the type of the substrate (1) or the demands of the site, dust removal on both the front and back sides may be required, so the double-side dust removal will be described below. The substrate chuck (6) for double-sided dust removal has its clamp part formed thinner than the substrate (1),
A self-aligning clamp groove (4) is formed on the inner circumference of the clamp part, and the taper part of the peripheral beveling part of the board (1) is formed by the board locking claws (5a) and (5b) of the claw body (5). Is being chucked.

Next, the operation of the present invention will be described with reference to FIGS. The loader (B) is a cassette containing a large number of substrates (1)
(54) is installed, and an empty cassette (54) is installed in the unloader (D). The controller (F) is operated to operate the transfer robot (C) to take out one substrate (1) from the loader (B). The taken-out substrate (1) is supplied to the dust removing section (E) by the transfer robot (C). On the contrary, after the processing is completed, the dust is removed from the dust removing section (E) and transferred to the unloader (D), but the transfer robot (C) passes through the home position every time. At this time, the ultraviolet rays of the lamp (88) installed at the home position hit the substrate (1) to remove static electricity generated by friction with the air during movement, and prevent the adhesion of suspended dust. ing.

Now, when the substrate (1) is supplied to the dust removing section (E), the substrate chuck (6) is expanded by the action of the expansion cylinder head (14) as shown in FIG.
The substrate (1) whose peripheral portion is clamped at (C) is inserted into the expanded substrate chuck (6).

At this time, the substrate receiving rod (33) is projected above the self-aligning clamp groove (4) of the substrate chuck (6) by the action of the substrate receiving operation cylinder (31) to remove dust from the substrate (1). surface
(1a) (in this embodiment, the back surface of the substrate (1)) is abutted. Substrate (1) is the receiving head of substrate receiving rod (33)
When placed on the substrate (35), the transfer robot (C) separates from the peripheral edge of the substrate (1) and places the substrate (1) on the head (35). Next, the substrate receiving operation cylinder (31) is reversely operated, and the substrate (1) is lowered to a position substantially matching the self-aligning clamp groove (4) of the substrate chuck (6), and stopped at this point. Figure 7
An enlarged view of the state is shown in. As shown by the phantom line in FIG. 7, the substrate (1) is held slightly above by the inner side surface (4a) of the self-aligning clamp groove (4), and the chuck diameter shrinking cylinder (15). ) Action closes the substrate chuck (6), the peripheral edge of the substrate (1) is self-aligning clamp groove (4).
It contacts the upper slide slope (4b) and moves downward along the upper slide slope (4b), so that the peripheral edge of the substrate (1) fits exactly on the inner side surface (4a). There is. At this time, the claws (5) of the substrate chuck (6) are in contact with the lower surface of the taper portion at the peripheral edge of the substrate (1), and as described above, the substrate chuck (6)
The lower surface of the substrate does not protrude below the dust removal surface (1a) of the substrate (1).

When the self-aligning clamp of the substrate (1) by the self-aligning clamp groove (4) is completed, the substrate receiving working cylinder (3
1) further actuates and lowers the board receiving rod (33) to lower the board (1).
Away from the dust removal surface (1a). In the meantime, the transfer robot (C) returns to the home position, waits for the completion of the dust removal of the substrate (1), and is ready to take out the dust-removed substrate (1) from the dust removing section (E).

When the transfer robot (C) moves from above the substrate (1) to the home position (when using the brush body (M), the back pressure paddle (7) descends from above after the movement,
Stop just above the back pressure surface (1b) of the board (1). After that, or at the same time as it descends, the back pressure and dust removal gas (2) is ejected to
Apply back pressure on the back pressure surface (1b) of (1). ), Dust removal means (E1)
{Suction nozzle (83) or brush body (M)} stands by below the substrate (1) and is lifted up by the operation of the dust removing member lifting cylinder (38) to remove the dust removal surface (1a) of the substrate (1). ) Approach or contact. (If the suction nozzle (83) is
In the case of (M), it becomes a koto to contact. ) At this time, the lamp (86)
Alternatively, (86a) is lit, the substrate (1) is irradiated, and the charge is removed by the above action.

In the case of the swing type suction nozzle (83) of the first embodiment, the suction nozzle (8) is operated by the action of the rotary cylinder (80).
3) swings from the center of the substrate (1) to the periphery in synchronization with the rotation of the substrate (1) (in the case of the fixed suction nozzle (83a), suction is performed in a stationary state. , Cylindrical brushes (3)
In this case, the dust removing member drive motor (44) is rotated to wipe off the dust on the dust removing surface (1a). )or,
Simultaneously with the dust removal, the rotating upper housing (10) is rotated by the substrate rotation drive motor (21), and the substrate (1) chucked by the substrate chuck (6) is rotated within its plane.

As a result, the dust removal surface (1a) of the substrate (1) is moved by the suction nozzle (83) which moves from the center to the periphery (or reciprocates between the center and the periphery or is stationary). The fine dust of (1a) is effectively sucked. This point is the same for the brush body (M) as well.
In the case of b), since the substrate (1) is in line contact and rotates in the plane, the entire surface is rapidly removed by the cylindrical brush (83b). Also, the back pressure gas (2) injected from the back pressure paddle (7) mainly used in the case of the brush body (M) is
As mentioned above, it may be a gas such as nitrogen gas,
It may be like clean air that is almost dust-free filtered by a filter (not shown), and it is desirable to contain like ions for static elimination.

Here, as shown in FIG. 7, during dust removal work,
Since the claws (5) of the substrate chuck (6) do not project below the dust removal surface (1a), the dust removal surface (1a) can be thoroughly dusted almost without leaving.

Next, the operation of the lock mechanism (H) will be described. When the substrate chuck (6) is rotated at the time of dust removal, the substrate chuck (6) is moved in the radial direction by its centrifugal force, and tends to be moved in a direction to increase the chuck diameter of the self-aligning clamp groove (4). Therefore, after the chuck diameter of the substrate chuck (6) is pressed and contracted by the action of the chuck diameter contraction cylinder (15), the lock cylinder (60) is operated to pull up the lever operation block (74) and the lever operation groove (74a). The actuating lever (61) engaged with is rotated upward. Then, through the lock horizontal shaft (62) fixed to (64), the roller mounting shaft (64)
Moves clockwise in the figure, the lock roller (63) strongly presses the upper surface of the lock block (70c), and the lock groove (6
Narrow the interval of 9). Then, the guide lock portion (12c) inserted in the lock through hole (71c) is strongly clamped by this.

When the lock cylinder (60) is operated and the lever operation block (74) is pulled up, the locking groove (7
Since the locking bolt (73) is engaged with 2a), an excessive bending force is not applied to the substrate chuck (6).

The lock roller (63) is a lock block (70
Due to the elastic force of c), that is, the "click action", the locked state of the guide lock portion (12c) is maintained. If the substrate chuck (6) rotates in this state, the operating lever (61) will move to the lever operating groove.
The board (1) rotates together with the board chuck (6) while being separated from the board (74a), the locking bolt (73) is separated from the locking groove (72a), and the locked state shown in FIG. Therefore, the lock cylinder (60) and the members attached to the lock cylinder (60) do not rotate. The lock mechanism (H) rotates together with the substrate chuck (6) while maintaining the locked state.However, as described above, only the portion necessary for locking is attached to the substrate chuck (6), so the substrate chuck (6) ) Can be made very light and the rotation of the substrate chuck (6) is facilitated.

When the dust removal of the substrate (1) is completed, the rotation of the substrate chuck (6) is stopped, but the operating lever (61)
Is required to stop exactly when it coincides with the position of the lever operation block (74) .Check the rotation position of the rotating upper housing (10) with the positioning sensor (23a) and set the positioning cam follower (23) to the positioning cam. By fitting it into (22), the stop position of the operating lever (61) can be accurately controlled.

The operating lever (61) is a lever operating block (74)
When it stops at the matching position and the operating lever (61) fits into the lever operating groove (74a), the lock cylinder (60) is reversely operated to lower the lever operating block (74) to move the lever operating groove (74). 74a) Push the operating lever (61) that has been re-fitted inside (74a) downward to lower it, and then push the lock lever mounting bar (62b) through the lock horizontal shaft (62) fixed to the operating lever (61). The lock roller (63) is detached from the upper surface of the lock block (70c) by rotating counterclockwise in the figure. As a result, the lock groove (69) is expanded by the elastic force of the lock block (70c), and the guide lock portion (12c) is locked by the lock through hole (71).
It will be released from the tightening of c) and will be able to slide freely.

After that, the expansion cylinder head (14) is re-activated and inserted between the pair of expansion rollers (13) to open the gap (6a) as shown in FIG. Inside surface (4a)
Expand the diameter of to free the substrate (1) from the self-aligning clamp groove (4).

Next, the operation after the rotation upper housing 10 is stopped will be described. When the rotating upper housing (10) stops, the dust removing member lifting cylinder (38) reversely moves down to stop the swinging and rotating movements of the dust removing means (E1), and then the dust removing surface of the substrate (1). Separate from (1a). At the same time, the rotary cylinder (80) stops. (Back pressure paddle (7)
If you are using, stop the back pressure gas (2) ejection,
Then, the substrate is moved upward, and the application of back pressure to the substrate (1) is stopped. )

After the dust removing means (E1) is separated from the substrate (1), the substrate receiving operation cylinder (31) is re-activated to raise the substrate receiving rod (33) to remove the dust removing surface (1a) of the substrate (1). The cushioning material (3
4) Make contact. At that time, the spring force of the cushioning material (34) causes the receiving head (35) to slightly bend. When the dust removal surface (1a) of the substrate (1) is supported by the receiving head (35), the substrate chuck (6) expands as described above, and the substrate (1) is automatically aligned with the substrate chuck (6). Free from groove (4),
It is placed only on the receiving head (35). In this state, the substrate receiving operation cylinder (31) is operated, the substrate (1) is placed above the substrate chuck (6) while the substrate (1) is placed, and the substrate (1) is transferred to the transfer robot (C). Take over.

When the substrate (1) is transferred by the transfer robot (C) to the unloader (D) via the home position of the transfer robot (C), the cassette (54) installed in the unloader (D).
Of the substrate (1), and the dust removal on one surface (back surface (1a)) of one substrate (1) is completed. In the above home position, the lamp (8
It receives the irradiation of 8) and eliminates static electricity generated by contact with air during transfer.

In this way, the dust removal surface (1a) of the substrate (1) is removed by the cylindrical brush (83b). The back pressure paddle (7)
The displacement sensor (49) installed on the
9) and the back pressure paddle so that the distance between the substrate (1) and the displacement sensor (49) is constant.
Back pressure gas ejected from (7) toward the back pressure surface (1b) (2)
Since the flow rate is controlled by feedback, the contact pressure of the cylindrical brush (83b) at the center portion of the substrate (1) can be sufficiently secured, and insufficient dust removal does not occur.

Looking at the relationship between the back pressure paddle (7) and the cylindrical brush (83b), the gas ejection port of the back pressure paddle (7) is shown in FIG.
(7a) is elongated along the cylindrical brush (83b) and linearly applies back pressure. As a result, only the peripheral edge is held by the self-aligning clamp groove (4), and the dust removal surface (1a) of the substrate (1) held in a levitating state is pressed to remove dust with the cylindrical brush (83b). Can be done.

Depending on the type of the substrate (1) or the requirements of the site, dust removal on both the front and back sides may be required, so the double-side dust removal will be described below. The substrate chuck (6) for double-sided dust removal has its clamp part formed thinner than the substrate (1),
A self-aligning clamp groove (4) is formed on the inner circumference of the clamp part, and the taper part of the peripheral beveling part of the board (1) is formed by the board locking claws (5a) and (5b) of the claw body (5). Is being chucked. (Figure 13)

In this embodiment, a brush body (83b) which can be moved up and down (of course, a suction nozzle (83) may be provided on both sides of the substrate (1). }
Are in contact with each other, and the brush body (83b) simultaneously removes dust from both surfaces of the substrate (1). Therefore, in the case of double-sided dust removal, instead of the back pressure paddle (7), the upper brush body (83
The point b) is different from the embodiment of FIG.

FIG. 14 is a schematic sectional view of another embodiment of the suction nozzle (83), in which a collar (83a) parallel to the substrate (1) is extended at the tip of the suction nozzle (83). Is. In this case the tsuba
By (83a), the suction gas flows in parallel to the substrate (1), and the suction gas enables the suction of fine dust more effectively. FIG. 15 shows still another embodiment of the suction nozzle (83), which is a double pipe, and clean gas that has passed through the filter is supplied from the outer pipe (83a) and is sucked from the central pipe (83b). It is like this. As a result, the dust-removing surface (1a) of the substrate (1) is always purified by the clean gas.

FIG. 16 shows a connecting portion of the substrate chuck (6). When the present apparatus is used as a pretreatment apparatus for an apparatus such as a stepper, the photosensitive material applied to the surface of the substrate (1) is exposed. The substrate chuck (6) is formed with a stepwise connection so that the agent is not exposed to light, and an elastic body (6a) is provided between them to form a substrate.
The surface side of (1) is not exposed. Incidentally, FIG.
5 is a drawing when using the suction nozzle (83),
It is illustrated here to show the positional relationship of the back pressure paddle (7).

[0074]

As described above, the device of the present invention exhibits excellent dust removing ability by removing static electricity and can keep the back surface or front and back surfaces of the substrate clean, and adheres during handling or processing of the substrate. It is possible to prevent the generation of defects due to fine dust, and it is possible to achieve an improvement in yield.

[Brief description of drawings]

FIG. 1 is a plan view of the entire dry scrubber according to the present invention.

FIG. 2 is a first part of a dust removing portion of the dry scrubber of the present invention.
Sectional view of the embodiment

FIG. 3 is a plan view of the substrate chuck of FIG. 2 when the diameter is closed.

FIG. 4 is a plan view of the substrate chuck of FIG. 2 when the diameter is expanded.

FIG. 5 is a plan view of a second embodiment in which a fixed suction nozzle is used for the dust removing unit according to the present invention.

FIG. 6 is a cross-sectional view of a third embodiment of the dust removing portion according to the present invention.

FIG. 7 is an enlarged cross-sectional view showing a locked state of the substrate according to the present invention.

FIG. 8 is a partially enlarged plan view of a lock mechanism portion of the present invention.

9 is a front view of FIG.

FIG. 10 is a partial side view of the lock mechanism of the present invention before actuation.

FIG. 11 is a partial side view of the lock mechanism of the present invention after actuation.

FIG. 12 is a schematic cross-sectional view showing a double-sided dust removing state of the dust removing unit in the present invention

FIG. 13 is an enlarged cross-sectional view showing a locked state of the substrate in double-sided dust removal according to the present invention.

FIG. 14 is a sectional view of another embodiment of the suction nozzle of the present invention.

FIG. 15 is a sectional view of another embodiment of the suction nozzle of the present invention.

FIG. 16 is a partial sectional view of a connecting portion of the substrate chuck of the present invention.

[Explanation of symbols]

 (A)… Dry scrubber (E1)… Dust removal means (J)… Electrification removal means (1)… Substrate (6)… Substrate chuck

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Haruyuki Kinan 3-6-16 Yanaka, Taito-ku, Tokyo M Setek Co., Ltd. (72) Hiroyuki Saito 3-16-16 Yanaka, Taito-ku, Tokyo M SETEK Co., Ltd.

Claims (7)

[Claims] 1. A substrate chuck for holding an outer periphery of a substrate, a dust removing unit for removing dust on at least one surface of the substrate, and a neutralizing unit for removing static electricity on the charged substrate. Dry scrubber to do. 2. A substrate chuck for gripping an outer periphery of the substrate, a dust removing unit for removing dust on at least one surface of the substrate, an electricity removing unit for eliminating the static electricity charged substrate, and a substrate rotating in a horizontal plane thereof. A dry scrubber comprising a substrate chuck rotating means for rotating the substrate chuck. 3. A substrate chuck for gripping the outer periphery of the substrate, a dust removing unit for removing dust on at least one surface of the substrate, an electricity removing unit for removing the static electricity charged substrate, and a parallel surface for removing dust on the substrate. A dry scrubber comprising a dust removing means moving mechanism for moving the dust removing means. 4. The height of a claw body of a substrate chuck that locks to a beveling portion of a substrate having a beveled peripheral edge is smaller than a height of a dust removal surface of the beveling portion of the substrate so that the claw body does not come out of the dust removal surface. The dry scrubber according to any one of claims 1 to 3, wherein the dry scrubber is formed. 5. The dust removing means is a suction nozzle which opens in proximity to the dust removing surface of the substrate.
The dry scrubber according to 4. 6. The dry scrubber according to claim 1, wherein the dust removing means is a brush body that comes into contact with the dust removing surface of the substrate to remove dust on the dust removing surface. 7. The brush body is formed in a cylindrical shape and is arranged parallel to the substrate and is rotating around its rotation axis, and sucks dust that comes into contact with the brush body and is transferred to the brush body. 7. The dry scrubber according to claim 6, further comprising a fixed scraper.