JPH0727187Y2 - IC module for IC card - Google Patents
IC module for IC cardInfo
- Publication number
- JPH0727187Y2 JPH0727187Y2 JP1988111161U JP11116188U JPH0727187Y2 JP H0727187 Y2 JPH0727187 Y2 JP H0727187Y2 JP 1988111161 U JP1988111161 U JP 1988111161U JP 11116188 U JP11116188 U JP 11116188U JP H0727187 Y2 JPH0727187 Y2 JP H0727187Y2
- Authority
- JP
- Japan
- Prior art keywords
- external terminals
- chip
- external
- module
- external terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Credit Cards Or The Like (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、ICカードに埋め込まれるICモジュールに関す
るものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an IC module embedded in an IC card.
なお、本明細書において「外部端子」とは、導電パター
ンを指し、ISO規格（ISO 7816-2）に基づく端子接触エ
リアとの電気的接続の如何を何等問うものではない。In the present specification, the “external terminal” refers to a conductive pattern, and does not matter what the electrical connection is with the terminal contact area based on the ISO standard (ISO 7816-2).
従来のICモジュールは、第４図に示す如く、複数の外部
端子71〜78を備え、この複数の外部端子71〜78は、その
相互間に隙間部分９を空けて互いに絶縁状態に設けられ
ている。この従来のICモジュールは、外部端子71〜78を
設けるときに、ICチップ２との位置関係には何等考慮が
払われておらず、外部端子とICチップが重なる領域の外
部端子にも、隙間部分９が形成されていた。また、隙間
部分９は、連続して表面部の一端縁から対向する他端縁
に達するように形成されているが、中心線81で示すよう
に一直線状に連続した隙間部分94があった。As shown in FIG. 4, the conventional IC module is provided with a plurality of external terminals 71 to 78, and the plurality of external terminals 71 to 78 are provided in an insulated state with a gap portion 9 therebetween. There is. In this conventional IC module, when the external terminals 71 to 78 are provided, no consideration is given to the positional relationship with the IC chip 2, and the external terminals in the region where the external terminals and the IC chip overlap each other have a gap. Portion 9 was formed. Further, the gap portion 9 is formed so as to continuously reach from one end edge of the surface portion to the opposite other end edge, but as shown by the center line 81, there is a straight gap continuous gap portion 94.
〔考案が解決しようとする課題〕 従って、ICモジュールに外力が加わった場合に、ICモジ
ュールの外部端子間に存在する隙間部分にも応力が集中
し、ICチップ２に外部端子の隙間部分９に沿ったクラッ
クが発生しやすく、ICチップが壊れる虞れがあった。ま
た、中心線81に沿って折れ曲り易く、該部で変形やボン
ディングワイヤ，配線パターンなどの断線を生じる虞れ
もあった。[Problems to be solved by the invention] Therefore, when an external force is applied to the IC module, stress is concentrated also in the gaps existing between the external terminals of the IC module, and the IC chip 2 is exposed to the gaps 9 of the external terminals. There was a risk that cracks along the line would easily occur and the IC chip would break. In addition, it is easy to bend along the center line 81, and there is a possibility that deformation or breakage of the bonding wire or the wiring pattern may occur at this portion.
本考案は、従来のこの問題点を解決しようとするもの
で、外力に対して強く壊れにくいICモジュールを提供す
ることを目的とするものである。The present invention is intended to solve this conventional problem, and an object thereof is to provide an IC module that is strong against external force and is not easily broken.
本考案においては、上述の目的を達成するため、ICチッ
プを内蔵し、表面部に複数の外部端子が配設されている
ものにおいて、前記表面部で該ICチップと重なり合う領
域に、前記ICチップよりも大きい面を持つ該複数の外部
端子における一の外部端子を独立状態で形成し、この一
の外部端子の周囲には、残りの複数の外部端子を該一の
外部端子を略囲繞するよう配設し、前記複数の外部端子
の相互間を絶縁する隙間部分を、該表面部の一端縁から
対向する他端縁に屈曲した直線で連続するよう形成する
ようにしている。In order to achieve the above-mentioned object, in the present invention, in a case where an IC chip is built in and a plurality of external terminals are provided on a surface portion, the IC chip is provided in a region overlapping the IC chip on the surface portion. One external terminal of the plurality of external terminals having a larger surface is formed in an independent state, and the remaining plurality of external terminals are substantially surrounded by the one external terminal around the one external terminal. The gap portion that is provided and insulates the plurality of external terminals from each other is formed so as to be continuous with a straight line that is bent from one edge of the surface portion to the opposite edge.
上記構成を有する本考案によれば、複数の外部端子にお
ける１個の外部端子を、ICチップと外部端子の重なり合
う領域を覆うように独立して形成したので、ICチップと
外部端子の重なり合う領域に強度の小さい隙間部分が存
在せず、ICチップは外部端子で完全に保護される。従っ
て、ICモジュールの心臓部であるICチップに外力が作用
しても壊れにくくなる。また、複数の外部端子相互を絶
縁する隙間部分が表面部の一端縁から対向する他端縁に
屈曲直線で連続して達するので、一端縁から対向する他
端縁に一直線状に達する折れ曲り易い隙間部分がなく、
壊れにくくなるのは明らかである。According to the present invention having the above configuration, one external terminal among the plurality of external terminals is independently formed so as to cover the overlapping area of the IC chip and the external terminal. The IC chip is completely protected by the external terminals because there is no small gap. Therefore, even if an external force is applied to the IC chip, which is the heart of the IC module, it is less likely to break. In addition, since the gap portion that insulates the plurality of external terminals from each other continuously reaches from the one edge of the surface portion to the opposite other edge with a bending straight line, the gap easily reaches from the one edge to the opposite other edge in a straight line. There is no gap,
Obviously, it won't break.
以下、本考案の一実施例を第１〜３図を用いて説明す
る。An embodiment of the present invention will be described below with reference to FIGS.
第1,2図は２層構造のICモジュールを示し、１は基板、
２はICチップ、３はダム基板、４はモールド材である。
基板１の表面部ISO規格（ISO 7816-2）に基づいた位置
には、複数の外部端子51〜58が配設されるとともに、中
央の外部端子59が基板１の裏面部に設けられているICチ
ップ２と重なり合う領域を完全に覆うように独立した状
態で形成されている。そして、この外部端子59の周囲に
は、残りの複数の外部端子51〜58が外部端子59を略囲繞
するよう配設されている。また、外部端子51〜58を絶縁
する隙間部分９は、いずれも表面部の一端縁から対向す
る他端縁に屈曲直線状に連続して達するように設けられ
るとともに、一直線状に連続しないよう形成されてい
る。さらに、隙間部分の一部は、外部端子59の周囲と残
りの複数の外部端子51〜58の間に略囲繞状態で形成され
ている。1 and 2 show a two-layer structure IC module, 1 is a substrate,
2 is an IC chip, 3 is a dam substrate, and 4 is a molding material.
A plurality of external terminals 51 to 58 are arranged at a position based on the ISO standard (ISO 7816-2) of the front surface of the board 1, and a central external terminal 59 is provided on the back surface of the board 1. It is formed in an independent state so as to completely cover the area overlapping with the IC chip 2. Around the external terminal 59, the remaining plural external terminals 51 to 58 are arranged so as to substantially surround the external terminal 59. In addition, the gap portions 9 that insulate the external terminals 51 to 58 are provided so as to reach from the one edge of the surface portion to the other edge opposite to each other continuously in a bent straight line, and are not formed in a straight line. Has been done. Further, a part of the gap portion is formed in a substantially surrounding state between the periphery of the external terminal 59 and the remaining plurality of external terminals 51 to 58.
なお、基板１の裏面部には、第２図に示す如く、ダイパ
ッドＡ及び配線パターン（図示せず）が配設されてい
る。この配線パターンは、ICチップ２とワイヤで接続さ
れ、複数の外部端子51〜58とはスルーホールで接続され
ているが、図示を省略する。As shown in FIG. 2, a die pad A and a wiring pattern (not shown) are provided on the back surface of the substrate 1. This wiring pattern is connected to the IC chip 2 by a wire and connected to the plurality of external terminals 51 to 58 by through holes, but not shown.
次に、第３図は別の実施例を示し、この実施例において
は複数の外部端子51〜59が点対称に配設されている。Next, FIG. 3 shows another embodiment, in which a plurality of external terminals 51 to 59 are arranged in point symmetry.
以上、コンタクト基板とボンディング基板を１枚の基板
１で構成した２層構造の例で説明したが、３層構造の例
に適用することもできる。The example of the two-layer structure in which the contact substrate and the bonding substrate are composed of one substrate 1 has been described above, but the present invention can also be applied to the example of the three-layer structure.
以上のように本考案によれば、表面部でICチップと重な
り合う領域に、ICチップよりも大きい面を持つ複数の外
部端子における一の外部端子を独立状態で形成し、この
一の外部端子の周囲には、残りの複数の外部端子を一の
外部端子を略囲繞するよう配設し、複数の外部端子の相
互間を絶縁する隙間部分を、表面部の一端縁から対向す
る他端縁に屈曲した直線で連続するよう形成しているの
で、外部端子とICチップの重なり合う領域に強度の小さ
い隙間部分が全く存在せず、また、一端縁から対向する
端縁に一直線状に連続して達する折れ曲り易い隙間部分
がないので、外力に対して強く、非常に壊れにくいICモ
ジュールを提供することができるという格別の効果があ
る。As described above, according to the present invention, one external terminal of a plurality of external terminals having a larger surface than the IC chip is formed in an independent state in a region where the surface portion overlaps with the IC chip. Around the periphery, a plurality of remaining external terminals are arranged so as to substantially surround one external terminal, and a gap portion that insulates the plurality of external terminals from each other is provided from the one edge of the surface portion to the other edge opposite to each other. Since it is formed so as to be continuous with a bent straight line, there is no gap with low strength in the area where the external terminal and the IC chip overlap, and it continuously reaches from the one edge to the opposite edge in a straight line. Since there are no gaps that are easily bent, there is a special effect that it is possible to provide an IC module that is strong against external force and is not easily broken.
第１図は本考案の一実施例の平面図、第２図は第１図の
Ｉ−Ｉ線断面正面図、第３図は他の実施例の平面図、第
４図は従来のICカード用ICモジュールの一例の平面図で
ある。 １……基板、２……ICチップ、３……ダム基板、４……
モールド材、51〜59……外部端子、71〜78……外部端
子、84……中心線、9,94……隙間部分。FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a sectional front view taken along the line I--I of FIG. 1, FIG. 3 is a plan view of another embodiment, and FIG. 4 is a conventional IC card. FIG. 3 is a plan view of an example of a use IC module. 1 ... Board, 2 ... IC chip, 3 ... Dam board, 4 ...
Mold material, 51 to 59 …… External terminal, 71 to 78 …… External terminal, 84 …… Center line, 9,94 …… Gap part.
───────────────────────────────────────────────────── フロントページの続き (72)考案者 中井 敬享 東京都文京区小石川４丁目14番12号 共同 印刷株式会社内 (56)参考文献 特開 昭63−87293（ＪＰ，Ａ) 特開 昭62−94393（ＪＰ，Ａ) 実開 昭63−68476（ＪＰ，Ｕ) 実開 昭62−185072（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takahiro Nakai 4-14-12 Koishikawa, Bunkyo-ku, Tokyo Kyodo Printing Co., Ltd. (56) Reference JP-A-63-87293 (JP, A) JP-A-SHO 62-94393 (JP, A) Actually opened 63-68476 (JP, U) Actually opened 62-185072 (JP, U)
Claims (1)
子が配設されているICカード用ICモジュールにおいて、
前記表面部で該ICチップと重なり合う領域に、前記ICチ
ップよりも大きい面を持つ該複数の外部端子における一
の外部端子を独立状態で形成し、この一の外部端子の周
囲には、残りの複数の外部端子を該一の外部端子を略囲
繞するよう配設し、前記複数の外部端子の相互間を絶縁
する隙間部分を、該表面部の一端縁から対向する他端縁
に屈曲した直線で連続するよう形成したことを特徴とす
るICカード用ICモジュール。Claim: What is claimed is: 1. An IC module for an IC card, which has a built-in IC chip and has a plurality of external terminals provided on a surface thereof
One external terminal of the plurality of external terminals having a larger surface than the IC chip is formed in an independent state in a region overlapping the IC chip on the surface portion, and the remaining external terminals are formed around the one external terminal. A straight line in which a plurality of external terminals are arranged so as to substantially surround the one external terminal, and a gap portion which insulates the plurality of external terminals from each other is bent from one edge of the surface portion to the other edge opposite to An IC module for IC cards, characterized by being formed so as to be continuous with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988111161U JPH0727187Y2 (en) | 1988-08-26 | 1988-08-26 | IC module for IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988111161U JPH0727187Y2 (en) | 1988-08-26 | 1988-08-26 | IC module for IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0234282U JPH0234282U (en) | 1990-03-05 |
| JPH0727187Y2 true JPH0727187Y2 (en) | 1995-06-21 |
Family
ID=31348965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988111161U Expired - Fee Related JPH0727187Y2 (en) | 1988-08-26 | 1988-08-26 | IC module for IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727187Y2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6294393A (en) * | 1985-10-21 | 1987-04-30 | 日立マクセル株式会社 | Integrated circuit card |
| JPH0517269Y2 (en) * | 1986-05-15 | 1993-05-10 | ||
| JPS6368476U (en) * | 1986-10-25 | 1988-05-09 |
-
1988
- 1988-08-26 JP JP1988111161U patent/JPH0727187Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0234282U (en) | 1990-03-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |