JPH0727146U - Substrate processing equipment - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] To reduce uneven processing on the substrate surface. [Structure] The developing machine includes a processing chamber, a transfer mechanism, a spray tube, and a rod-shaped member 19. Substrate W in the processing chamber
Side wall 1 in which a pass line opening 15a for carrying in is formed
Have five. The transport mechanism loads the substrate W into the processing chamber through the pass line opening 15a. The spray tube 12 sprays the developing solution onto the substrate W carried into the processing chamber. The rod-shaped member 19 is fixed to the inner side surface of the side wall 15 so as to cover the pass line opening 15a from above above the pass line opening 15a.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus that processes a substrate carried into the inside with a processing liquid and conveys the substrate to the outside.

[0002]

[Prior art]

 For example, in the manufacturing process of semiconductors and liquid crystal displays, photo-etching processing is repeatedly performed on the substrate. In a series of photo-etching processes, processes such as development, etching, and resist film peeling are performed after the application and exposure of photo resist. These treatments are performed by spraying a treatment liquid onto the substrates carried into each treatment chamber.

As a general substrate processing apparatus, an apparatus including a shower nozzle for spraying a processing liquid onto a substrate from above and a roller unit for horizontally moving the substrate has already been developed. A pass line opening for loading and unloading the substrate is formed on a side wall of the substrate processing chamber that houses the shower nozzle and the roller portion. The substrate is conveyed horizontally by the roller portion into the substrate processing chamber, and is processed by the processing liquid from the shower nozzle in the processing chamber. The processed substrate is carried out of the processing chamber from the pass line opening by the roller unit.

[0004]

[Problems to be solved by the device]

 In the conventional substrate processing apparatus, the processing liquid sprayed from the spraying device adheres to the side wall of the substrate processing chamber, and the processing liquid becomes droplets and drops from the passage port onto the substrate transported into the substrate processing chamber. To do. Since a larger amount of the treatment liquid is applied to this droplet drop portion than to the other portions, unevenness of treatment occurs on the substrate and the quality of the substrate deteriorates.

An object of the present invention is to reduce processing unevenness on the surface of a substrate.

[0006]

[Means for Solving the Problems]

 A substrate processing apparatus according to a first aspect of the present invention is an apparatus that processes a substrate to be transferred therein with a processing liquid, and includes a substrate processing chamber, a transfer mechanism, a substrate processing liquid spraying device, and a rod-shaped member. ing. The substrate processing chamber has a side wall formed with a passage opening through which the substrate passes. The transfer mechanism is for transferring the substrate to the outside of the substrate processing chamber. The substrate processing liquid spraying device is for spraying the processing liquid onto the substrates carried into the substrate processing chamber. The rod-shaped member is fixed to the inner surface of the side wall so as to cover the passage opening from above the passage opening.

A substrate processing apparatus according to a second aspect of the present invention is an apparatus for processing a substrate transported therein by a processing liquid, and includes a substrate processing chamber, a transfer mechanism, and a substrate processing liquid spraying device. . The substrate processing chamber has a sidewall having a passage opening through which the substrate passes and an inner groove extending above the passage opening and extending along the upper edge of the passage opening. The transfer mechanism is for transferring the substrate from the inlet to the outside of the substrate processing chamber. The substrate processing liquid spraying device is for spraying the processing liquid onto the substrate carried into the substrate processing chamber.

[0008]

[Action]

 In the substrate processing apparatus according to the first aspect, the transfer mechanism transfers the substrate into the substrate processing chamber and sprays it from the substrate processing liquid spraying device. Here, it is assumed that the processing liquid sprayed from the substrate processing liquid sprayer adheres to the inner surface of the side wall of the substrate processing chamber. The adhered processing liquid moves downward along the inner surface of the side wall, but above the passage opening, the rod-shaped member is fixed so as to cover the passage opening from above, so that the treatment liquid does not reach the substrate passing through the passage opening. Will not fall. As a result, uneven processing of the substrate can be suppressed.

In the substrate processing apparatus according to the second aspect of the invention, the transfer mechanism transfers the substrate in the substrate processing chamber into the substrate processing chamber and sprays it from the substrate processing liquid spraying device. Here, it is assumed that the processing liquid sprayed from the substrate processing liquid sprayer adheres to the inner surface of the side wall of the substrate processing chamber. The adhered processing solution moves downward along the inner surface of the side wall, but above the passage opening, it flows into the inner groove extending along the upper edge of the passage opening, so that it drops onto the substrate passing through the passage opening. Will not do. As a result, uneven processing of the substrate can be suppressed.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment FIG. 1 shows a schematic structure of a continuous surface treatment apparatus for continuously performing a series of substrate treatments. This device constitutes a part of a manufacturing line of a substrate such as a liquid crystal or a printed circuit board, and mainly comprises a developing machine 1, a spray etching machine 2 and a resist film peeling machine 3. There is. The developing machine 1, the spray etching machine 2 and the resist film peeling machine 3 are respectively provided with a processing chamber 11 which is shielded from the outside, and a spray tube 12 for applying a processing liquid to the rectangular substrate W 1. Each processing chamber 11 is connected to an exhaust fan (not shown) so that the atmosphere gas inside each processing chamber 11 is forcibly exhausted.

On the upstream side (left side in the drawing) of the developing machine 1, there is provided a first communication chamber 5 for connecting a pre-processing chamber not shown and the processing chamber 11 of the developing machine 1. A second communication chamber 6 is provided between the processing chamber 11 of the developing machine 1 and the processing chamber 11 of the spray etching machine 2, and the processing chamber 11 of the spray etching machine 2 and the processing chamber 11 of the resist film peeling machine 3 are provided. A third communication room 7 is provided between them. Further, on the downstream side of the resist film peeling machine 3, a fourth communication chamber 8 for connecting a processing chamber (not shown) in the subsequent stage and the processing chamber 11 is provided. An opening 21 is formed in the upper wall of each communication chamber 5-8, and the inside of each communication chamber 5-8 communicates with the outside. A lid member 22 is provided at the opening 21 of each of the communication chambers 5 to 8 in order to prevent unnecessary substances from dropping into the communication chambers 5 to 8 through the opening 21. The lid member 22 is arranged above the upper walls of the communication chambers 5 to 8 at a predetermined distance, and covers the opening 21 and forms an air passage.

The communication chambers 5 to 8 and the processing chambers 11 are arranged in a straight line and communicate with each other through a pass line opening 15 a formed in the side wall 15 of each processing chamber 11. As shown in FIG. 2, the pass line opening 15a extends laterally (in the depth direction in FIG. 1) like a slit. Further, inside each of the processing chambers 11 and each of the communication chambers 5 to 8, a transport mechanism 10 including transport rollers is provided. The transfer mechanism 10 is arranged in a straight line and horizontally transfers the rectangular substrate W through the pass line opening 15a of each processing chamber 11.

The rod-shaped member 19 is fixed above the pass line opening 15 a on the inner surface of the side wall 15 of the processing chamber 11. As shown in FIG. 2, the rod-shaped member 19 is arranged above the pass line opening 15a so as to cover the pass line opening 15a from above, and is parallel to the extending direction (horizontal direction) of the pass line opening 15a. It is extended. The length of the rod-shaped member 19 is slightly longer than the width of the pass line opening 15a. As shown in FIG. 3, the rod-shaped member 19 has a trapezoidal cross section, and one side surface of the rod-shaped member 19 serves as an attachment surface 19 a adhered to the inner side surface of the side wall 15. Further, the upper surface of the rod-shaped member 19 is an inclined surface 19b which is inclined so as to decrease toward the side wall 15 side.

Next, the operation will be described. The substrate W sent by the transfer mechanism 10 from the processing chamber at the preceding stage (not shown) passes through the first communication chamber 5 and is carried into the processing chamber 11 of the developing machine 1 through the pass line opening 15a. On the other hand, the spray tube 12 starts spraying the developing solution downward. The mist-like treatment liquid adheres to the inner surface of the side wall 15 to form a droplet, and flows downward on the inner surface of the side wall 15. The flowing developing solution is accumulated on the inclined surface 19b of the rod-shaped member 19 as shown in FIG. 3 above the pass line opening 15a and flows to both sides of the rod-shaped member 19 as shown by an arrow in FIG. It flows down. As a result, the developer flowing along the side wall 15 does not adhere to the substrate W which is carried in. As a result, only the developing solution directly sprayed from the spray tube 12 is supplied to the substrate W, and the developing solution is evenly and uniformly applied.

The substrate W on which the developing solution is sprayed by the spray tube 12 while being transported in the processing chamber 11 by the transport mechanism 10 is unloaded to the second communication chamber 6 from the pass line opening 15 a on the subsequent stage side. Even when passing through the exit-side pass line opening 15a, the developing solution flowing on the inner surface of the side wall 15 is excluded on both sides by another rod-shaped member 19 and therefore does not adhere to the substrate W.

The substrate W is sprayed with an etching liquid (corrosion liquid) in the processing chamber 11 of the spray etching machine 2 and further sprayed with a stripping liquid in the processing chamber 11 of the resist film stripping machine 3. Also in these processing chambers 11, since the rod-shaped member 19 is provided above each pass line opening 15a, the processing liquid flowing through the side wall 15 does not adhere to the substrate W. The substrate W transferred to the fourth communication chamber 8 is sent to a processing chamber in the subsequent stage (not shown).

During the above operation, the inside of each processing chamber 11 is forcibly exhausted to a negative pressure, and the outside air flows into the inside through the openings 21 of each of the communication chambers 5, 6, 7 and 8, and is further exposed. The outside air then flows into each processing chamber 11 through the pass line opening 15a. Therefore, even if the negative pressures in the processing chambers 11 are different, the atmospheric gases are not mixed between the processing chambers 11. Second Embodiment The rod-shaped member 24 shown in FIG. 4 has the same shape as the rod-shaped member 19 shown in the first embodiment, but is fixed while being inclined with respect to the pass line opening 15a. In this case, the processing liquid flowing along the side wall 15 is blocked by the rod-shaped member 24, flows to one side according to the inclination, and flows downward from one end thereof. Also in this case, the same effect as that of the first embodiment can be obtained. Third Embodiment The rod-shaped member 25 shown in FIG. 5 is formed in a mountain shape. In this case, the processing liquid flowing along the side wall 15 flows to both sides of the rod-shaped member 25 and flows down on the side wall 15 from both ends. Also in this case, the same effect as that of the above-described embodiment can be obtained. Fourth Embodiment As shown in FIG. 6, the inclined surface 19c may be curved. Also in this case, the same effect as that of the above-mentioned embodiment can be obtained. Fifth Embodiment In the fifth embodiment shown in FIGS. 7 and 8, an inner groove 30 is formed on the inner side surface of the side wall 15 above the pass line opening 15a. The inner groove 30 is formed wider than the pass line opening 15a, and is formed substantially parallel to the pass line opening 15a.

The inner groove 30 includes an upper inclined portion 30a and a groove portion 30b in which the processing liquid flowing down is stored. Further, side grooves 31 extending vertically are connected to both ends of the inner groove 30. In this embodiment, when the treatment liquid attached to the inner surface of the side wall 15 flows down along the side wall 15, the treatment liquid flows into the groove portion 30b along the inclined portion 30a of the inner groove 30. The processing liquid accumulated in the groove portion 30b flows to both sides and drops through the side groove 31.

Also in this case, the same effect as that of the above-described embodiment can be obtained. The shape of the inner groove 30 is not limited to the above-mentioned embodiment. Inclined, chevron and curved shapes can be used.

[0020]

[Effect of device]

 In the substrate processing apparatus according to the first and second aspects of the present invention, the rod-shaped member or the inner groove arranged above the passage opening formed in the side wall causes the treatment liquid flowing on the inner surface of the side wall on the substrate passing through the passage opening. Prevent the falling. Therefore, uneven processing of the substrate can be suppressed.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a connection type surface treatment apparatus to which a first embodiment of the present invention is applied.

FIG. 2 is a partial perspective view showing a side wall and a rod-shaped member.

FIG. 3 is a sectional view taken along line III-III of FIG.

FIG. 4 is a partial front view of the inner surface of the side wall of the second embodiment.

FIG. 5 is a view corresponding to FIG. 4 of the third embodiment.

FIG. 6 is a diagram corresponding to FIG. 3 of the fourth embodiment.

FIG. 7 is a view corresponding to FIG. 4 of the fifth embodiment.

8 is a sectional view taken along line VIII-VIII of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Developing machine 2 Spray etching machine 3 Resist film peeling machine 10 Transfer mechanism 11 Processing chamber 12 Spray pipe 15 Side wall 15a Pass line opening 19, 24, 25 Rod-shaped member 30 Inner groove

Claims (2)

[Scope of utility model registration request] 1. A substrate processing apparatus for processing a substrate transported inside by a processing liquid, comprising: a substrate processing chamber having a sidewall formed with a passage opening through which the substrate passes; A transport mechanism for transporting a substrate, a substrate processing liquid spraying device for spraying a processing liquid onto the substrate transported into the substrate processing chamber, and at least one of the pass ports is located above the pass port. And a rod-like member fixed to the inner surface of the side wall so as to cover the substrate processing apparatus. 2. A substrate processing apparatus for processing a substrate transported therein by a processing liquid, wherein the substrate has a passage opening through which the substrate passes and an inner side extending above the passage opening along an upper edge of the passage opening. A substrate processing chamber having a side wall in which a side groove is formed, a transport mechanism for transporting the substrate into and out of the substrate processing chamber, and a substrate for spraying a processing liquid onto the substrate loaded into the substrate processing chamber. A substrate processing apparatus including a processing liquid spraying device.