JPH07270489A - Semiconductor inspection device - Google Patents

Abstract

PURPOSE:To provide a semiconductor inspection device having the capability of checking the contact condition of a power supply pin without any need of increasing the number of power supply sources. CONSTITUTION:A semiconductor inspection device is internally provided with power switches 4A, 4B are 4C in parallel to a single power supply source 1 by a number at least equal to or above the number of the power supply pins 5a and 5b of an inspected semiconductor device 2, so as to control power supply thereto. Also, only the necessary power source of a plurality of supply power sources are applied to the power supply pins 5a and 5b of the device 2 through a performance board 3. For checking the contact condition of each of the pins 5a and 5b and the power supply source 1 of the inspection device, only the power switch 4A is first turned on and other power switches 4B and 4C turned off for checking the contact condition of the pin 5a and the power supply source 1. Similarly, only the switch 4B is turned on and other switches 4A and 4C turned off for checking the contact condition of the pin 5b and the power supply source 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor inspection device for inspecting the electrical characteristics of a semiconductor device.

[0002]

2. Description of the Related Art In a final semiconductor device, a specific power supply (for example, V _CC ) pin may be divided into two or more. Similarly, a semiconductor device in a wafer state may have two or more specific power supply (for example, V _CC ) pads. When performing a final product inspection or a wafer state intermediate inspection of these semiconductor devices, it is necessary to apply a voltage to each power supply pin or power supply pad.

FIG. 3 is a block diagram showing an example of a power supply voltage applying circuit to a power supply pin of a semiconductor device to be inspected by a conventional semiconductor inspection device, and shows a case where there are two power supply pins.
In FIG. 3, 1 is a power source of a semiconductor inspection device for supplying the semiconductor device to be inspected, 2 is a semiconductor device to be inspected, 3 is a performance board manufactured for each type of semiconductor device to be inspected, 4 is a semiconductor device to be inspected 2 is a power supply switch for controlling voltage application from the power supply 1 to the two power supply pins 5a and 5b.

In the power supply voltage applying circuit having the above structure, since the power supply voltage can be applied to all the power supply pins of the semiconductor device 2 to be inspected at the same time, the semiconductor device 2 to be inspected can be inspected. There is a problem that the contact check between the semiconductor inspection device and the semiconductor device 2 to be inspected, which is the first inspection item of the device, cannot be completely performed.

That is, in the contact check, the contact check is carried out for each pin including all the power pins of the semiconductor device 2 to be inspected.
In the semiconductor inspection apparatus shown in FIG. 3, only two power supply pin contact checks can be performed at the same time. Therefore, if two power supply pins are open, it can be detected as a defect by the contact check, but only one power supply pin. When the contact is made and the other power supply pin is in the open state, the contact check may not detect the defect, and the subsequent inspection may not be performed correctly.

FIG. 4 is a block diagram showing a power supply voltage applying circuit improved from that of FIG. 3 in order to solve the above-mentioned problems. Power supplies 1a and 1b of different semiconductor inspection devices are individually supplied to the semiconductor device 2 to be inspected. It is connected to the pins 5a and 5b. In this power supply voltage applying circuit, since the individual power supply pins 5a, 5b are connected to the individual power supplies 1a, 1b, contact check is possible, and the inspection after the contact check is performed by the individual power supplies 1a, 1b. Can be carried out by applying simultaneously.

[0007]

However, in general, the semiconductor inspection is carried out on a large number of semiconductor devices at the same time, and the example of FIG. If there are three power supply pins, the number of power supplies must be three times the number that can be measured simultaneously. For that reason,
If a large number of simultaneous measurement is possible for the semiconductor inspection device, the problem that the semiconductor inspection device becomes expensive arises.

The present invention has been made in order to solve the above-mentioned problems associated with the conventional example, and obtains a semiconductor inspection device which enables contact check of power supply pins without increasing the number of power supplies of the semiconductor inspection device. Is intended.

[0009]

A semiconductor inspection device according to claim 1 of the present invention comprises a performance board for inspecting the electrical characteristics of a semiconductor device to be inspected, and a contact check of a power supply pin of the semiconductor device to be inspected. And, in a semiconductor inspection device for performing a functional test, at least a single power supply for supplying a power supply voltage to the semiconductor device to be inspected and an application of supply power from the power supply to the single power supply are controlled. The semiconductor device to be inspected is provided with a plurality of power supply switches whose number is equal to or larger than the number of power supply pins of the semiconductor device to be inspected.

A semiconductor inspection apparatus according to claim 2 is
The plurality of power supply switches are provided in parallel with the single power supply, and the performance board applies only a necessary amount of the plurality of power supplies to the power supply of the semiconductor device to be inspected. Is.

Further, the semiconductor inspection apparatus according to claim 3 is characterized in that the plurality of power supply switches are provided on the performance board in a one-to-one correspondence with respective power supply pins of the semiconductor device to be inspected. Is.

[0012]

In the semiconductor inspection apparatus according to the first aspect of the present invention, the power supply from a single power source to each power supply pin of the semiconductor device to be inspected is at least a plurality of power supply pins of the semiconductor device to be inspected. By making it controllable by the power switch, the contact check and the function test of the power supply pin of the semiconductor device to be inspected can be realized without increasing the number of power supplies of the semiconductor inspection device.

Further, in the semiconductor inspection apparatus according to the second aspect, the plurality of power source switches are provided in parallel with the single power source, and only the necessary portion of the plurality of power sources is provided by the performance board. Since it is applied to the power supply of the semiconductor device to be inspected, it is possible to check the contact between the power supply pin and the power supply of the semiconductor device to be inspected by controlling the combination of turning on and off the power supply switch. In the inspection item, a power supply voltage is supplied from the power supply to the power supply pin by simultaneously turning on a power supply switch for supplying power to the power supply pin.

Furthermore, in the semiconductor inspection apparatus according to the third aspect, the performance is improved by providing the plurality of power supply switches on the performance board in a one-to-one correspondence with individual power supply pins of the semiconductor device under test. By controlling the combination of turning on and off the power supply switch on the board, it is possible to check the contact between the power supply pin of the semiconductor device under test and the power supply, and in the inspection items after the contact check, to supply power to the power supply pin. By simultaneously turning on the power supply switch on the performance board, the power supply voltage is supplied from the power supply to the power supply pin.

[0015]

【Example】

Example 1. Hereinafter, the present invention will be described based on illustrated embodiments. FIG. 1 is a configuration diagram showing a power supply voltage application circuit up to a power supply pin of a semiconductor device to be inspected by the semiconductor inspection device according to the first embodiment. In FIG. 1, the same parts as those in the conventional example shown in FIG. As new reference numerals, 4A, 4B, and 4C are power supply switches provided inside the semiconductor inspection device for controlling the power supply to the power supply pins 5a and 5b of the semiconductor device 2 to be inspected. 3 more than the number of power supply pins for inspection semiconductor devices
There are a number of switches, which are provided in parallel to a single power supply 1, and the performance board 3 applies only a necessary amount of the plurality of power supplies to the power supply pin of the semiconductor device 2 to be inspected. There is.

In FIG. 1, when performing a contact check between the individual power supply pins 5a and 5b of the semiconductor device 2 to be inspected and the power supply 1 of the semiconductor inspection device, first, only the power supply switch 4a is turned on and the other power supplies are turned on. By turning off the switches 4b and 4c, the power supply pin 5a of the semiconductor device 2 to be inspected
It is possible to check the contact between the power source 1 and the power source 1. Similarly, by turning on only the power supply switch 4b and turning off the other power supply switches 4a and 4c, the contact check between the power supply pin 5b of the semiconductor device 2 to be inspected and the power supply 1 becomes possible. Further, in the inspection items after the contact check, the power supply voltage is supplied from the power supply 1 to the power supply pins 5a and 5b by turning on the power supply switches 4a and 4b at the same time.

Therefore, according to the first embodiment, at least a plurality of power supply switches 4A, 4B and 4C having at least the number of power supply pins of the semiconductor device 2 to be inspected are provided in parallel with respect to the single power supply 1 and the performance is improved. Since the board 3 is configured to apply only a necessary amount of the plurality of power supplies to the power pins 5a and 5b of the semiconductor device 2 to be inspected, by controlling the combination for turning the power switches on and off,
The contact check between the power supply pin of the semiconductor device 2 to be inspected and the power supply 1 becomes possible, and in the inspection items after the contact check, the power supply switches 4A and 4B for supplying power to the power supply pin are turned on at the same time to turn on the power supply. The power supply voltage is supplied from the power supply 1 to the pins 5a and 5b, and the contact check and the function test of the power supply pin of the semiconductor device under test 2 can be realized without increasing the number of power supplies of the semiconductor inspection device. There is.

Example 2. Next, FIG. 2 is a configuration diagram showing a power supply voltage application circuit up to a power supply pin of a semiconductor device to be inspected by the semiconductor inspection device according to the second embodiment. In the semiconductor inspection apparatus according to the second embodiment shown in FIG. 2, there is only one power supply switch 4 for one power supply 1, but the power supply pins 5a and 5b of the semiconductor device 2 to be inspected are mounted on the performance board 3. Power supply switches 6a and 6b individually corresponding to
Is provided.

In the semiconductor inspection device having the above structure,
When performing a contact check between the individual power supply pins 5a and 5b of the semiconductor device 2 to be inspected and the power supply 1 of the semiconductor inspection device, first, the power supply switch 4 and the switch 6a are turned on, and the switch 6b is turned off. It is possible to check the contact between the pin 5a and the power supply 1. Similarly, by turning on the power source switch 4 and the switch 6b and turning off the switch 6a, it is possible to check the contact between the power source pin 5b and the power source 1. For the inspection items after the contact check, the power switch 4 switch 6a
By simultaneously turning on the power supply terminals 6 and 6b, the power supply voltage is supplied from the power supply 1 to the power supply pins 5a and 5b.

Therefore, according to the second embodiment, the power supply switches 6a and 6b are provided on the performance board 3 in a one-to-one correspondence with the individual power supply pins 5a and 5b of the semiconductor device to be inspected. By controlling the combination of turning on and off the power supply switch 4, it is possible to perform a contact check between the power supply pin of the semiconductor device 2 to be inspected and the single power supply 1, and in the inspection items after the contact check, power is supplied to the power supply pin. By simultaneously turning on the power supply switch on the performance board 2 for carrying out the operation, the power supply voltage is supplied from the power supply to the power supply pin, which is carried out. There is an effect that a contact check and a function test of the power supply pin can be realized.

[0021]

As described above, according to the first aspect of the present invention, the power supply from the single power source to each power supply pin of the semiconductor device under test is at least equal to or more than the power supply pin of the semiconductor device under test. The controllability by a plurality of power supply switches has an effect that a contact check and a function test of a power supply pin of a semiconductor device to be inspected can be realized without increasing the number of power supplies of the semiconductor inspection device.

According to a second aspect of the present invention, the plurality of power supply switches are provided in parallel with the single power supply, and only the necessary portion of the plurality of power supplies is inspected by the performance board. Since it is applied to the power supply of the power supply, it is possible to check the contact between the power supply pin of the semiconductor device under test and the power supply by controlling the combination that turns on and off the power supply switch. By simultaneously turning on the power supply switch for supplying power to the pins, the power supply voltage is supplied from the power supply to the power supply pins for execution, and the power supply pins of the semiconductor device under test are not increased without increasing the number of power supplies of the semiconductor inspection device. There is an effect that the contact check and the functional test can be realized.

According to a third aspect of the present invention, the plurality of power supply switches are provided on the performance board in a one-to-one correspondence with the individual power supply pins of the semiconductor device to be inspected. By controlling the combination of turning on and off, it is possible to check the contact between the power supply pin and the power supply of the semiconductor device under test, and for the inspection items after the contact check, the power supply on the above performance board for supplying power to the power supply pin. By turning on the power switch at the same time, the power supply voltage is supplied from the power supply to the power supply pin, and the contact check and function test of the power supply pin of the semiconductor device under test are realized without increasing the number of power supplies of the semiconductor inspection device. The effect is that it will be possible.

[Brief description of drawings]

FIG. 1 is a circuit diagram showing a power supply voltage applying circuit of a semiconductor inspection device according to a first embodiment of the present invention.

FIG. 2 is a circuit diagram showing a power supply voltage applying circuit of a semiconductor inspection device according to a second embodiment of the present invention.

FIG. 3 is a circuit diagram showing a power supply voltage application circuit of a semiconductor inspection device according to a conventional example.

FIG. 4 is a circuit diagram showing a power supply voltage applying circuit of a semiconductor inspection device according to another conventional example.

[Explanation of symbols]

 1 power supply 2 semiconductor device to be inspected 3 performance board 4 power supply switch 4A power supply switch 4B power supply switch 4C power supply switch 5a power supply pin 5b power supply pin 6a power supply switch 6b power supply switch

Claims (3)

[Claims] 1. A semiconductor inspecting apparatus comprising a performance board for inspecting electrical characteristics of a semiconductor device to be inspected, for performing a contact check and a function test of a power supply pin of the inspecting semiconductor device, the semiconductor device being inspected. A single power supply for supplying a power supply voltage and a plurality of power supply switches for controlling the application of the power supply from the power supply to the single power supply are provided at least as many as the number of power supply pins of the semiconductor device under test. A semiconductor inspection device characterized by being provided. 2. The plurality of power supply switches are provided in parallel with the single power supply, and the performance board applies only a necessary amount of the plurality of power supplies to the power supply of the semiconductor device under test. Claim 1 characterized by the above-mentioned.
The semiconductor inspection device described. 3. The plurality of power supply switches are provided on the performance board in a one-to-one correspondence with the individual power supply pins of the semiconductor device under test.
The semiconductor inspection device described.