JPH07258439A - Flame retardant laminated sheet and its production - Google Patents
Flame retardant laminated sheet and its productionInfo
- Publication number
- JPH07258439A JPH07258439A JP5240194A JP5240194A JPH07258439A JP H07258439 A JPH07258439 A JP H07258439A JP 5240194 A JP5240194 A JP 5240194A JP 5240194 A JP5240194 A JP 5240194A JP H07258439 A JPH07258439 A JP H07258439A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- flame
- thermal decomposition
- inorganic compound
- decomposition temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、熱分解温度が高く、耐
熱性に優れた難燃性積層板およびその製造法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flame-retardant laminate having a high thermal decomposition temperature and excellent heat resistance, and a method for producing the same.
【０００２】[0002]
【従来の技術】電子機器に組込んで使用されるプリント
配線板には、他部品からの発火時に対する安全性の面か
ら難燃性が厳しく要求されている。さらに、近年、耐熱
性も併せて要求される場合が増えてきている。例えば、
従来のプリント配線板の製造には、銅張り積層板からエ
ッチングにより回路を形成する技術が多く採用されてい
るが、配線の微細化に伴い、樹脂基板上にスパッタリン
グ法や蒸着法により微細回路を直接形成し併せて薄膜抵
抗などを微細回路上に形成する技術が採用されるように
なってきた。これらの微細回路や薄膜抵抗を形成する技
術では、樹脂基板である積層板に熱分解温度３５０℃以
上の耐熱性が要求される。樹脂の難燃化の要求に対し、
従来から樹脂に配合して使用されている難燃剤として、 １）ハロゲン化合物（テトラブロモビスフェノールＡ，
デカブロモジフェニルオキサイド等）などの有機系難燃
剤 ２）リン系化合物（ポリメタリン酸等）などの有機系難
燃剤 ３）金属水酸化物（水酸化アルミニウム，水酸化マグネ
シウム等）などの無機系難燃剤 がある。これらの難燃剤は、樹脂に比べ熱分解温度が低
いため、このような難燃剤を配合した樹脂組成物を使用
した積層板は、樹脂自体の熱分解温度が幾ら高くても難
燃剤の使用により耐熱性が低下してしまう。耐熱性と難
燃性を併せて要求されるプリント配線板の分野には使用
できないという問題がある。2. Description of the Related Art Printed wiring boards used by being incorporated in electronic equipment are strictly required to have flame retardancy in terms of safety against ignition from other components. Further, in recent years, cases where heat resistance is also required are increasing. For example,
In the conventional manufacturing of printed wiring boards, a technique of forming a circuit from a copper-clad laminate by etching is often used, but with the miniaturization of wiring, a fine circuit is formed on a resin substrate by a sputtering method or an evaporation method. A technique for directly forming and simultaneously forming a thin film resistor or the like on a fine circuit has been adopted. In the technology for forming these fine circuits and thin film resistors, a laminated plate which is a resin substrate is required to have heat resistance at a thermal decomposition temperature of 350 ° C. or higher. To meet the demand for flame retardant resin
As a flame retardant that has been conventionally compounded and used in a resin, 1) a halogen compound (tetrabromobisphenol A,
Organic flame retardants such as decabromodiphenyl oxide) 2) Organic flame retardants such as phosphorus compounds (polymetaphosphoric acid) 3) Inorganic flame retardants such as metal hydroxides (aluminum hydroxide, magnesium hydroxide, etc.) There is. Since these flame retardants have a lower thermal decomposition temperature than the resin, a laminated board using a resin composition containing such a flame retardant can be used even if the thermal decomposition temperature of the resin itself is high. The heat resistance will decrease. There is a problem that it cannot be used in the field of printed wiring boards that require both heat resistance and flame retardancy.
【０００３】[0003]
【発明が解決しようとする課題】本発明が解決しようと
する課題は、積層板の耐熱性が、難燃剤の添加に影響さ
れることを排除し、当該耐熱性をできるだけ積層板を構
成する樹脂自体の耐熱温度にまで近づけることである。The problem to be solved by the present invention is to eliminate the influence of the addition of a flame retardant on the heat resistance of the laminated plate, and to make the heat resistant resin which composes the laminated plate as much as possible. It is to approach the heat resistant temperature of itself.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決するため
に、本発明に係る難燃性積層板は、樹脂を含浸したシー
ト状基材を加熱加圧成形した積層板において、樹脂中に
樹脂の熱分解温度以下で溶融する無機化合物を含有する
ことを特徴とする。無機化合物の熱分解温度は樹脂の熱
分解温度より高い方が好ましいが、必ずしもこれに限定
されない。例えば、樹脂がエポキシ樹脂である場合、無
機化合物は、低融点ガラス粉末および／または酸化アル
ミニウム一水和物粉末、ハロゲン化スズ粉末などであ
る。In order to solve the above-mentioned problems, a flame-retardant laminate according to the present invention is a laminate in which a sheet-shaped base material impregnated with a resin is heated and pressure-molded. It is characterized in that it contains an inorganic compound which melts at a temperature not higher than the thermal decomposition temperature thereof. The thermal decomposition temperature of the inorganic compound is preferably higher than the thermal decomposition temperature of the resin, but is not necessarily limited to this. For example, when the resin is an epoxy resin, the inorganic compound is low-melting glass powder and / or aluminum oxide monohydrate powder, tin halide powder, or the like.
【０００５】[0005]
【作用】従来の積層板の樹脂中に配合して使用されてい
る難燃剤の燃焼抑制作用は、次に述べるように、難燃剤
が熱分解することによる。例えば、 １）ハロゲン化合物においては、その熱分解時に発生す
るハロゲン化水素が、樹脂を酸素および熱から遮断し、
また、樹脂燃焼時に生成するフリーラジカルを捕捉す
る。 ２）リン系化合物においては、その熱分解時に生成する
ポリリン酸の炭化膜が樹脂を酸素および熱から遮断す
る。 ３）金属水酸化物においては、その熱分解（結晶水解
離）時の吸熱により温度低下を図る。 などの作用により燃焼を抑制する。本発明に係る積層板
における燃焼抑制作用は、添加されている無機化合物が
燃焼時の熱により溶融し、これが樹脂を包み込むことに
より、樹脂を酸素および熱から遮断するものである。無
機化合物は分解することなく溶融するだけで難燃作用を
発揮し、周囲温度が下がれば元の固体状態に戻る。従っ
て、難燃剤の添加に影響されることなく樹脂自体の耐熱
温度に近づくまで積層板の耐熱性を確保できる。このよ
うな難燃作用は、難燃剤が熱分解してしまう上記従来技
術におけるものとは全く異なるものである。The function of suppressing the combustion of the flame retardant used by being mixed with the resin of the conventional laminate is due to the thermal decomposition of the flame retardant as described below. For example: 1) In halogen compounds, the hydrogen halide generated during its thermal decomposition shields the resin from oxygen and heat,
It also captures free radicals generated during resin combustion. 2) In the phosphorus compound, the carbonized film of polyphosphoric acid generated during the thermal decomposition shields the resin from oxygen and heat. 3) The temperature of the metal hydroxide is reduced due to the heat absorption during the thermal decomposition (dissociation of water of crystallization). Combustion is suppressed by the action of. The combustion suppressing effect in the laminated plate according to the present invention is that the added inorganic compound is melted by the heat at the time of combustion and wraps the resin, thereby insulating the resin from oxygen and heat. The inorganic compound exhibits a flame-retardant effect only by melting without decomposition, and returns to its original solid state when the ambient temperature decreases. Therefore, the heat resistance of the laminate can be ensured until the heat resistance temperature of the resin itself is approached without being affected by the addition of the flame retardant. Such a flame retardant action is completely different from that in the above-mentioned conventional technique in which the flame retardant is thermally decomposed.
【０００６】[0006]
【実施例】本発明に係る難燃性積層板は、樹脂が、エポ
キシ樹脂、フェノール樹脂などであり、特に限定するも
のではない。尚、樹脂中に従来の難燃剤を配合した積層
板においても、３００℃程度の耐熱温度は確保できるた
め、樹脂自体がそれ以上の耐熱性を有する樹脂、特に、
エポキシ樹脂に対しての適用が効果が著しく好ましい。
積層板を構成する樹脂中に配合する無機化合物は、当該
樹脂の熱分解温度以下で溶融するものであり、使用する
樹脂との組合せで適宜選択することになるが、エポキシ
樹脂との組合せでは、好ましくは、低融点ガラス粉末
（ＰｂＯ・Ｂ2Ｏ3系等）、酸化アルミニウム一水和物粉
末（Ａｌ2Ｏ3・Ｈ2Ｏ）、ハロゲン化スズ（ＳｎＢｒ2，
ＳｎＩ2等）などである。EXAMPLE The resin of the flame-retardant laminate according to the present invention is epoxy resin, phenol resin, etc., and is not particularly limited. In addition, even in a laminated board in which a conventional flame retardant is mixed in a resin, a heat resistant temperature of about 300 ° C. can be secured, so that the resin itself has heat resistance higher than that, particularly,
Application to epoxy resin is extremely effective and preferable.
The inorganic compound to be blended in the resin constituting the laminate is one that melts at a temperature below the thermal decomposition temperature of the resin, and will be appropriately selected in combination with the resin used, but in combination with the epoxy resin, preferably, the low melting point glass frit (PbO · B 2 O 3 system, etc.), aluminum oxide monohydrate powder (Al 2 O 3 · H 2 O), tin halide (SnBr 2,
SnI 2 etc.) and the like.
【０００７】実施例１ ビスフェノールＡ型エポキシ樹脂（エポキシ当量：４８
０）１００重量部、ジシアンジアミド３重量部、ベンジ
ルジメチルアミン０．４重量部を配合した樹脂ワニス
（Ａ）を調製した。この樹脂ワニス（Ａ）の硬化物の熱
分解温度は、４０５℃であった。上記樹脂ワニス（Ａ）
に、低融点ガラス粉末（ＰｂＯ・Ｂ2Ｏ3系，融点：３８
０℃，熱分解温度：５００℃以上）を８０重量部配合
し、難燃性樹脂ワニス（Ａ）を調製した。難燃性樹脂ワ
ニス（Ａ）をガラス不織布（単位重量：７５ｇ/ｍ2）に
含浸乾燥し、樹脂量７８重量％のプリプレグを得た。こ
のプリプレグを所定枚数積層し、温度１７０℃、圧力４
０kgf／cm2で９０分間加熱加圧成形し、厚み１．２mmの
積層板とした。Example 1 Bisphenol A type epoxy resin (epoxy equivalent: 48
0) 100 parts by weight, 3 parts by weight of dicyandiamide, and 0.4 parts by weight of benzyldimethylamine were mixed to prepare a resin varnish (A). The thermal decomposition temperature of the cured product of this resin varnish (A) was 405 ° C. The above resin varnish (A)
Low melting point glass powder (PbO.B 2 O 3 system, melting point: 38
80 parts by weight of 0 ° C., thermal decomposition temperature: 500 ° C. or more) was mixed to prepare a flame-retardant resin varnish (A). A glass nonwoven fabric (unit weight: 75 g / m 2 ) was impregnated with the flame-retardant resin varnish (A) and dried to obtain a prepreg having a resin amount of 78% by weight. A predetermined number of these prepregs are laminated and the temperature is 170 ° C. and the pressure is 4
It was heat and pressure molded at 0 kgf / cm 2 for 90 minutes to obtain a laminated plate having a thickness of 1.2 mm.
【０００８】実施例２ 樹脂ワニス（Ａ）に、酸化アルミニウム一水和物粉末
（Ａｌ2Ｏ3・Ｈ2Ｏ，融点：３５０℃，熱分解温度：３８
０℃）を８０重量部配合し、難燃性樹脂ワニス（Ｂ）を
調製した。難燃性樹脂ワニス（Ｂ）を使用し、以下、実
施例１と同様にして厚み１．２mmの積層板とした。Example 2 A resin varnish (A) was mixed with aluminum oxide monohydrate powder (Al 2 O 3 .H 2 O, melting point: 350 ° C., thermal decomposition temperature: 38).
80 parts by weight of 0 ° C.) was blended to prepare a flame-retardant resin varnish (B). A flame-retardant resin varnish (B) was used, and thereafter, a laminated plate having a thickness of 1.2 mm was prepared in the same manner as in Example 1.
【０００９】実施例３ 樹脂ワニス（Ａ）に、実施例１で使用した低融点ガラス
粉末を４０重量部、酸化アルミニウム一水和物粉末を４
０重量部配合した難燃性樹脂ワニス（Ｃ）を調製した。
難燃性樹脂ワニス（Ｃ）を使用し、以下、実施例１と同
様にして厚み１．２mmの積層板とした。Example 3 40 parts by weight of the low melting glass powder used in Example 1 and 4 parts of aluminum oxide monohydrate powder were added to the resin varnish (A).
A flame-retardant resin varnish (C) containing 0 part by weight was prepared.
A flame-retardant resin varnish (C) was used, and a laminated board having a thickness of 1.2 mm was prepared in the same manner as in Example 1.
【００１０】実施例４ 樹脂ワニス（Ａ）に、ヨウ化スズ（ＳｎＩ2，融点：３
２０℃，熱分解温度：５００℃以上）を８０重量部配合
した難燃性樹脂ワニス（Ｄ）を調製した。難燃性樹脂ワ
ニス（Ｄ）を使用し、以下、実施例１と同様にして厚み
１．２mmの積層板とした。Example 4 A resin varnish (A) was added with tin iodide (SnI 2 , melting point: 3).
A flame-retardant resin varnish (D) containing 80 parts by weight of 20 ° C. and a thermal decomposition temperature of 500 ° C. or higher was prepared. A flame-retardant resin varnish (D) was used, and a laminated board having a thickness of 1.2 mm was prepared in the same manner as in Example 1.
【００１１】従来例１ ビスフェノールＡ型臭素化エポキシ樹脂（エポキシ当
量：４８０，臭素含率：２１重量％）７０重量部、ビス
フェノールＡ型エポキシ樹脂（エポキシ当量：４８０）
３０重量部、ジジシアンジアミド３重量部、ベンジルジ
メチルアミン０．４重量部を配合し、難燃性樹脂ワニス
（Ｅ）を調製した。難燃性樹脂ワニス（Ｅ）を使用し、
以下、実施例１と同様にして厚み１．２mmの積層板とし
た。Conventional Example 1 70 parts by weight of bisphenol A type brominated epoxy resin (epoxy equivalent: 480, bromine content: 21% by weight), bisphenol A type epoxy resin (epoxy equivalent: 480)
30 parts by weight, 3 parts by weight of didicyandiamide, and 0.4 parts by weight of benzyldimethylamine were blended to prepare a flame-retardant resin varnish (E). Using flame-retardant resin varnish (E),
Thereafter, a laminated plate having a thickness of 1.2 mm was prepared in the same manner as in Example 1.
【００１２】従来例２ 樹脂ワニス（Ａ）に、水酸化アルミニウム粉末（Ａｌ
(ＯＨ)3，熱分解温度：２８０℃）を８０重量部配合し
た難燃性樹脂ワニス（Ｆ）を調製した。難燃性樹脂ワニ
ス（Ｆ）を使用し、以下、実施例１と同様にして厚み
１．２mmの積層板とした。Conventional Example 2 A resin varnish (A) was mixed with aluminum hydroxide powder (Al
A flame-retardant resin varnish (F) containing 80 parts by weight of (OH) 3 and a thermal decomposition temperature of 280 ° C. was prepared. A flame-retardant resin varnish (F) was used, and a laminated plate having a thickness of 1.2 mm was prepared in the same manner as in Example 1.
【００１３】比較例１ 樹脂ワニス（Ａ）を使用し、以下、実施例１と同様にし
て厚み１．２mmの積層板とした。Comparative Example 1 A resin varnish (A) was used, and thereafter, a laminated plate having a thickness of 1.2 mm was prepared in the same manner as in Example 1.
【００１４】上記の各種樹脂ワニスを使用して得られた
積層板の特性を表１に示す。表１において、熱分解温度
は、熱天秤により主分解温度を測定した。曲げ強度保持
率は、（数１）に基づいて計算した。尚、曲げ強度自体
の測定は、ＪＩＳ−Ｃ−６９１１に準拠した。難燃性
は、ＵＬ−９４に準拠した。表中の（＊）印は、処理に
よって積層板表面にフクレが発生したことを表す。Table 1 shows the characteristics of the laminates obtained by using the above various resin varnishes. In Table 1, for the thermal decomposition temperature, the main decomposition temperature was measured with a thermobalance. The flexural strength retention rate was calculated based on (Equation 1). The bending strength itself was measured according to JIS-C-6911. The flame retardancy complied with UL-94. The mark (*) in the table indicates that blisters were generated on the surface of the laminate by the treatment.
【００１５】[0015]
【数１】 [Equation 1]
【００１６】[0016]
【表１】 [Table 1]
【００１７】表１から明らかなように、実施例の積層板
は、難燃性を保持しながら熱分解温度も高い。そして、
高温にさらされた後も強度低下が少なく耐熱性に優れて
いる。難燃性を確保するために配合した無機化合物が、
耐熱性や機械強度などの特性に悪影響を与えていないこ
とを理解できる。特に、無機化合物として樹脂の熱分解
温度より高い熱分解温度を有するものを選択したときに
は、積層板の熱分解温度が積層板を構成する樹脂自体の
熱分解温度と同等かそれをしのぐものになり、耐熱性も
一層優れたものとなる。As is clear from Table 1, the laminated plates of Examples have high thermal decomposition temperatures while maintaining flame retardancy. And
Excellent heat resistance with little decrease in strength even after exposure to high temperatures. Inorganic compound blended to ensure flame retardancy,
It can be understood that the properties such as heat resistance and mechanical strength are not adversely affected. In particular, when an inorganic compound having a thermal decomposition temperature higher than that of the resin is selected, the thermal decomposition temperature of the laminated plate is equal to or surpasses the thermal decomposition temperature of the resin itself constituting the laminated plate. Also, the heat resistance is further improved.
【００１８】無機化合物の溶融温度は、絶対的なもので
はなく、当該無機化合物を配合する樹脂の耐熱温度との
関係で決定され、使用する樹脂の熱分解温度以下で溶融
するものを適宜選択すればよい。積層板は、その表面に
銅箔等の金属箔を一体化したものであってもよい。The melting temperature of the inorganic compound is not absolute, but is determined in relation to the heat resistance temperature of the resin in which the inorganic compound is blended, and a material that melts at a temperature lower than the thermal decomposition temperature of the resin used can be appropriately selected. Good. The laminated plate may have a metal foil such as a copper foil integrated on the surface thereof.
【００１９】[0019]
【発明の効果】上述のように、本発明に係る難燃性積層
板は、積層板を構成する樹脂中に配合した無機化合物が
熱分解するのではなく溶融することにより難燃作用を発
揮するので、積層板の耐熱性を当該積層板を構成する樹
脂自体の耐熱温度にまで近づけることができる。積層板
を構成する樹脂としてエポキシ樹脂のように耐熱性の高
いものを使用すれば、従来の難燃剤の配合では得られな
かった耐熱性の高い積層板を得ることができる。As described above, the flame-retardant laminate according to the present invention exhibits a flame-retardant action by melting the inorganic compound compounded in the resin constituting the laminate, not by thermal decomposition but by melting. Therefore, the heat resistance of the laminated plate can be brought close to the heat resistant temperature of the resin itself constituting the laminated plate. If a resin having a high heat resistance such as an epoxy resin is used as a resin forming the laminated plate, a laminated plate having a high heat resistance which cannot be obtained by the conventional compounding of a flame retardant can be obtained.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｂ２９Ｋ 63:00 105:06 505:00 509:08 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Office reference number FI technical display location // B29K 63:00 105: 06 505: 00 509: 08
Claims (8)
形した積層板において、樹脂中に樹脂の熱分解温度以下
で溶融する無機化合物を含有することを特徴とする難燃
性積層板。1. A flame-retardant laminate comprising a sheet-shaped base material impregnated with a resin, which is heat-press molded, wherein the resin contains an inorganic compound that melts at a temperature lower than the thermal decomposition temperature of the resin. .
度より高い請求項１記載の難燃性積層板。2. The flame-retardant laminate according to claim 1, wherein the thermal decomposition temperature of the inorganic compound is higher than the thermal decomposition temperature of the resin.
度以下である請求項１記載の難燃性積層板。3. The flame-retardant laminate according to claim 1, wherein the thermal decomposition temperature of the inorganic compound is not higher than the thermal decomposition temperature of the resin.
低融点ガラス粉末である請求項２記載の難燃性積層板。4. The flame-retardant laminate according to claim 2, wherein the resin is an epoxy resin and the inorganic compound is a low melting point glass powder.
酸化アルミニウム一水和物粉末である請求項３記載の難
燃性積層板。5. The flame-retardant laminate according to claim 3, wherein the resin is an epoxy resin and the inorganic compound is aluminum oxide monohydrate powder.
低融点ガラス粉末と酸化アルミニウム一水和物粉末の併
用である請求項１記載の難燃性積層板。6. The flame-retardant laminate according to claim 1, wherein the resin is an epoxy resin, and the inorganic compound is a combination of low-melting glass powder and aluminum oxide monohydrate powder.
ハロゲン化スズである請求項２記載の難燃性積層板。7. The flame-retardant laminate according to claim 2, wherein the resin is an epoxy resin and the inorganic compound is tin halide.
加熱加圧成形する積層板の製造において、樹脂ワニス中
に樹脂の熱分解温度以下で溶融する無機化合物を配合す
ることを特徴とする難燃性積層板の製造法。8. In the production of a laminated plate in which a sheet-shaped base material is impregnated with a resin varnish and is heated and pressed, an inorganic compound which melts at a temperature lower than the thermal decomposition temperature of the resin is blended in the resin varnish. A method for producing a flame-retardant laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5240194A JPH07258439A (en) | 1994-03-24 | 1994-03-24 | Flame retardant laminated sheet and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5240194A JPH07258439A (en) | 1994-03-24 | 1994-03-24 | Flame retardant laminated sheet and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07258439A true JPH07258439A (en) | 1995-10-09 |
Family
ID=12913789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5240194A Pending JPH07258439A (en) | 1994-03-24 | 1994-03-24 | Flame retardant laminated sheet and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07258439A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005015624A (en) * | 2003-06-26 | 2005-01-20 | Sumitomo Bakelite Co Ltd | Transparent composite sheet |
| JP2006249343A (en) * | 2005-03-14 | 2006-09-21 | Mitsui Chemicals Inc | Epoxy resin composition and package for housing semiconductor element |
| JP2007051264A (en) * | 2005-07-22 | 2007-03-01 | Mitsubishi Rayon Co Ltd | Fiber-reinforced composite material |
| JP2011037036A (en) * | 2009-08-06 | 2011-02-24 | Lintec Corp | Release sheet |
| JP2014111719A (en) * | 2012-11-12 | 2014-06-19 | Panasonic Corp | Laminate, metal-clad laminate, printed wiring board, and multilayer printed wiring board |
-
1994
- 1994-03-24 JP JP5240194A patent/JPH07258439A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005015624A (en) * | 2003-06-26 | 2005-01-20 | Sumitomo Bakelite Co Ltd | Transparent composite sheet |
| JP2006249343A (en) * | 2005-03-14 | 2006-09-21 | Mitsui Chemicals Inc | Epoxy resin composition and package for housing semiconductor element |
| JP2007051264A (en) * | 2005-07-22 | 2007-03-01 | Mitsubishi Rayon Co Ltd | Fiber-reinforced composite material |
| JP2011037036A (en) * | 2009-08-06 | 2011-02-24 | Lintec Corp | Release sheet |
| JP2014111719A (en) * | 2012-11-12 | 2014-06-19 | Panasonic Corp | Laminate, metal-clad laminate, printed wiring board, and multilayer printed wiring board |
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