JPH07254837A - High frequency piezoelectric vibration device - Google Patents

Abstract

PURPOSE:To improve the reliability of the device in which a fault such as a broken electrode hardly takes place, to facilitate the forming of each electrode and to improve the yield and the productivity. CONSTITUTION:The device is made up of a piezoelectric vibration area 11 with a small thickness in which a couple of exciting electrodes 11a, 11a are at least formed on its front and rear sides and up of a thick reinforcement section 12 in succession to the piezoelectric vibration area and provided therearound, and an electrode leadout area 13 whose thickness is nearly the same as that of the piezoelectric vibration area 11 is provided to a part of the reinforcement section 12 in a groove shape up to an outer circumferential end of the piezoelectric plate and a leadout electrode 11b connecting electrically to the exciting electrode is formed to the electrode leadout area 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a reference oscillation source for communication equipment,
Further, the present invention relates to a piezoelectric vibrating device such as a crystal oscillator or a crystal filter used as a clock source of a microcomputer, and particularly to a thin piezoelectric vibrating device compatible with high frequencies.

[0002]

2. Description of the Related Art With the increase in frequency of communication equipment and the increase in operating frequency of microcomputers, piezoelectric vibrating devices such as crystal oscillators and crystal filters are required to support high frequencies. Generally, the thickness shear vibration of an AT-cut crystal plate is often used as a crystal plate adapted to higher frequencies, and as is well known, the frequency is determined by the thickness, and the frequency and the thickness are inversely proportional. For example, 4.2
When trying to obtain a frequency of MHz, the thickness of the quartz plate is about 0.4 mm, while when trying to obtain a frequency of 20 MHz, the thickness of the quartz plate is about 0.08 mm. As the frequency becomes higher, the thickness becomes thinner, and it becomes difficult to process the crystal plate itself such as cutting and polishing. In order to solve such a problem, the thickness of the crystal plate is the thickness of the fundamental wave, and in some cases, harmonic oscillation is used in order to obtain higher-order frequencies such as 3 times and 5 times. The value (crystal impedance) becomes high, the peripheral circuit becomes complicated, and as a result, it is difficult to reduce the size as a whole. In some cases, the required electrical characteristics cannot be obtained depending on the applied electronic device.

In order to solve such a problem, FIG.
As shown in FIG. 2, a structure is provided in which a recess is provided in the central portion of a quartz plate, a thinned vibration region is set in the recess, and the vibration region is reinforced by a thick portion around the recess. 14
FIG. 9 is an internal cross-sectional view showing a conventional example, in which a thinned recess 9 is formed.
1 and a quartz plate 9 having a thick portion 92 formed around it
In addition, the excitation electrode 9a is drawn out from the recess to the end of the thick portion by the extraction electrode 9b. By adopting such a configuration, the vibration region can be made considerably thinner than the conventional one, and 40M which was the harmonic frequency region in the conventional one.
It realizes frequencies above Hz with fundamental vibration.

[0004]

However, in the above-mentioned structure, the formation of electrodes by vapor deposition or the like is difficult due to the presence of the recesses, and it is difficult to form an electrode material on the inner wall portion which stands upright. Since the extraction electrode 9b extending to the thick portion passes through a sharp edge portion of the crystal plate, a part or the whole of the electrode may be cut at this portion to cause defective conduction. In particular, for crystal oscillators with higher frequencies (that is, thinner walls), it is required to make the electrodes thinner than usual so as not to damp the excited vibrations as much as possible. It was a factor that promoted cutting.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a highly reliable piezoelectric vibrating device in which an accident such as electrode cutting is unlikely to occur. Further, another object is to facilitate the formation of each electrode itself and improve the yield and the productivity.

[0006]

In order to solve the above problems, the invention as set forth in claim 1 is a piezoelectric vibrating region in which excitation electrodes are formed on the front and back sides of a thin wall, and this piezoelectric vibrating region is followed by the piezoelectric vibrating region. A piezoelectric plate having a thick reinforcing portion provided around the piezoelectric plate is provided, and an electrode lead-out region having substantially the same thickness as the piezoelectric vibrating region is provided in a part of the reinforcing portion, and the excitation electrode is provided in the electrode lead-out region. A high-frequency piezoelectric vibrating device, characterized in that an extraction electrode that is electrically connected is formed.

The invention according to claim 2 is characterized in that the electrode lead-out region and the lead-out electrode are formed up to the outer peripheral end of the piezoelectric plate, and the lead-out electrode portion is electrically connected to the outside. The high frequency piezoelectric vibration device according to claim 1.

The invention according to claim 3 is characterized in that the electrode lead-out region and the lead-out electrode are formed up to the vicinity of the outer peripheral end of the piezoelectric plate, and the lead-out electrode portion is electrically connected to the outside. The high frequency piezoelectric vibration device according to claim 1.

The invention according to claim 4 is the high-frequency piezoelectric vibrating device according to any one of claims 1, 2 and 3, characterized in that an embedding material is provided in at least a part of the electrode lead-out region.

The invention according to claim 5 is the high-frequency piezoelectric vibration device according to claim 4, characterized in that the embedding material is a conductive bonding material.

The invention according to claim 6 is characterized in that a narrow width portion is provided in at least a part of the electrode lead-out region to prevent the burying material from flowing out of the electrode lead-out portion. 5. The high frequency piezoelectric vibration device according to item 5.

The invention according to claim 7 is the high-frequency piezoelectric vibration device according to claim 1, 2, 3, 4, 5, or 6, characterized in that a reinforcing member is provided on at least a part of the reinforcing portion. is there.

The invention according to claim 8 is the high-frequency piezoelectric vibrating device according to claim 7, characterized in that a conductive material is used for the reinforcing member and is formed in a substantially circumferential shape along the reinforcing portion. Examples of the conductive material include metal films such as gold and silver, conductive resin materials, and combinations thereof.

The invention according to claim 9 is the high-frequency piezoelectric vibration device according to claim 7, characterized in that a thin solid body is bonded as a reinforcing member with a bonding material.

[0015]

[Action]

According to the present invention, an electrode lead-out region having substantially the same thickness as the piezoelectric vibrating region is provided in a part of the reinforcing portion, and the electrode lead-out region is electrically connected to the excitation electrode. Since the extraction electrode is formed as described above, the extraction electrode does not pass through the edge portion and does not bend in the thickness direction, so that there is no fear of cutting the electrode at the edge portion. Further, since it is not necessary to form an electrode on the inner wall of the recess formed by the vibrating region and the reinforcing portion, the electrode formation itself is easy.

According to the fourth aspect of the invention, the embedding material provided in the electrode lead-out region integrally reinforces the thin portion.

According to the invention as set forth in claim 5, since the burying material is the conductive bonding material, it assists the electrical connection between the extraction electrode and the outside together with the reinforcing effect.

According to the invention described in claim 6, the narrow width portion provided in at least a part of the lead-out region prevents the embedding material from flowing out of the electrode lead-out portion.

According to the invention described in claim 7, since the reinforcing member is provided on at least a part of the reinforcing portion, the piezoelectric vibration device is reinforced.

According to the invention as set forth in claim 8, since a conductive material is used for the reinforcing member and is formed in a substantially circumferential shape along the reinforcing portion, the reinforcing portion serves to reinforce the connecting portion with the outside. It can be set freely.

According to the invention described in claim 9, since the thin solid body is joined as the reinforcing member by the joining material, the reinforcing effect can be further improved.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to the drawings, taking a crystal oscillator as an example. FIG. 1 is an exploded perspective view showing a first embodiment of the present invention, and FIG. 2 is a sectional view showing a state in which each component of FIG. 1 is housed and hermetically sealed by a cover plate. The crystal plate 1 that is a piezoelectric body has a concave shape in which the front and back surfaces of the central portion of the plate surface are recessed as a whole. The central portion of the concave shape is thin and serves as the piezoelectric vibration region 11,
Exciting electrodes 11a, 1 made of aluminum or the like facing the front and back surfaces
1a is provided. A reinforcing portion 12 having a thickness several times thicker than that of the piezoelectric vibrating region is provided on the outer peripheral portion of the piezoelectric vibrating region 11, and the thin piezoelectric vibrating region has two opposing corner portions (one corner of the surface) of the outer peripheral portion. And the other corner of the back surface) are provided with electrode lead-out regions 13, 13 extending in a groove shape. Extraction electrodes 11b and 11b are formed in the electrode extraction regions 13 and 13 up to the outer peripheral end, respectively. When obtaining a frequency of 90 MHz, for example, the thickness of each portion is 18 μm in the piezoelectric vibrating region, and the thickness of the reinforcing portion is 80 μm. Thus, the concave piezoelectric vibrating region or the groove-shaped electrode lead-out region can be formed by a wet etching method, a dry etching method, a sandblast method, or the like, and the electrode can be formed by a vacuum vapor deposition method or the like. Aluminum, silver, etc. are used for each electrode material.

The package P for accommodating the crystal plate 1 is made of ceramics such as alumina, and is provided with a lead-out electrode P1 for leading out an electrode from the crystal plate accommodating portion to the outside. The crystal plate is housed in a package, and the extraction electrode 13 and the extraction electrode P1
Can be conductively bonded with the conductive bonding material S and airtightly bonded with the upper surface of the package with the cover plate C to obtain a surface mount type crystal resonator. In this embodiment, the groove-shaped electrode lead-out region is filled with the conductive bonding material S1 as an embedding material to improve the mechanical strength of the crystal plate 1 as a whole. Further, the electrode lead-out region may be provided on both front and back surfaces as long as the mechanical strength can be secured.

A second embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a perspective view showing a second embodiment of the present invention. The crystal plate 1 that is a piezoelectric body has a concave shape in which the front and back surfaces of the central portion of the plate surface are recessed as a whole.
The concave central portion is thin and serves as a piezoelectric vibrating region 14. The exciting electrode 14 made of aluminum or the like faces the front and back surfaces.
a and 14a are provided. A reinforcing portion 15 having a thickness several times thicker than that of the piezoelectric vibrating region is provided on the outer peripheral portion of the piezoelectric vibrating region 14, and the thin piezoelectric vibrating region is provided on two opposing sides of the outer peripheral portion (one side of the surface). And the other side of the back)
Electrode lead-out regions 16 and 16 extending in the shape of a groove are provided. Extraction electrodes 14b and 14b are formed in the electrode extraction regions 16 and 16 up to the outer peripheral end, respectively. By forming the electrode extension regions on the opposite sides in this way, the mechanical strength of the quartz plate is improved. Further, the embedding material may be filled in the electrode lead-out region as in the above embodiment.

A third embodiment of the present invention will be described with reference to the drawings. 4 is a perspective view showing a third embodiment of the present invention, and FIG. 5 is a sectional view taken along line AA of FIG. This embodiment describes claim 6, and shows an example of a narrow portion formed in the electrode lead-out region. The crystal plate 2 which is a piezoelectric body has a concave shape in which only one surface of the central portion of the plate surface is concave as a whole. The central portion of the concave shape is thin and serves as a piezoelectric vibration region 21, and excitation electrodes 21a, 21a made of aluminum or the like are provided facing the front and back surfaces. The outer peripheral portion of the piezoelectric vibrating region 21 is provided with a reinforcing portion 22 having a thickness several times thicker than that of the piezoelectric vibrating region, and the thin piezoelectric vibrating region extends in a groove shape in two opposite corner portions of the outer peripheral portion. Electrode lead-out areas 23 and 24 are provided. Lead-out electrodes 21b and 21b are formed in the electrode lead-out regions 23 and 24, respectively, up to the outer peripheral ends. In the electrode lead-out region 23, the protrusions 23a and 23b are provided so as to face the outer peripheral end portion and the piezoelectric vibrating region, respectively.
23c and 23d are provided to form a narrow portion. The projections may be formed integrally when the crystal plate is processed, or may be formed by applying a bonding material or the like after the processing.
The electrode lead-out region 24 is formed to be narrower than the electrode lead-out region 23, and a reservoir portion 24a for accumulating an embedding material or the like is formed in the central portion thereof. By forming each of these narrow parts, it is possible to prevent the conductive bonding material used for bonding to the embedding material or the package from flowing out from the electrode lead-out area, and preventing the piezoelectric vibration from being disturbed. To do.

A fourth embodiment of the present invention will be described with reference to the drawings. FIG. 6 is a perspective view showing a fourth embodiment of the present invention. This embodiment describes claim 3, and also refers to the connection relation with the package Q. The crystal plate 3, which is a piezoelectric body, has a concave shape in which the front and back surfaces of the central portion of the plate surface are recessed as a whole. The central portion of the concave shape is thin and the piezoelectric vibration region 31 is formed,
Exciting electrodes 31a, 3 made of aluminum or the like facing the front and back surfaces
1a is provided. The outer peripheral portion of the piezoelectric vibrating region 31 is provided with a reinforcing portion 32 having a thickness several times thicker than that of the piezoelectric vibrating region, and the thin piezoelectric vibrating region extends in a groove shape toward two opposing sides of the outer peripheral portion. Electrode drawing area 3
3, 33 are provided. This electrode lead-out area 3
3 and 33 are formed up to the front of the outer peripheral end portion, and lead electrodes 31b and 31b are formed, respectively. Although not shown, excitation electrodes and extraction electrodes are also formed on the back surface. However, the electrode lead-out region may be extended in a direction orthogonal to the direction formed on the surface in order to secure the strength of the entire crystal plate. Further, the electrode lead-out region on the back surface may be formed to extend to the outer peripheral end portion as in the configuration shown in the above-mentioned embodiment. In this case, there is an advantage that workability is improved when the electrical connection with the package is performed by the conductive bonding material. The extraction electrode 31b on the front surface of the crystal plate 3 and the electrode pad Q1 of the package Q are electrically connected via the bonding wire W, and the back surface may be conductively bonded by the conductive bonding material as described above.

A fifth embodiment of the present invention will be described with reference to the drawings. 7 is a perspective view of a monolithic crystal filter showing a fifth embodiment of the present invention, and FIG.
It is a -B sectional view. The crystal plate 4, which is a piezoelectric body, has a concave shape in which only one surface of the central part of the plate surface is recessed as a whole. The central portion of the concave shape is thin and serves as a piezoelectric vibrating region 41, an input electrode 45a and an output electrode 46a are formed in parallel on the front surface, and a common electrode 47a corresponding to each of these electrodes is formed on the back surface. Has been done. Piezoelectric vibration area 4
A reinforcing portion 42 having a thickness several times thicker than that of the piezoelectric vibrating region is provided on the outer peripheral portion of 1, and the thin piezoelectric vibrating region extends in a groove shape toward two opposing sides of the outer peripheral portion. Areas 43 and 44 are provided. In the electrode lead-out regions 43 and 44, the lead-out electrodes 45b and 4
6b is formed up to the outer peripheral end. Further, although not shown, the common electrode 47 on the back surface is the above-mentioned extraction electrode 45b,
46b is drawn out by the extraction electrode 47b to the side other than the side where 46b is drawn out. Electrical connection to the outside is made by these extraction electrodes.

A sixth embodiment of the present invention will be described with reference to the drawings. FIG. 9 is a perspective view of a monolithic crystal filter showing a sixth embodiment of the present invention. The crystal plate 4, which is a piezoelectric body, is almost the same as that of the fifth embodiment except that the recesses are formed on both the front and back surfaces and the electrode lead-out positions are different, so the description of the same structural parts will be omitted. Different from the fifth embodiment, the electrode lead-out regions 48 and 49 are set so as not to be located on a straight line parallel to each side of the outer circumference. Further, the electrode lead-out area 50 on the back surface is also set on a side different from the areas 48 and 49. With such a setting, the thin-walled portion is not biased to a part, so that the mechanical strength of the quartz plate does not decrease.

A sixth embodiment of the present invention will be described with reference to the drawings. FIG. 10 is a perspective view showing a sixth embodiment of the present invention. This embodiment relates to patent claims 4, 5, 7, and 8. The crystal plate 5, which is a piezoelectric body, has a concave shape in which the front and back surfaces of the central portion of the plate surface are recessed as a whole.
The central portion of the concave shape is thin and serves as a piezoelectric vibration region 51. The excitation electrode 51 made of aluminum or the like faces the front and back surfaces.
a and 51a are provided. The outer peripheral portion of the piezoelectric vibrating region 51 is provided with a reinforcing portion 52 having a thickness several times thicker than that of the piezoelectric vibrating region, and the thin piezoelectric vibrating region extends in a groove shape toward one side of the outer peripheral portion. A pull-out area 53 is provided. An extraction electrode 51b is formed in the electrode extraction region 53. Further, electrode pads 52a and 52b are also formed on the reinforcing portion. Although not shown, the excitation electrode 51a and the extraction electrode 51 are also formed on the back surface.
b is formed. The electrode lead-out region is filled with the conductive bonding material S2 and electrically connected to the conductive bonding material S2, and the electrode pads 52a, 52b are also provided.
A conductive bonding material S3 is applied circumferentially on the reinforcing portion through the top. As the conductive bonding materials S2 and S3, for example, a polyimide-based conductive bonding material is used. Since the polyimide-based resin has high heat resistance and a small thermal expansion coefficient, it is possible to prevent the piezoelectric body from being distorted and to provide firm and stable reinforcement. With such a structure, the mechanical strength of the reinforcing portion can be improved, and the electrode can be led out to the outside from the electrode pad formed at an arbitrary position on the reinforcing portion by, for example, the metal elastic thin plate W1.

A seventh embodiment of the present invention will be described with reference to the drawings. FIG. 11 is a perspective view of a monolithic crystal filter showing a seventh embodiment of the present invention, and FIG.
FIG. 13 is a perspective view of the No. 1 seen from the back side, and FIG.
In the state where the reinforcing material G2 is joined with the resin adhesive G1 in
It is C sectional drawing. The crystal plate 6, which is a piezoelectric body, has a concave shape in which only one surface of the central portion of the plate surface is concave as a whole. The central portion of the concave shape is thin and serves as a piezoelectric vibration region 61, an input electrode 65a and an output electrode 66a are formed in parallel on the front surface, and a common electrode 67a corresponding to each of these electrodes is formed in the concave portion on the back surface. Are formed. Extraction electrodes 65b and 66b are respectively extracted from the input electrode and the output electrode to the outer peripheral ends. A reinforcing portion 62 having a thickness several times thicker than that of the piezoelectric vibrating region is provided on the outer peripheral portion of the piezoelectric vibrating region 61, and the thin piezoelectric vibrating region is grooved on the back surface toward two opposite sides of the outer peripheral portion. Electrode lead-out regions 63 and 64 that extend like a circle are provided. The lead-out electrodes 67b and 67 are provided in the electrode lead-out regions 63 and 64, respectively.
b is formed up to the outer peripheral edge. Although not shown, an embedding material such as resin may be provided in the electrode lead-out region to improve the mechanical strength. An insulative resin adhesive G1 (for example, a polyimide-based resin) is circumferentially applied to the reinforcing portion on the surface, and a circumferential reinforcing member is provided on the upper portion thereof.
G2 (glass, crystal, metal, resin, etc.) is joined.
This further enhances the reinforcing effect. Reinforcing member
G2 does not have to have a circumferential shape, and may have a rod shape, a thin plate shape, or the like as long as it has an effect of reinforcing the thin portion.
Both the resin adhesive G1 and the reinforcing member G2 correspond to the reinforcing member described in claim 7.

The reinforcing member is not limited to the above embodiment, and a metal material may be formed by vapor deposition.
Further, a low melting point glass or resin material may be formed on the vapor-deposited metal surface. Further, although the crystal plate is used as the piezoelectric body in each of the above-mentioned embodiments, other single crystal piezoelectric bodies such as lithium tantalate may be used, or piezoelectric ceramics may be used although the processing technique is limited. Although the thickness shear vibration is illustrated as the vibration mode, the present invention can be applied to any vibration mode in which the frequency depends on the thickness of the piezoelectric body, such as thickness vibration.

[0032]

According to the present invention, an electrode lead-out region having substantially the same thickness as the piezoelectric vibration region is provided in a part of the reinforcing portion,
Since the extraction electrode electrically connected to the excitation electrode is formed in this electrode extraction region, the extraction electrode does not pass through the edge portion and does not have to be bent in the thickness direction. It is possible to obtain a highly reliable high-frequency piezoelectric vibrating device that is free from the risk of electrode disconnection and does not change over time. Moreover, since it is not necessary to form an electrode on the inner wall of the recess formed by the vibration region and the reinforcing portion, the electrode itself can be easily formed, and the yield and the productivity can be improved.

According to the invention described in claim 4, since the embedding material provided in the electrode lead-out region integrally reinforces the thin portion, a high-frequency piezoelectric vibration device excellent in mechanical strength can be obtained. .

According to the fifth aspect of the invention, since the embedding material is a conductive bonding material, it assists the reinforcing electrode and the electrical connection between the extraction electrode and the outside.

According to the invention described in claim 6, the narrow width portion provided in at least a part of the lead-out region prevents the embedding material from flowing out of the electrode lead-out portion. It is possible to prevent the conductive bonding material used for bonding to the package from flowing out from the electrode lead-out region, and prevent the vibration from being hindered.

According to the invention described in claim 7, since the reinforcing member is provided on at least a part of the reinforcing portion, the piezoelectric vibrating device is reinforced and a high frequency piezoelectric vibrating device excellent in mechanical strength can be obtained.

According to the invention as set forth in claim 8, since the conductive resin is used for the reinforcing member and is formed in a substantially circumferential shape along the reinforcing portion, the reinforcing function and the connecting portion to the outside of the reinforcing portion are formed. It can be set freely.

According to the invention as set forth in claim 9, since a thin solid body is joined by the joining material as the reinforcing member, the reinforcing effect can be further improved and firm reinforcement can be achieved.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a first embodiment of the present invention.

2 is a cross-sectional view of FIG. 1 after being assembled.

FIG. 3 is a perspective view showing a second embodiment of the present invention.

FIG. 4 is a perspective view showing a third embodiment of the present invention.

5 is a cross-sectional view taken along the line AA of FIG.

FIG. 6 is a perspective view showing a fourth embodiment of the present invention.

FIG. 7 is a perspective view showing a fifth embodiment of the present invention.

8 is a sectional view taken along line BB of FIG.

FIG. 9 is a perspective view showing a sixth embodiment of the present invention.

FIG. 10 is a perspective view showing a seventh embodiment of the present invention.

FIG. 11 is a perspective view showing an eighth embodiment of the present invention.

FIG. 12 is a rear perspective view of FIG. 11.

13 is a cross-sectional view taken along line CC of FIG.

FIG. 14 is a diagram showing a conventional example.

[Explanation of symbols]

1, 2, 3, 4, 5, 6, 9 Crystal plate (piezoelectric body) 11, 14, 21, 31, 41, 51, 61, 91 Piezoelectric vibration region 12, 15, 22, 32, 42, 52, 62 , 92 Reinforcement parts 13, 16, 23, 33, 43, 53, 63 Electrode drawing regions 11a, 14a, 21a, 31a, 41a, 51a, 6
1a, 9a Excitation electrode P, Q package S, S1, S2, S3 Conductive bonding material

Claims (9)

[Claims] 1. A high-frequency piezoelectric vibration having a piezoelectric vibrating region that is thin and has at least a pair of excitation electrodes formed on the front and back sides, and a piezoelectric plate that is composed of a thick-walled reinforcing portion that is provided around the piezoelectric vibrating region. In the device, an electrode lead-out region having substantially the same thickness as the piezoelectric vibration region is provided in a part of the reinforcing portion, and a lead-out electrode electrically connected to the excitation electrode is formed in the electrode lead-out region. High frequency piezoelectric vibration device 2. The high frequency piezoelectric element according to claim 1, wherein the electrode lead-out region and the lead-out electrode are formed up to the outer peripheral end of the piezoelectric plate and are electrically connected to the outside at the lead-out electrode portion. Vibrating device. 3. The high frequency wave according to claim 1, wherein the electrode lead-out region and the lead-out electrode are formed up to the vicinity of the outer peripheral end of the piezoelectric plate, and the lead-out electrode portion is electrically connected to the outside. Piezoelectric vibration device. 4. An embedding material is provided on at least a part of the electrode lead-out region.
3. The high frequency piezoelectric vibration device according to item 3. 5. The high-frequency piezoelectric vibration device according to claim 4, wherein the embedding material is a conductive bonding material. 6. The high-frequency piezoelectric vibration device according to claim 4, wherein a narrow width portion is provided in at least a part of the electrode lead-out region to prevent the embedding material from flowing out of the electrode lead-out portion. . 7. The reinforcing member is provided on at least a part of the reinforcing portion.
6. The high frequency piezoelectric vibrating device according to 6. 8. The high-frequency piezoelectric vibration device according to claim 7, wherein the reinforcing member is made of a conductive material and is formed in a substantially circumferential shape along the reinforcing portion. 9. The high-frequency piezoelectric vibration device according to claim 7, wherein a thin solid body is bonded as a reinforcing member with a bonding material.