JPH07248621A - Photosensitive resin composition - Google Patents

Abstract

PURPOSE:To provide a photosensitive resin composition having high resolution and excellent in fine line adhesion of the line width of 30mum or below and pattern forming property. CONSTITUTION:This resin composition contains a base polymer (A) having the acid value of 100-200mgKOH/g and the weight average molecular weight of 30000-120000, an ethylene unsaturated compound (B), P,P'-bis(dialkyl amino) benzophenone (C), hexaaryl biimidazole (D), and a leuco dye (E). The resin composition contains (C) of 0.01-0.25 pts.wt., (D) of 1.0-10 pts.wt., and (E) of 0.05-2wt.% against (A) and (B) of 100 pts.wt. in total. The (B) constituent contains the ethylene unsaturated compound of 95wt.% or above having two polymerization unsaturated groups.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photosensitive resin composition having a high resolution and a high fine line adhesiveness and a good pattern formability, and in particular, an adhesive force of ITO film, 42 alloy or SUS is required. The present invention relates to a photosensitive resin composition useful for processing a substrate.

[0002]

A three-layer laminate film in which a photosensitive resin composition is applied as a layer on a base film such as a polyester film and dried and then a protective film such as a polyester film and a polyvinyl alcohol film is laminated on the base film is generally a dry film. Film resist (DFR)
It is widely used for manufacturing printed wiring boards, precision machining of metals, and the like. In its use, first, the base film or the protective film, whichever has the smaller adhesive force, is peeled off from the DFR and the photosensitive resin composition layer side is desired to form a pattern such as the copper surface of the copper clad substrate. After sticking to the surface of the material, it is exposed with the pattern mask in contact with the other film (in some cases, the other film is peeled and removed before exposure), and then the other film is peeled and removed. Ready for development. As the developing method after exposure, there are a solvent developing type and a dilute alkali developing type.

In addition to DFR, a method is also well known in which a photosensitive resin composition is directly coated on the surface of the base material, and a pattern mask is adhered through a film such as a polyester film laminated on the base material for exposure. ing. 2. Description of the Related Art In recent years, as the density of printed circuit wiring patterns and the like has increased, high resolution of formed patterns has been required. That is, when a pattern having a thickness of the photosensitive layer of 50 μm is formed, a high resolution of line / space = 50 (μm) / 50 (μm) or more (where the value of the thickness of the photosensitive layer / line width or space width is the aspect ratio). The higher the aspect ratio, the higher the resolution), the adhesion of fine lines with a line width of about 30 μm, and the sharp pattern formation.

To solve these problems, the acid value is 10
Weight average molecular weight of 0-600mgKOH / g is 1000
0 to 500000 base polymer, 10 to 50% by weight of a compound having one polymerizable unsaturated group and 10 to 90% by weight of a compound having two polymerizable unsaturated groups, and photopolymerization initiation A photosensitive resin composition comprising an agent has been proposed. (JP-A-3-6202)

[0005]

However, in the above method, when the thickness of the photosensitive layer is 50 μm, the line / space =
The resolution is about 60 (μm) / 60 (μm), that is, the aspect ratio is 0.83 (50 μm / 60 μm) and the aspect ratio is 1.0 or less.
Only the adhesiveness in the μm width is secured, and there is still room for improvement in order to satisfy the above required performance.

[0006]

[Means for Solving the Problem] Therefore, the inventors of the present invention have made diligent studies in view of such circumstances, and as a result, an acid value of 100 to 100 was obtained.
200 mgKOH / g and weight average molecular weight of 30,000-
120,000 base polymers (A), ethylenically unsaturated compounds (B), P, P'-bis (dialkylamino)
In a resin composition containing benzophenone (C), hexaarylbiimidazole (D) and leuco dye (E), 0.01 to 0.01 parts of (C) is added to 100 parts by weight of the total of (A) and (B). 0.25 parts by weight, (D) 1.0 to
Photosensitivity: 10 parts by weight, 0.05 to 2% by weight of (E), and 95% by weight or more of an ethylenically unsaturated compound in which the component (B) has two polymerizable unsaturated groups. It was found that the resin composition has a high resolution with an aspect ratio of 1.0 or more, is excellent in the adhesiveness to a fine line having a line width of 30 μm or less, and has a very sharp pattern formed, thus completing the present invention. Came to. The present invention is described in detail below.

The base polymer (A) of the present invention has an acid value of 100 to 200 mgKOH / g and a weight average molecular weight of 30.
000 to 120,000, usually a carboxyl group-containing acrylic resin is used, a (meth) acrylate as a main component, an ethylenically unsaturated carboxylic acid and other copolymerizable monomer as necessary are copolymerized. It is an acrylic copolymer. An acetoacetyl group-containing acrylic copolymer can also be used. Here, as the (meth) acrylic acid ester, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, hexyl (meth) acrylate is used.
Acrylate, 2-ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, dimethylaminoethyl (meth)
Acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, glycidyl (meth) acrylate and the like are exemplified.

As the ethylenically unsaturated carboxylic acid, monocarboxylic acids such as acrylic acid, methacrylic acid and crotonic acid are preferably used, and in addition, dicarboxylic acids such as maleic acid, fumaric acid and itaconic acid, or their anhydrides. A thing and a half ester can also be used. Among these, acrylic acid and methacrylic acid are particularly preferable.

The acid value of the base polymer (A) is 100 to 2
00 mgKOH / g, preferably 120-180 mg
KOH / g, more preferably 130 to 170 mg KOH
/ G and the acid value is less than 100 mgKOH / g, good developability cannot be obtained and the desired resolution cannot be obtained. Conversely, 200
If it exceeds mgKOH / g, the developing speed becomes too fast at a film thickness of 25 μm or less, control becomes difficult, and the formed pattern may be attacked by the developing solution. As a method for satisfying the acid value, for example, an ethylenically unsaturated carboxylic acid in the base polymer (A) is added in an amount of 15 to 30.
It is possible by copolymerizing about wt%.

Further, the weight average molecular weight of the base polymer (A) is 30,000 to 120,000, preferably 50.
000 to 100,000, particularly preferably 60,000 to 9
When the weight average molecular weight is 0000 and the weight average molecular weight is less than 30,000, the resin becomes too soft and edge fusion occurs when the resin is processed into a roll form. Conversely, 120
If it exceeds 000, the resolution is lowered and it is unsuitable. Examples of other copolymerizable monomers include acrylamide, methacrylamide, acrylonitrile, methacrylonitrile, styrene, α-methylstyrene, vinyl acetate, alkyl vinyl ether and the like.

As the ethylenically unsaturated compound (B),
Ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, butylene glycol Di (meta)
Acrylate, neopentyl glycol di (meth) acrylate, ethylene oxide modified bisphenol A type di (meth) acrylate, propylene oxide modified bisphenol A type di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, glycerin di ( (Meth) acrylate, pentaerythritol di (meth) acrylate, ethylene glycol diglycidyl ether di (meth) acrylate, diethylene glycol diglycidyl ether di (meth) acrylate, phthalic acid diglycidyl ester di (meth) acrylate, hydroxypivalic acid modified neopentyl 2 having two polymerizable unsaturated groups such as glycol di (meth) acrylate
Functional monomers may be mentioned.

It is possible to use two or more kinds of these bifunctional monomers, and it is also possible to use an appropriate amount of a monofunctional monomer or a trifunctional or more functional monomer described below, but in the present invention, ethylenically unsaturated The greatest feature is that the compound (B) contains 95% by weight or more of the above-mentioned bifunctional monomer. Preferably, the effects of the present invention can be efficiently obtained by using all the bifunctional monomers. That is, if the amount of the polyfunctional monomer in the ethylenically unsaturated compound (B) is less than 95% by weight, the sensitivity, the fine line adhesion, the pattern formation failure, etc. occur, and the effects of the present invention cannot be obtained. Among the above polyfunctional monomers, tetraethylene glycol di (meth) acrylate and ethylene oxide-modified bisphenol A type di (meth) acrylate are preferably used.

Examples of monofunctional monomers are 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate and 2-phenoxy-2-hydroxypropyl (meth) acrylate. , 2- (meth) acryloyloxy-2-hydroxypropyl phthalate, 3-chloro-2-hydroxypropyl (meth) acrylate,
Glycerin mono (meth) acrylate, 2- (meth) acryloyloxyethyl acid phosphate, half (meth) acrylate of a phthalic acid derivative, N-methylol (meth) acrylamide and the like can be mentioned, and trimethylol as a trifunctional or higher functional monomer. Propane tri (meth) acrylate, pentaerythritol tri (meth)
Acrylate, dipentaerythritol penta (meth)
Examples thereof include acrylate, tri (meth) acryloyloxyethoxytrimethylolpropane, glycerin polyglycidyl ether poly (meth) acrylate, and the like.

The mixing ratio of the ethylenically unsaturated compound (B) with respect to 100 parts by weight of the base polymer (A) is 10-.
It is desirable to select from the range of 200 parts by weight, particularly 40 to 100 parts by weight. An insufficient amount of the ethylenically unsaturated compound (B) leads to poor curing, a decrease in flexibility, and a delay in the developing rate. An excessive amount of the ethylenically unsaturated compound (B) increases the tackiness, cold flow, and peeling of the cured resist. This leads to a decrease in speed.

In the present invention, in addition to the above components (A) and (B), P, P'-bis (dialkylamino) benzophenone (C), hexaarylbiimidazole (D) and a color former are used as photopolymerization initiators. Is used as the leuco dye (E). Specific examples of P, P'-bis (dialkylamino) benzophenone (C) include P, P'-bis (dimethylamino) benzophenone, P, P'-bis (diethylamino) benzophenone, P, P'-bis ( Examples thereof include dibutylamino) benzophenone, and P, P'-bis (diethylamino) benzophenone is preferably used.

The hexaarylbiimidazole (D) is 2,2'-bis (o-chlorophenyl) -4,5,4 ', 5'-tetraphenyl-1,2'.
-Biimidazole, 2,2'-bis (o-chlorophenyl) -4,5,4 ', 5'-tetraphenyl-1,1'
-Biimidazole, 2,2'-bis (o-fluorophenyl) -4,5,4 ', 5'-tetraphenyl-1,
1'-biimidazole, 2,2'-bis (o-methoxyphenyl) -4,5,4 ', 5'-tetraphenyl-
1,1′-biimidazole, 2,2′-bis (p-methoxyphenyl) -4,5,4 ′, 5′-tetraphenyl-1,1′-biimidazole, 2,4,2 ′, 4 '-Bis [bi (p-methoxyphenyl)]-5,5'-diphenyl-1,1'-biimidazole, 2,2'-bis (2,4-dimethoxyphenyl) -4,5,4', 5 '
-Diphenyl-1,1'-biimidazole, 2,2'-
Bis (p-methylthiophenyl) -4,5,4 ', 5'
-Diphenyl-1,1'-biimidazole, bis (2,2
4,5-triphenyl) -1,1′-biimidazole and the like, and further, 1,2′-, 1,4′-, 2,4′- disclosed in JP-B-45-37377. Although tautomers covalently bonded to each other can be used, 2,2′-bis (o-chlorophenyl) -4,5,
4 ', 5'-Tetraphenyl-1,2'-biimidazole is preferably used.

Other photopolymerization initiators that can be used in combination with these photopolymerization initiators include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin phenyl ether, benzoin isobutyl ether. , Benzyl diphenyl disulfide, benzyl dimethyl ketal, dibenzyl, diacetyl, anthraquinone, naphthoquinone, 3,3'-dimethyl-4-
Methoxybenzophenone, benzophenone, p, p'-
Bis (dimethylamino) benzophenone, p, p'-bis (diethylamino) benzophenone, pivaloin ethyl ether, 1,1-dichloroacetophenone, pt
-Butyldichloroacetophenone, hexaarylimidazole dimer, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-diethylthioxanthone,
2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-dichloro-
4-phenoxyacetophenone, phenylglyoxylate, α-hydroxyisobutylphenone, dibezosparone, 1- (4-isopropylphenyl) -2-hydroxy-2-methyl-1-propanone, 2-methyl- [4
-(Methylthio) phenyl] -2-morpholino-1-
Examples include propanone, tribromophenyl sulfone, tribromomethylphenyl sulfone and the like.

Further, 2,4,6- [tris (trichloromethyl)]-1,3,5-triazine and 2,4- [bis (trichloromethyl)]-6- (4'-methoxyphenyl) -1. , 3,5-Triazine, 2,4- [bis (trichloromethyl)]-6- (4'-methoxynaphthyl)-
1,3,5-triazine, 2,4- [bis (trichloromethyl)]-6- (piperonyl) -1,3,5-triazine, 2,4- [bis (trichloromethyl)]-6-
Triazine derivatives such as (4′-methoxystyryl) -1,3,5-triazine and acridine derivatives such as acridine and 9-phenylacridine can also be used. As the leuco dye (E), bis (4-N,
N-diethylamino-o-tolyl) methylenedylthiophenylmethane, bis (4-N, N-diethylamino-o
-Tolyl) benzylthiophenylmethane, leuco crystal violet, leuco malachite green and the like can be mentioned, and among them, leuco crystal violet is preferably used.

The components (C) to (E) are blended in amounts of P, P'-bis (dialkylamino) based on 100 parts by weight of the total amount of the base polymer (A) and the ethylenically unsaturated compound (B). ) Benzophenone (C) is 0.01-
0.25 parts by weight, preferably 0.05 to 0.2 parts by weight, hexaarylbiimidazole (D), 1 to 10 parts by weight, preferably 2 to 6 parts by weight, leuco dye (E), 0.05 to.
2 parts by weight, preferably 0.1 to 1 part by weight. When the content of the component (C) is less than the above content, good surface hardness cannot be obtained and the chemical resistance is lowered. If the amount is large, the transmittance of ultraviolet rays is lowered and sufficient internal curing cannot be obtained. Further, if the contents of the components (D) and (E) are less than the above-mentioned contents, sufficient internal curing cannot be obtained, and conversely, if the contents are more than the above-mentioned contents, it is unsuitable because it is difficult to dissolve during the dope formulation.

In addition to the photosensitive resin composition of the present invention, color dyes such as crystal violet, malachite green, malachite green lake, brilliant green, patent blue, methyl violet, Victoria blue, roseaniline, parafuchsin and ethylene violet, and adhesion are also included. Property imparting agent, plasticizer, antioxidant, thermal polymerization inhibitor, solvent, surface tension modifier, stabilizer, chain transfer agent,
Additives such as defoaming agents and flame retardants can be added as appropriate. A method for producing a DFR using the photosensitive resin composition of the present invention and a method for producing a printed wiring board using the DFR will be described.

(Layering Method) The above photosensitive resin composition is
After coating this on the base film surface such as polyester film, polypropylene film, polystyrene film, polyethylene film from the coated surface,
A protective film such as a polyvinyl alcohol film is coated to obtain DFR. For applications other than DFR, the photosensitive resin composition of the present invention is directly coated on a (copper) substrate to be processed by a conventional method such as a dip coating method, a flow coating method, or a screen printing method to obtain a thickness. It is also possible to easily form a photosensitive layer having a thickness of 1 to 150 μm. At the time of coating, a solvent such as methyl ethyl ketone, methyl cellosolve acetate, ethyl cellosolve acetate, cyclohexane, methyl cellosolve, methylene chloride, or 1,1,1-trichloroethane can be added.

To form an image by (exposure) DFR, the adhesive strength between the base film and the photosensitive resin composition layer and the adhesive strength between the protective film and the photosensitive resin composition layer are compared, and the one having the lower adhesive strength is compared. After peeling off the film of, the photosensitive resin composition layer side is attached to the metal surface (pattern forming substrate surface) such as the copper surface of the copper clad substrate, and then the pattern mask is adhered to the other film. Expose. When the photosensitive resin composition does not have tackiness, the other film may be peeled off and then the pattern mask may be brought into direct contact with the photosensitive resin composition layer for exposure. When a metal surface is directly coated, a pattern mask is brought into contact with the coated surface directly or through a polyester film or the like, and the surface is exposed. The exposure is usually carried out by ultraviolet irradiation, and as the light source at that time, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a carbon arc lamp, a xenon lamp, a metal halide lamp, a chemical lamp and the like are used. After irradiation with ultraviolet rays, heating can be performed as necessary to achieve complete curing.

(Development) After exposure, the film on the resist is peeled and removed, and then development is performed. Since the photosensitive resin composition of the present invention is a dilute alkali developing type, the development after exposure is
It is performed by using a dilute aqueous solution of about 0.5 to 3% by weight of alkali such as sodium carbonate and potassium carbonate. (Etching) After development, etching is performed. For etching, an acid etching solution such as cupric chloride-hydrochloric acid or ferric chloride-hydrochloric acid is usually used, but rarely an ammonia-based alkali etching solution is also used. (Removal of cured resist) After the etching step, the remaining cured resist is removed. Removal of cured resist
0.5-10 such as sodium hydroxide and potassium hydroxide
It is carried out using an alkali stripping solution consisting of an aqueous alkali solution having a concentration of about wt%.

[0024]

[Working] Since the photosensitive resin composition of the present invention uses an acrylic copolymer containing a specific ethylenically unsaturated compound, it exhibits a high resolution with an aspect ratio of 1.0 or more, and a line Excellent adhesion to fine wires with a width of 30 μm or less,
Furthermore, a sharp pattern shape can be obtained,
It is very useful for applications such as processing of transparent conductive films such as O and chemical rings such as 42 alloy and SUS that require high resolution and high fine line adhesion.

[0025]

EXAMPLES The present invention will be specifically described below with reference to examples. In addition, "%" in the examples means weight basis unless otherwise specified. Example 1 (Adjustment of Dope) In 62 parts by weight of the following base polymer (A1), 38 parts by weight of tetraethylene glycol dimethacrylate as an ethylenically unsaturated compound (B), P, P '
-Bis (diethylamino) benzophenone (C) 0.1
Parts by weight, 2,2'-bis (o-chlorophenyl) -4,
A dope was prepared by blending 3.0 parts by weight of 5,4 ′, 5′-tetraphenyl-1,2′-biimidazole (D) and 0.3 part of leuco crystal violet (E) and mixing them well. Base polymer (A1) methyl methacrylate / n-butyl methacrylate / 2
A copolymer in which the copolymerization ratio of -hydroxyethyl methacrylate / 2-ethylhexyl acrylate / methacrylic acid is 21/30/10/15/24 on a weight basis (acid value 156.3, glass transition point 44.7 ° C, weight). Average molecular weight 80,000)

(Preparation of DFR) Next, each dope was applied to a thickness of 2 using an applicator with a gap of 10 mils.
It is coated on a 0 μm polyester film, left at room temperature for 1 minute and 30 seconds, and then dried in an oven at 60 ° C., 90 ° C. and 110 ° C. for 3 minutes, respectively, and a resist film having a thickness of 50 μm D
It was FR (however, no protective film was provided). (Lamination on Copper Clad Laminate) This DFR was laminated on a copper clad laminate preheated to 60 ° C. in an oven at a laminating roll temperature of 100 ° C., a roll pressure of 3 kg / cm ² , and a laminating speed of 2 m / sec. Then, the following evaluation was performed.

A. Sensitivity After the above (laminating to copper clad laminate), Stouffer 2
Using a 1-step tablet, an exposure machine HMW-532D manufactured by OAK Seisakusho Co., Ltd., 20 mj with a 3 kW ultra-high pressure mercury lamp.
Each was exposed. After taking a hold time of 15 minutes after the exposure, development was carried out in a 1% Na ₂ CO ₃ aqueous solution at 30 ° C. for a time 1.5 times the minimum development time. From each exposure amount and the number of steps remaining after development, an exposure amount (mj / cm ² ) sufficient to give 7 steps with a Stouffer 21 step tablet was examined.

B. Resolution After the above (lamination to copper clad laminate), a line / space = 1/1, a glass pattern mask designed every 5 µm with 30 to 80 µm is vacuum-contacted, and a 7-step equivalent of a 21-step step tablet of a stower is attached. The minimum line width (μ
m) was examined, and the aspect ratio (resist thickness / minimum line width) at that time was also calculated. The development conditions were the same as in the sensitivity evaluation above. C. Fine wire adhesion After the above (laminating to copper clad laminate), line width 10,
15, 20, 25, 30, 35, 40, 45, 50 μm
Each pattern mask (only one line-space width ∞) was used to develop in the same manner as in the above-described resolution evaluation, and the minimum line width (μm) at which good adhesion was obtained was examined. The cross-sectional shape was also observed by SEM (scanning electron microscope).

Example 2 Example 2 was repeated except that the base polymer (A1) was 55 parts by weight and the ethylene oxide-modified bisphenol A-type dimethacrylate was 45 parts by weight as the ethylenically unsaturated compound (B). A photosensitive resin composition was prepared according to 1, and evaluated in the same manner. Example 3 In Example 1, 60 parts by weight of the base polymer (A1), 15 parts by weight of tetraethylene glycol dimethacrylate and 25 parts by weight of ethylene oxide-modified bisphenol A-type dimethacrylate as the ethylenically unsaturated compound (B) were used in combination. A photosensitive resin composition was prepared in the same manner as in Example 1 except that the above was performed, and the same evaluation was performed.

Example 4 55 parts by weight of the following base polymer (A2), 45 parts by weight of tetraethylene glycol dimethacrylate as an ethylenically unsaturated compound (B), P, P'-bis (diethylamino) benzophenone (C) 0. 05 parts by weight, 2,
2'-bis (o-chlorophenyl) -4,5,4 ',
A photosensitive resin composition was prepared according to Example 1 using 6.0 parts by weight of 5'-tetraphenyl-1,2'-biimidazole (D) and 0.9 parts by weight of leuco crystal violet (E). Then, the same evaluation was performed. Base polymer (A2) methyl methacrylate / n-butyl acrylate / 2-
Copolymer in which the copolymerization ratio of ethylhexyl acrylate / methacrylic acid is 48/10/20/22 on a weight basis (acid value 143.3, glass transition point 40.1 ° C., weight average molecular weight 75,000)

Example 5 60 parts by weight of the following base polymer (A3), 40 parts by weight of tetraethylene glycol dimethacrylate as an ethylenically unsaturated compound (B), P, P'-bis (diethylamino) benzophenone (C) 0. 2 parts by weight, 2,2 '
-Bis (o-chlorophenyl) -4,5,4 ', 5'-
Tetraphenyl-1,2′-biimidazole (D) 5.
0 parts by weight and leuco crystal violet (E) 0.
A photosensitive resin composition was prepared according to Example 1 using 25 parts by weight and evaluated in the same manner. Copolymerization ratio of base polymer (A3) methyl methacrylate / n-butyl acrylate / styrene / methacrylic acid is 50/1 on a weight basis.
Copolymer of 5/10/25 (acid value 162.8, glass transition point 80.2 ° C, weight average molecular weight 60,000)

Comparative Example 1 In Example 1, except that 34 parts by weight of tetraethylene glycol dimethacrylate and 4 parts by weight of 2-acryloyloxyethyl-2-2hydroxyethyl phthalic acid were used as the ethylenically unsaturated compound (B). A photosensitive resin composition was prepared according to Example 1 and evaluated in the same manner. Comparative Example 2 A photosensitive resin composition was prepared and evaluated in the same manner as in Example 1 except that trimethylolpropane tri (meth) acrylate was used as the ethylenically unsaturated compound (B). It was

Comparative Examples 3 to 8 In Example 1, P, P'-bis (diethylamino)
The compounding amount of benzophenone (C) was 0 part by weight (Comparative Example 3).
Alternatively, 0.3 parts by weight (Comparative Example 4), 2,2′-bis (o
-Chlorophenyl) -4,5,4 ', 5'-tetraphenyl-1,2'-biimidazole (D) is added in an amount of 1
2.0 parts by weight (Comparative Example 5) or 0.05 parts by weight (Comparative Example 6), the compounding amount of leuco crystal violet (E) was 3.0 parts by weight (Comparative Example 7) or 0.03 parts by weight (Comparison). Example 8) was varied, and a photosensitive resin composition was prepared according to Example 1 and evaluated in the same manner. Table 1 shows the evaluation results of the examples and the comparative examples.

[0034]

TABLE 1 Sensitivity Resolution fine lines tight adhesion exposure amount (mj / cm ²⁾ Line width ([mu] m) aspect ratio line width ([mu] m) Pattern shape Example 1 80 40 1.25 20 rectangular Example 2 80 35 1.43 30 Rectangular Example 3 80 40 1.25 25 Rectangular Example 4 20 35 1.43 20 Rectangular Example 5 50 40 1.25 25 Rectangular Comparative Example 1 30 60 0.83 35 Trapezoid Comparative Example 2 80 55 1.00 40 Rectangle Comparative Example 3 60 60 0.83 25 Trapezoidal Comparative Example 4 100 50 1.00 50 Inverse trapezoidal Comparative Example 5 Additive (D component) is not completely dissolved and dope preparation is not possible Comparative Example 6 Resist curing Defects occurred and no sensitivity was obtained. Comparative Example 7 30 45 1.1 1 45 Inverse trapezoidal Comparative Example 8 160 Resist elutes

[0035]

Since the photosensitive resin composition of the present invention uses an acrylic copolymer containing a specific ethylenically unsaturated compound, it exhibits a high resolution with an aspect ratio of 1.0 or more, and Excellent adhesion to fine lines with a line width of 30 μm or less, and a sharp pattern shape can be obtained.
It is very useful for applications such as processing of transparent conductive films such as ITO and chemical rings such as 42 alloy and SUS which require high resolution and high fine line adhesion.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display H05K 3/06 H

Claims (5)

[Claims] 1. A base polymer (A) having an acid value of 100 to 200 mg KOH / g and a weight average molecular weight of 30,000 to 120,000, an ethylenically unsaturated compound (B), P,
In a resin composition containing P′-bis (dialkylamino) benzophenone (C), hexaarylbiimidazole (D) and leuco dye (E), (A)
0.01% of (C) with respect to 100 parts by weight of (B)
˜0.25 parts by weight, (D) 1.0 to 10 parts by weight,
(E) is contained in an amount of 0.05 to 2% by weight, and the component (B) contains 95% by weight or more of an ethylenically unsaturated compound having two polymerizable unsaturated groups. Resin composition. 2. The blending ratio of the ethylenically unsaturated compound (B) to 100 parts by weight of the base polymer (A) is 10.
To 200 parts by weight, The photosensitive resin composition according to claim 1. 3. The ethylenically unsaturated compound having two polymerizable unsaturated groups is tetraethylene glycol di (meth) acrylate or ethylene oxide modified bisphenol A type di (meth) acrylate. The photosensitive resin composition according to claim 1. 4. The photosensitive material according to claim 1, wherein the ethylenically unsaturated compound (B) is an ethylenically unsaturated compound having two polymerizable unsaturated groups. Resin composition. 5. The photosensitive resin composition according to claim 1, wherein the triphenylmethane dye (E) is leuco crystal violet.