JPH07245377A - Electronic part and its manufacture - Google Patents

Abstract

PURPOSE:To realize a micro-electronic part including an IC chip without using a printed substrate. CONSTITUTION:An IC chip is mounted on a lead frame, bonded and mold. Necessary chip capacitors C1, C2 are mounted on an area near the IC package 52 and electrically connected. According to this constitution, it is possible to eliminate the need for connection of chip parts such as a chip capacitor through a printed substrate and to form a compact electronic part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultra-compact electronic component on which an IC chip or the like is mounted and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, information cards equipped with IC chips have been put into practical use, and card-shaped substrates having a structure as shown in Japanese Utility Model Laid-Open No. 2-76078 etc. have been proposed in order to reduce the thickness thereof. Has been done. As shown in FIG. 9, a printed coil 2 is formed on an outer peripheral portion of a card-shaped printed circuit board 1, and recesses 3a and 3b for mounting IC chips and electronic parts are provided inside the printed coil 2. Then, the chip IC 4 is COB-mounted in the depressions 3a and 3b, and the chip component 5 such as a capacitor is formed.
Are mounted on the printed circuit board 1 and passed through a reflow furnace to be electrically connected. Then, the epoxy resin 6 is injected into the depressions 3a and 3b to fix the IC chip 4 and the chip component 5 and fill the gap. In this way, the upper and lower surfaces are painted to form a card-shaped substrate.

Further, as shown in FIG. 10, an IC is provided in a case 11.
Insert the printed circuit board 12 on which chips and the like are mounted, and attach the wire-type air-core coil 13 to the edge portion of the groove of the case 11,
There is also used an electronic component in which the electronic component is formed in a flat plate shape by covering the lid 14 from above. In this case, the lid 14 is fixed to the case 11 by ultrasonic welding or the like to form a flat plate type electronic component.

[0004]

However, such a conventional electronic component has a drawback that a printed circuit board is required and it is difficult to reduce the cost of the electronic component.
Further, when a bare chip IC is used, the COB process for die bonding and potting and the chip mounting process are independent, which complicates the number of steps and makes it difficult to reduce the cost. Further, since the printed circuit board is used, there is a drawback that miniaturization is limited.

The present invention has been made in view of such conventional problems, and an object of the present invention is to miniaturize an electronic component without using a printed board and to manufacture it at a low cost.

[0006]

According to a first aspect of the present invention, terminals of an IC chip mounted on a lead frame are connected to the lead frame, and the IC chip and its connecting portion are molded so as to include the same. The electronic component has a structure in which a chip-type electronic component is placed on a lead frame and electrically connected.

In the invention of claim 2 of the present application, the lead frame on which the chip component is mounted is a chip type electronic component and an IC.
It is characterized in that a solder flow prevention portion is provided between the molding portion and the molding portion.

According to a third aspect of the present invention, there is provided an electronic component formed by connecting a terminal of an IC chip mounted on a lead frame to the lead frame and molding the IC chip and the connecting portion thereof to be molded. The chip-type electronic component is placed on the lead frame for electrical connection, at least a part of the lead frame is bent at a right angle, and a coil is wound around the bent lead frame. It is characterized by.

According to a fourth aspect of the present invention, the IC chip in the electronic component has a demodulation circuit for demodulating a signal based on an envelope signal of a resonance signal received by a resonance circuit outside the IC chip, a memory, and a memory. A data carrier having a memory control unit that controls a memory based on a signal obtained from a demodulation circuit, and a reverberation control unit that controls reverberation of the resonance circuit when the level of a signal received by the resonance circuit is lowered. The electronic component is characterized by including a capacitor forming a resonance circuit.

According to a fifth aspect of the present invention, the lead frame is punched, and the first connecting step of bonding and connecting to the terminals of the IC chip mounted on the lead frame, and the connecting portion between the IC chip and the lead frame. A first molding step of molding by transfer molding,
A bending step of bending the lead frame around the molded IC package at a right angle, a winding step of winding a coil winding around the lead frame of the bent IC to form a coil, and mounting a chip component on the lead frame. A second connecting step for placing and electrically connecting the chip parts,
A second molding step of molding the IC package and the coil portion by transfer molding.

[0011]

According to the invention of claim 1 of the present application having such characteristics, the IC chip is mounted on the lead frame, and its terminals are connected to the lead frame for molding. Then, a chip-type electronic component is further mounted on the lead frame of the electronic component, and the chip-type electronic component is electrically connected to the lead frame to form the electronic component.

According to the second aspect of the present invention, a solder flow prevention portion is provided between the chip type electronic component and the molded IC package so that the solder does not flow out from the chip component to the IC package side when electrically connecting. I am trying.

Further, in the inventions of claims 3 and 5 of the present application, I
After the C chip is molded together with the connecting portion, a part of the lead frame is engaged with the lead frame bent at a right angle to wind the coil to form an electronic component including the coil.

Further, according to the invention of claim 4 of the present application, a resonance circuit is formed by a chip type capacitor and a coil, and a data carrier is constituted by the resonance circuit and an IC chip. The data carrier receives and demodulates the resonance signal, and the memory controller writes and reads data in the memory based on the demodulated signal. Then, the reverberation of the resonance circuit is controlled by the read signal to output the signal to the outside.

[0015]

1 is a block diagram of an electronic component according to an embodiment of the present invention, with reference to a data carrier used in an identification system. In the identification system, the data carrier has an LC resonance circuit and a smoothing capacitor, and the other part is configured as an IC circuit. Therefore, it is necessary to attach the coil and the capacitors C1 and C2 as external parts to the IC chip forming the data carrier as shown in FIG. Data carrier 30 of this embodiment
Is a method in which an IC chip is mounted on a lead frame and bonded, and then an electronic component is further attached to the lead frame.

FIG. 2 is a block diagram showing the structure of the data carrier 30. In the figure, the data carrier 30 has a resonance circuit 31. The resonance circuit 31 includes a coil L,
It is composed of a capacitor C1 connected in parallel to the coil L. A voltage control circuit 32 and a full-wave rectification circuit 33 are connected to both ends of the resonance circuit 31. The voltage control circuit 32 limits the voltage level across the voltage control circuit 32 to a predetermined value or less. The full-wave rectification circuit 33 full-wave rectifies the obtained signal and supplies it to each part of the data carrier as the power supply Vcc via the power supply circuit 34, and is connected to the smoothing capacitor C2.

A DEM extraction circuit 35 is connected to one end of the resonance circuit 31. The DEM extraction circuit 35 converts the carrier of the transmission signal into a square wave by half-wave rectifying and shaping the carrier of the transmission signal with the frequency of the carrier as the passing frequency, and the output thereof is given to the demodulation circuit 36. Further, the integration comparator circuit 37 is connected to one end of the resonance circuit 31. The integration comparator circuit 37 performs envelope detection of the signal obtained in the resonance circuit 31 and discriminates the power supply with a divided threshold value to extract the clock signal CKA and output its output to the demodulation circuit 36. . When the data carrier receives a signal, the demodulation circuit 36 counts the number of carrier pulses extracted by the DEM extraction circuit 35 based on CKA, and determines either H level or L level depending on the intermittent duty ratio of the transmission signal. It is to determine. The signal thus demodulated is separated into a command and data by the memory control unit 38, necessary data is written in the memory 39, and the data is read from the memory 39. The output of the integration comparator circuit 37 is also given to the falling pulse generation circuit 40. The falling pulse generation circuit 40 generates a short pulse at every falling of the pulse of the output CKA of the integration comparator circuit 37, and its output is given to the shunt pulse generation circuit 41. The NRZ signal read from the memory control unit 38 is converted into the conversion circuit 42.
Is converted into, for example, a serial bi-phase code and input to the shunt pulse generation circuit 41. The shunt pulse generation circuit 41 generates a shunt pulse by the logical product of these, and is input to the shunt circuit 43. The shunt circuit 43 has a pair of switching elements that ground both ends of the resonance circuit 31 based on a shunt pulse, and grounds both ends of the resonance circuit at the same time to stop reverberation in a short time. In this data carrier, all circuits except the resonance circuit including the coil L and the capacitor C1 and the smoothing capacitor C2 are incorporated in the IC chip 50.

Next, the manufacturing process of the data carrier 30 will be described. FIG. 3A shows a state where the lead frame is punched. The lead frame 51 is a part of the lead frames 51a and 51b as shown in the figure.
The ends of the are made slightly thinner. In addition, the lead frame 51c,
51d has a square end, and an opening is formed at the center thereof. Then, the IC chip 50 is adhered onto a predetermined lead frame and connected to a required terminal of the lead frame by wire bonding. After that, as shown in FIG. 3B, transfer molding is performed using a predetermined mold to mold the IC package 52. Around the IC package 52, as shown in FIG. 1, a chip component, that is, a chip capacitor C1 in the case of a data carrier.
And install C2. And chip capacitors C1 and C
Solder through the reflow furnace to the part where 2 is mounted. FIG. 1 shows an IC package 52 and capacitors C1 and C2.
It shows an electronic component connected to and. In this way, by connecting the coil L to the terminals 51a and 51b of the lead frame,
The data carrier 30 can be configured.

When the chip capacitors C1 and C2 are mounted on the lead frame 51 and soldering is performed through a reflow furnace, the solder may flow out and reach the IC package 52. FIG. 4 is a partial side view showing various examples of the solder flow prevention portion for preventing the solder outflow. The solder flow prevention portion is a curved portion 53 formed at a position slightly apart from the chip component as shown in FIG. 4 (a) and a step 54 as shown in FIG. 4 (b) in addition to the portion where the chip component is mounted. . At the same time as the transfer molding, FIG. 4 (c)
The molding dam 55 as shown in FIG. In this case, when the chip components C1 and C2 are connected through the reflow furnace, the solder flow is surely prevented. See also FIG.
As shown in (d), a dam for preventing solder flow may be formed as the printed portion 56 when the lead frame is formed. In this case, by limiting the printed film thickness to 50 μm or less, it becomes possible to perform transfer molding by using the existing mold as it is at the time of transfer molding processing.

As shown in FIG. 1, the electronic component thus constructed is processed so that the width of the coil is reduced by a predetermined portion so that the coil end can be easily connected to a specific lead frame. It becomes easy to wind and process. Further, since the lead frames 51c and 51d are provided with the mounting portions to the case, it is possible to obtain an effect that the electronic parts can be mounted to the case very easily. The lead frame to which the chip component is attached can be made thin as shown in FIG. 1, and if the chip component is attached to the upper portion of the lead frame, the entire structure can be made thin, and a dam can be formed. It becomes unnecessary.

Next, a second embodiment of the present invention will be described. FIG. 5 shows the structure of an electronic component according to the second embodiment of the present invention.
6 and 7 are schematic views showing the manufacturing process. Figure 5
5A is a side view thereof, and FIG. 5B is a front view thereof. The electronic component of the present embodiment has a coil wound around a part of the lead frame connected to the IC chip 60, and may be the data carrier shown in FIG. Then, the IC chip and the coil are integrally molded.

Next, the manufacturing process of the electronic component according to this embodiment will be described. FIG. 6A is a diagram showing a state in which the lead frame 61 is punched and formed into a strip shape. In this state, the IC chip is mounted on a specific lead frame and the required lead frame 61 is connected by wire bonding. Then, as shown in FIG. 6B, a transfer molding process is performed to mold the IC chip and mold the IC package 62. Then, as shown in FIG. 6C, all the lead frames 61 are separated, and the lead frames around them, that is, 61a to 61h, are formed with upward curved portions, and are bent upward at a position closer to the IC package 62. . After that, as shown in FIG. 5B, chip parts are provided on the lead frames 61i, 61j, 61k, 61m, and the chip capacitor C is used in the above-mentioned data carrier.
1, C2 are mounted using a chip mounter and mounted through a solder reflow furnace. At this time, as shown in FIG. 4 of the above-described first embodiment, the solder is the IC package 62.
It is necessary to provide a solder flow prevention part such as a curved part, a step or a dam so as not to flow out to the side.

Next, as shown in FIG. 7A, the coil wire 63 is wound around the curved portions of the lead frames 61a to 61h. The winding step is performed by, for example, performing a winding process of a predetermined turn with a flyer winding machine and winding the coil wire 63. Both ends of the coil wire 63 are, for example, the lead frame 61.
a, 61b.

Next, as shown in FIG. 7B, the IC package 62, the chip components C1 and C2 mounted on the lead frame, and the winding portion of the lead frame on which the coil wire 63 after bending is wound, Transfer molding is performed so that everything is contained in the mold.
Then, the outer case 64 is formed as shown in FIG. 7B. In this state, the IC chip, the lead frames 61a to 61h bent upward, and the lead frame 61 on which the chip components C1 and C2 are mounted.
i, 61j and 61k, 61m are included in the transfer-molded mold portion. Therefore, only the lead frames 61n, 61p, 61q and 61r are projected to the outside of the electronic component. Case 64 formed in this way
The lead frames 61n to 61r projecting to the left and right are cut and bent, and molded as shown in FIG. 7 (c). In this way, the dual in-line type data carrier can be made extremely small.

In the process of the second embodiment described above, a part of the lead frame, that is, 61a to 61h is bent upward and then the chip capacitor C is used by using the chip mounter.
Although C1 and C2 are mounted, other lead frames may be bent upward after mounting a chip capacitor or the like.

[0026]

As described in detail above, the electronic parts according to claims 1 to 5 of the present application are extremely small in size without using a printed board by forming the electronic parts integrally with the IC chip on the lead frame. Electronic parts can be manufactured. Further, in the invention of claim 2, since the solder flow prevention portion is provided on the lead frame, the solder flows out to the IC package side even when the chip component is mounted on the lead frame and soldered and connected through the reflow furnace. It is possible to prevent the thermal destruction of the IC. Further, according to the inventions of claims 3 and 4, by forming the coil winding on the lead frame itself, it is possible to obtain an effect that the electronic component having the coil can be extremely miniaturized and manufactured at a low price.

[Brief description of drawings]

FIG. 1 is a front view and a side view showing a configuration of an electronic component according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of an internal circuit of the electronic component according to the first embodiment of the present invention.

FIG. 3 is a schematic perspective view showing a manufacturing process of the electronic component according to the first embodiment of the present invention.

FIG. 4 is a partial side view showing various examples of a solder flow prevention portion formed in a chip component mounting portion of an electronic component according to the first embodiment of the present invention.

FIG. 5 is a front view and an elevation view showing a configuration of an electronic component according to a second embodiment of the present invention.

FIG. 6 is a schematic perspective view (No. 1) showing the manufacturing process of the electronic component according to the second embodiment of the present invention.

FIG. 7 is a schematic perspective view (No. 2) showing the manufacturing process of the electronic component according to the second embodiment of the present invention.

FIG. 8 is a front view and an elevation view showing a state in which an IC package of an electronic component according to a second embodiment of the present invention is molded.

FIG. 9 is a perspective view showing an example of a conventional card-type electronic component.

FIG. 10 is an assembly diagram showing another example of a conventional card-type electronic component.

[Explanation of symbols]

50, 60 IC chips 51, 51a to 51c, 52, 61, 61a to 61r,
62 IC Package 53 Curved Part 54 Step 55 Molding Dam 56 Printing Part L Coil C1, C2 Chip Capacitor

Claims (5)

[Claims] 1. An IC mounted on a lead frame
In an electronic component formed by connecting a terminal of a chip to a lead frame and molding the IC chip and its connecting portion, a chip type electronic component is placed on the lead frame and electrically connected. Electronic parts characterized by the following. 2. The electronic component according to claim 1, wherein the lead frame on which the chip component is mounted is provided with a solder flow prevention portion between the chip type electronic component and the IC molding portion. 3. An IC mounted on a lead frame
In an electronic component formed by connecting a terminal of a chip to a lead frame and molding the IC chip and its connecting portion, a chip type electronic component is placed on the lead frame and electrically connected. At the same time, at least a part of the lead frame is bent at a right angle, and a coil is wound around the bent lead frame. 4. The IC chip in the electronic component is obtained from a demodulation circuit for demodulating a signal based on an envelope signal of a resonance signal received by a resonance circuit outside the IC chip, a memory, and the demodulation circuit. A data carrier, comprising: a memory control unit that controls the memory based on a signal; and a reverberation control unit that controls reverberation of the resonance circuit when the level of a signal received by the resonance circuit decreases. 4. The electronic component according to claim 1, wherein the component includes a capacitor that constitutes a resonance circuit. 5. A first connecting step of punching a lead frame to perform bonding connection with a terminal of an IC chip mounted on the lead frame, and a step of molding the connecting portion of the IC chip and the lead frame by transfer molding. 1. A molding step of 1, a bending step of bending a lead frame around a molded IC package at a right angle, and a winding step of winding a coil winding around the bent lead frame of the IC to form a coil, A second connecting step of mounting a chip component on the lead frame and electrically connecting the same, and a second molding step of molding the chip component, the IC package and the coil portion by transfer molding. And a method of manufacturing an electronic component.