JPH07239B2 - Cream solder - Google Patents

Cream solder

Info

Publication number
JPH07239B2
JPH07239B2 JP60164884A JP16488485A JPH07239B2 JP H07239 B2 JPH07239 B2 JP H07239B2 JP 60164884 A JP60164884 A JP 60164884A JP 16488485 A JP16488485 A JP 16488485A JP H07239 B2 JPH07239 B2 JP H07239B2
Authority
JP
Japan
Prior art keywords
rosin
activator
solder
cream solder
flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60164884A
Other languages
Japanese (ja)
Other versions
JPS6224889A (en
Inventor
好人 浜田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uchihashi Estec Co Ltd
Original Assignee
Uchihashi Estec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uchihashi Estec Co Ltd filed Critical Uchihashi Estec Co Ltd
Priority to JP60164884A priority Critical patent/JPH07239B2/en
Publication of JPS6224889A publication Critical patent/JPS6224889A/en
Publication of JPH07239B2 publication Critical patent/JPH07239B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3485Applying solder paste, slurry or powder

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明はクリームはんだの改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention relates to an improvement in cream solder.

〈先行技術と問題点〉 近来、電子機器の小型化に伴い電子回路のはんだ付けに
は、クリームはんだを用いたリフロー法が汎用されてい
る。
<Prior Art and Problems> With the recent miniaturization of electronic devices, a reflow method using cream solder has been widely used for soldering electronic circuits.

クリームはんだは、ロジンを主成分とし、活性剤、例え
ばハロゲン化アミンを含有せるフラツクスと粉末はんだ
とを混合した組成であり、活性剤は被はんだ付け面の酸
化物、不純物の除去、はんだ付け時のはんだの凝集促進
に不可欠である。
Cream solder has a composition in which rosin is the main component and an activator, for example, a flux containing a halogenated amine and powdered solder are mixed, and the activator is used to remove oxides and impurities on the surface to be soldered and when soldering. It is indispensable for promoting the agglomeration of the solder.

このように、活性剤ははんだ付け時に不可欠は洗浄作
用、凝集作用等を営むものであるが、クリームはんだの
保存中に、粉末はんだの微粉末表面が活性剤中のハロゲ
ンによつて侵され易く、その結果、クリームはんだの高
粘度化、塊状化が惹起され、印刷性、吐出性の低下が避
けられず、はんだ付け不良が懸念される。
As described above, the activator has a cleaning action, an aggregating action, and the like, which are indispensable during soldering, but during the storage of the cream solder, the fine powder surface of the powder solder is easily attacked by the halogen in the activator. As a result, the viscosity of the cream solder is increased and the cream solder is lumped, and the printability and the dischargeability are unavoidably deteriorated, and there is a concern of defective soldering.

〈発明の目的〉 本発明の目的は、クリームはんだ保存中でのはんだ粉末
表面の活性剤による侵食を防止し、クリームはんだの印
刷性、吐出性の特性を良好に保持することにある。
<Object of the Invention> An object of the present invention is to prevent erosion of a solder powder surface by an activator during storage of cream solder, and to maintain good printability and dischargeability of the cream solder.

〈発明の構成〉 本発明に係るクリームはんだは、ロジンを主成分とし、
活性剤を含有せるフラツクスと粉末はんだとの混合物に
おいて、ロジンの一部または全部を結晶微粒子化し、こ
の結晶微粒子中に活性剤の全部または一部を含有させた
ことを特徴とするものである。
<Structure of the Invention> The cream solder according to the present invention contains rosin as a main component,
In the mixture of the flux containing the activator and the powdered solder, part or all of the rosin is made into crystal fine particles, and all or part of the activator is contained in the crystal fine particles.

活性剤を含むロジンの結晶微粒子化は、溶剤(カルビト
ール)とロジンとを加熱下で撹拌混合し、急冷してロジ
ン溶液を得、このロジン溶液に粒状の活性剤を撹拌混合
して分散させたのち、放置し、活性剤粒を核としてロジ
ンの結晶微粒子化を進行させ、活性剤含有ロジンの結晶
微粒子体を溶剤中にコロイド状に分散させる方法、また
は、ロジン並びに活性剤を加熱溶融下で混合し、これを
冷却固化して結晶化し、これを微粒子体に加工する方法
がある。
Crystallization of rosin containing an activator is carried out by stirring and mixing a solvent (carbitol) and rosin under heating and then rapidly cooling to obtain a rosin solution. Stirring and mixing the rosin solution with a granular activator to disperse the rosin solution. After that, the mixture is allowed to stand and the activating agent particles are used as nuclei to promote the formation of rosin crystal fine particles, and the activating agent-containing rosin crystal fine particles are dispersed in a solvent in a colloidal state, or the rosin and the active agent are melted under heating. There is a method in which the particles are mixed with each other, cooled and solidified to be crystallized, and processed into fine particles.

上記活性剤には、ハロゲン化アミン、例えば、ジエチル
アミンHclを使用できる。ロジンには、不均化ロジン、
重合ロジンを使用でき、特に制限はない。
The activator can be a halogenated amine, such as diethylamine Hcl. Rosin is a disproportionated rosin,
Polymerized rosin can be used without any particular limitation.

粉末はんだの粒子径は、通常100μm以下であり、ロジ
ンの結晶微粒子体の径ははんだ粒子径よりも小である。
The particle diameter of the powdered solder is usually 100 μm or less, and the diameter of the crystalline fine particles of rosin is smaller than the solder particle diameter.

本発明に係るクリームはんだは、(1)ロジンを結晶微
粒子化すると共にこの結晶化ロジンに活性剤の全量を含
有させたフラツクスA1と、ロジンを非結晶のままとした
フラツクス(活性剤を含まず)B1と、粉末はんだCとを
混合せる態様、(2)ロジンを結晶微粒子化すると共に
この結晶化ロジンに活性剤の一部を含有させたフラツク
スA2と、ロジンを非結晶のままとしかつ活性剤の残部を
含有させたフラツクスB2と、粉末はんだCとを混合せる
態様、(3)上記(1)において、フラツクスB1のロジ
ンを結晶微粒子化せる態様等で実施できる。
The cream solder according to the present invention includes (1) a flux A 1 in which rosin is crystallized into fine particles and the crystallized rosin contains the entire amount of the activator, and a flux in which the rosin remains amorphous (including the activator. No. ) A mode in which B 1 and powdered solder C are mixed, and (2) a rosin crystallized into fine particles and a flux A 2 in which a part of the activator is contained in this crystallized rosin, and the rosin remains amorphous. In addition, the flux B 2 containing the balance of the activator and the powdered solder C can be mixed, and (3) in the above (1), the rosin of the flux B 1 can be crystallized into fine particles.

本発明に係るクリームはんだは、上述した通り、結晶微
粒子化したロジンの微粒子中に活性剤を閉じ込めてあ
り、クリームはんだの保存中は、活性剤中のロジン微粒
子表面の活性剤のみが粉末はんだに接触するだけであ
り、粉末はんだに接触する活性剤が全量中のごく一部に
すぎないから、活性剤による粉末はんだの侵食を充分に
抑制できる。従つて、クリームはんだ保存中での粘度増
加を防止でき、印刷性、吐出性を良好に保持できる。
Cream solder according to the present invention, as described above, the activator is confined in the fine particles of rosin crystallized, during storage of the cream solder, only the activator on the surface of the rosin fine particles in the activator is powder solder. Since the activator that only makes contact with the powdered solder contacts only a small part of the total amount, erosion of the powdered solder by the activator can be sufficiently suppressed. Therefore, it is possible to prevent an increase in viscosity during storage of the cream solder, and to maintain good printability and dischargeability.

勿論、はんだ付け時には結晶化したロジン(融点:100℃
前後)が加熱溶融し、活性剤が直ちにフラツクス中によ
く拡散するから、はんだ付け温度である230℃前後にお
いて、活性剤の機能を全とうできる。
Of course, when soldering, crystallized rosin (melting point: 100 ° C
(Before and after) is heated and melted, and the activator immediately diffuses well into the flux, so that the activator can fully fulfill its function at a soldering temperature of about 230 ° C.

〈実施例の説明〉 実施例 不均化ロジン:70%(重量%、以下同じ)とカルビトー
ル:28%とを加熱混合し、急冷し、このロジン溶液に粒
状のジエチルアミンHclを2重量%を添加して、活性剤
を核とする結晶微粒子化ロジンを溶剤中に分散させたフ
ラックスA、並びに重合ロジン:60%とカルビトール:38
%とカスタ−ワツクス:2%とからなる非結晶フラツクス
Bとを作成し、フラツクスAとフラツクスBとを1:1で
混合したフラツクスD:12%とSn63%粉はんだ88%とを混
合してクリームはんだを製造した。
<Explanation of Examples> Examples Disproportionated rosin: 70% (wt%, the same applies hereinafter) and carbitol: 28% were heated and mixed, and rapidly cooled, and 2 wt% of granular diethylamine Hcl was added to this rosin solution. In addition, flux A prepared by dispersing a crystallized rosin having an activator as a core in a solvent, and polymerized rosin: 60% and carbitol: 38
% And caster wax: 2%, and an amorphous flux B was prepared, and the flux D: 12% in which the flux A and the flux B were mixed at a ratio of 1: 1 and the Sn63% powder solder 88% were mixed. A cream solder was manufactured.

このクリームはんだを使用してリフロー法によりはんだ
付けを行つたところ、印刷性、吐出性並びにはんだ付け
性の何れにおいても良好であつた。
When soldering was performed by the reflow method using this cream solder, the printability, dischargeability and solderability were all good.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】ロジンを主成分とし、活性剤を含有せるフ
ラツクスと粉末はんだとの混合物において、ロジンの一
部または全部を結晶微粒子化し、この結晶微粒子中に活
性剤の一部または全部を含有させたことを特徴とするク
リームはんだ。
1. A mixture of a flux containing rosin as a main component and containing an activator and powdered solder, wherein a part or all of the rosin is crystallized into fine particles, and the fine particles contain part or all of the active agent. Cream solder characterized by being made.
JP60164884A 1985-07-24 1985-07-24 Cream solder Expired - Lifetime JPH07239B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60164884A JPH07239B2 (en) 1985-07-24 1985-07-24 Cream solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60164884A JPH07239B2 (en) 1985-07-24 1985-07-24 Cream solder

Publications (2)

Publication Number Publication Date
JPS6224889A JPS6224889A (en) 1987-02-02
JPH07239B2 true JPH07239B2 (en) 1995-01-11

Family

ID=15801726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60164884A Expired - Lifetime JPH07239B2 (en) 1985-07-24 1985-07-24 Cream solder

Country Status (1)

Country Link
JP (1) JPH07239B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4644963B2 (en) * 2001-04-03 2011-03-09 住友ベークライト株式会社 Curing flux and solder joint

Also Published As

Publication number Publication date
JPS6224889A (en) 1987-02-02

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