JPH07239344A - Probe contact for inspection of vlsi - Google Patents

Probe contact for inspection of vlsi

Info

Publication number
JPH07239344A
JPH07239344A JP6052821A JP5282194A JPH07239344A JP H07239344 A JPH07239344 A JP H07239344A JP 6052821 A JP6052821 A JP 6052821A JP 5282194 A JP5282194 A JP 5282194A JP H07239344 A JPH07239344 A JP H07239344A
Authority
JP
Japan
Prior art keywords
diameter
small
contact
microspheres
plunger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6052821A
Other languages
Japanese (ja)
Inventor
Shigeo Kiyota
清田茂雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kiyota Manufacturing Co
Original Assignee
Kiyota Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kiyota Manufacturing Co filed Critical Kiyota Manufacturing Co
Priority to JP6052821A priority Critical patent/JPH07239344A/en
Publication of JPH07239344A publication Critical patent/JPH07239344A/en
Priority to JP10132559A priority patent/JPH11101819A/en
Pending legal-status Critical Current

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  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE:To form a probe contact to have a small diameter and correctly inspect a very-large-scale integrated circuit (VLSI) having a very small pitch, by using a minute ball obtained by holding a small ball between friction plates, sliding the friction plates to grind the small ball. CONSTITUTION:A coil spring 2 is set inside a trunk part 1 of an outer diameter of 0.2mm. Plunger contacts 3, 3' of a diameter of 0.14mm are fitted to the trunk part 1. Very small balls 4, 4' of a diameter of 0.13mm are inserted at parts where the plunger contacts 3, 3' are in touch with the spring 2. The very small balls 4, 4' are manufactured, for example, by holding a small ball 4a of a diameter of 0.5mm between friction plates 8 and 8', rotating the friction plates 8, 8' in the opposite directions and grinding the small ball 4a. The obtained very small ball has a diameter of 0.2mm or so. An abrasive material or fine powders of an abrasive material of a smaller diameter than that of the target balls 4, 4' are filled between the friction plates 8 and 8'.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、超微小なピッチ間隔
の半導体、液晶等の電極若しくはパタ−ン等の断線、シ
ョート等を精密にトライ検査することのできる超微細な
径の超LSI検査用プローブコンタクトに関するもので
ある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultra-fine-diameter super LSI capable of performing a precise tri-inspection of a semiconductor such as an ultra-fine pitch interval, a disconnection of electrodes or patterns of liquid crystal or the like, or a short circuit. The present invention relates to a probe contact for inspection.

【0002】[0002]

【従来の技術】プリント基板の回路導通などのテストに
使用されるプローブコンタクトは、円筒状の胴部内にコ
イルスプリングを介してプランジャーコンタクトを嵌合
装着してなり、該プランジャーコンタクトの先端部がプ
リント基板の被測定面に押し当てられた時に、プランジ
ャーコンタクトが胴部に対し相対移動可能に構成されて
いる。
2. Description of the Related Art A probe contact used for testing the circuit continuity of a printed circuit board is formed by fitting a plunger contact through a coil spring in a cylindrical body, and attaching the tip of the plunger contact. The plunger contact is configured to be movable relative to the body portion when is pressed against the surface to be measured of the printed circuit board.

【0003】しかして、前記先端部が被測定面に垂直に
当接し、コイルスプリングが真直に押圧される場合はあ
まり問題はないが、先端部が被測定面に傾斜して当接し
た場合または何等かの理由によって、コイルスプリング
に不均一な力がかかる状態となると、胴部とプランジャ
ーコンタクトの摺動部とが瞬間的に離れ、その結果瞬間
的に電流が流れなくなり、このことが導通試験の障害と
なっている。プリント基板の回路導通試験等を行う場
合、プローブコンタクト自体には常に正常に電流が流れ
なければならないからである。特に、最近はより精密な
試験の必要性が高くなってきているので、このような欠
点のないプローブコンタクトが強く求められている。
Although there is no problem when the tip end contacts the surface to be measured perpendicularly and the coil spring is pressed straight, there is no problem when the tip end contacts the surface to be measured at an angle. If, for some reason, the coil spring is applied with an uneven force, the body and the sliding part of the plunger contact are momentarily separated, and as a result, current does not flow instantaneously. It is an obstacle to the exam. This is because when conducting a circuit continuity test or the like on a printed circuit board, a current must always flow normally through the probe contact itself. In particular, recently, the need for more precise tests is increasing, and thus there is a strong demand for probe contacts free from such defects.

【0004】このような問題点を解決するため、プラン
ジャーコンタクトの摺動部の下面を斜面に形成し、該斜
面とコイルスプリングとの間に小球を介装させてなるプ
ローブコンタクトが、米国の会社から提案され、既に特
許されている。このプローブコンタクトは、摺動部の斜
面と小球とが当接するので、摺動部は、常に胴部に接触
する力を受けるため、接触が確実となるものである。し
かして、最近検査するプリント基板のピッチ間隔が非常
に狭くなってきているので、プランジャーコンタクトの
先端が中心からできるだけ移動しないコンタクトプロー
ブが強く求められている。プランジャーコンタクトの先
端が若干でも移動すると、プランジャーコンタクトの先
端が目的としない被測定面に当たる恐れが生じるからで
ある。
In order to solve such a problem, a probe contact in which the lower surface of the sliding portion of the plunger contact is formed into an inclined surface and a small ball is interposed between the inclined surface and the coil spring is known in the United States. Has been proposed and already patented. In this probe contact, the slant surface of the sliding portion and the small sphere are in contact with each other, so that the sliding portion always receives a force for contacting the body portion, so that the contact is reliable. In recent years, the pitch of printed circuit boards to be inspected has become very narrow, so that there is a strong demand for a contact probe in which the tip of the plunger contact does not move from the center as much as possible. This is because even if the tip of the plunger contact moves even a little, the tip of the plunger contact may hit an unintended measured surface.

【0005】プランジャーコンタクトの先端をできるだ
け移動させないようにするには、プランジャーコンタク
トをできるだけ細くし、プランジャーコンタクトとスリ
ーブとの間のクリアランスをできるだけ少なくする必要
がある。しかしながら、従来のコンタクトプローブで
は、現在入手し得る小球は0.5mm以上であるので、
プランジャーコンタクトは0.7mm以下とすることは
できない問題があった。
In order to prevent the tip of the plunger contact from moving as much as possible, it is necessary to make the plunger contact as thin as possible and to minimize the clearance between the plunger contact and the sleeve. However, in the conventional contact probe, since the currently available small balls are 0.5 mm or more,
There was a problem that the plunger contact could not be 0.7 mm or less.

【0006】[0006]

【発明が解決しようとする課題】この発明は、このよう
な従来の問題点を一挙に解決しようとするものであり、
プランジャーコンタクトと胴部とを安定して接触し得る
ようにし、しかもプローブコンタクト自体を極めて小径
に形成したプローブコンタクトを提供することを目的と
する。
SUMMARY OF THE INVENTION The present invention intends to solve all of the above-mentioned conventional problems at once.
An object of the present invention is to provide a probe contact in which the plunger contact and the body can be stably contacted with each other and the probe contact itself has an extremely small diameter.

【0007】[0007]

【課題を解決するための手段】上記目的を達成するた
め、本発明者は鋭意研究の結果、擦り板の間に小球を挟
持し、該擦り板を摺動させて、小球を研磨することによ
り極めて微小な径の小球を製造することを可能とし、こ
の微小な径の小球を使用することによって、プランジャ
ーコンタクトを極めて小径に形成することに成功し、本
発明に到達した。即ち、本発明は、プランジャーコンタ
クトと該プランジャーコンタクトの摺動部を摺動自在に
保持する円筒状の胴部と、該胴部に内装したコイルスプ
リングと、前記プランジャーコンタクトと前記コイルス
プリングとの当接部に介装した微小球とを具備してな
り、該微小球は、擦り板の間に小球を挟持し、該擦り板
を摺動させて、前記小球を直径0.4mm〜0.05m
mの微小球に研削してなることを特徴とする。
In order to achieve the above object, the present inventor has conducted earnest research and, as a result, sandwiches a small ball between rubbing plates and slides the rubbing plate to polish the small balls. The present invention has succeeded in forming a plunger contact with a very small diameter by making it possible to manufacture a very small diameter small ball, and by using this very small diameter small ball. That is, according to the present invention, a plunger contact and a cylindrical body portion that slidably holds a sliding portion of the plunger contact, a coil spring installed in the body portion, the plunger contact and the coil spring are provided. And a microsphere interposed at a contact portion with the microsphere, the microsphere sandwiches a small ball between rubbing plates, and the rubbing plate is slid so that the small ball has a diameter of 0.4 mm to 0.05m
It is characterized by being ground into m microspheres.

【0008】[0008]

【実施例】次に、本発明の実施例を図面に基づいて説明
する。図1は、本発明の実施例を示す断面図であり、外
径0.2mmの胴部1に、コイルスプリング2を内装
し、直径0.14mmのプランジャーコンタクト3,
3′を前記胴部1に嵌合させ、プランジャーコンタクト
3,3′と前記コイルスプリング2との当接部にそれぞ
れ直径0.13mmの微小球4,4′を介装した例を示
す。図2は、本発明の他の実施例を示す断面図であり、
外径0.2mmの胴部1に、コイルスプリング2を内装
し、直径0.14mmのプランジャーコンタクト3を前
記胴部1に嵌合させ、プランジャーコンタクト3と前記
コイルスプリング2との当接部にそれぞれ直径0.13
mmの微小球4を介装した例を示す。微小球4,4′と
の当接部のプランジャーコンタクト3,3′は、接触を
確実にするため、斜面に形成されている。
Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a cross-sectional view showing an embodiment of the present invention, in which a body 1 having an outer diameter of 0.2 mm is internally provided with a coil spring 2 and a plunger contact 3 having a diameter of 0.14 mm.
An example is shown in which 3'is fitted into the body portion 1 and microspheres 4 and 4'having a diameter of 0.13 mm are provided at the contact portions of the plunger contacts 3 and 3'and the coil spring 2, respectively. FIG. 2 is a sectional view showing another embodiment of the present invention,
A coil spring 2 is internally provided in a body portion 1 having an outer diameter of 0.2 mm, and a plunger contact 3 having a diameter of 0.14 mm is fitted in the body portion 1 to bring the plunger contact 3 and the coil spring 2 into contact with each other. Each part has a diameter of 0.13
An example in which a mm microsphere 4 is interposed is shown. Plunger contacts 3 and 3'at the contact portion with the microspheres 4 and 4'are formed on the inclined surface to ensure the contact.

【0009】従来の小球の製法は、丸棒を切断し、これ
を小球の型内に入れて、加圧成型するものであるが、こ
の方法では、直径0.5mm以下の微小球を製造するこ
とは不可能であった。本発明で使用する微小球は、図6
に示すように、擦り板8,8′間で例えば直径0.5m
mの小球4aを挟持し、擦り板8と8′を互いに逆方向
に回転させて、小球4aを研磨することにより、直径
0.2mm程度の微小球にすることができる。擦り板8
と8′には、研磨材を含有させておくか、或は擦り板8
と8′間に、製造しようとする微小球よりも小径の研磨
材の微粉体を入れておく必要がある。研磨材としては、
例えば、ダイヤモンド、研磨材として使用し得るセラミ
ック等を使用することができる。
The conventional method for producing small spheres is to cut a round bar, put it in a small sphere mold, and press-mold it. In this method, fine spheres having a diameter of 0.5 mm or less are formed. It was impossible to manufacture. The microspheres used in the present invention are shown in FIG.
As shown in, between the rubbing plates 8 and 8 ', for example, a diameter of 0.5 m
The small sphere 4a of m is sandwiched, the rubbing plates 8 and 8'are rotated in opposite directions, and the small sphere 4a is polished to form a microsphere having a diameter of about 0.2 mm. Rubbing plate 8
And 8'contain an abrasive or a scraping plate 8
It is necessary to insert a fine powder of an abrasive having a diameter smaller than that of the microspheres to be manufactured between 8 and 8 '. As an abrasive,
For example, diamond, ceramic that can be used as an abrasive, or the like can be used.

【0010】本発明で使用する微小球は、製造のし易さ
から、特に図3〜図5に示すように製造するのが良い。
即ち、図3に示すように、目的とする微小球の径よりも
20〜30%大きい径の断面円形のスチール線材5を、
図4に示すように、旋盤で先端を小球部6に形成し、つ
いで、図5に示すように、小球部6と線材5との間のく
びれ部7に、カッタ−9を当てて切断する、カッタ−9
は、刃部が斜面になっているので、この斜面に案内され
て、くびれ部7は、直線状ではなく、曲線状に切断され
る。上記のようにして、直径0.16mmの線材5から
製造した小球を使用し、図6に示すように研磨して、直
径0.13mmの微小球を得た、
The microspheres used in the present invention are preferably manufactured as shown in FIGS. 3 to 5 because of their ease of manufacture.
That is, as shown in FIG. 3, a steel wire rod 5 having a circular cross section with a diameter 20 to 30% larger than the diameter of the target microsphere is
As shown in FIG. 4, the tip is formed on the small ball portion 6 with a lathe, and then, as shown in FIG. 5, a cutter 9 is applied to the constricted portion 7 between the small ball portion 6 and the wire rod 5. Cutting, cutter-9
Has a slanted surface, the guided portion is guided by this slanted surface, and the constricted portion 7 is cut not in a straight line but in a curved line. As described above, the small spheres manufactured from the wire rod 5 having a diameter of 0.16 mm were used and polished as shown in FIG. 6 to obtain microspheres having a diameter of 0.13 mm.

【0011】得られた微小球の電子顕微鏡写真(200
倍)を図7に示す。図7の横の直線状部は髪の毛であ
り、その上方に3個の微小球が写つている。図7から、
上記のようにして得た微小球の直径は、髪の毛と同じよ
うな大きさであることがわかる。上記図3〜図6に示す
方法によれば、直径O.05mmまでの小球を得ること
ができ、この微小球を使用すれば、直径0.1mmのプ
ランジャ−コンタクトとすることができる。上記のよう
にして得た直径0.2mmのプロ−ブコンタクトを1列
に配列すると、0.3mm間隔の超LSIのプリント基
板の端子を同時に検査することができ、交互若しくは千
鳥に配列することによって、端子ピッチ0.08mmの
超LSIのプリント基板の端子を同時に検査することが
できる
An electron micrograph of the obtained microspheres (200
7) is shown in FIG. The linear portion on the horizontal side of FIG. 7 is hair, and three microspheres are imaged above it. From FIG.
It can be seen that the diameter of the microspheres obtained as described above is similar to the size of hair. According to the method shown in FIGS. Small spheres up to 05 mm can be obtained, and by using these fine spheres, a plunger contact with a diameter of 0.1 mm can be obtained. If the probe contacts with a diameter of 0.2 mm obtained as described above are arranged in a row, the terminals of the printed circuit board of the VLSI with 0.3 mm intervals can be inspected at the same time, and they can be arranged alternately or in a staggered manner. Can simultaneously inspect the terminals of the printed circuit board of VLSI with a terminal pitch of 0.08 mm.

【0012】[0012]

【作用】上記図1に示す本発明のプローブコンタクトを
使用して、2000回プロ−ビング試験による抵抗値の
変化を測定した。試験は、それぞれ別のプローブコンタ
クトを使用して5回行った。結果を次表−1に示す。
尚、1回目の試験の1000回プロ−ビングの抵抗値の
変化を図7に示す。
Using the probe contact of the present invention shown in FIG. 1, the change in resistance value was measured by the 2000-time probing test. The test was performed 5 times using different probe contacts. The results are shown in Table 1 below.
Incidentally, FIG. 7 shows the change in the resistance value after probing 1000 times in the first test.

【0013】[0013]

【表−1】 [Table-1]

【0014】表−1及び図7の結果から、本発明のプロ
ーブコンタクトは、2000回プロ−ビング試験の抵抗
値の変化が極めて少ないことがわかる。これは、従来の
小球を介装したプローブコンタクトと比べてもはるかに
優れており、全く予想外のことであった。微小球を介装
し、超微小な径のプローブコンタクトとすることによ
り、接触が確実になったものと考えられる。
From the results shown in Table 1 and FIG. 7, it can be seen that the probe contact of the present invention has very little change in resistance value after 2000 probing tests. This was far superior to the conventional probe contact via small balls, which was completely unexpected. It is considered that the contact was ensured by interposing a microsphere and forming a probe contact with an extremely small diameter.

【0015】[0015]

【効果】以上述べたごとく、本発明によれば、従来製造
が不可能であった微小球を使用することができるので、
プランジャ−コンタクトを従来不可能視されていた超微
細な径とすることができるから、プリント基板のピッチ
間隔の非常に狭い超LSIを極めて正確に検査すること
ができ、しかもこのような超微細な径とすることによっ
て、プローブコンタクトには常に安定して電流が流れ、
そのためプリント配線基板の試験精度が飛躍的に向上す
るという予想外の効果をも有する極めて画期的な発明で
ある。
As described above, according to the present invention, it is possible to use the microspheres which cannot be manufactured conventionally.
Since the plunger contact can be made to have an ultrafine diameter, which has been considered impossible in the past, it is possible to extremely accurately inspect a super LSI having a very narrow pitch interval on a printed circuit board, and further, such an ultrafine diameter. By setting the diameter, a stable current always flows through the probe contact,
Therefore, this is an extremely epoch-making invention which has an unexpected effect that the test accuracy of the printed wiring board is dramatically improved.

【0016】[0016]

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.

【図2】本発明の他の実施例を示す断面図である。FIG. 2 is a sectional view showing another embodiment of the present invention.

【図3】本発明の微小球の製造に使用する線材の側面図
である。
FIG. 3 is a side view of a wire used to manufacture the microspheres of the present invention.

【図4】線材の先端に小球を形成した状態の側面図であ
る。
FIG. 4 is a side view showing a state where small balls are formed at the tip of the wire.

【図5】先端の小球を切断する状態を示す側面図であ
る。
FIG. 5 is a side view showing a state in which a small ball at the tip is cut.

【図6】本発明の方法により、微小球を製造する状態を
示す断面図である。
FIG. 6 is a cross-sectional view showing a state in which microspheres are manufactured by the method of the present invention.

【図7】本発明の方法により得た微小球の電子顕微鏡写
真である。
FIG. 7 is an electron micrograph of microspheres obtained by the method of the present invention.

【図8】本発明のプロ−ブコンタクトを使用した連続プ
ロ−ビング試験による抵抗値の変化の線図である。
FIG. 8 is a diagram showing a change in resistance value by a continuous probing test using the probe contact of the present invention.

【符号の説明】[Explanation of symbols]

1 胴部 3,3′ プランジャーコンタクト 4,4′ 微小球 1 Body 3,3 'Plunger contact 4,4' Microsphere

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成6年6月24日[Submission date] June 24, 1994

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】図面[Document name to be corrected] Drawing

【補正対象項目名】全図[Correction target item name] All drawings

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【図1】 [Figure 1]

【図2】 [Fig. 2]

【図3】 [Figure 3]

【図4】 [Figure 4]

【図5】 [Figure 5]

【図6】 [Figure 6]

【図7】 [Figure 7]

【図8】 [Figure 8]

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】プランジャーコンタクトと該プランジャー
コンタクトの摺動部を摺動自在に保持する円筒状の胴部
と、該胴部に内装したコイルスプリングと、前記プラン
ジャーコンタクトと前記コイルスプリングとの当接部に
介装した微小球とを具備してなり、該微小球は、擦り板
の間に小球を挟持し、該擦り板を摺動させて、前記小球
を直径0.4mm〜0.05mmに研削してなる微小球
であることを特徴とする超LSI検査用プローブコンタ
クト。
1. A cylindrical body for slidably holding a plunger contact and a sliding portion of the plunger contact, a coil spring installed in the body, the plunger contact and the coil spring. Of the microspheres interposed between the rubbing plates, and the rubbing plates are slid so that the microspheres have a diameter of 0.4 mm to 0 mm. A probe contact for VLSI inspection, which is a microsphere ground to 0.05 mm.
【請求項2】前記微小球の直径が0.2mm〜0.05
mmである請求項1に記載のプローブコンタクト。
2. The diameter of the microspheres is 0.2 mm to 0.05.
The probe contact according to claim 1, which is mm.
【請求項3】前記プランジャーコンタクトの直径が0.
5mm〜0.1mmである請求項1に記載のプローブコ
ンタクト。
3. The diameter of the plunger contact is 0.
The probe contact according to claim 1, which has a length of 5 mm to 0.1 mm.
【請求項4】前記擦り板に研磨剤を含有させるか、或は
前記擦り板間に前記微小球よりも小径の研磨剤の微細粉
体を介装してなる請求項1に記載のプローブコンタク
ト。
4. The probe contact according to claim 1, wherein the rubbing plate contains an abrasive, or fine particles of an abrasive having a diameter smaller than that of the microspheres are interposed between the rubbing plates. .
【請求項5】前記小球が、断面円形の線材を研削して、
先端を球状に形成し、該球状物をカッタ−で切断して形
成した小球である請求項1に記載のプローブコンタク
ト。
5. The small balls grind a wire having a circular cross section,
The probe contact according to claim 1, which is a small ball formed by forming a spherical tip and cutting the spherical object with a cutter.
JP6052821A 1994-02-27 1994-02-27 Probe contact for inspection of vlsi Pending JPH07239344A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP6052821A JPH07239344A (en) 1994-02-27 1994-02-27 Probe contact for inspection of vlsi
JP10132559A JPH11101819A (en) 1994-02-27 1998-04-28 Manufacture of very small ball

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6052821A JPH07239344A (en) 1994-02-27 1994-02-27 Probe contact for inspection of vlsi

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP10132559A Division JPH11101819A (en) 1994-02-27 1998-04-28 Manufacture of very small ball

Publications (1)

Publication Number Publication Date
JPH07239344A true JPH07239344A (en) 1995-09-12

Family

ID=12925519

Family Applications (2)

Application Number Title Priority Date Filing Date
JP6052821A Pending JPH07239344A (en) 1994-02-27 1994-02-27 Probe contact for inspection of vlsi
JP10132559A Pending JPH11101819A (en) 1994-02-27 1998-04-28 Manufacture of very small ball

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP10132559A Pending JPH11101819A (en) 1994-02-27 1998-04-28 Manufacture of very small ball

Country Status (1)

Country Link
JP (2) JPH07239344A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234369B2 (en) * 1985-06-11 1987-07-27 Toyoichi Shinkai

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234369B2 (en) * 1985-06-11 1987-07-27 Toyoichi Shinkai

Also Published As

Publication number Publication date
JPH11101819A (en) 1999-04-13

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