JPH07237100A - Polishing device for outer periphery of wafer - Google Patents

Abstract

PURPOSE:To improve the stability and quickness of polishing by winding a tape round the outer periphery of a rotary drum, and moving the tape relatively to the outer periphery of the wafer through the rotation of winding reel for abutting the new part of the tape on the outer periphery of the wafer. CONSTITUTION:After a tape T drawn out of a drawing out reel is spirally wound on the outer periphery of the rotary drum 32 of a polishing machine 6a, (6b), the tape T is set so as to roll it round a winding reel. A bearing 14 having a rubber member 15 which is plated on its outside in a circumferential direction is provided along the outer periphery of the rotary drum 32 to give a cushioning function between the tape T and a wafer and moreover to enlarge a contact area. The tape T is formed by sticking and fixing fixed abrasive grains on the surface of a substrate. When the wafer is polished, the tape T is also moved in a peripheral direction by a winding reel motor 12 with the rotation of the rotary drum 32 made by its motor 11. A plurality of polishing machines 6a, 6b are arranged at fixed spaces along the outer periphery of the wafer.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus for the outer peripheral portion of a wafer, and more particularly to a polishing apparatus for polishing a chamfered portion on the outer peripheral surface of a wafer.

[0002]

2. Description of the Related Art In a silicon single crystal wafer, a compound semiconductor wafer or the like (hereinafter referred to as a wafer), a chamfered portion is formed by grinding the outer peripheral portion thereof. When the chamfered portion is formed on the wafer in this way, cracks and chips from the chamfered portion can be prevented during handling or alignment, but generation of fine powder cannot be prevented. Therefore, there is a risk that the yield and reliability of semiconductor device manufacturing may be reduced due to the fine powder.
Therefore, conventionally, after chamfering the wafer, the chamfered portion is polished.

By the way, in this polishing, polishing is performed by pressing a rotating polishing buff against the chamfered portion of the wafer, and at that time, an abrasive (free particles) in which colloidal silica or the like is dispersed in an alkaline solution is used. (Abrasive grains) are supplied to the polishing section.

However, when the polishing agent is supplied to the polishing section, the polishing agent is applied to areas other than the polishing section (for example, the front surface and the back surface of the wafer), and the portion is scratched by the etching action of the alkali. This scratch cannot be removed by a cleaning process for cleaning the abrasive. Even so, scratches on the surface of the wafer can be removed by the subsequent mirror polishing, but the scratches left on the back surface of the wafer remain on the product, which becomes a new source of fine powder, which causes semiconductors. This causes inconveniences such as yield in device manufacturing and deterioration of semiconductor device characteristics.

Therefore, in recent years, as a polishing apparatus for polishing without using an abrasive, an apparatus for polishing a chamfered portion of a wafer by using a tape carrying fixed abrasive grains has been considered. Since this apparatus does not use an abrasive containing alkali, the problem of scratches on the back surface of the wafer does not occur. However, in the case of a tape carrying fixed abrasives, unlike free abrasive polishing, the abrasives do not switch on the working surface, so repeated use of the same surface of the tape causes the fixed abrasives to wear out or become clogged. Will occur. Therefore, in order to efficiently polish the chamfered portion, it is necessary to successively apply the new surface of the tape to the chamfered portion. Therefore, in a polishing device that uses a tape carrying fixed abrasive grains, a new surface of the tape is fed by a reel for feeding, polishing is performed by this new surface, and used parts are sequentially wound by a reel for winding. It has been devised such as taking.

FIG. 13 shows an outline of this polishing apparatus. This polishing apparatus 1 includes a wafer holding means 2 for holding a wafer W, a pressing member 3 for pressing a tape T against a chamfered portion of a wafer W to be polished, and a tape T.
A reel 4 for reeling out the tape T and a reel 5 for reeling up a used portion of the tape T are provided. In this apparatus 1, the tape T is unwound by the unwind reel 4, the unwound tape T is pressed against the chamfered portion of the wafer W by the pressing member 3, the new surface of the tape T is polished, and the used portion is sequentially removed. Winding reel 5
During the polishing, the tape T itself is slightly swung in the width direction and the wafer W held by the wafer holding means 2 is rotated during the polishing so that the chamfered portion of the wafer W and the tape are Giving relative speed.

[0007]

However, this polishing apparatus has the following problems.

When polishing with the tape T, the feeding speed of the new surface of the tape T and the relative speed between the chamfered portion in the polishing portion and the tape T are important factors for satisfactory polishing. In the polishing apparatus 1, the winding speed of the tape T can be arbitrarily changed, and thus the feeding speed of the new surface of the tape T can be changed, but the widthwise use of the tape T is caused by the vibration in the tape widthwise direction. It is difficult to use the entire surface effectively, and the wafer W is used to obtain the relative speed.
When the wafer is rotated at high speed, the wafer W
While there is concern that vibration due to the eccentricity may occur, the corner portions of the orientation flat portion may be excessively polished.

The present invention has been made in view of the above points, and an object of the present invention is to provide a polishing apparatus for the outer peripheral portion of a wafer, which can perform good polishing stably and quickly.

[0010]

The polishing apparatus of the present invention is a polishing apparatus for polishing the outer peripheral portion of a wafer with a tape having fixed abrasive grains carried on the surface thereof, the tape being wound and held. A reel for reeling out the tape, a reel for reeling up the tape reeled out from the reel, a rotary drum in which both reels are detachably installed, and the rotary drum is rotated. A plurality of polishing machines having a motor and a motor for rotating the take-up reel, wherein the middle part of the tape wound around the reels is wound around the outer circumference of the rotary drum. A wafer holding means that includes a table and can support the wafer so that the main surface of the wafer is orthogonal to the rotation axis of the drum and that rotates the wafer. The provided, a plurality of the polishing machine, in which are installed at predetermined intervals along the outer periphery of the wafer supported on the wafer holding means. Further, in this case, the tapes having different fixed abrasive grain sizes are used between the plurality of polishing machines, and the outer peripheral portion of the wafer is parallel to the main surface of the wafer supported by the wafer holding means. A means for rotating the rotating drum or the wafer is provided around an axis existing on a line passing through the vicinity.

[0011]

According to the above-mentioned means, the tape is wound around the outer circumference of the rotary drum, and the tape moves relative to the outer circumference of the wafer due to the rotation of the winding reel. Successive new portions of the tape are brought into contact with the outer peripheral portion of the wafer, and rotation of the rotary drum provides a sufficient relative speed between the outer peripheral portion and the tape. As a result, stable polishing can be performed.

Further, since it can be polished by a plurality of polishing machines, for example, if simultaneous polishing is performed by a plurality of polishing machines using tapes having the same fixed abrasive grain size, The polishing time can be shortened. On the other hand, even when polishing is performed with a plurality of polishing machines using tapes having different fixed abrasive grain sizes, the inclination of the rotating drum with respect to the main surface of the wafer is continuously or stepwise changed, In order to prevent the rough polishing and the fine polishing from interfering with each other locally, if the fine polishing is performed in a form that follows the rough polishing, the time during which the rough polishing and the fine polishing are performed simultaneously is performed. The polishing time can be shortened accordingly. Further, for example, polishing is performed by two pairs of polishing machines using tapes having different fixed abrasive grain sizes. First, a pair of polishing machines having relatively large fixed abrasive grain diameters are used to polish the outer peripheral portion of the wafer. It is possible to shorten the polishing time by rough polishing, and then finely polishing the outer peripheral portion of the wafer with a pair of polishing machines having a relatively small fixed abrasive grain size.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A polishing apparatus according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of the polishing apparatus of the first embodiment, and FIG. 2 is an external perspective view of the polishing apparatus. The polishing apparatus 6 includes two polishing machines 6a and 6b and a wafer holding means 7. These polishing machines 6a, 6b
Are the rotary drum 32 and the rotary drum 32, respectively.
A reel 9 for reeling out (FIG. 3) and a reel 10 for reeling (FIG. 3) installed therein, a motor 11 for rotationally driving the rotary drum 32, and a motor 12 for rotationally driving the reel 10 for winding. have. Each polishing machine 6a, 6b
The tape T fed from the feeding reel 9 is wound around the outer circumference of the rotating drum 32 in a spiral shape, and then guided to the inside of the rotating drum 32 again and wound by the winding reel 10. ing. Further, as shown in FIG. 3, a bearing 14 is attached to the outer peripheral portion of the rotary drum 32, and the tape 14 is moved smoothly by the bearing 14. Further, the rubber material 15 is formed on the outer surface of the bearing 14 along the circumferential direction thereof.
Is burned. This rubber material 15 functions as a cushion when the wafer W is pressed against the tape T,
It serves to increase the contact area between the chamfered portion of the wafer W and the tape T.

The tape T will now be described. As shown in FIG. 4, the tape T is, for example, a tape base material 13a on which fixed abrasive grains 13c are bonded via an adhesive 13b. The reel 9 for feeding is wound so that the surface on which the fixed abrasive grains 13c are formed is on the outside. At this time, tapes T having different fixed abrasive grain sizes are used between the two polishing machines 6a and 6b. That is, the polishing machine 6a
In, the tape T having a large grain size (coarse tape T1) is used, and in the polishing machine 6b, the tape T having a small grain size (fine tape T2) is used. As the tape T, although not shown in the drawing, a tape base material coated with a coating material containing fixed abrasive grains may be used.

Next, the rotary drum 32 will be described. As shown in FIG. 3, the rotary drum 32 has a bottom plate 20a.
It is composed of a cylinder body 20 with a mark and a cylinder body 21 with a top plate 21a and is integrated. Of these, the cylinder 20
The dimension along the generatrix direction of the peripheral wall 20b of the
It is larger than that of 1b. In addition, the peripheral wall 20b of the tubular body 20 has a large diameter on the base end side, and the upper half of the small diameter portion that is continuous with the large diameter portion is configured to be fittable inside the tubular body 21. The bearing 14 can be fitted to the outside of the lower half of the small diameter portion. Furthermore, the cylinder 2
A reel support shaft 23 is erected on the bottom plate 20a of No. 0, and a reel 9 for delivery is attached to the reel support shaft 23 so as to be idle and detachable. In addition, the bottom plate 2 of the tubular body 20
Below 0a is fixed to the motor shaft 11a of the motor 11. On the other hand, a motor 12 is provided on the cylindrical body 21, and a motor shaft 12 a of the motor 12 penetrates the top plate 21 a of the cylindrical body 21 and faces the inside of the cylindrical body 21. The motor shaft 12a serves as a reel support shaft, and the winding reel 10 is fixed to a portion of the motor shaft 12a that faces the inside of the cylindrical body 21. In addition, as shown in FIG. 2, slits 24a and 24b for tape are provided on the peripheral walls of the cylindrical bodies 20 and 21.
Are respectively provided, and the tape T fed from the feeding reel 9 is once guided to the outside of the rotating drum 32 and wound around the outer periphery thereof in a spiral shape, and then guided to the inside of the rotating drum 32 again to be wound up on the winding reel 10. It can be wound around.

The polishing machines 6a, 6b having the rotating drum 32 thus constructed are installed at a predetermined interval along the outer periphery of the wafer W supported by the wafer holding means 7. The wafer W held by the holding means 7 can be simultaneously contacted.

On the other hand, the wafer holding means 7 shown in FIG. 2 will be described. The wafer holding means 7 includes a suction plate 7a for vacuum-sucking the wafer W and a motor for rotating the wafer W supported by the suction plate 7a. (Not shown),
Stage 7b for supporting the suction plate 7a and the motor
Is equipped with.

Although not shown, the polishing machines 6a, 6b
The rotary drum 32 of the
Is attached to the center of the wafer W held by the wafer holding means 7. With this air cylinder device, the tape T of the rotary drum 32 can be pressed against the chamfered portion of the wafer W with a predetermined pressure. When both rotary drums 32 contact the chamfered portion of the wafer W within the range of the central angle of the wafer W of 90 °, the air cylinder device may be provided on the wafer holding means 7 side. Further, the rotary drum 32 has its rotary drum centered on an axis which is parallel to the main surface of the wafer W supported by the wafer holding means 7 and which extends along the chamfered portion (outer peripheral portion) of the wafer W. 32 is rotated to rotate the rotating drum 3 with respect to the chamfered portion of the wafer W.
Tilt means (not shown) for tilting 2 is attached.

Next, a method of using the polishing apparatus 6 of this embodiment will be described.

First, the cylindrical body 20 and the cylindrical body 21 are separated from each other, the reel 9 for winding the tape T is set on the cylindrical body 20 side, and the winding reel 10 is arranged on the cylindrical body 21 side. Set. Then, the tip of the tape T wound around the feeding reel 9 is pulled out from the tape slit 24a of the tubular body 20, guided to the outside of the rotary drum 32, and wound around the outer periphery thereof in a spiral shape, and then the tubular body 21. Slit for tape 24
It is attached to the winding reel 10 through b. Then
The cylindrical body 20 and the cylindrical body 21 are fitted together, and the motor 12 is driven to remove the slack of the tape T. This operation is performed on the two polishing machines 6a and 6b. At this time, as described above, the polishing machine 6a is provided with the rough tape T1 and the polishing machine 6b is provided.
The precision tape T2 is attached to.

On the other hand, the wafer W is sucked onto the suction plate 7a of the wafer holding means 7 substantially concentrically. Next, the rotary drum 32 of the polishing machine 6a is moved toward the chamfered portion of the wafer W by an air cylinder device (not shown), and the chamfered portion of the wafer W is brought into contact with the rough tape T1 wound around the outer periphery of the rotary drum 32. . At the time of this contact, it is preferable that the rotating drum 32 is driven by driving the motor 11 and the wafer W is rotated by driving a motor (not shown), and the tape T is moved by driving the motor 12. Further, it is desirable that the rotating direction of the rotary drum 32 and the moving direction of the tape T1 be the same. Further, the tilting means not shown in FIG.
As shown in, the rotary drum 32 is initially tilted forward (tilt angle θ0).

In this way, the tape T1 is brought into contact with the chamfered portion to perform rough polishing. In this case, in order to move the polished portion of the wafer W in the circumferential direction of the wafer W, the wafer W is rotated at a low speed. Further, as shown in the timing chart of FIG. 6, the rotary drum 32 is gradually raised by the tilting means (not shown) as the rough polishing progresses. In addition, the tilting speed of the rotary drum 32 in this case is set to a value such that each part of the chamfered part of the wafer W can be roughly polished without leakage.

If the rotary drum 32 of the polishing machine 6a is rotated about once or twice and the rotary drum 32 of the polishing machine 6a is slightly raised, the rotary drum 32 of the polishing machine 6b is chamfered on the wafer W by an air cylinder device (not shown). To the chamfered portion of the wafer W, the rotary drum 3
The fine tape T2 wound around the outer circumference of 2 is brought into contact with the tape. At the time of this contact, as in the polishing machine 6a, the rotating drum 32 is rotated by the drive of the motor 11 and the wafer W is rotated by the drive of the motor (not shown), and the tape T2 is moved by the drive of the motor 12. It is preferable to leave it. Further, it is desirable that the rotating direction of the rotating drum 32 and the moving direction of the tape T2 are the same. Further, as shown in FIG. 5, the rotary drum 32 of the polishing machine 6b is tilted forward (tilt angle θ0) so that the rough polishing and the fine polishing do not locally interfere with each other, and the rough polishing is performed. Let's perform fine polishing in a way that follows.

In this way, when the tilt angle of the rotary drum 32 of the polishing machine 6a becomes -θ0, the rotary drum 32 of the polishing machine 6a is retracted with respect to the wafer W to complete the rough polishing. For example, the wafer W rotates 5 to 20 times by the end of this rough polishing. Next, the rotary drum 32 of the polishing machine 6b
When the tilting angle of − becomes −θ0, the rotary drum 32 of the polishing machine 6b is retracted with respect to the wafer W to end the fine polishing.

According to the polishing apparatus 6 thus constructed, the tape T is spirally wound around the rotary drum 32, and the tape T is moved by the rotation of the winding reel 10. The new surface of the tape T is fed out one after another, and the relative speed between the chamfered portion and the tape is sufficiently obtained by the rotation of the rotary drum 32. Therefore, good polishing can be stably performed. Further, the tape T is attached to the rotary drum 32.
Is wound in a spiral, the contact portion with the outer peripheral portion of the wafer W is the tape T as the rotating drum 32 rotates.
Since the tape T is gradually crossed, and the tape T is slowly wound, the tape T is moved to the new surface side at a fine pitch, so that the entire surface of the tape T can be effectively used.

Further, the two polishing machines 6a and 6b in which the fixed abrasive grains of the tape T have different grain sizes are followed by the rough polishing so that the rough polishing and the fine polishing do not locally interfere with each other. Since the fine polishing is performed in this manner, the polishing time can be shortened by the time during which the rough polishing and the fine polishing are simultaneously performed as shown in FIG.

FIG. 7 is a plan view of the polishing apparatus of the second embodiment, and FIG. 8 is an external perspective view of a part of the polishing apparatus. This polishing apparatus 30 is the polishing apparatus 6 of the first embodiment.
Since their components are almost the same, the same reference numerals are used for corresponding parts or corresponding parts, and detailed description thereof will be omitted.

The polishing apparatus 30 of the second embodiment is provided with polishing machines 30a and 30b different in structure from the polishing machines 6a and 6b of the polishing apparatus 6 of the first embodiment.

The rotary drums 32 in the polishing machines 30a and 30b are respectively provided with bottom plates 33a as shown in FIG.
It is composed of a cylindrical body 33 with a mark and a lid 34 that closes the opening of the cylindrical body 33. The bottom of the bottom plate 33 a of the cylindrical body 33 is attached to the motor shaft 11 a of the motor 11. Further, another motor 12 is attached to the lower side of the cylindrical body 33, and the motor shaft 12a of the motor 12 is attached.
9 penetrates the bottom plate 33a of the tubular body 33 and extends to the inside of the tubular body 33, as shown in FIG. The winding reel 10 can be set on the motor shaft 12a. A reel support shaft 35 is erected on the bottom plate 33a of the cylindrical body 33.
The reel 9 for feeding out can be set to 5.

Further, as shown in FIGS. 8 and 10, a tape slit 36 reaching the upper end is formed on the outer peripheral portion of the cylindrical body 33. The tape T can be led out and introduced from the tape slit 36. Further, inside the cylindrical body 33, a tension roller 37 and a pressing roller 38 are attached. Then, the tension roller 37 or the pressing roller 3
By counting the number of rotations of 8, the feeding amount of the tape T can be controlled.

In the polishing machines 30a and 30b,
The tape T fed from the reel 9 for reeling is wound around the outer peripheral surface of the rotary drum 32 almost once along the circumferential direction thereof, and then is guided to the inside of the rotary drum 32 again and is wound on the reel 10 for reeling. It is designed to be wound up. A rubber material 15 is baked on the outer peripheral surface of the rotary drum 32 along the circumferential direction thereof. Although not shown, the polishing device 30 has a lifting device (moving means) for moving the rotary drum 32 up and down by the tape width. Other configurations, such as the wafer holding means 7 and the tilting means, are the same as those of the first embodiment.

Next, a method of using the polishing apparatus 30 of this embodiment will be described.

First, the lid 34 is removed from the tubular body 33, and the reel 9 for feeding the tape T wound thereon and the empty reel 10 for winding are set in the tubular body 33. Then, the tip of the tape T wound around the reel 9 for delivery is set to the cylindrical body 3
Pull out from the tape slit 36 of 3 and the rotary drum 3
After being wound around the tape substantially once, it is attached to the winding reel 10 through the tape slit 36 of the cylindrical body 33. At this time, the polishing machine 30a is provided with the rough tape T1 and
The precision tape T2 is attached to the polishing machine 30b.

Next, the lid 34 is attached to the cylindrical body 33,
The motor 12 is driven to remove the slack of the tape T and bring it to a stopped state. In addition, when starting the polishing of the outer peripheral portion of the wafer, the position of the rotary drum 32 is set in advance by a lifting device (not shown) so that the upper end portion of the tape T is pressed against the outer peripheral portion of the wafer. Leave.

On the other hand, the suction plate 7a of the wafer holding means 7 sucks the wafer W substantially concentrically, and the rotary drum 32 of the polishing machine 30a is moved by an air cylinder device (not shown) to move the chamfered portion of the wafer W to the chamfered portion. Rotating drum 32
The tape T wound around the outer periphery of is contacted. In this contact, the rotating drum 32 is driven by driving the motor 11 and the wafer W is driven by driving a motor (not shown).
Are preferably rotated respectively.

The procedure of polishing performed thereafter is almost the same as that of the first embodiment. However, during polishing, the rotating drum 32 is lifted by the lifting device (not shown), and the tape T
Is different from that of the first embodiment in that the contact portion of is moved in the width direction of the tape T and the chamfered portion of the wafer W is polished by a new portion in the width direction of the tape T. The width of a unit with a hatched portion in FIG. 11 is the tape width required for polishing the outer peripheral portion of one wafer W. In this way, if the rotary drum 32 is raised and the contact portion of the tape T is moved in the width direction of the tape T, and a plurality of wafers W are polished using the same surface of the tape T, the width of the tape T can be reduced. The direction can be effectively used. When the tape T is used up in the entire width direction, the rotary drum 32 itself is again lowered to the lowest position by the elevating device, and the motor 12 is driven to move the tape T by one turn to move the new surface. I will put it out. After that, polishing is performed in the same manner as above.

According to the polishing apparatus 30 having the above-described structure, the rotary drum 32 moves toward the wafer W during the polishing process.
Since the tape T moves in the axial direction, it becomes the same as if a new surface is continuously fed over the entire length and width of the tape T, and the rotation of the rotary drum 32 provides a sufficient relative speed between the chamfered portion and the tape. Will be done. Therefore, good polishing can be performed stably and quickly.

Further, since the feeding reel 9 and the winding reel 10 are provided in the same plane orthogonal to the drum rotation axis, the reels 9 and 10 can be easily attached and detached. Become.

Although the embodiments made by the present inventor have been described above, it is needless to say that the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention.

For example, in both of the above embodiments, the tilting means for tilting the rotary drum 32 with respect to the wafer W is provided, but the tilting means may be provided not on the rotary drum 32 side but on the wafer holding means 7 side. .

Further, in the second embodiment, in order to effectively utilize the width direction of the tape T, an elevating device for moving the rotating drum 32 up and down is provided, but instead of this, the wafer holding means 31 is used. An elevating device for elevating may be provided.

In the above embodiment, the rotary drum 32 is continuously tilted as shown in FIG. 6, but it may be tilted stepwise. For example, tilt 3
After the rough polishing of the chamfered portion on the front surface side of the wafer W is finished, the end surface of the chamfered portion of the wafer W is roughly polished, and at the same time, the chamfered portion on the front surface side is finely polished. Furthermore, while roughening the chamfered portion on the back surface side of the wafer W,
The end face of the chamfer should be precisely polished. Then, finally, the chamfered portion on the back surface side of the wafer W may be finely polished.

Further, in both of the above-mentioned examples, the tapes T having different fixed abrasive grain sizes were used between the polishing machines 6a and 6b and between the polishing machines 30a and 30b. Tapes T having the same grain size may be used. In this case, it is possible to reduce the polishing time to about 1/2 or less of the conventional one.

Further, like the polishing device 40 shown in FIG. 12, two polishing machines 40a, 40a using a rough tape,
Two polishing machines 40b, 40b using a precise tape are installed at a predetermined interval along the outer periphery of the wafer W, first, rough polishing is performed by the polishing machines 40a, 40a, and after the rough polishing is completed, polishing is performed. Fine polishing may be performed by the machines 40b and 40b.

[0046]

According to the present invention, the outer peripheral portion of the wafer is
A polishing device for polishing with a tape having fixed abrasive particles carried on the surface thereof, wherein a reel for reeling-out and reeling out the tape, and a reel for reeling-out the tape reeled out from the reel for reeling-up A take-up reel, a rotary drum in which the both reels are removably installed, and a motor for rotating the rotary drum,
And a plurality of polishing machines each having a motor for rotating the take-up reel, wherein the middle part of the tape wound around the reels is wound around the outer circumference of the rotating drum. , A wafer holding means for supporting the wafer so that the main surface of the wafer is orthogonal to the drum rotation axis and rotating the wafer, and a plurality of the polishing machines are supported by the wafer holding means. Since the wafers are installed at a predetermined interval along the outer circumference of the wafer, good polishing can be performed stably and quickly.

[Brief description of drawings]

FIG. 1 is a plan view of a polishing apparatus according to a first embodiment.

FIG. 2 is an external perspective view of the polishing apparatus of the first embodiment.

FIG. 3 is a vertical cross-sectional view for explaining the configuration of the polishing machine according to the first embodiment.

FIG. 4 is a schematic configuration diagram of a tape.

FIG. 5 is a diagram showing a tilted state of the rotary drum according to the first embodiment.

FIG. 6 is a timing chart of a tilting state of the rotary drum according to the first embodiment.

FIG. 7 is a plan view of a polishing apparatus according to a second embodiment.

FIG. 8 is an external perspective view of a polishing machine according to a second embodiment.

FIG. 9 is a vertical sectional view of a polishing apparatus according to a second embodiment.

FIG. 10 is a plan view of a polishing machine according to a second embodiment.

FIG. 11 is a diagram showing an example of how to use a tape in the second embodiment.

FIG. 12 is a plan view of a polishing apparatus of another embodiment.

FIG. 13 is a schematic configuration diagram of a conventional polishing apparatus.

[Explanation of symbols]

 6,30,40 Polishing device 6a, 6b, 30a, 30b Polishing machine 32 Rotating drum 9 Reel for feeding 10 Reel for winding 11, 12 Motor T Tape W Wafer

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tatsuo Otani 150 Odaira, Odakura, Nishigokawa-mura, Nishishirakawa-gun, Fukushima Prefecture, Shinagawa Semiconductor Shirakawa Laboratory, Shinetsu Semiconductor Co., Ltd. (72) Yasuka Kuroda Odakura, Nishigo-mura, Nishishirakawa-gun, Fukushima Prefecture Ohira 150 Address Shin-Etsu Semiconductor Co., Ltd.Shirakawa Research Laboratories (72) Inventor Koichiro Ichikawa 1650 Kiyono Matsushiro-cho, Nagano City, Nagano Prefecture In-house Fujikoshi Machinery Co., Ltd. (72) 1650 Kiyono Matsushiro-cho, Nagano City, Nagano Prefecture Fujikoshi Machine Industry Co., Ltd.

Claims (2)

[Claims] 1. A polishing apparatus for polishing the outer peripheral portion of a wafer with a tape having fixed abrasive particles carried on the surface thereof, comprising: a reel for feeding out which the tape is wound and held; A winding reel that winds the tape fed from the feeding reel, a rotating drum in which both reels are detachably installed, a motor that rotates the rotating drum, and a winding reel that rotates. And a plurality of polishing machines configured to be wound around the outer periphery of the rotary drum, and the main surface of the wafer has the motor. The wafer can be supported so as to be orthogonal to the drum rotation axis, and comprises a wafer holding means for rotating the wafer, a plurality of the polishing machine, A polishing apparatus for an outer peripheral portion of a wafer, which is installed at a predetermined interval along an outer periphery of the wafer supported by a wafer holding means. 2. The tapes having different fixed abrasive grain sizes are used among a plurality of the polishing machines, and the tapes are parallel to the main surface of the wafer supported by the wafer holding means and near the outer peripheral portion of the wafers. Centering on the axis that exists on the line that passes through
2. The polishing apparatus for a wafer outer peripheral portion according to claim 1, further comprising means for rotating the rotating drum or the wafer.