JPH07235487A - Managing apparatus for resist stripper - Google Patents

Abstract

PURPOSE:To provide a managing apparatus for resist strippers, used to strip resist in liquid crystal substrate or semiconductor manufacturing processes, that maintains specific qualities of resist strippers and allows the reduction of quantity required, down time and cost. CONSTITUTION:The managing apparatus for resist strippers consists of a resist stripper discharge means that detects the concentration of resist dissolved in a resist stripper through an absorption spectrophotometer 16, and that discharges the resist stripper; a first replenishing means that detects the level of resist stripper through a level gauge 3, and that replenishes organic solvent and alkanol amine, such as MEA; and a second replenishing means that detects the concentration of alkanol amine, such as MEA, dissolved in resist stripper through an absorption spectrophotometer 15, and that replenishes either or both of organic solvent and alkanol amine, such as MEA.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resist stripping liquid management device used for stripping resist in a liquid crystal substrate manufacturing process, a semiconductor manufacturing process, etc. The present invention relates to an apparatus having both an alkanolamine concentration adjusting mechanism and a resist stripping liquid automatic discharging mechanism for suppressing deterioration of resist stripping performance due to concentration of resist eluted during resist stripping.

[0002]

2. Description of the Related Art Resist materials used in photolithography processes in manufacturing liquid crystal substrates and semiconductors include a positive type which is solubilized by exposure and a negative type which is insolubilized by exposure. Has been done. As a typical example of the positive type resist, there is one having a naphthoquinonediazide-based photosensitizer and an alkali-soluble resin (novolak resin) as main components. At the final stage of the photolithography process, a process of completely removing the resist from the substrate is required. In a resist stripping process for a liquid crystal substrate or a semiconductor, an organic solvent solution, an organic alkali solution, a mixed solution of an organic solvent and an organic alkali, or the like is used as a resist stripping solution. For example, a dimethylsulfoxide-based solution, an N-methylpyrrolidone-based solution, a mixed solution of a glycol ether and an alkanolamine-based solution, and the like are used by a spray method or a dip method.

In the conventional method, a resist stripping tank is filled with a predetermined amount of a new resist stripping solution to start the process.
When the amount of resist stripper reaches the prescribed deterioration concentration range while decreasing, using the number of substrates processed based on experience etc. as an index,
It is in the form of batch operation in which all the new liquid prepared in advance is exchanged at once. The liquid exchange timing is not constant depending on the tank capacity, the type of substrate, the number of substrates, etc., but is performed once every four days or so. When the resist stripping solution deteriorates, a constant stripping rate cannot be obtained, and stripping residues occur, which causes a reduction in yield.

The non-aqueous solution used as a resist stripping solution is usually used at 70 to 90 ° C. The boiling point of the component used in the resist stripping solution is 190 to 2 for the organic solvent.
It is about 40 ° C, and alkanolamine such as monoethanolamine (hereinafter simply referred to as MEA) is 171 ° C.
Is. Therefore, the resist stripping solution accompanies the purge nitrogen gas for sealing the atmosphere of the resist stripping tank during use and preferentially evaporates the low boiling point MEA, whereby the MEA concentration decreases and the concentration changes. In addition, the concentration of MEA, which is an alkali, decreases due to the reaction with the acid of the dissolved resist and the absorption and reaction of carbon dioxide gas in the air, or due to decomposition. As a result, the resist stripping performance is gradually deteriorated, but conventionally, the MEA concentration was not measured in real time, and the MEA concentration was not constantly controlled to a predetermined concentration.

Further, the resist dissolved in the resist stripping solution by the resist stripping process is successively concentrated, which is a cause of deterioration of the resist stripping performance, but conventionally, the concentration of the dissolved resist is not measured in real time. Moreover, it has not been performed to control the concentration to a predetermined value.

[0006]

Therefore, during this period, the ME
Since the A concentration and the dissolved resist concentration change with time and are not constant, a resist peeling residue is generated, it is difficult to control the precision of the high-definition dimension of the liquid crystal substrate, and the product quality becomes unstable.
It was reducing the yield. Further, the operation rate (downtime) at the time of exchanging the liquid caused a large decrease in the operating rate, and the labor cost associated with the exchanging work of the resist stripping liquid was required.

The present invention has been made in view of the above points, and an object of the present invention is to make use of the advantages of the conventional conventional line transfer system suitable for mass production such as a liquid crystal substrate manufacturing process, while taking advantage of the above-mentioned conventional method. It eliminates technical problems. That is, the object of the present invention is to prepare an undiluted solution of an organic solvent and an alkanolamine, to automatically control the resist stripping solution to a predetermined alkanolamine concentration and a dissolved resist concentration, and to replenish the resist stripping tank. The purpose is to maintain proper resist stripping performance at all times, reduce the amount of stock solution used, and significantly reduce the downtime of operations, thus making it possible to reduce overall manufacturing costs.

[0008]

According to the present invention, it is confirmed by experiments that the concentration of resist dissolved in the resist stripping solution in the resist stripping tank is correlated with its absorbance, as shown in FIG. Therefore, the concentration of the dissolved resist was adjusted and controlled by measuring the absorbance, and further, it was confirmed by experiments that the MEA concentration in the resist stripping solution has a correlation with the absorbance as shown in FIG. Therefore, the MEA concentration is adjusted and controlled by measuring the absorbance.

That is, in order to achieve the above object,
As shown in FIG. 1, the resist stripping solution management apparatus of the present invention measures the dissolved resist concentration of the resist stripping solution by an absorptiometer 1
A resist stripping solution discharging means for discharging the resist stripping solution detected by 6; and a first replenishing means for sensing the liquid level of the resist stripping solution by the liquid level meter 3 to replenish the organic solvent and the alkanolamine. A second replenishing means for replenishing at least one of the organic solvent and the alkanolamine by detecting the alkanolamine concentration of the resist stripping solution by the absorptiometer 15 is provided. In addition, the resist stripping solution management apparatus of the present invention is, in the first replenishing means, instead of replenishing the organic solvent and the alkanolamine, as shown in FIG. The feature is that it is replenished with liquid.

Further, as shown in FIG. 3, the resist stripping solution management apparatus of the present invention detects the dissolved resist concentration of the resist stripping solution with an absorptiometer 16 and replenishes the organic solvent and the alkanolamine with the third replenishment. And a second replenishing means for replenishing at least one of the organic solvent and the alkanolamine by detecting the alkanolamine concentration of the resist stripping solution with the absorptiometer 15. Further, as shown in FIG. 4, the resist stripping solution management apparatus of the present invention uses a third replenishing means for replenishing the organic solvent and the alkanolamine, instead of replenishing the organic solvent and the alkanolamine. The feature is that a new resist stripping solution prepared in advance with amine is replenished. As the organic solvent, for example, a dimethylsulfoxide-based stock solution, an N-methylpyrrolidone-based stock solution, a glycol ether-based stock solution, or the like is used. As alkanolamine, monoethanolamine, diethanolamine, triethanolamine, N, N-dimethylethanolamine, N, N-diethylethanolamine, aminoethylethanolamine, N-methyl-N, N-diethanolamine, N, N
-Dibutyl ethanolamine, N-methyl ethanolamine, 3-amino-1-propanol can be mentioned.

[0011]

The preferred embodiments of the present invention will be described below in detail with reference to the drawings in the case of using monoethanolamine (MEA) as an alkanolamine. However, the shape of the constituent devices described in this embodiment, the relative arrangement thereof, and the like, unless otherwise specified, do not limit the scope of the present invention to only those, but are merely illustrative examples. Absent. FIG. 1 is a system diagram showing an embodiment of the present invention. Reference numerals 1 to 13 in the figure are devices constituting a conventional existing resist stripping processing apparatus. That is, this conventional resist stripping processing apparatus is applied to a resist stripping processing tank 1 for storing a resist stripping solution, an overflow tank 2, a liquid level meter 3, a resist stripping chamber hood 4, a resist stripping solution spray 7, a resist stripping solution spray. Liquid feed pump 8, a filter 9 for removing fine particles and the like in the resist stripping solution, a roller conveyor 5 for disposing the substrate and moving while stripping the resist, a substrate 6, and cleaning and stirring of the resist stripping solution. Circulation pump 11 for cleaning, fine particle removing filter 13, N ₂ gas, MEA
It is composed of piping etc.

According to the present invention, the equipment attached to the resist stripping processing apparatus is an absorptiometer 15, an absorptiometer 16, a liquid discharge pump 18, and an organic solvent stock solution supply can 1.
9, flow control valve 21 for supplying organic solvent, MEA stock solution (M
A supply can 29, a flow control valve 22 for MEA supply, and pipes connecting these devices, electric instrumentation or air instrumentation, etc. are also included.

The amount of liquid stored in the resist stripping treatment tank 1 is sufficient if the required amount of the resist stripping liquid spray 7 can be supplied, but it is necessary to control it in order to stabilize the process. The liquid level meter 3 detects a decrease in the liquid level due to spontaneous reduction by adhering to the substrate during the resist stripping process and being taken out of the system, or when the liquid with degraded resist stripping performance is forcibly discharged. The decrease in the liquid level is detected and the liquid amount in the resist stripping tank 1 is controlled within a certain range. Here, the resist peeling deterioration liquid is the discharge pump 18
Is activated to flow down to the drain pipe. In addition,
In some cases, the deterioration liquid may be directly extracted from the system without passing through the drain pipe.

An organic solvent stock solution supply canister 19 for storing an organic solvent such as butyldiglycol (hereinafter, abbreviated as BDG; boiling point is 230.6 ° C.) is provided with a pipe 20.
Is pressurized to 1-2 Kgf / cm ² with N ₂ gas from
The pressure is fed by opening the organic solvent flow control valve 21. Also,
The MEA undiluted solution supply canister 29 that stores the MEA is pressurized to 1-2 Kgf / cm ² with N ₂ gas from the pipe 30, and
Liquid is delivered by opening the EA flow rate control valve 22. The organic solvent and MEA are sent by automatically adjusting their valves.
They merge in the pipe line 23, flow into the pipe line 12, and enter the resist stripping tank 1 while being mixed with the circulating flow. It is also possible to connect the organic solvent and the MEA to the pipe line 12 or the resist stripping treatment tank 1 without joining them.
However, as shown in FIG.
It is desirable to join them in 3 and then to flow them into the circulation line 12 because sufficient mixing is achieved.

Further, a pipe line 1 for spraying the resist stripping solution.
A sample solution is introduced from the conduit 14 into the absorptiometer 15 and the absorptiometer 16 (for example, both instruments are integrated) installed online at 0, and the absorbances of both are continuously measured, and the measured solution is Returning from line 17 to line 10. It is also possible to install the absorptiometer 15 and the absorptiometer 16 as separate bodies.

FIG. 2 is a system diagram showing another embodiment of the present invention. In this embodiment, instead of detecting the liquid level of the resist stripping liquid with the liquid level meter 3 and replenishing the organic solvent and MEA, the liquid level of the resist stripping liquid is changed to the liquid level as shown in FIG. It is configured so that a resist stripping new liquid prepared by preliminarily mixing an organic solvent and MEA as detected by the level meter 3 is replenished. 27 is a resist stripping new liquid supply can, and 28 is a new liquid flow rate control valve. Other configurations are similar to those in the case of FIG.

FIG. 3 is a system diagram showing another embodiment of the present invention. In this embodiment, the concentration of dissolved resist in the resist stripper is detected by an absorptiometer 16 to detect the organic solvent and ME.
It is configured to supply A and A. As shown in FIG. 3, normally, the liquid level is near the position of the overflow weir, and when at least one of the organic solvent and MEA is replenished, the deteriorated resist stripping liquid overflows from the overflow weir. Then, it is automatically ejected. The discharge pump 18 is not always necessary, and a valve may be provided instead of the discharge pump 18. Other configurations are similar to those in the case of FIG.

FIG. 4 is a device system diagram showing still another embodiment of the present invention. In the present embodiment, in the third replenishing means for detecting the dissolved resist concentration of the resist stripping solution by the absorptiometer 16 and replenishing it, instead of replenishing the organic solvent and MEA, as shown in FIG. MEA and MEA are prepared in advance to supply a new resist stripping solution. Other configurations are similar to those in the case of FIG.

Next, the control system of the embodiment apparatus shown in FIG. 1 will be described. Liquid level meter 3 and resist stripping tank 1
Liquid level, absorptiometer 15 and ME of resist stripper
The A concentration, the absorptiometer 16 and the dissolved resist concentration of the resist stripping solution essentially act as independent functions, respectively, but in the present invention, it is necessary to make them function in a mutually complementary relationship. It has a feature. Also,
First, the target value of the MEA concentration of the resist stripping solution and the concentration limit value of the dissolved resist concentration, which are necessary for quality control of the product substrate, must be set in advance in each controller based on the operation results or calculation.

Below, BDG and ME were used as resist stripping solutions.
An example using the mixed solution A will be described. Normally, the MEA concentration of the resist stripping solution kept at a constant solution temperature of about 80 ° C. decreases as the number of substrates processed increases, mainly because MEA having a low boiling point is preferentially evaporated along with the purge N ₂ gas. Therefore, the resist stripping performance of the resist stripping solution deteriorates. Therefore, it is necessary to control the MEA concentration to a predetermined target value, for example, 39.0 ± 1.0%. Conventionally, the degree of deterioration of the resist stripping solution has been determined by experience based on correlation with the number of processed substrates, chemical analysis, or the like, but it has been difficult to grasp quickly and accurately.

The present inventor examined the relationship between the MEA concentration of the resist stripping solution and the absorbance by experiment, and as shown in FIG. 5, the MEA concentration is the absorbance at the measurement wavelength λ = 1048 nm and the influence of the dissolved resist concentration or the like. It was confirmed that there was a high degree of linearity and that accurate measurement was possible. The absorptiometer 15 installed online in the conduit 10 is equipped with various compensation functions for minimizing measurement errors and an absorbance controller 25. The absorbance measurement value of the sample liquid introduced from the pipe line 10 is
At least one of the organic solvent and the MEA is automatically controlled by the flow rate adjusting valves 21 and 22 by inputting it to the absorbance controller 25 so that the value becomes the target value, and the MEA concentration becomes the target value. Replenish until adjusted.

The deterioration of the resist stripping performance depends not only on the MEA concentration described above but also on the dissolved resist concentration. The resist stripping solution for substrate processing is taken out from the resist stripping processing tank 1 by the liquid feed pump 8 and is circulated through the resist stripping solution spray 7, so that the dissolved substance is gradually concentrated in the resist stripping solution. The main dissolved substance is resist, which is concentrated as the number of processed substrates increases, as shown in the operation example of FIG. 6, and as a result, the resist stripping performance is significantly deteriorated. Conventionally, this change in concentration has not been measured in real time, and the resist stripping performance has not been managed at a constant value. In other words, the number of processed substrates is used as a deterioration index, but since the shape of the substrate, the film thickness of the resist, and the resist stripping pattern are not constant, the amount of dissolved resist differs for each substrate type. It is impossible to use it as a factor.

The inventors of the present invention focused on measuring the resist concentration in relation to the absorbance from the study of the contamination state due to the resist concentration in the resist stripping solution, and obtained the results shown in FIGS. 7 and 8 by experiments. Obtained. As shown in FIG.
The dissolved resist concentration and the absorbance have a highly linear relationship without being affected by the MEA concentration, etc., and do not depend on the number of processed substrates.
It became possible to determine the resist stripping performance limit value based on the dissolved resist concentration itself. In addition, λ = 550 nm was used as an appropriate measurement wavelength of the dissolved resist concentration. Therefore, the absorptiometer 16 installed in the conduit 10 integrally with or separately from the absorptiometer 15 detects continuously that the dissolved resist concentration of the resist stripping solution exceeds the deterioration limit value, and the absorbance controller The discharge pump 18 operates according to the output signal of 26, and the deteriorated resist stripping liquid is extracted from the resist stripping processing tank 1 and discarded in the drain pipe or directly outside the system.
As a result, in the resist stripping treatment tank 1 whose amount has been reduced, the liquid level meter 3 immediately detects the lowered liquid level, so that fresh resist stripping liquid is replenished and the dissolved resist concentration is diluted to the deterioration limit value. As a result, the resist peeling performance is restored and the discharge pump 18 is stopped.

Here, the functional relationship of the control system intended by the apparatus of this embodiment shown in FIG. 1 will be described. When the resist stripping tank 1 is empty, the liquid level meter 3 detects that the liquid level meter 3 is empty, and the output signal of the liquid level controller 24 causes the organic solvent and MEA to flow at an appropriate flow ratio. The valve opening is adjusted by the flow rate adjusting valves 21 and 22 to deliver the liquid. Then, the absorptiometer 15 continuously measures the absorbance of the building bath resist stripping solution, and at least one of the organic solvent and the MEA is at a proper minute flow rate according to the output signal of the absorbance controller 25, and the flow rate control valves 21 and 22 are operated. The valve opening is adjusted by at least one of the two, and the liquid is delivered, and the target value ME
It is automatically controlled to obtain the A concentration.

Next, when the resist stripping process is started, M
The EA concentration decreases, the amount of the liquid is reduced by taking out the substrate, and the concentration of the dissolved resist proceeds. If the MEA concentration drops,
The absorptiometer 15 continuously measures the absorbance of the resist stripping solution, and the output signal of the absorbance controller 25 causes the MEA to adjust the valve opening by the flow rate control valve 22 at an appropriate minute flow rate to deliver the solution. The MEA concentration is automatically controlled. When the amount of the liquid is reduced by taking out the substrate, the liquid level meter 3 detects the lowered liquid level and the output signal of the liquid level controller 24 causes the organic solvent and the MEA to flow at an appropriate flow ratio. The control valves 21 and 22 adjust the valve opening degree to deliver the liquid.

When the dissolved resist concentration is concentrated and reaches the deterioration limit value, the absorptiometer 16 continuously measures the dissolved resist concentration of the resist stripping liquid and detects that the deterioration limit value is exceeded, and the absorbance controller The discharge pump 18 operates according to the output signal of 26, and the deteriorated resist stripping liquid is extracted from the resist stripping processing tank 1 and discarded in the drain pipe or directly outside the system. As a result, since the liquid level decreases, the liquid level meter 3 detects the lowered liquid level and the output signal of the liquid level controller 24 adjusts the flow rate of the organic solvent and MEA at an appropriate flow ratio. Valves 21,2
The valve opening is adjusted by 2 to deliver the liquid. Since the resist stripping tank 1 is replenished with fresh resist stripping liquid,
When the dissolved resist concentration is diluted to the deterioration limit value, the resist stripping performance is restored, and the discharge pump 18 is stopped. A weir for overflow is provided above the liquid level meter 3 at a position where it does not normally overflow, but it may overflow slightly.

Next, the functional relationship of the control system intended by the embodiment apparatus shown in FIG. 3 will be described. When the resist stripping treatment tank 1 is empty, the flow rate control valve 2 is manually operated at an appropriate flow rate ratio of the organic solvent and MEA.
The valve opening is adjusted by 1 and 22 and liquid is supplied until a predetermined liquid level is reached. Then, the absorptiometer 15 continuously measures the absorbance of the building bath resist stripping solution, and the absorbance controller 2
According to the output signal of 5, at least one of the organic solvent and the MEA has an appropriate minute flow rate, the flow rate control valves 21 and 2
The valve opening is adjusted by at least one of the two, and liquid is sent,
The MEA density is automatically controlled to reach the target value.

Next, when the resist stripping process is started, M
The EA concentration decreases, the amount of the liquid is reduced by taking out the substrate, and the concentration of the dissolved resist proceeds. When the MEA concentration decreases, the absorptiometer 15 continuously measures the absorbance of the resist stripping solution, and the output signal of the absorbance controller 25 adjusts the valve opening degree by the flow rate control valve 22 at a proper minute flow rate of the MEA. Then, the solution is sent, and the MEA concentration of the target value is automatically controlled. When the amount of the liquid is reduced by taking out the substrate, the liquid level meter is slightly lower than the position of the overflow weir.

When the dissolved resist concentration is concentrated and reaches the deterioration limit value, the absorptiometer 16 continuously measures the dissolved resist concentration of the resist stripper to detect that it exceeds the deterioration limit value and controls the absorbance. According to the output signal of the device 26, the flow rate control valve 2 is operated at a proper flow rate ratio of the organic solvent and MEA.
The valve opening is adjusted by 1 and 22 to deliver the liquid. Since the fresh resist stripping solution is replenished, the dissolved resist concentration is diluted to the deterioration limit value and the resist stripping performance is restored.

The liquid level is near the position of the overflow weir, and when the organic solvent or MEA is replenished, the deteriorated resist stripping liquid overflows from the overflow weir. The present inventor facilitates comprehensive recovery of resist stripping performance, continuous operation, and reduction of resist stripping solution usage by operating results based on each control function in a mutually complementary relationship as described above. We have experimentally found that it can be realized.

Next, for conceptual understanding, a comparison of the effects of the operation patterns of the present invention and the conventional method is shown in FIGS.
In the conventional method, as shown in FIG. 9, the MEA concentration at the start is, for example, 40.0 wt%, and when the concentration decreases with the passage of time and reaches, for example, 30.0 wt% (chemical analysis value). The liquid was being exchanged. In this case, the change over time in the MEA concentration has a saw-tooth shape, and there is a variation range in the concentration, so the resist stripping performance is not constant. But,
When the apparatus of the present invention is used, the MEA concentration is constant, for example, 39.0 ± 1.0 wt% over time, as shown in FIG. There is no need.

In the conventional method, as shown in FIG.
From the start, the concentration of dissolved resist increased with the passage of time, and the concentration reached a region value that deteriorates the resist stripping performance, and liquid exchange was performed. In this case, as shown in FIG. 11, the change over time in the dissolved resist concentration has a saw-tooth shape, and a variation width of the dissolved resist concentration occurs, so that the resist peeling performance was not constant. However, when the apparatus of the present invention is used, as shown in FIG. 12, the dissolved resist concentration becomes constant after a certain period of time, so that the resist stripping performance is stable and the liquid replacement work is not necessary.
In the above, the present invention provides a B
The invention is not limited to the case of using the mixed solution of DG and MEA, and can be applied to the case of using the mixed solution of the organic solvent solution other than BDG and the MEA or the alkanolamine solution other than MEA as the resist stripping solution.

[0033]

Since the present invention is constructed as described above, it has the following effects. (1) By applying the present invention to a resist stripping process for a liquid crystal substrate, a semiconductor or the like, the alkanolamine concentration and the dissolved resist concentration of the resist stripping liquid are constantly monitored and controlled to desired target values, and a stable liquid is obtained. Allows continuous operation for a long time at the surface level. (2) Since the resist stripping solution quality can be controlled to be constant, the resist stripping performance is also stabilized. Therefore, when applied to a liquid crystal substrate manufacturing process or a semiconductor manufacturing process,
It is possible to achieve the comprehensive effects of drastically reducing the amount of liquid used, improving the yield, reducing the downtime, and reducing the labor cost.

[Brief description of drawings]

FIG. 1 is a system diagram of a resist stripping solution management apparatus showing an embodiment of the present invention.

FIG. 2 is a system diagram of a resist stripping solution management apparatus showing another embodiment of the present invention.

FIG. 3 is a system diagram of a resist stripping solution management apparatus showing another embodiment of the present invention.

FIG. 4 is a system diagram of a resist stripping liquid management apparatus showing still another embodiment of the present invention.

FIG. 5 is a graph of an example showing the relationship between the MEA concentration and the absorbance of the resist stripping solution according to the present invention.

FIG. 6 is a graph of an operation example showing the relationship between the number of resist stripping treatments and the dissolved resist concentration.

FIG. 7 is a graph showing the relationship between the number of resist stripping treatments and the absorbance of a resist stripping solution according to the present invention.

FIG. 8 is a graph showing the relationship between the dissolved resist concentration and the absorbance of the resist stripping solution according to the present invention.

FIG. 9 is a graph showing the relationship between MEA concentration and operating time in the conventional method.

FIG. 10 is a graph showing the relationship between MEA concentration and operating time when the device of the present invention is used.

FIG. 11 is a graph showing the relationship between dissolved resist concentration and operating time in the conventional method.

FIG. 12 is a graph showing the relationship between dissolved resist concentration and operating time when the apparatus of the present invention is used.

[Explanation of symbols]

 1 resist stripping treatment tank 3 liquid level meter 5 roller conveyor 6 substrate 7 resist stripping solution spray 8 liquid feed pump 11 circulation pump 15 absorptiometer 16 absorptiometer 18 discharge pump 19 organic solvent stock solution supply can 21 organic solvent flow control valve 22 MEA flow rate control valve 24 Liquid level controller 25 Absorbance controller 26 Absorbance controller 27 Resist stripping new solution supply can 28 New solution flow rate control valve 29 MEA stock solution supply can

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Osamu Ogawa 5-1 Nihonbashi Kobunecho, Chuo-ku, Tokyo Nagase Sangyo Co., Ltd. (72) Inventor Yoshitaka Sato 5-1 Nibashi-kobunecho, Chuo-ku, Tokyo Nagase Industrial Co., Ltd. (72) Inventor Shinichiro Shiozu 236 Nakai, Tatsuno-cho, Tatsuno-shi, Hyogo Nagase Electronic Chemical Co., Ltd. Hyogo factory

Claims (4)

[Claims] 1. A resist stripping liquid discharge means for discharging the resist stripping liquid by detecting the dissolved resist concentration of the resist stripping liquid by an absorptiometer (16), and a liquid level meter (3) for measuring the liquid level of the resist stripping liquid. ) And the alkanolamine concentration of the resist stripping solution by means of an absorptiometer (1
5) A resist stripping solution management device, characterized in that it comprises a second replenishing means for replenishing at least one of an organic solvent and an alkanolamine as detected by 5). 2. The first replenishing means, instead of replenishing the organic solvent and the alkanolamine, replenish a new resist stripping solution prepared by preliminarily mixing the organic solvent and the alkanolamine. 1. The resist stripping liquid management device according to 1. 3. A third replenishing means for replenishing an organic solvent and an alkanolamine by detecting the dissolved resist concentration of the resist stripping solution by an absorptiometer (16), and an alkanolamine concentration of the resist stripping solution by an absorptiometer ( 15) A resist stripping solution management device, characterized in that it comprises a second replenishing means for replenishing at least one of an organic solvent and an alkanolamine as detected by 15). 4. The third replenishing means, instead of replenishing the organic solvent and the alkanolamine, replenish a new resist stripping solution prepared by preliminarily mixing the organic solvent and the alkanolamine. 3. The resist stripping liquid management device described in 3.