JPH07231026A - Semiconductor device and conveying method for semiconductor device - Google Patents

Abstract

PURPOSE:To perform smooth conveyance without creating jamming on a conveying rail or deformation of lead wires during conveyance with respect to semiconductor devices sealed and packaged with resins particularly semiconductor devices and their conveying method in which the bottom portion of the package is brought into contact with a sloped conveying rail and descends by its dead weight. CONSTITUTION:A semiconductor element is sealed with a resin and lead terminals connected to electrodes of the semiconductor element are extended to the outside of the resin thereby packaging the semiconductor device; and an air flowing groove 4 generating the flow of constant air during movement is formed at the bottom of a package 2. Also, in a semiconductor device conveying method for conveying it to a predetermined position by lowering the device by its dead weight on a sloped conveying rail, air is jetted from the surface of a conveyor rail 15, air is sent to the air flowing groove 4 formed at the bottom surface of the package 2 of a semiconductor device 1, and the semiconductor device 1 is floated and carried while generating a constant air flow.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device packaged in a resin and packaged, and more particularly to a semiconductor device in which the bottom surface of the package is brought into contact with an inclined transport rail and is transported by descending by its own weight. Concerning the transportation method. When sequentially transporting a plurality of semiconductor devices to a predetermined position via the transport rail, it is required that smooth transport be performed without jamming in the middle.

[0002]

2. Description of the Related Art A conventional semiconductor device and its carrying method will be described with reference to FIG. FIG. 6 is a perspective view showing a conventional semiconductor device, showing a state in which the semiconductor device is moving on an inclined transport rail. In general semiconductor devices, semiconductor elements are packaged by resin sealing for protection, and lead terminals connected to the electrodes of the semiconductor elements are led out of the package and connected to a printed circuit board, etc. It is configured to do.

A package 32 of a conventional semiconductor device 31
6 has a substantially rectangular shape as shown in FIG. 6, and conveys it to a predetermined position while its bottom surface is in contact with the conveyance rail 35. The transport rail 35 has a convex portion 35a that comes into contact with the bottom surface of the package 32 and guides the lead terminal 33 of the semiconductor device 31 at the side surface portion. Further, although not shown, there is a package having a recess for guiding the upper surface of the package 32.

Conventionally, a semiconductor device transfer method has been adopted in which a plurality of semiconductor devices 31 are sent to the transfer rails 35 having the above-described structure and sequentially transferred to a predetermined position such as a test device. There is.

[0005]

According to the conventional semiconductor device and the transportation method described above, the frictional force between the bottom surface of the package 32 of the semiconductor device 31 and the transportation rail 35 is large, and the frictional force is related to this. The semiconductor device 31 may be transported in an inclined state due to the shake of the semiconductor device 31 in the transport rail 35 or the like.

[0006] In such an inclined state, not only smooth transportation cannot be performed, but also the semiconductor device 31 may be completely clogged in the transportation rail 35. Further, when the lead terminal 33 led out of the package 32 comes into contact with the transport rail 35, there arises a problem that the lead terminal 33 is deformed. An object of the present invention is to solve the above problems and to perform smooth transportation without jamming of the semiconductor device in the transportation rail and deformation of the lead terminals.

[0007]

According to the present invention for solving the above-mentioned problems, a semiconductor element is packaged by resin-sealing and lead terminals connected to electrodes of the semiconductor element are led out of the resin. In this semiconductor device, an air circulation groove 4 for generating a constant air flow during movement is formed on the bottom surface of the package 2.

Further, in the method of transporting a semiconductor device in which a slanted transport rail is lowered by its own weight to transport the semiconductor device to a predetermined position, air is ejected from the surface of the transport rail 15 to be formed on the bottom surface of the package 2 of the semiconductor device 1. The semiconductor device 1 is floated by sending air into the air circulation groove 4 and is conveyed while generating a constant air flow in the air circulation groove 4.

[0009]

According to the semiconductor device and the method of carrying the same of the present invention described above, the contact surface between the carrying rail and the package of the semiconductor device is reduced and the frictional force is weakened. Since a stable air flow is generated around the semiconductor device while circulating, the straightness of the semiconductor device is enhanced, and the shake of the semiconductor device in the transport rail is suppressed.

Therefore, the semiconductor device is always in parallel with the carrier rail, so that the semiconductor device can be carried smoothly and the deformation of the lead terminals can be prevented.

[0011]

Embodiments of the semiconductor device and the method of carrying the same according to the present invention will be described below. 1 (a) and 1 (b) are a bottom perspective view and a bottom view for explaining a first embodiment of a semiconductor device of the present invention, and FIG. 2 is a cross-sectional view showing a carrying state of the semiconductor device of FIG. It is a figure.

In the semiconductor device 1 of this embodiment, the lead terminals 3 are sealed with resin so as to be led out to the outside as in the conventional case, and as is apparent from FIG. 4 are formed. This air circulation groove 4
Communicates from the front to the rear in the transport direction, and the rear part thereof is divided into two parts so that the air flows out from two parts.

The semiconductor device 1 of the present embodiment is supplied onto an inclined carrier rail 5 as shown in FIG. 2, and is conveyed from above to a predetermined position such as a test device by the weight of the semiconductor device 1 itself. While the semiconductor device 1 is transported in the direction indicated by the thick arrow, an air flow as indicated by the thin arrow is generated in the air circulation groove 4 on the bottom surface of the package 2 to enable the semiconductor device 1 to be transported smoothly. .

That is, the presence of the air circulation groove 4 on the bottom surface of the package 2 allows air to be taken in from the front side and flow out from the two grooves separated in the rear side, thereby stabilizing the inside and the periphery of the semiconductor device 1. The generated air flow suppresses the shake of the semiconductor device 1 during transportation. The outflow side of the air circulation groove 4 is bifurcated in order to stabilize the air flow in the rear of the package 2, and the outflow of air from one location makes the air flow unstable. The rear portion of the semiconductor device 1 will shake.

By adopting the structure of the semiconductor device described above, the semiconductor device 1 can always be kept in parallel on the carrier rail 5, and the carrier can be carried smoothly without clogging, and the lead terminals 3 can also be carried on the carrier rail 5. It does not touch, so it does not deform. Next, a second embodiment of the semiconductor device of the present invention will be described with reference to FIG. FIG. 3 is a bottom view of the semiconductor device of the second embodiment, and the shape of the air circulation groove formed in the package is different from that of the first embodiment.

In the semiconductor device 11 of this embodiment, the air circulation groove 14 on the bottom surface of the package 12 has a bifurcated shape in both the front and the rear with respect to the carrying direction, and is connected at the intermediate portion. Has become. That is, since the front and rear sides are symmetrical with respect to the transport direction, it is not necessary to consider the direction when feeding on the transport rail, and therefore the feeding work becomes easy. Further, even in the case where the conveyance is performed while changing the direction on the way, it is possible to deal with the situation, and a stable air flow can be created.

Further, a method for performing reliable conveyance will be described with reference to FIG. In the embodiment described above, the semiconductor device is carried on the tilted carrying rail only by its own weight, but a method for carrying out more reliable carrying will be described below. FIG. 4 is a cross-sectional view for explaining the carrying method of the present invention, showing a state where the semiconductor device 1 of FIG. 1 is being carried.

In FIG. 4, the carrier rail 15 has an air supply pipe 16 therein, and by supplying air to the air supply pipe 16 at a predetermined pressure, air is jetted from the surface of the carrier rail 15. To be done. The semiconductor device 1 which is transported to a predetermined position is sent to above the transport rail 15 and air is supplied to the air supply pipe 16 of the transport rail 15, so that the semiconductor device 1 that descends by its own weight is the air circulation groove 4 on the bottom surface of the package 2. Receives air from the supply pipe 16,
Slightly surface.

The air from the air supply pipe 16 flows out from the rear of the air circulation groove 4 to generate a constant air flow. As described above, while the semiconductor device 1 is levitated,
Since the transfer is performed in a state where a constant air flow is generated, the bottom surface of the package 2 of the semiconductor device 1 and the transfer rail 1
Since the frictional force with 5 can be made extremely small and a constant flow of air can be created, stable transportation without vibration or shaking is possible.

A preferred embodiment of the semiconductor device will be described in the case of adopting the transportation method of levitating by supplying air as described above. FIG. 5 is a bottom view for explaining the third embodiment of the semiconductor device of the present invention. In the semiconductor device 21 of this embodiment, the air circulation groove 24 on the bottom surface of the package 22 is
It is configured so that it does not communicate with the front and the rear with respect to the transport direction, but only comes out in the rear. According to the semiconductor device 21 of the present embodiment, when the air supply described with reference to FIG. 4 is performed, the air supplied in the front portion of the air circulation groove 24 is sufficiently received and levitated, and then the air is discharged to the rear.

Therefore, the floating effect of the semiconductor device 21 and the stability due to the flow of air are increased, and a smoother transfer can be realized.

[0022]

According to the present invention described above, since the contact surface between the carrier rail and the bottom surface of the package of the semiconductor device is reduced, the frictional force is weakened, and the air flows through the air circulation groove on the bottom surface of the package of the semiconductor device. Since a stable air flow is generated around the semiconductor device, the straightness of the semiconductor device is enhanced, so that the shake of the semiconductor device in the transport rail can be suppressed.

Therefore, the semiconductor device is always in parallel with the carrier rail, so that the semiconductor device can be carried smoothly and the deformation of the lead terminals can be prevented.

[Brief description of drawings]

FIG. 1 is a perspective view and a bottom view for explaining a first embodiment of a semiconductor device of the present invention.

FIG. 2 is a cross-sectional view showing a transportation state of the semiconductor device of the present invention.

FIG. 3 is a bottom view for explaining the second embodiment of the semiconductor device of the present invention.

FIG. 4 is a cross-sectional view for explaining the carrying method of the present invention.

FIG. 5 is a bottom view for explaining the third embodiment of the semiconductor device of the present invention.

FIG. 6 is a perspective view for explaining a conventional semiconductor device and a method of carrying the same.

Claims (4)

[Claims] 1. In a semiconductor device in which a semiconductor element is sealed with a resin and lead terminals connected to electrodes of the semiconductor element are led out of the resin to be packaged, a constant air flow is generated during movement. A semiconductor device, wherein an air circulation groove (4) is formed on the bottom surface of the package (2). 2. The air flow groove (4) is divided into at least two branches on the air outflow side.
The semiconductor device described. 3. The semiconductor device according to claim 2, wherein the air circulation groove (4) is divided into at least two branches on the air inflow side and the air outflow side, and is connected at an intermediate portion. 4. A method of transporting a semiconductor device in which a slanted transport rail is lowered by its own weight to transport the semiconductor device to a predetermined position, in which air is jetted from the surface of the transport rail (15) to package the semiconductor device (1) ( 2) Transporting a semiconductor device characterized in that the semiconductor device (1) is levitated by feeding air into an air circulation groove (4) formed on the bottom surface and is transported while generating a constant air flow. Method.