JPH0722793A - Board holding apparatus - Google Patents

Abstract

PURPOSE:To shorten the time for arrangements and to enhance the productivity of a holding apparatus by a method wherein pins which hold a board are erected automatically according to many kinds of electronic-component mounting patterns. CONSTITUTION:The title holding apparatus is provided with a plurality of pins 1 each of which has a protrusion part and each of which can press a board at one end and with a support plate 3 in which holes passing the pins 1 and pin support parts composed of a plurality of grooves, in different depths, supporting protrusion parts of the pins 1 are formed for every pin 1. In addition, the title holding apparatus is provided with a first driving device 5 which slides and moves the pins 1 to the axial direction of the pins 1 and which turns the pins 1 around the axis of the pins 1, with an X-Y table 21 which supports the support plate 3 and with a controller 22 which drives the first driving device 5 and the X-Y table 21, which moves the X-Y table 21 in such a way that the first driving device 5 is situated at the upper part of the pin as a target and which takes the pins 1 in and out.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holding device for holding and fixing a substrate for mounting an electronic component at a predetermined position on the substrate.

[0002]

2. Description of the Related Art A conventional substrate holding device will be described with reference to FIG. The conventional substrate holding device 30 is a substrate transfer rail.
A support plate 26 having a pin 25 for holding the substrate 24 regulated by 27 from below and a large number of pin holes 26A, and the pins 25 being inserted into the pin holes 26A corresponding to the positions where the substrate 24 needs to be held. This board holding device 30 prevents the board 24 from bending and vibrating when mounting the electronic component 31 on the board 24 by a mounting machine (not shown), and improves the mounting position accuracy of the electronic component 31. I am letting you.

[0003]

However, the operator determines which pin hole 26A on the support plate 26 the pin 25 should be inserted into, and the pin 25 is inserted each time the mounting pattern of the board 24 changes.
Workers are changing the position of. Therefore, a lot of time is spent on the setup of the substrate holding device, that is, the determination of the pin position and the exchange of the pins, which deteriorates the productivity. In particular, in recent years, the number of setups has increased with the increase in the production of many kinds of small quantities, and thus the setup time has increased, which further deteriorates the productivity.

The present invention solves the above problems,
It is an object of the present invention to provide a substrate holding device that shortens setup time and improves productivity.

[0005]

In order to solve the above problems, a substrate holding device according to a first aspect of the present invention has a plurality of pins each having a protrusion and capable of pressing a substrate at one end, and a pin for each pin. A support plate provided with a pin support portion formed of a hole through which the pin and a plurality of grooves having different depths for supporting the protruding portion of the pin, and the pin sliding in the axial direction of the pin and centering around the pin axis. A drive device that rotates a pin, an XY table that supports the support plate, and a drive device and an XY table that are driven to move the XY table so that the drive device is located above a target pin. It is characterized in that it is provided with a controller for taking in and out.

Further, the substrate holding device of the second invention has a projecting portion that can be taken in and out and a stepped portion that supports one end of the spring, and a plurality of pins that can press the substrate at one end, and an axial direction of the pins. An upper plate having a first driving device that slides the pin, the upper plate having a support hole for supporting one end of the upper side of the pin for each bin, and the upper end provided for each pin is outside the support hole of the upper plate. A spring having a lower end supported by the stepped portion and urging the pin downward, and a hole having a sectional shape of the pin and a protrusion of the pin in a state in which the protruding portion of the pin is pushed in for each pin. A middle plate having a support hole in which a hole having a cross-sectional shape of the pin in a state where the part projects is provided adjacently, a lower plate having a support hole for supporting the lower end of the pin for each pin, and the upper plate,
A side plate that regulates the mutual positions of the middle plate and the lower plate, and a support device including a second drive device that slides the middle plate, and an XY table that supports the support device, and the first and second drive devices. And a controller for driving the XY table to move the XY table so that the first drive device is located above the target pin, and to take in and out the pin.

[0007]

According to the first aspect of the invention, the XY table is driven according to the program in the controller created in advance, the drive device is positioned above the target pin, and the pin is slid by the drive device, and By rotating the pin around the pin axis, the groove of the support plate where the pin protrusion is located is changed, and the height of the pin changes according to the depth of the groove. Be seen.

According to the second aspect of the invention, the XY table is driven according to the program in the controller created in advance, the first driving device is positioned above the target pin, and the pin is moved by the first driving device. The protrusion of the pin is slid upward against the spring, and the protrusion of the pin is supported at the hole position of the cross-sectional shape of the pin in the state where the protrusion of the pin of the support hole of the intermediate plate is pushed, and the pin is erected. Further, by sliding the middle plate to one side by the second drive device, the protrusion of the pin moves to the hole position of the cross-sectional shape of the pin in the state where the protrusion of the pin of the support hole of the middle plate is projected, The pins are urged downward by springs and all pins are lowered together.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an overall configuration diagram of a substrate holding device according to an embodiment of the present invention.

The substrate holding device of the present invention comprises a plurality of pins 1 to be described later, a support plate 5 provided with a pin support portion for supporting the substrate, and a pin 1 slidable in the axial direction of the pin 1. Also, a first drive device 5 for rotating the pin 1 about the axis of the pin 1 and a second drive device 20 for supporting the support plate 3 so that the support plate 3 is movable in the vertical direction.
The XY table 21 supported via the XY table 21, the first and second driving devices 5 and 20, and the XY table 21 are driven, and the XY table is positioned so that the first driving device 5 is located above the target pin 1 according to the program. A controller 22 for moving the pin 21 to move the pin 1 in and out is provided. In FIG.
Reference numeral 19 is a board transport rail, and 23 is a mounting head of a mounting machine.

The pin 1 and the support plate 3 will be described in detail with reference to FIG. As shown, pin 1 has
Is provided with a pair of protrusions 2 around the axis of the support plate 3, and the support plate 3 has, for each pin 1, a hole 4a through which the pin passes and a protrusion 2
Is provided with a pin support portion 4 including a deep groove 4b and a shallow groove 4c.

The operation of taking in and out the pin 1 by the first driving device 5 will be described with reference to FIGS. 3 (a), 4 (a), and 5 (a) are views taken along the line AA of FIG.
(B), FIG. 4 (b), and FIG. 5 (b) are BB arrow views of FIG.

FIG. 3 shows the state in which the pin 1 is lowered, and the protrusion 2 of the pin 1 is supported by the deep groove 4b. From this state, as shown in FIG. 4, in order to raise the pin 1, the pin 1 is pulled up by the first driving device 5 and the pin 1 is rotated about the axis of 90 °.
Rotate it once. Next, as shown in FIG. 5, the pin 1 is lowered by the first driving device 5 and the protrusion 2 of the pin 1 is formed into the shallow groove 4b.
Support. Therefore, the pin 1 is set up and the substrate is held in this state. When lowering pin 1, the above operation is performed in reverse.

Next, the operation of the substrate holding device shown in FIG. 1 by the controller 22 will be described with reference to the flowchart of FIG. [1] Perform an operation of raising all pins 1 to be raised. That is, the XY table 21 is driven according to a program previously entered in the controller 22, the first driving device 5 is positioned above the target pin 1, and the pin 1 is set up by the operation of the first driving device. By repeating this operation, all the pins 1 to be set up are set up.

[2] The XY table 21 is driven to move the support plate 3 to the mounting head 23 side. [3] The substrate is sent to the substrate transfer rail 19 and fixed from the side surface.

[4] The second drive device 20 is driven to raise the support plate 3 and the pin 1 fixes the substrate from the lower surface. [5] Electronic components are mounted on the board by the mounting head 23.

[6] When the mounting of electronic components is completed, the second
The drive device 20 is driven to lower the support plate 3 to release the fixation of the substrate. [7] The board on which the electronic component is mounted is sent from the board transport rail 19 to the next step.

[8] It is judged whether or not it is necessary to change the pattern in which the pin 1 is set up. If there is no need, return to [3], and if necessary, proceed to [9]. [9] Support plate 3 by driving XY table 21
To the first drive device 5 side.

[10] Lower pin 1. That is, the XY table 21 is driven, the first driving device 5 is positioned above the pin 1 to be lowered, and the pin 1 is moved by the operation of the first driving device.
Can be lowered. By repeating this operation, all the pins are lowered one by one.

[11] It is judged whether or not component mounting is completed, and if it is to continue, the process returns to [1]. In this way, according to the program created in the controller 22 in advance, the XY table
21. By operating the first drive device 5 that raises the pin 1, the desired pin 1 can be automatically raised according to the type of the board. It is possible to automatically and accurately perform the setup of the substrate holding device, which can shorten the setup time and improve the productivity. Further, since the pin 1 has a simple shape, the pin 1 can be erected densely on the support plate 3 and can be applied to various kinds of substrates.

FIG. 7 shows another embodiment which replaces the pin 1 and the support plate 3 of the above embodiment. A third drive device 14 that slides the pin 6 in the axial direction of the pin 6 is provided instead of the first drive device 5.

As shown in the figure, the plurality of pins 6 capable of pressing the substrate at one end have a projecting portion 7a that can be taken in and out and a stepped portion 7b that supports one end of the spring 8. Also,
An upper plate 9 having a support hole 9a for supporting one upper end of the pin 6 for each bottle 6, and an upper end provided for each pin 6 is supported outside the support hole 9a of the upper plate 9, and a lower end is stepped. The spring 8 which is supported by the portion 7b and urges the pin 6 downward, the hole 10a having a pin cross-sectional shape in which the protruding portion 7a of the pin 6 is pushed in for each pin 6, and the protruding portion 7a of the pin 6 are projected. A middle plate 10 having a support hole 10c provided adjacently with a pin cross-sectional hole 10b, a lower plate 11 having a support hole 11a for supporting the lower end of the pin 6 for each pin 6, and an upper plate. 9, middle plate 10, lower plate 11
4 which slides the side plate 12 that regulates the mutual position of the
A support device 15 including a drive device 13 is provided.

The operation of taking in and out the pin 6 by the third drive device 14 and the support device 15 will be described with reference to FIGS. 8 (a), 9 (a) and 10 (a) are shown in FIG.
8A, FIG. 8B, FIG. 9B, and FIG. 10B.
FIG. 8 is a view on arrow B in FIG. 7.

FIG. 8 shows the state in which the pin 6 is lowered, and is urged by the spring 8 so that the stepped portion 7b of the pin 6 is
It is in contact with the lower plate 11. Further, the pin 6 has a hole 10a having a pin cross-sectional shape in which the projection 7a of the pin 6 of the intermediate plate 10 is pressed.
In the position. From this state, as shown in FIG.
In order to stand, the drive device 14 pulls up the pin 6 against the spring 8. On the way, the protrusion 7a is
It hits the edge of the hole 10a, is retracted, and passes through the hole 10a. After the passage, the protrusion 7a again projects and contacts the intermediate plate 10 to support the pin 6. The pin 6 holds the substrate in this state. After the substrate holding is completed, the intermediate plate 10 is slid by the driving device 13 as shown in FIG. 10 (in the case of FIG. 10, rightward). Then, since the protrusion 7a is not caught in the hole 10b, it is urged downward by the spring 8 and the pin 6 is lowered. Then, the drive device 13 slides the middle plate 10 to the left.

According to the third drive unit 14 and the support unit 15 of the other embodiment, all the pins 6 are moved by the operation of FIG. 10, that is, by sliding the middle plate 10 to the right by the drive unit 13. It can be collectively lowered, and the setup time can be shortened and productivity can be improved.

[0026]

As described above, according to the first aspect of the present invention, the pins that are conventionally set by a person can be automatically changed every time the type of the substrate changes.
Partial selection can be performed and the temperature can be raised, and the setup time can be shortened and productivity can be improved. Also, since the shape of the pins is simple, the distance between the pins can be shortened,
The pins can be set up tightly on the support plate, and can be used for various types of substrates.

According to the second aspect of the invention, the pins that were conventionally set up by a person can be automatically selected and lifted up every time the type of substrate changes, and the pins can be moved by sliding the middle plate. It can be collectively lowered, and the setup time can be shortened and productivity can be improved.

[Brief description of drawings]

FIG. 1 is an overall configuration diagram of a substrate holding device according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram of pins and support plate portions of the substrate holding device.

3A is a view taken along the line AA of FIG. 2, and FIG. 3B is a view taken along the line BB of FIG.

4A is a view taken along the line AA of FIG. 2, and FIG. 4B is a view taken along the line BB of FIG.

5A is a view taken along the line AA of FIG. 2, and FIG. 5B is a view taken along the line BB of FIG.

FIG. 6 is a flowchart illustrating an operation of the substrate holding device according to the embodiment of the present invention.

FIG. 7 is an explanatory diagram of pins and a support plate portion of a substrate holding device according to another embodiment of the present invention.

8A is a view taken along the line AA of FIG. 7, and FIG. 8B is a view taken along the line B of FIG.

9A is a view taken along the line AA of FIG. 7, and FIG. 9B is a view taken along the line B of FIG.

10A is a view taken along the line AA of FIG. 7, and FIG. 10B is a view taken along the line B of FIG.

FIG. 11 is an explanatory diagram of a conventional substrate holding device.

[Explanation of symbols]

 1,6 pin 2 pin protrusion 3 Support plate 4a hole 4b Deep groove 4c Shallow groove 5 First drive device 7a Pin protrusion 7b Pin step 8 Spring 9 Upper plate 10 Middle plate 10a hole 10b hole 11 Lower Plate 12 Side plate 13 Third drive device 14 Fourth drive device 15 Support device 19 Substrate transport rail 20 Second drive device 21 XY table 22 Controller 23 Mounting head

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazuhiko Narisei 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (2)

[Claims] 1. A pin comprising a plurality of pins having a protrusion and capable of pressing a substrate at one end, and a hole through which the pin passes and a plurality of grooves having different depths for supporting the protrusion of the pin for each pin. A support plate provided with a support portion, a drive device that slides the pin in the axial direction of the pin and rotates the pin about the pin axis, an XY table that supports the support plate, and the drive device. A substrate holding device provided with a controller that drives an XY table and moves the XY table so that the driving device is located above a target pin to move the pin in and out. 2. A plurality of pins, each of which has a projecting portion that can be taken in and out and a stepped portion that supports one end of a spring, can press the substrate at one end, and a first driving device that slides the pins in the axial direction of the pins. An upper plate having a support hole for supporting one end on the upper side of a pin for each bin, and an upper end provided for each pin, the upper end being supported outside the support hole of the upper plate, and the lower end having the step. A spring that urges the pins downwards, a hole having a cross-sectional shape of the pin in which the protrusions of the pins are pushed in for each pin, and a cross-section of the pin in which the protrusions of the pins project. The mutual position of the middle plate having a supporting hole in which a hole having a shape is provided adjacently, the lower plate having a supporting hole for supporting the lower end of the pin for each pin, and the upper plate, the middle plate and the lower plate A support device including a side plate to be regulated and a second drive device that slides on the middle plate is provided. Driving the XY table supporting the support device, the first and second driving devices and the XY table, and moving the XY table so that the first driving device is located above the target pin, A substrate holding device having a controller for loading and unloading.